ACCRETECH UF200R User manual

FULLY AUTOMATIC
PROBER
UF200
R
UF190
R
USER’S MANUAL
- OPERATION -
TOKYO SEIMITSU CO., LTD.
Before operation, be sure to read this manual and obtain
full knowledge about this device through training.
Keep this manual safely in a specified place.
WARNING
Document No. : FT32000-R001-E0
Date Issued : 2010-05-26

PREFACE
i
PREFACE
This User’s Manual for Operation explains the operation procedures for Fully Automatic Prober
UF200R running on System Software Ver. S5.0U-P2.
In addition to standard functions, this manual also covers common optional functions (either
with or without the “Optional” note). For this reason, it should be noted that some of the
descriptions in this manual may not apply to your particular system, depending on its
configuration.
Prepared by : Prober System Group, Hachioji Plant, Tokyo Seimitsu Co., Ltd.
Published by : Tokyo Seimitsu Co., Ltd.
First edition issued : May 26, 2010
Reproduction of this document, either physically or electronically, in part or whole without prior
consent from Tokyo Seimitsu Co., Ltd. is strictly prohibited.
Copyright 2010, TOKYO SEIMITSU CO., LTD.

PREFACE
ii
DANGER
■The system contains high voltage parts that can cause death or severe injury upon contact.
• Electrical parts, control parts and moving parts inside the system should be handled by service
engineers only.
• Be sure to turn off the power before performing work inside the system.
WARNINGS
■Contact with a moving chuck may result in serious injury.
• Check that the chuck is stopped before working on or around the chuck.
■When working with the front door open, serious injury may be caused by the moving chuck.
• Check that the chuck is stopped before working with the front door open.
■Dropping of the head stage may result in serious injury.
• When closing the head stage, keep your hands clear of the underside of the head stage.
■Contact with a moving wafer transfer robot may result in serious injury.
• Keep the loader cover closed during operation.
■Contact with a moving transfer arm may result in serious injury.
• Keep the loader cover closed during operation.
■[ When using the optional HF test head manipulator ]
Dropping of the upright head stage may result in serious injury.
• When working with the test head in an upright position, activate the upright position retention
stopper.
■[ When using the optional hot chuck ]
When working with the head stage or the chuck access door open, contact with the hot chuck
may result in a burn.
• Do not touch the hot chuck when manually handling wafers on the hot chuck.
• The hot chuck will remain hot for some time after the power has been turned off. Check that the
chuck is well cooled before touching it.
■[ When using the optional cold chuck ]
When working with the head stage or the chuck access door open, contact with the cold chuck
may result in frostbite.
• Do not touch the cold chuck when manually handling wafers or performing maintenance on the
cold chuck.
CAUTION
• When relocating or disassembling the system, contact ACCRETECH. Failure to do so
may void warranty.

PREFACE
iii
Scope of System Warranty and Liabilities
■Warranty period
• Warranty period
The term of free warranty is one year from your acceptance of the system. Any failure that
occur during this period, for which ACCRETECH is responsible, will be repaired free of
charge.
• Charged service period
The term of charged service is six years from the expiration of the warranty period. In
principle, the customer shall be liable for repairs past the charged service period, due to
issues such as availability of maintenance parts.
ACCRETECH will provide any references necessary for the repair, but the cost shall be
borne by the customer.
■Scope of warranty
ACCRETECH will not be liable for any damage or problem caused by any of the following.
・ Natural disasters.
・ Modifications made to the system without approval from ACCRETECH.
・ Incorrect operations or use of the system that fail to observe the contents of this manual.
Costs of consumable parts, as well as for spare parts, labor and transportation for maintenance
past the warranty period, shall be borne by the customer.
■Damages and liabilities
When reselling, disposing or relocating the system, contact ACCRETECH in advance for
approval.
ACCRETECH will not be liable for any losses resulting from unapproved resell, disposal or
relocation of the system.
Observe the national and/or local laws, regulations and ordinances when using the system or
disposing of the system or its components.
Before using the system, thoroughly read and understand the documents provided by
ACCRETECH (i.e. this operation manual), and receive adequate training from ACCRETECH on
the use of the system. Furthermore, strictly observe the DANGER and WARNING notes
described in the manuals. ACCRETECH will not be liable for any damages caused by improper
operation or maintenance of the system.
ACCRETECH will not be liable for damages resulting from revisions or changes made to
system-related documents (i.e. this operation manual) by those other than ACCRETECH.

