Analog Devices AD6122 User manual

REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
a
AD6122
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700 World Wide Web Site: http://www.analog.com
Fax: 781/326-8703 © Analog Devices, Inc., 2000
CDMA 3 V Transmitter IF Subsystem
with Integrated Voltage Regulator
FUNCTIONAL BLOCK DIAGRAM
I INPUT
Q INPUT
LOCAL
OSCILLATOR
INPUT
ATTENUATOR
LOW
DROPOUT
REGULATOR
COMMON-MODE
REFERENCE
OUTPUT
VREG
POWER-
DOWN 1 1.23 V
REFERENCE
OUTPUT
VPOS TEMPERATURE
COMPENSATION
GAIN
CONTROL
SCALE
FACTOR
GAIN CONTROL
VOLTAGE
INPUT
GAIN CONTROL
REFERENCE
VOLTAGE
INPUT
TRANSMIT
OUTPUT
IF AMPLIFIERS
QUADRATURE MODULATOR
POWER-
DOWN 2
IF AMPLIFIER
INPUT
QUADRATURE
MODULATOR
OUTPUT
ⴜ2
AD6122
VCC
FEATURES
Fully Compliant with IS98A and PCS Specifications
Linear IF Amplifier
–63 dB to +34 dB
Linear-in-dB Gain Control
Temperature-Compensated Gain Control
Quadrature Modulator
Modulates IFs from 50 MHz to 350 MHz
Integral Low Dropout Regulator
Accepts 2.9 V to 4.2 V Input from Battery
Low Power
10.4 mA at Midgain
<10 A Sleep Mode Operation
Companion Receiver IF Chip Available (AD6121)
APPLICATIONS
CDMA, W-CDMA, AMPS and TACS Operation
QPSK Transmitters
GENERAL DESCRIPTION
The AD6122 is a low power IF transmitter subsystem, specifi-
cally designed for CDMA applications. It consists of an I and Q
modulator, a divide-by-two quadrature generator, high dynamic
range IF amplifiers with voltage-controlled gain and a power-
down control input. An integral low dropout regulator allows
operation from battery voltages from 2.9 V to 4.2 V.
The gain control input accepts an external gain control voltage
input from a DAC. It provides 97 dB of gain control with a
nominal 75 dB/V scale factor. Either an internal or an external
reference may be used to set the gain-control scale factor.
The I and Q modulator accepts differential quadrature base-
band inputs from a CDMA baseband converter. The local oscil-
lator is injected at twice the IF frequency. A divide-by-two
quadrature generator followed by dual polyphase filters ensures
±1°quadrature accuracy.
The modulator provides a common-mode reference output to
bias the transmit DACs in the baseband converter to the same
common-mode voltage as the modulator inputs, allowing dc
coupling between the two ICs and thus eliminating the need to
charge and discharge coupling capacitors. This allows the fastest
power-up and power-down times for the AD6122 and CDMA
baseband ICs.
The AD6122 is fabricated using a 25 GHz f
t
silicon BiCMOS
process and is packaged in a 28-lead SSOP and a 32-leadless
LPCC chip scale package (5 mm ×5 mm).
OBSOLETE

