AIC FB122-PV User manual

UM_FB122-PV_v 3.3_061419
FB122-PV
Storage Server Barebone
User's Manual

Content
Table of Contents
Preface������������������������������������������������������������������������������������������������� i
Safety Instructions ������������������������������������������������������������������������������ ii
About This Manual������������������������������������������������������������������������������ iv
Chapter 1� Product Features ��������������������������������������������������������������1
1.1 Box Contents ...........................................................................................1
1.2 Specications ..........................................................................................2
1.3 Features ...................................................................................................3
Chapter 2� Hardware Setup ����������������������������������������������������������������7
2.1 Central Processiong Unit Setup.............................................................. 7
2.1.1 Processor Support..............................................................................................7
2.1.2 Processor Heat Sink Module and Processor Socket Assembly.......................8
2.1.3 Processor Heat Sink Module..............................................................................9
2.1.4 Processor Heat Sink Location ........................................................................ 11
2.2 System Memory.....................................................................................12
2.2.1 Recommended Dimm Installation Order........................................................ 13
2.2.2 DIMM Installation ............................................................................................ 15
2.4 Removing and Installing the Top Cover................................................16
2.4.1 Removing and installing the rear top cover ................................................... 16
2.4.2 Removing and installing middle section of the top cover ............................. 16
2.5 Removing and Installing the Hard Disk Drive.......................................17
2.5.1 Removing the hard disk tray ........................................................................... 17
2.5.2 Installing the hard disk tray ............................................................................ 17
2.5.3 Installing the hard disk drive........................................................................... 18
2.6 Removing and Installing the Fan Module.............................................19
2.6.1 Removing the fan ............................................................................................ 19
2.6.2 Installing the fan ............................................................................................. 20
2.7 Replacing the PCIe Card and Riser Assembly......................................22
2.7.1 Installing the riser card.................................................................................... 22
2.8 Slide Rail Installation.............................................................................24
Chapter 3� Hardware Settings ���������������������������������������������������������� 27
3.1 Motherboard Block Diagram.................................................................27
3.2 Motherboard Content List .....................................................................28

Content
3.3 Motherboard Layout..............................................................................29
3.4 Internal Connectors/Jumpers..............................................................30
3.5 System LED Indicator ............................................................................35
3.5.1 Front Panel LED .............................................................................................. 35
3.5.2 Rear I350 LAN LEDs......................................................................................... 35
3.5.3 Rear PCH LAN LEDs......................................................................................... 36
3.6 HDD Backplane......................................................................................37
3.6.1 Placement ........................................................................................................ 37
3.6.2 Internal Connectors/Jumpers......................................................................... 38
3.6.3 LEDs ................................................................................................................. 39
3.7 Riser Card...............................................................................................40
3.7.1 Placement ........................................................................................................ 40
3.7.2 Internal Connectors/Jumpers......................................................................... 41
3.7.3 LED ................................................................................................................... 42
3.7.4 Jumpers ........................................................................................................... 43
Chapter 4. BIOS Conguration Settings ������������������������������������������� 44
4.1 Navigation Keys.....................................................................................44
4.2 BIOS Setup .............................................................................................45
4.2.1 Menu................................................................................................................. 45
4.2.2 Startup.............................................................................................................. 45
4.3 Main .......................................................................................................48
4.3.1 Main.................................................................................................................. 48
4.4 Advanced................................................................................................49
4.4.1 Peripheral Conguration ................................................................................. 49
4.4.2 Video Conguration......................................................................................... 49
4.4.3 Socket Conguration....................................................................................... 49
4.4.4 PCH Conguration........................................................................................... 53
4.4.5 H2o IPMI Conguration................................................................................... 57
4.4.6 H2o Event Log Cong Manager ...................................................................... 58
4.5 Security ..................................................................................................59
4.5.1 Security ............................................................................................................ 59
4.6 Power......................................................................................................60
4.6.1 Power ............................................................................................................... 60
4.7 Boot ........................................................................................................61