PREFACE
iv
If the system is maintained or modified using components or parts that were not acquired from
ACCRETECH or its suppliers, the system may malfunction or be hindered in performance.
ACCRETECH will not be liable for damages resulting from the use of such components and
parts. Furthermore, even if the components and parts were acquired from ACCRETECH or its
suppliers, ACCRETECH will not be liable for damages caused by defects of such components
and parts.
Notwithstanding the above provisions, ACCRETECH will not be liable for losses or damages
resulting from the operation of the system.

Contents
I
Contents
1 Operation Points and Startup
1.1 Appearance...............................................................................................1-2
1.2 EMO and POWER Switches.....................................................................1-3
1.3 Display/Touch Panel Unit.........................................................................1-4
1.4 Head Stage................................................................................................1-5
1.5 Storage Media...........................................................................................1-6
1.6 Internal Printer (Optional)........................................................................1-7
1.7 Loader Unit ...............................................................................................1-8
1.8 Prober Startup ..........................................................................................1-9
2 Lot Processing
2.1 Screen Display and Operations Prior to Starting Lot Processing .......2-2
2.1.1 Switching the display with the <Screen Change >button ................... 2-3
2.1.2 Operation settings ................................................................................. 2-4
2.2 Device Data Switching .............................................................................2-5
2.2.1 Saving /deleting device data ................................................................. 2-7
2.3 Probe Card Replacement.........................................................................2-8
2.4 Wafer Alignment ..................................................................................... 2-11
2.4.1 Manual registartion of models ............................................................ 2-13
2.4.2. Manual Alignment ................................................................................ 2-15
3 Automatic Probe-Pad Alignment
3.1 Setting Control Parameters.....................................................................3-3
3.2 Registering Pads .................................................................................... 3-11
3.2.1 Tips on the pad registration ................................................................ 3-13
3.3 Pad Alignment ........................................................................................3-15
3.3.1 Manual needle alignment(teaching).................................................... 3-16
3.3.2 Confirming the pad alignment results ................................................ 3-17
3.4 Contact Height Determination...............................................................3-21
3.4.1 Execution of the automatic contact height determination................ 3-22
3.5 Checking/Correcting Probe Mark Position ..........................................3-23

Contents
II
4 Wafer Mapping & Die Sampling
4.1 Operation Flow Chart ...............................................................................4-2
4.2 Test Die Area Setting................................................................................4-3
4.2.1 Setting the test die area......................................................................... 4-5
4.3 Reference Die Setting ..............................................................................4-6
4.3.1 Target Sensing........................................................................................ 4-8
4.3.2 Difference between TEG and corner targets ...................................... 4-10
4.3.3 Setting the reference die...................................................................... 4-12
4.4 Die Attribute Setting ...............................................................................4-13
4.5 Sampling Dice Setting............................................................................4-15
4.5.1 Performing data-in for sample dice.....................................................4-17
5 Operations After Start of Probing
5.1 Device Parameter Modifications During Lot Processing......................5-2
5.2 Overdrive Amount Modification ..............................................................5-3
5.3 Confirmation and Correction of Probe Mark Position...........................5-4
5.4 Probe Mark Display ..................................................................................5-5
5.5 Sequence-Back.........................................................................................5-6
5.6 Multi-Pass Probing ...................................................................................5-7
5.6.1 Tips for multi-pass probing ...................................................................5-9
5.6.2 Operation setting for multi-pass probing ........................................... 5-12
6 Utility Functions
6.1 Wafer Handling .........................................................................................6-2
6.2 TTLManual Test ........................................................................................6-3
6.3 GP-IB Communication Data Display .......................................................6-3
6.4 Map Data Utility.........................................................................................6-4
6.5 Date & Time Setting..................................................................................6-4
6.6 Internal Printer Status Display/Switching...............................................6-4
6.7 Cleaning Utility .........................................................................................6-5
6.8 Task Version .............................................................................................6-5
6.9 Test Count Display ...................................................................................6-6
6.10 Reject Counter Reset ...............................................................................6-6
6.11 Data Reference .........................................................................................6-6
6.12 Marker Counter Reset ..............................................................................6-7
6.13 Parameter Mask Utility .............................................................................6-7

