AIC HP201-AG User manual

UM_HP201-AG_v1_082021
HP201-AG
Storage Barebone
User's Manual

Table of Contents
Preface ������������������������������������������������������������������������������������������������ i
Safety Instructions ������������������������������������������������������������������������������ ii
About This Manual ����������������������������������������������������������������������������� iv
Chapter 1� Product Features �������������������������������������������������������������� 1
1.1 Box Contents ............................................................................................ 1
1.2 Specifications............................................................................................ 2
1.3 System Block Diagram.............................................................................. 3
1.4 Feature ....................................................................................................... 4
Chapter 2� Hardware Setup���������������������������������������������������������������� 7
2.1 Central Processing Unit ............................................................................ 7
2.1.1 Processor Installation.......................................................................................... 7
2.2 System Memory ...................................................................................... 10
2.2.1 DIMM Placement................................................................................................10
2.2.2 DIMM Population ...............................................................................................10
2.2.3 Installation..........................................................................................................11
2.3 Top Cover................................................................................................. 12
2.4 Power Supply Unit .................................................................................. 13
2.4.1 Installation..........................................................................................................13
2.4.2 LED Indicator ......................................................................................................13
2.5 Fan ........................................................................................................... 14
2.6 Disk Drive ................................................................................................. 15
2.6.1 External Disk Drive .............................................................................................15
2.6.2 Internal Disk Drive ..............................................................................................16
2.6.3 LED Indicator ......................................................................................................17
2.7 Node......................................................................................................... 18
2.8 Riser Card................................................................................................. 18
2.9 Air Duct .................................................................................................... 19
2.10 Slide Rail ............................................................................................... 20
Chapter 3� Hardware Settings ���������������������������������������������������������� 23
3.1 Motherboard ............................................................................................ 23
3.1.1 Block Diagram ...................................................................................................23
3.1.2 Content List ........................................................................................................24
3.1.3 Connector and Junper Placement ....................................................................25
3.1.4 Connector and Junper Pin Define .....................................................................26
3.1.5 Internal LED .......................................................................................................31
3.1.6 Rear I/O Panel ....................................................................................................33
3.2 SAS/U.2 Drive Backplane........................................................................ 34
3.2.1 Placement...........................................................................................................34
3.2.2 Connector and Jumper ......................................................................................34
3.2.3 Cable Routing .....................................................................................................37
Content

Chapter 4� BIOS Configuration Settings ������������������������������������������� 38
4.1 Navigation Keys....................................................................................... 38
4.2 Menu ....................................................................................................... 39
4.3 Main ......................................................................................................... 40
4.4 Advanced ................................................................................................. 41
4.4.1 Trusted Computing ............................................................................................41
4.4.2 ACPI Settings......................................................................................................41
4.4.3 AMD PBS ............................................................................................................42
4.4.4 AMD CBS ............................................................................................................42
4.4.5 Serial Port Console Redirection ........................................................................49
4.4.6 CPU Configuration..............................................................................................49
4.4.7 Debug Port Table Configuration........................................................................49
4.4.8 SIO Common Setting .........................................................................................49
4.4.9 SIO Configuration...............................................................................................49
4.4.10 PCI Subsystem Settings ..................................................................................50
4.4.11 USB Configuration............................................................................................50
4.4.12 Network Stack Configuration ..........................................................................50
4.4.13 CSM Configuration...........................................................................................50
4.4.14 T1s Auth Configuration....................................................................................51
4.5 Chipset ..................................................................................................... 52
4.6 Security .................................................................................................... 53
4.7 Boot.......................................................................................................... 54
4.8 Save and Exit ........................................................................................... 55
4.9 Event Logs ............................................................................................... 56
4.9.1 Change Smbios Event Log Settings..................................................................56
4.10 Server Mangement................................................................................ 57
Chapter 5� BMC Configuration Settings ������������������������������������������� 58
5.1 Login......................................................................................................... 58
5.2 Web GUI ................................................................................................... 59
5.2.1 Menu Bar.............................................................................................................59
5.2.2 User Information and Quick Button ..................................................................60
5.2.3 Dashboard ..........................................................................................................61
5.2.4 Sensor.................................................................................................................61
5.2.5 FRU Information .................................................................................................62
5.2.6 Logs and Report.................................................................................................63
5.2.7 Settings...............................................................................................................64
5.2.8 Remote Control ..................................................................................................66
5.2.9 Power Control.....................................................................................................70
5.2.10 Maintenance.....................................................................................................71
5.2.11 Sign out.............................................................................................................73
Chapter 6� Technical Support����������������������������������������������������������� 74
Content