REV. B
–2–
AD6122–SPECIFICATIONS
(TA= +25ⴗC, VCC = +3.0 V, LO = 2 ⴛIF, REFIN = 1.23 V, LDO Enabled, unless otherwise
noted) NOTE: All powers shown in dBm are referred to 1 k⍀.
Specification Conditions Min Typ Max Unit
MODULATOR LO = 260.76 MHz (2 ×IF), 100 mV p-p
500 mV p-p Differential I and Q Inputs;
Output Level Output Level Referred to a 1 kΩDifferential Load –21 dBm
Output Third Order Harmonic –50 dBc
I/Q Inputs
Differential Input Voltage Differential 500 mV p-p
Bandwidth –3 dB 20 MHz
Resistance 30 kΩ
Quadrature Accuracy ±1°
Amplitude Balance ±0.1 dB
Output Referred Noise 0.9 MHz to 5.0 MHz Offsets –169 dBm/Hz
Modulator Common-Mode Reference 1.408 V
LO Input Resistance Differential Input at 260.38 MHz 1.2 kΩ
LO Input Capacitance Differential Input at 260.38 MHz 2.4 pF
LO Carrier Leakage Bias I/Q Using MODCMREF –40 dBc
IF AMPLIFIER F
IF
= 130.38 MHz
Noise Figure VGAIN = 2.5 V, 1 kΩDifferential Load 10 dB
Input 1 dB Compression Point VGAIN = 2.5 V –32 dBm
Input Third-Order Intercept VGAIN = 2.5 V –24 dBm
Gain Flatness IF ±630 kHz ±0.25 dB
Input Capacitance Shunt Equivalent Model at 130.38 MHz 2.3 pF
Differential IF Input Resistance Shunt Equivalent Model at 130.38 MHz 680 Ω
Differential IF Output Resistance Per Pin at 130.38 MHz 4.2 kΩ
Differential IF Output Capacitance Per Pin at 130.38 MHz 2.0 pF
GAIN CONTROL INTERFACE
Gain Scaling Using Internal Reference 75 dB/V
Gain Scaling Linearity For a Typical Dynamic Range of 92 dB ±3 dB/V
Minimum Gain VGAIN = 0.5 V –63 dB
Maximum Gain VGAIN = 2.5 V +34 dB
Gain Control Response Time 90 dB Gain Change, Min Gain to Max Gain 0.7 µs
Input Resistance at REFIN 10 MΩ
Input Resistance at VGAIN 109 kΩ
POWER-DOWN INTERFACE
Logic Threshold High Power-Up on Logical High 1.34 V
Logic Threshold Low 1.30 V
Input Current for Logical High 0.1 µA
Turn-On Response Time Measure to Settling of AGC from Standby Mode 23 µs
Turn-Off Response Time To 200 µA Supply Current 187 ns
LOW DROPOUT REGULATOR External PNP Pass Transistor, VCE
SAT
= –0.4 V
Max, h
FE
= 100/300 Min/Max
Input Range 2.9–4.2 V
Nominal Output 2.70 V
Dropout Voltage 200 mV
Reference Output 1.23 V
POWER SUPPLY
Supply Range Bypassing Internal LDO 2.7–5.0 V
Supply Current VGAIN = 1.5 V (Unity Gain) 10.4 mA
Standby Current 7.8 µA
OPERATING TEMPERATURE
T
MIN
to T
MAX
–40 +85 °C
Specifications subject to change without notice.
OBSOLETE

REV. B
AD6122
–3–
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage DVCC, IFVCC, TXVCC to DGND,
IFGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 V
Internal Power Dissipation
2
. . . . . . . . . . . . . . . . . . . 600 mW
Operating Temperature Range . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300°C
ORDERING GUIDE
Temperature Package
Model Range Package Description Option
AD6122ARS –40°C to +85°C Shrink Small Outline Package (SSOP) RS-28
AD6122ARSRL –40°C to +85°C 28-Lead SSOP on Tape-and-Reel
AD6122ACP –40°C to +85°C Chip Scale Package (LPCC) CP-32
AD6122ACPRL –40°C to +85°C 32-Leadless LPCC on Tape-and-Reel
PIN CONFIGURATIONS
LDOC
PD1
PD2
223
322
421
520
619
718
817
124
10
31
11
30
12
29
13
28
14
27
15
26
16
25
NC
9
32
AD6122 Top View
(Not to Scale)
NC = NO CONNECT
LDOB
LDOGND
LDOGND
DGND
LOIPP
LOIPN
DVCC MODOPP
QIPP
QIPN
MODCMREF
IIPN
IIPP
IFGND
IFGND
TXOPP
TXOPN
TXVCC
IFGND
IFGND
IFINN
IFINP
MODOPN
IFVCC
REFOUT
REFIN
VGAIN
LDOE
LPCC Package
TOP VIEW
(Not to Scale)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AD6122
IFGND
TXVCC
TXOPN
TXOPP
DVCC
LOIPN
LOIPP
PD1
PD2
LDOE
LDOB
DGND
LDOGND
LDOC
IFINN
IFINP
MODOPN
MODOPP
QIPP
QIPN
MODCMREF
VGAIN
REFIN
REFOUT
IFVCC
IIPN
IIPP
IFGND
SSOP Package
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD6122 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Thermal Characteristics: 28-lead SSOP Package: θ
JA
= 115.25°C/W.
OBSOLETE