Contents
III
6.14 Make User File ..........................................................................................6-8
6.15 System Reset............................................................................................6-9
7 APPENDIX Prober Status Display

1 Operation Points and Startup
1.1 Appearance .........................................................................1-2
1.2 EMO and POWER Switches ...............................................1-3
1.3 Display/Touch Panel Unit ...................................................1-4
1.4 Head Stage ..........................................................................1-5
1.5 Storage Media .....................................................................1-6
1.5.1 Floppy Disk Drive (FDD)..................................................................1-6
1.5.2 USB terminal ..................................................................................1-6
1.6 Internal Printer (Optional) ..................................................1-7
1.7 Loader Unit ..........................................................................1-8
1.8 Prober Startup.....................................................................1-9

1 Operation Points and Startup
1-1
1 Operation Points and Startup
This chapter outlines the operation for the following operation points.
The startup procedure from power-up to staring of operation is also explained.
Operation points for UF200R/UF190R:
1) EMO (emergency stop) and POWER switches
2) Loader unit
3) Display/touch panel unit
4) Head stage
5) Storage media (USB terminal)
6) Internal printer

1 Operation Points and Startup
1-2
1.1 Appearance
The external appearance of a standard specification UF200R system is shown below.
Loader
Display / Touch panel
Head stage
Internal printer
(optional)
Storage media EMO switch
POWER switches

1 Operation Points and Startup
1-3
1.2 EMO and POWER Switches
The EMO (emergency stop) and POWER switches are located on the right-hand side of the
prober’s front panel.
If an abnormality is observed during the operation of the loader, the chuck or the optional HF
test head manipulator, press the EMO switch. Power supply to the prober will be shut off
immediately, and all moving parts will be stopped (the ON switch lamp will dim, and the OFF
switch lamp will be lit). To recover from this power down status, unlock the EMO switch by
rotating it in the clockwise direction. This will re-enable the POWER ON switch.
When the OFF switch lamp is lit, pressing the ON switch will light the ON switch lamp and
supply power to the prober. Press the OFF switch to turn off the power. The ON switch lamp will
dim and the power supply will be shut off.

1 Operation Points and Startup
1-4
1.3 Display/Touch Panel Unit
The vertical and horizontal angles of the display/touch panel unit can be adjusted by loosening
the clamp knob on the support joint.
Display/Touch Panel (Screen)
The screen displays information such
as the prober status and control
parameters. It also displays various
switches that can be touched to
select the corresponding operation or
function.
Clamp knob

1 Operation Points and Startup
1-5
1.4 Head Stage
The head stage on the top panel of the prober main body is used to attach the probe card. It is
also used to support the test head for the tester.
Opening/closing the head stage
1) Check that there is no obstacle above and within the operation range of the head stage.
2) While holding down the head stage with one hand, completely loosen the two clamp bolts.
Caution:
The head stage is spring-loaded, and will automatically begin to lift once the clamp bolts have
been loosed. To avoid the head stage from jumping open, be sure to hold down the head stage
as you loosen the clamp bolts. Allow the head stage to open gradually by slowly reducing the
downward force on it.
3) To close the head stage, hold down the head stage with your right hand as you pull the
PULL knob provided on the front left interior of the main body.
4) Firmly tighten all four clamp bolts.
Clamp bolts