4.7.1 Boot .................................................................................................................. 61
4.8 Exit..........................................................................................................62
4.8.1 Exit.................................................................................................................... 62
Chapter 5. BMC Conguration Settings�������������������������������������������� 63
5.1 Method 1 (Use the BIOS Setup) ............................................................63
5.2 Method 2 (Use a Dos Tool - Syscheck) ................................................66
5.3 Login.......................................................................................................68
5.4 Web GUI ................................................................................................69
5.4.1 Menu Bar.......................................................................................................... 69
5.4.2 User Information and Quick Button ............................................................... 70
5.4.3 Dashboard........................................................................................................ 71
5.4.4 Sensor ............................................................................................................. 71
5.4.5 FRU Information............................................................................................... 71
5.4.6 Logs and Report .............................................................................................. 72
5.4.7 Settings ........................................................................................................... 72
5.4.8 KVM Mouse Setting ........................................................................................ 73
Chapter 6� Technical Support����������������������������������������������������������� 75
Contents

Copyright © 2018 AIC, Inc� All Rights Reserved�
This document contains proprietary information about
AIC products and is not to be disclosed or used except in
accordance with applicable agreements.

Document Release History
Release Date Version Update Content
2018 1 Manual release to public.
July
2018 3Content update
Febuary
2019 3.1 1. New cover
2. Motherboard/BIOS/BMC update
June
2019 3.3
1. Safety label
2. Image update
3. Dimm update

i
Copyright
No part of this publication may be reproduced, stored in a retrieval system, or
transmitted in any form or by any means, electronic, mechanical, photo-static, recording
or otherwise, without the prior written consent of the manufacturer.
Trademarks
All products and trade names used in this document are trademarks or registered
trademarks of their respective holders.
Changes
The material in this document is for information purposes only and is subject to change
without notice.
Warning
1. A shielded-type power cord is required in order to meet FCC emission limits and also
to prevent interference to the nearby radio and television reception. It is essential
that only the supplied power cord be used.
2. Use only shielded cables to connect I/O devices to this equipment.
3. You are cautioned that changes or modifications not expressly approved by the
party responsible for compliance could void your authority to operate the equipment.
Disclaimer
AIC shall not be liable for technical or editorial errors or omissions contained herein.
The information provided is provided "as is" without warranty of any kind. To the
extent permitted by law, neither AIC or its afliates, subcontractors or suppliers will be
liable for incidental, special or consequential damages including downtime cost; lost
profits; damages relating to the procurement of substitute products or services; or
damages for loss of data, or software restoration. The information in this document
is subject to change without notice.
Instruction Symbols
Special attention should be given to the instruction symbols below.
NOTE This symbol indicates that there is an explanatory or
supplementary instruction.
CAUTION This symbol denotes possible hardware impairment. Upmost
precaution must be taken to prevent serious harware damage.
WARNING This symbol serves as a warning alert for body injury. The user
may suffer possible injury from disregard or lack of attention.
Preface

ii
Before getting started, please read the following important cautions:
• All cautions and warnings on the equipment or in the manuals should be noted.
• Most electronic components are sensitive to electrical static discharge. Therefore, be
sure to ground yourself at all times when installing the internal components.
• Use a grounding wrist strap and place all electronic components in static-shielded
devices. Grounding wrist straps can be purchased in any electronic supply store.
• Be sure to turn off the power and then disconnect the power cords from your system
before performing any installation or servicing. A sudden surge of power could
damage sensitive electronic components.
• Do not open the system’s top cover. If opening the cover for maintenance is a must,
only a trained technician should do so. Integrated circuits on computer boards are
sensitive to static electricity. Before handling a board or integrated circuit, touch
an unpainted portion of the system unit chassis for a few seconds. This will help to
discharge any static electricity on your body.
• Place this equipment on a stable surface when install. A drop or fall could cause injury.
• Please keep this equipment away from humidity.
• Carefully mount the equipment into the rack, in such manner, that it won’t be
hazardous due to uneven mechanical loading.
• This equipment is to be installed for operation in an environment with maximum
ambient temperature below 35°C.
• The openings on the system are for air convection to protect the equipment from
overheating. DO NOT COVER THE OPENINGS.
• Never pour any liquid into ventilation openings. This could cause fire or electrical
shock.
• Make sure the voltage of the power source is within the specication on the label when
connecting the equipment to the power outlet. The current load and output power of
loads shall be within the specication.
• This equipment must be connected to reliable grounding before using. Pay special
attention to power supplied other than direct connections, e.g. using of power strips.
• Place the power cord out of the way of foot traffic. Do not place anything over the
power cord. The power cord must be rated for the product, voltage and current marked
on the product’s electrical ratings label. The voltage and current rating of the cord
should be greater than the voltage and current rating marked on the product.
Safety Instructions
ii