REV. B
AD6122
–4–
PIN FUNCTION DESCRIPTIONS
SSOP LPCC
Pin # Pin # Pin Label Description Function
1 30 PD1 Power-Down 1 IF Amplifier Power-Down Control Input; CMOS Com-
patible; HIGH = Entire IC Powers Down, LOW = IF
Amplifiers On.
2 31 PD2 Power-Down 2 Modulator Power-Down Control Input; CMOS Compat-
ible; HIGH = Modulator Off , LOW = Modulator On.
3 32 LDOE Low Dropout Regulator Pass Connects to Emitter of External PNP Pass Transistor
Transistor Emitter Connection and VCC.
4 1 LDOB Low Dropout Regulator Pass Connects to Base of External PNP Pass Transistor.
Transistor Base
5 2 LDOC Low Dropout Regulator Pass Connects to Collector of External PNP Pass Transistor.
Transistor Collector
6 3, 4 LDOGND Low Dropout Regulator Ground Ground.
7 5 DGND Digital Ground Ground.
8 6 LOIPP Local Oscillator “Positive” Input Connects to Local Oscillator; AC Coupled.
9 7 LOIPN Local Oscillator “Negative” Input Connects to Ground via Decoupling Capacitor.
10 8 DVCC Digital VCC Connects to Digital Supply.
11 9 TXOPP Transmit Output “Positive” Connects to Output Filter; AC Coupled.
12 10 TXOPN Transmit Output “Negative” Connects to Output Filter; AC Coupled.
13 11 TXVCC Transmit Output VCC Connects to LDO Output via Decoupling Network.
14 12, 13 IFGND IF Ground Ground.
15 14 IFINN IF Input “Negative” IF “Negative” Input from LC Roofing Filter.
16 15 IFINP IF Input “Positive” IF “Positive” Input from LC Roofing Filter.
17 16 MODOPN Modulator “Negative” If Output Output Modulator Output to LC Roofing Filter.
18 17 MODOPP Modulator “Positive” Output Modulator Output to LC Roofing Filter.
19 18 QIPP Q Input “Positive” Connects to Q “Positive” Output of Baseband IC.
20 19 QIPN Q Input “Negative” Connects to Q “Negative” Output of Baseband IC.
21 20 MODCMREF Modulator Common-Mode Connects to CDMA Baseband Converter Tx DAC
Reference Out Common-Mode Reference Input.
22 21 IIPN I Input “Negative” Connects to I “Negative” Output of Baseband IC.
23 22 IIPP I Input “Positive” Connects to I “Positive” Output of Baseband IC.
24 23, 24 IFGND Ground Connects to IF Ground.
25 NC No Connect
25 26 IFVCC IF VCC Connects to Decoupled Output of LDO Regulator.
26 27 REFOUT Gain Control Reference Output Provides 1.23 V Voltage Reference Output for DAC in
CDMA Baseband Converter and REFIN.
27 28 REFIN Gain Control Reference Input Accepts 1.23 V Reference Input from REFOUT or
External Reference.
28 29 VGAIN Gain Control Voltage Input Accepts Gain Control Input Voltage from External DAC.
Max Gain = 2.5 V; Min Gain = 0.5 V.
OBSOLETE