Document Release History
Release Date Version Update Content
August, 2021 1 User's Manual release to public.

Copyright © 2021 AIC®, Inc� All Rights Reserved�
This document contains proprietary information about
AIC® products and is not to be disclosed or used except in
accordance with applicable agreements.

Copyright
No part of this publication may be reproduced, stored in a retrieval system, or transmitted
in any form or by any means, electronic, mechanical, photo-static, recording or otherwise,
without the prior written consent of the manufacturer.
Trademarks
All products and trade names used in this document are trademarks or registered
trademarks of their respective holders.
Changes
The material in this document is for information purposes only and is subject to change
without notice.
Warning
1. A shielded-type power cord is required in order to meet FCC emission limits and also
to prevent interference to the nearby radio and television reception. It is essential that
only the supplied power cord be used.
2. Use only shielded cables to connect I/O devices to this equipment.
3. You are cautioned that changes or modications not expressly approved by the party
responsible for compliance could void your authority to operate the equipment.
Disclaimer
AIC® shall not be liable for technical or editorial errors or omissions contained herein.
The information provided is provided "as is" without warranty of any kind. To the extent
permitted by law, neither AIC® or its aliates, subcontractors or suppliers will be liable
for incidental, special or consequential damages including downtime cost; lost prots;
damages relating to the procurement of substitute products or services; or damages
for loss of data, or software restoration. The information in this document is subject to
change without notice.
Instruction Symbols
Special attention should be given to the instruction symbols below.
NOTE This symbol indicates that there is an explanatory or
supplementary instruction.
CAUTION
This symbol denotes possible hardware impairment. Upmost
precaution must be taken to prevent serious harware damage.
WARNING
This symbol serves as a warning alert for potential body injury.
The user may suffer possible injury from disregard or lack of
attention.
Preface
i

Before you commence, please attentively read the following important discretions below. All
cautions and warnings on the equipment or in the manuals should be circumspectly noted
and reviewed.
Always ground yourself to prevent static electricity.Always ground yourself to prevent static electricity.
請請全程接地，以防止靜電。全程接地，以防止靜電。
请请全程接地，以防止静电。全程接地，以防止静电。
Всегда заземляйте себя, чтобы избежать статического электричества.Всегда заземляйте себя, чтобы избежать статического электричества.
Aard jezelf altijd om statische elektriciteit te voorkomen.Aard jezelf altijd om statische elektriciteit te voorkomen.
• Firmly ground yourself at all times when installing or assembling the internal
components of the server. Most of electronic components in the server are highly
sensitive to electrical static discharge.
• Use a solid grounding wrist strap and distintively place all electronic components in
static-shielded devices to prevent static. Grounding wrist straps can be purchased in
any electronic supply store.
• Confirm that the power source is turned off and then disconnect the power cords from
your system before performing any type of installation or manual servicing. A sudden
surge of power could serverly damage the sensitive electronic components.
• Do not precipitously open the system’s top cover. If you must open the cover for
maintenance purposes, only a trained technician should be allowed to proceed this
action. Integrated circuits on computer boards are highly sensitive to static electricity.
Before operating a board or integrated circuit, touch an unpainted portion of the system
unit chassis for a couple of seconds to discharge any static electricity on your body.
Place the server in a stable environment.Place the server in a stable environment.
請請將伺服器放置在穩定的環境中。將伺服器放置在穩定的環境中。
请请将伺服器放置在稳定的环境中。将伺服器放置在稳定的环境中。
Поместите сервер в стабильную среду.Поместите сервер в стабильную среду.
Plaats de server in een stabiele omgeving.Plaats de server in een stabiele omgeving.
• Place this equipment on a stable surface when installing. A small mild drop or fall could
cause fatal injury to both the equipment and the person handling the equipment.
• Please keep this equipment away from humidity to prevent vast rust and disintergration.
• Carefully and accurately mount the equipment into the rack. Uneven mechanical
loading may lead to hazadous consequences.
• This equipment is to be installed for operation in an environment with maximum
ambient temperature below 35°C.
• Review the environment before performing any installation or servicing. Keep the
equipment away from hazardous and uneven grounds.
• This server must be installed only in Restricted Acess Locations.
Handle equipment with care.Handle equipment with care.
請謹慎操作設備。請謹慎操作設備。
请谨慎操作设备。请谨慎操作设备。
Обращайтесь с оборудованием осторожно.Обращайтесь с оборудованием осторожно.
Behandel de apparatuur voorzichtig.Behandel de apparatuur voorzichtig.
• Do not cover the openings of the system. The openings on the system are for air
convection, which intentionally protect the equipment from overheating.
• Never pour any liquid into ventilation openings of the system. This could cause
catastrophic fire or electrical shock.
Safety Instructions
ii