iii
• If the equipment is not used for a long time, disconnect the equipment from mains to
avoid being damaged by transient over-voltage.
• Never open the equipment. For safety reasons, only qualied service personnel should
open the equipment.
• If one of the following situations arise, the equipment should be checked by service
personnel:
1. The power cord or plug is damaged.
2. Liquid has penetrated the equipment.
3. The equipment has been exposed to moisture.
4. The equipment does not work well or will not work according to its user manual.
5. The equipment has been dropped and/or damaged.
6. The equipment has obvious signs of breakage.
7. Please disconnect this equipment from the AC outlet before cleaning. Do not
use liquid or detergent for cleaning. The use of a moisture sheet or cloth is
recommended for cleaning.
• Module and drive bays must not be empty! They must have a dummy cover.
CAUTION
The equipment intended for installation should be placed in Restricted Access
Location.
CAUTION
There will be a risk of explosion if battery is replaced by an incorrect type. Dispose
of used batteries according to the instructions. After performing any installation or
servicing, make sure the enclosure is correct in position before turning on the power.
CAUTION
This unit may have more than one power supply. Disconnect all power sources before
maintenance to avoid electric shock.
iii

Thank you for selecting and purchasing the FB122-PV.
This user's manual is provided for professional technicians to perform easy hardware
setup, basic system congurations, and quick software startup. This document presents
a brief overview of the product design, device installation, and firmware settings for
FB122-PV. For the latest version of this user's manual, please refer to the AIC website:
https://www.aicipc.com/en/productdetail/20883.
Chapter 1 Product Features
FB122-PV is a flexible storage server barebone that is specifically designed to
accommodate diverse corporations and enterprises for managing heavy workloads and
multiple applications.
Chapter 2 Hardware Setup
This chapter displays an easy installation guide for assembling the hardware in this
product. Utmost caution for proceeding to set up the hardware is highly advised. Most of
the components are highly fragile and vulnerable to exterior influence. Do not endanger
the device by placing the device in an unstable environment.
Chapter 3 Hardware Settings
This chapter provides descriptions for the hardware, including multifarious connectors,
jumpers, and LED descriptions. These descriptions assist users to configure different
settings and functions of the motherboard, as well as to confirm the location of each
connector and jumper.
Chapter 4 BIOS Conguration Settings
This chapter introduces the key features of BIOS, including the descriptions and option
keys for diverse functions. These details provide users to effortlessly navigate and
congure the input/output devices.
Chapter 5 BMC Conguration Settings
This chapter illustrates the diverse functions of IPMI BMC, including the details on logging
into the web page and assorted denitions. These descriptions are helpful in conguring
various functions through Web GUI without entering the BIOS setup. For more information
of BMC congurations, please refer to IPMI BMC (Aspeed2500) User's Manual for a more
detailed description.
Chapter 6 Technical Support
For more information or suggestion, please contact the nearest AIC corporation
representative in your district or visit the AIC website: http://www.aicipc.com/en. It is our
greatest honor to provide the best service for our customers.
About This Manual
iv

1
Chapter 1. Product FeaturesFB122-PV User Manual
FB122-PV is a high density storage server that includes mother board, chassis, power
supply, and HDD backplane. For more information about our product, please visit our
website at http://www.aicipc.com/en.
Before removing the subsystem from the shipping carton, visually inspect the physical
condition of the shipping carton. Exterior damage to the shipping carton may indicate
that the contents of the carton are damaged. If any damage is found, do not remove
the components; contact the dealer where the subsystem was purchased for further
instructions. Before continuing, rst unpack the subsystem and verify that the number
of components in the shipping carton is accurate and in good condition.
1�1 Box Contents
This product contains the components listed below.
Please conrm the number and the condition of the components before
installation.
•System barebone
(includes power supply, fan
& hard disk drive tray)
• Power cord (vary per region)
• 28" Slide rail x 1 set (optional)
Product features are subject to change without notice�
FB122-PV User Manual
Chapter 1� Product Features