REV. B
AD6122
–5–
Test Figures
2
5
X1 VP
AD830
IDATA –15V
0.1F
MODCMREF
A=1
V–1
X2
Y1
Y2
VN
1
3
4
+15V
0.1F
8
7
2
5
X1 VP
AD830
–15V
0.1F
MODCMREF
A=1
X2
Y1
Y2
VN
1
3
4
+15V
0.1F
8
7
MUST BE EQUAL
LENGTHS
2
5
X1 VP
AD830
QDATA –15V
0.1F
MODCMREF
A=1
X2
Y1
Y2
VN
1
3
4
+15V
0.1F
8
7
2
5
X1 VP
AD830
–15V
0.1F
MODCMREF
A=1
X2
Y1
Y2
VN
1
3
4
+15V
0.1F
8
7
MUST BE EQUAL
LENGTHS
AD6122
IIPP
IIPN
QIPP
QIPN
LOIPP
LO INPUT
MODCMREF
10nF
10nF
0.1F
MOD_OUT
VREG OUT
450⍀
205⍀
450⍀
0.1F
VREG OUT
MODOPP
MODOPN
50⍀
50⍀
50⍀
50⍀
50⍀
50⍀
OUT
OUT
OUT
OUT
V–1
V–1
V–1
V–1
V–1
V–1
V–1
LOIPN
Figure 1. Quadrature Modulator’s Characterization Input and Output Impedance Matches
OBSOLETE

REV. B
AD6122
–6–
MOD OUT
I CHANNEL
Q CHANNEL
LO INPUT
IF IN
RF SOURCE 1
AUX MEAS
PORT
NOTE: RF CABLES FOR I AND Q PATHS MUST BE OF EQUAL LENGTH
IFTX OUT
I DATA
Q DATA
RF SOURCE 2
R&S FSEA20/30
SPECTRUM
ANALYZER
RF
INPUT
R&S
SMT03 RF
R&S
SMT03 RF
HPE3610
POWER SUPPLY
HP34970A
DATA ACQUISITION
& SWITCH CONTROL
DC MEASUREMENTS
& CONTROL BITS
TO RF SWITCHES
TEKTRONIX
AFG2002 500mVp-p DIFFERENTIAL
TEST BED MOTHERBOARD
Figure 3. General Test Set
10nF
10nF
0.1F
TO
SPECTRUM
ANALYZER
VREG OUT
453⍀
205⍀
453⍀
0.1F
VREG OUT
PULL-UP INDUCTORS CHOSEN
FOR PEAK RESPONSE AT THE
TEST FREQUENCY.
10nF
10nF
RF SOURCE
511⍀
383⍀
383⍀
4:1
IFINN
IFINP TXOPP
TXOPN
1:8
AD6122
Figure 2. IF Amplifier’s Characterization Input and Output Impedance Matches
OBSOLETE

REV. B
AD6122
–7–
10nF
10nF
0.1F
VREG OUT
453⍀
205⍀
453⍀
0.1F
VREG OUT
PULL-UP INDUCTORS CHOSEN
FOR PEAK RESPONSE AT THE
TEST FREQUENCY.
10nF
10nF
NOISE
SOURCE
REACTIVE
CONJUGATE
MATCH
TO NOISE
FILTER
METER
4:1
IFINN
IFINP TXOPP
TXOPN
1:8
AD6122
Figure 4. IF Amplifier’s Noise Figure Test Set
HP8116A
FUNCTION GEN.
4kHz, 0V TO 2.7V
SQ. WAVE
ROHDE & SCHWARZ
SMT03
100kHz, –30dBm
AD6122 TEST BED
PD1,
PD2
IFIN
IFOUT
TEKTRONIX TDS 744A
CH 1 WITH X10 PROBE
CH 2 WITH COAX CABLE
50⍀
b. Response Time from PD1 and PD2 Control to IF Output
HP8116A
FUNCTION GEN.
4 kHz, 0.5V TO 2.5V
SQ. WAVE
ROHDE & SCHWARZ
SMT03
100MHz, –30dBm
AD6122 TEST BED
AGC IFIN
IFOUT
TEKTRONIX TDS 744A
CH 1 WITH X10 PROBE
CH 2 WITH COAX CABLE
50⍀
a. Response Time from Gain Control to IF Output
Figure 5. Response Time Setup
OBSOLETE