• Ensure that the voltage of the power source is within the specification on the label
when connecting the equipment to the power outlet. The current load and output power
of loads must be within the specification.
• This equipment must be firmly connected to reliable grounding before usage. Pay
special attention to power supplied other than direct connections, e.g. using of power
strips.
• Place the power cord out of the way of foot traffic. Do not place anything over the
power cord. The power cord must be rated for the product, voltage and current marked
on the product’s electrical ratings label. The voltage and current rating of the cord
should be greater than the voltage and current rating marked on the product.
Pay attention to hardware maintenance.Pay attention to hardware maintenance.
注意硬體維護注意硬體維護。。
注意硬体维护注意硬体维护。。
Обратите внимание на обслуживание оборудования.Обратите внимание на обслуживание оборудования.
Besteed aandacht aan hardware-onderhoud.Besteed aandacht aan hardware-onderhoud.
• If the equipment is not used for a long time, disconnect the equipment from mains to
avoid being damaged by transient over-voltage.
• Module and drive bays must not be empty. They must have a dummy cover.
• Never open the equipment without professional assistence. For safety reasons, only
qualified service personnel should open the equipment.
• If one of the following situations arise, the equipment should be checked and tested by
service personnel:
1. The power cord or plug is damaged.
2. Liquid has penetrated the equipment.
3. The equipment has been exposed to moisture.
4. The equipment does not work well or will not work according to its user manual.
5. The equipment has been dropped and/or damaged.
6. The equipment has obvious signs of breakage.
7. Please disconnect this equipment from the AC outlet before cleaning. Do not
use liquid or detergent for cleaning. The use of a moisture sheet or cloth is
recommended for cleaning.
CAUTION
The equipment intended for installation should be placed in Restricted Access Location.
CAUTION
There will be a risk of explosion if battery is replaced by an incorrect type. Dispose
of used batteries according to the instructions. After performing any installation or
servicing, make sure the enclosure is correct in position before turning on the power.
CAUTION
This unit may have more than one power supply. Disconnect all power sources before
maintenance to avoid electric shock.
iii