2
Chapter 1. Product FeaturesFB122-PV User Manual
1�2 Specications
NOTE
This product doesn't support redundant function under 115 voltage AC inlet.
Dimensions
(W x D x H)
mm : 438 x 845 x 44.4
inches : 17.2 x 33.2 x 1.75
Motherboard AICServer Board Pavo
Processor
Processor
Support
• Intel® Xeon® Scalable Processors
(Skylake and next gen. CPU)
• Supports CPU TDP up to 140W
UPI Speeds 10.4 GT/s, 9.6 GT/s
Socket Type Socket P0 (LGA-3647 Socket)
Chipset Support Intel® Lewisburg C620 series PCH
System Memory
• 6 x memory channels per CPU,
1 x DIMM per channel
• 16 x DIMM slots support:
2666/2400MHz RDIMM/LRDIMM
(feature supports up to DDR4 2933MHz
by next gen. process upgrade)
- up to 192GB RDIMM SRx4
- up to 384GB RDIMM DRx4
- up to 1536GB RDIMM 3DS 8Rx4
- up to 768GB LRDIMM QRx4
- up to 1536GB LRDIMM 3DS 8Rx4
• Intel® NVM DIMM (Apache Pass) support by
next gen. Purley Refresh CPU
FrontPanel System power on/off, System ID, System reset, USB 2.0 Type A
LEDs Power status, System alert, System ID
Drive BaysExternal 2.5" hot swap
10 (U.2 NVMe)
2 (7mm, rear)
Backplanes 5 x 2-port PCIe BP with dual SFF-8643 connectors on each
Expansion Slots PCIe 3.0 • 1 x16 slot (FHHL)
• 1 x OCP mezzanine card V2.0
Riser Card
(included) RC-PE1U16-TY (1 x16 PCIe slot) +10 x OCULINK
System BIOS
BIOS TypeInsyde UEFI BIOS
BIOS Features
• ACP
• PXE
• WOL
• AC loss recovery
• SMBIOS
• Serial console
redirection
• Serial console redirection
• BIOS Recovery Mode
• SRIOV
• iSCSI
• TPM
• PICe Hotplug
On-board
Devices
SATA
Intel® Lewisburg PCH on-chip solution
• 4 x SATA 6.0 Gb/s (by 1 x mini-SAS HD) +
2 x SATA 6.0 Gb/s (by 2 x SATA 7 pin) +
5 x SATA 6.0 Gb/s (by Max I/O®)
BMC
Aspeed AST2500 Advanced PCIe Graphics &
Remote Management Processor
• Baseboard Management Controller
• Intelligent Platform Interface 2.0 (IPMI 2.0)
• iKVM, Media Redirection, IPMI over LAN,
Serial over LAN
• SMASH Support
• HTML5
Network
Controllers
• Intel® PCH (Lewisburg) Integrated 10GbE
LAN Controller with dual SFP+ rear connectors
• Intel® I350 dual ports GbE RJ45 rear
connectors
• Realtek RTL8211E for BMC dedicated
management port
Graphics
Aspeed AST2500 Advanced PCIe Graphics &
Remote Management Processor
• PCIe VGA/2D Controller
• 1920x1200@60Hz 32bpp
Rear I/O
LAN
• 2 x 10GbE SFP+
• 2 x GbE RJ45
• 1 x GbE RJ45 dedicated to BMC
management
USB 2 x USB 3.0 Type A
VGA 1 x external DB-15 VGA port
Serial Port 1 x audio jack for COM port
Power Supply 750W 1+1 redundant power supply 80+ Platinum
• AC INPUT: 100~240V or 115~204V,50/60Hz,8.8A-4.3A
System Cooling 6 x 40x56mm easy swap fans
System
Management
• IPMI 2.0
• KVM over IP
• Media redirection
• Temperature, fan, voltage, PSU sensor monitor
• System temperature
• System ID / System fail indicator
• Remote power on/off/reset
• SEL message alarm through mail
• SNMP support
• Intel NM
• HTML5
Environmental • Storage temperature : -10ºC(14ºF) ~ 60ºC(140ºF)
• Operating temperature : 0ºC(32ºF) ~ 35ºC(95ºF)
• Storage operating humidity : 5%~95% non-condensing
Gross Weight (w/ PSU & Rail)
kgs : 27
lbs : 59.5
Packaging
Dimensions(W x D x H)
mm : 615 x 1172 x 276
inches : 24.2 x 46.1 x 10.9
Mounting Standard28" tool-less slide rail