1 Operation Points and Startup
1-6
1.5 Storage Media
UF200R is equipped with a USB terminal, both located at the bottom-right of the front panel.
For normal prober operations, it is not necessary to use a USB terminal, as the device data
(control parameter) can be written to the internal hard disk drive. However, you will need to use
these drives should you wish to backup the contents of the internal hard disk drive or exchange
data with another prober (i.e. UF3000).
USB

1 Operation Points and Startup
1-7
1.6 Internal Printer (Optional)
An internal printer , which is an option, is installed on the lower left part of the Prober front.
The print head is in the upper portion and the paper roll holder is in the center.
You can feed printing paper by pushing FEED button.
FEED switch
Roll paper

1 Operation Points and Startup
1-8
1.7 Loader Unit
The cassette elevator in the loader unit supports 5-, 6- and 8-inch cassettes.
In UF200R, processing of new cassettes and locking/unlocking of the inspection tray are
performed with buttons on the display/touch panel.
Touch the “NEW CST” button to process new cassettes, and the “Lock/Unlock” button to
lock/unlock the inspection tray.
To set a wafer onto the inspection tray, or to remove the wafer from the inspection tray, first
unlock the inspection tray by touching the “Lock/Unlock” button. Then, pull out the tray as
shown below, and set or remove the wafer.

1 Operation Points and Startup
1-9
1.8 Prober Startup
“Startup” refers to the procedures from power-up to the completion of prober initialization.
When the POWER ON switch is pressed and lit, the
initialization screen (shown on left) is displayed.
The “Operation mode” can be set to [Operator],
[Engineer], [Manager] or [System], depending on the
nature of the prober operation and on the skill level of
the user. (By default, [Operator] is selected at
power-up.)
To change the operation mode, touch the <System
Mode Change> button. The second screen shown on
the left is displayed.
Touch the switch for [Engineer], [Manager] or [System],
and input the preset password (up to 8 alphanumeric
characters) to switch the operation mode. (The
password for each operation level is set to ‘12345678’
at shipment. Passwords are registered as part of the
[Prober Configuration Data]. Engineer level data can
contain the password for the Engineer level only;
Manager level data can contain a password each for
both the Engineer level and the Manager level.)
Input the password (the password is not shown on the
screen) and touch the <ENT> button. You will be
returned to the initialization screen. In the Engineering
mode, <Config. Data Change> and <Init. All Axes>
buttons become available. In the Manager and System
mode, <Mainte/Adjust> button further becomes
available.
Touch the <START> button on the initialization screen
to start the initialization of the prober.
If there is a wafer left in the loader unit, an error will
result. The wafer is transferred to the inspection tray,
and an ejection request is displayed.
A
wafer left on the
chuck also causes an error. The chuck is moved to the
front door, and a wafer ejection request is displayed.
Touch the ALARM OFF key to stop the buzzer, and
follow the instructions on the screen.

2 Lot Processing
2.1 Screen Display and Operations Prior to Starting Lot
Processing .....................................................................................2-2
2.1.1 Switching the display with the <Screen Change> button ...........2-3
2.1.2 Operation settings ...........................................................................2-4
2.2 Device Data Switching........................................................2-5
2.2.1 Saving/deleting device data............................................................2-7
2.3 Probe Card Replacement ...................................................2-8
2.4 Wafer Alignment................................................................ 2-11
2.4.1 Manual registration of models .....................................................2-13
2.4.2. Manual Alignment..........................................................................2-15

2 Lot Processing
2-1
2 Lot Processing
This chapter explains the following procedures for the preparation and starting of wafer lot
processing, which takes place after the completion of prober startup.
1) Screen display and operations prior to starting lot processing
2) Switching of device data
3) Replacement and management of prober cards
4) Wafer alignment
For needle alignment procedures on a system equipped with an automatic alignment function,
refer to Chapter 3. For information on wafer maps, refer to Chapter 4.