Thank you for choosing and purchasing AIC® HP201-AG Storage Server Barebone.
This user's manual is prepensely designed for professional technicians to perform
dextrous hardware setup, basic system configurations and quick software startup.
This document pellucidly presents a brief overview of the product design, equipment
installation and firmware settings for our product HP201-AG. To download the latest
version of this manual, please refer to the AIC® website: https://www.aicipc.com/en/
productdetail/51170.
Chapter 1 Product Features
HP201-AG is a flexible 2U 4 node hyper-converged server that supports 24 hot swap 2.5-
inch drives bays for NVMe SSDs(U.2)/SATA/SAS. With the maximization of the memory
capacity and add-on card installation, this server is specifically designed to accommodate
diverse corporations and enterprises for managing heavy workloads and multiple
applications.
Chapter 2 Hardware Setup
A server is composed of multiple components and metal brackets. This chapter displays
an easy installation guide for assembling the hardware in this product. The installation and
removal of the internal component of the server are performed for technicians only. Utmost
caution for proceeding to set up the hardware is highly advised. Most of the components
are highly fragile and vulnerable to exterior influence. Do not endanger the device by
placing the device in an unstable environment.
Chapter 3 Hardware Settings
System boards are placed in the server to operate the whole system.This chapter
elaborates the overall layout of the system board which may vary according to the system.
Multifarious connectors, jumpers and LED functions and descriptions are listed in this
chapter. These descriptions assist professional technicians to configure different settings
of the motherboard and confirm the placement of each connector and jumper.
Chapter 4 BIOS Configuration Settings
BIOS(Basic Input Output System) is a firmware employed to operate the server's
initialization and to manage optimal runtime services for server systems. This chapter
introduces the key features of BIOS, including the descriptions and option keys for diverse
functions. These details provide users to effortlessly navigate and configure the input/
output devices.
Chapter 5 BMC Configuration Settings
This chapter illustrates the diverse functions of IPMI BMC, including the details on logging
into the web page and assorted definitions. These descriptions are helpful in configuring
various functions through Web GUI without entering the BIOS setup. For more information
of BMC configurations, please refer to IPMI BMC (Aspeed AST2500) User's Manual for a
more detailed description.
Chapter 6 Technical Support
For more information or suggestion, please contact the nearest AIC® corporation
representative in your district or visit the AIC® website: https://www.aicipc.com/en/index.
It is our greatest honor to provide the best service for our customers.
About This Manual
iv

1
Chapter 1� Product Features
HP201-AG is a high density storage server that includes motherboard, chassis, power sup-
ply and disk drives. For more information about our product, please visit our website at
https://www.aicipc.com/en/index.
Before removing the subsystem from the shipping carton, visually inspect the physical
condition of the shipping carton. Exterior damage to the shipping carton may indicate that
the contents of the carton are damaged. If any damage is found, do not remove the com-
ponents; contact the dealer where the subsystem was purchased for further instructions.
Before continuing, rst unpack the subsystem and verify that the number of components in
the shipping carton is accurate and in good condition.
1�1 Box Contents
This product contains the components listed below.
Please conrm the number and the condition of the components before
installation.
Pre-installed into the system Number
1600W redundant power supply 80+ Platinum 1+1
2.5-inch external hot swap disk drive tray
(6 * NVMe/SAS/SATA per node) 24
M.2 internal disk drive tray
(M.2 (NGFF)/M-Key/2280/Supports SATA or PCIe x2)) 2
Heat sink 2
Easy swap 60*56mm fan 4
Easy swap 60*38mm fan 1
AIC® Auriga motherboard 1
24-port NVMe/SAS/SATA backplane with high-density
connectors to bridge riser board 1
Accessory Item Number
Screw for 10 * 2.5" HDD, bottom: F(+),M3*4L,NI 96
Screw for 24 * 2.5" HDD, bottom: F(+),M3*4L,NI 40
EPE foam for front board: 563*510*105H 1
EPE foam for rear board: 563*510*105H 1
EPE foam for front tray: 563*300*145H 1
EPE foam for rear tray: 563*300*145H 1
EPE pad for rail: 130*100*45T 2
Power cord vary per region
BTO
28-inch tool-less slide rail assembly 1
2.5-inch internal hot swap SATA disk drive tray (2 per node) 8
2000W redundant power supply 80+ Platinum 1+1
Product features are subject to change without notice