3
Chapter 1. Product FeaturesFB122-PV User Manual
FB122-PV is a reliable 1U storage server barebone with 10 hotswap drives bays. This
product is designed to accommodate the AIC-patented serverboard, Pavo, which sup-
ports two Intel®Xeon® Scalable Processors (Skylake and next generation CPU) and 16
DDR4 DIMM to offer greater perfomance, efciency, and utility for our customers. Featur-
ing Intel® C620 Series Chipset, which is emphasized for its accelerated speed and expan-
sion, this product enhances these advantages by integrating flexible IO usage and system
expansion into to provide greater bandwidth and utilization.
In addition to the noteworthy features of the barebone, FB122-PV provides immediate and
efcient management with Onboard Baseboard Management Controller and greater I/O
extension. Featuring IPMI 2.0 and Aspeed AST2500 Advanced PCIe Graphics, the server
board offers support for iKVM, Media Redirection, Smash Support, IPMI over LAN, and Se-
rial over LAN.
• 1U 10-Bay storage server supports 10PCIe SSD 2.5" FF drives (NVMe) to provide a
highly dense, all NVMe Flash storage array
• Supports two Intel® Xeon® Scalable Processors
• With Intel® Lewisburg C620 Series Chipset to provide 5+ years product life cycle
• Onboard Baseboard Management Controller for system management and IPMI control
• Two 10GbE RJ45 ports
• Front-to-back airflow and hot swap redundant fans to provide optimal thermal
conditions
• Customizable to meet your requirements
1�3 Features

4
Chapter 1. Product FeaturesFB122-PV User Manual
Front Panel
Control Panel
Control ICON System Behavior
System Power Button Power switch.
System ID System ID on or off.
System Reset Reset the system.
LED indicator
LED ICON Color System Behavior
Power Green Solid: System on
Off: System off
System ID Blue Blinking: System ID Activity
System Alert Red Solid: System alert

5
Chapter 1. Product FeaturesFB122-PV User Manual
Rear Panel
Item Feature Description
1Power socket 750W 1+1 redundant power supply 80+ Platinum
2LAN port Two10G SFP+ port
3LAN port Two GbE RJ45 port
4VGA port External DB-15 VGA port
5PCIe 3.0 slot One OCP Mezzaine card V2.0
6USB port Two USB 3.0 Type A
7Serial port One Audio jack for COM port
8LAN port One GbE RJ45 port dedicated to BMC management
9PCIe slot PCIe x16 slot (FHHL)
10 External 2.5" drive bay Two 2.5" hotswap drive bay (7mm)
  

  



6
Chapter 1. Product FeaturesFB122-PV User Manual
Major Components
750W 1+1 redundant power supply 80+ Platinum
AIC Server Board Pavo
6 x 40x56mm easy swap fan modules
10 x 2.5" hot swap drive bays

7
Chapter 2. Hardware SetupFB122-PV User Manual
2�1�1 Processor Support
The server board includes two processor sockets (LGA3647) that provides one or two
processors of the Intel® Xeon® Processor Scalable Family and supports a Thermal Design
Power (TDP) of up to 165W on selected models.
2�1 Central Processiong Unit Setup
Spica User Manual
Chapter 2� Hardware Setup

8
Chapter 2. Hardware Setup
FB122-PV User Manual
2�1�2 Processor Heat Sink Module and Processor Socket Assembly
Each processor socket on the server board is pre-assembled with a loading
mechanism that is designed to secure the Processor Heat Sink Module (PHM) to the
server board as shown below.
CAUTION
Previous generations of the Intel® Xeon® Processors and heat sinks are not compatible with
the Intel Server Board S2600BP Product Family. Processor installation requires that the pro-
cessor be attached to the installation onto the server board.
This information is provided for professional technicians only.

9
Chapter 2. Hardware SetupFB122-PV User Manual
2�1�3 Processor Heat Sink Module
The PHM refers to the sub-assembly where the heat sink and processor are clipped
together onto the server board prior to installation. The PHM consists of the
components shown below.
Processor Heat Sink Module (PHM) Sub-Assembly
Processor Heat sink Module (PHM)
This information is provided for professional technicians only.

10
Chapter 2. Hardware Setup
FB122-PV User Manual
The PHM sits level with the processor socket assembly. The PHM is NOT installed
properly if it does not sit level with the processor socket assembly. Once the PHM is
seated over the processor socket assembly, the four heat sink torque screws must be
tightened in order as shown below.
Processor Heat Sink – Top View with Screw Tightening Order
CAUTION
Failure to tighten the heat sink screws in the specied order may cause damage to the
processor socket assembly. Heat sink screws should be tighted to 12 in-lbs torque
according to the indicated order on the top of the heat sink label.
This information is provided for professional technicians only.


 