REV. B
AD6122
–8–
A
–40
–140
–130
–120
–110
–100
–90
–80
–70
–60
–50
CL1
1
CU1
REF LEV
–40dBm
CENTER 130.38MHz 519kHz/DIV SPAN 5.19MHz
RBW
VBW
SWT
30kHz
100kHz
2s UNIT dBm
–49.18dBm
130.67458918MHz
–33.92dBm
–77.32dB
77.46dB
(T1)
1
CH PWR
ACP UP
AVE LOW
POWER –dBm
Figure 6. Spectral Plot at Modulator Outputs: ACPR
FREQUENCY –MHz
–50
50 350100
LO LEAKAGE –dBc
150 200 250 300
–45
–35
–40
Figure 7. Modulator LO Leakage vs. Output Frequency
OUTPUT FREQUENCY –MHz
–15
–20
–40
50 350100
OUTPUT DESIRED SIDEBAND LEVEL –
dBm REFERRED TO 1k⍀
150 200 250 300
–25
–30
–35
Figure 8. Modulator Output Desired Sideband vs.
Output Frequency Without Roofing Filter
–Typical Performance Characteristics
OUTPUT FREQUENCY –MHz
–30
–45
50 350100
UNDESIRED SIDEBAND –dBc
150 200 250 300
–35
–40
Figure 9. Modulator Output Undesired Sideband vs.
Output Frequency
MODULATOR, I = Q –dBV
–10
–15
–35
–14.0 –2.0–12.0
MODULATOR OUTPUT –dBm REFERRED
TO A 1k⍀DIFFERENTIAL LOAD
–10.0 –8.0 –6.0 –4.0
–20
–25
–30
Figure 10. Modulator Gain: Input (dBV) vs. Output (dBm)
OUTPUT FREQUENCY –MHz
–65
50 350100
THIRD HARMONIC –dBc
150 200 250 300
–45
–55
–60
–50
Figure 11. Modulator Third Harmonic
OBSOLETE

REV. B
AD6122
–9–
VGAIN –V
40
20
–80
0.5 2.51.0
GAIN –dB With a 1k⍀Load
1.5 2.0
0
–40
–60
–20
TA= –40ⴗC
TA= +85ⴗC
TA= +25ⴗC
Figure 12. IF Amplifier Response Curve: Gain vs.
VGAIN, T
A
= –40
°
C, +25
°
C, +85
°
C
VGAIN –V
45
25
–75
0.5 2.50.9
ERROR FROM PREDICTED VALVE –dB
1.3 1.7 2.1
5
–15
–55
–6.0
–5.0
–35
6.0
5.0
3.0
1.0
–1.0
GAIN –dB
–65
–45
–25
–5
15
35
4.0
2.0
0
–4.0
–3.0
–2.0
GAIN
GAIN ERROR
Figure 13. IF Amplifier Gain and Error vs. VGAIN
VGAIN –V
5.0
0
–25.0
0.5 2.50.9
IIP3 –dBm Referred to 1k⍀
1.3 1.7 2.1
–5.0
–15.0
–20.0
–10.0
Figure 14. IF Amplifier Input IP3 vs. VGAIN
SUPPLY VOLTAGE –V
–24
–25
–28
2.5 3.72.7
IIP3 –dBm Referred to 1k⍀
2.9 3.1 3.3 3.5
–26
–27
Figure 15. IF Amplifier Input IP3 vs. Supply Voltage
–23
–26
50 350100
IIP3 –dBm Referred to 1k⍀
150 200 250 300
–24
–25
FREQUENCY –MHz
Figure 16. IF Amplifier Input IP3 vs. Frequency
GAIN –dB
30.0
25.0
5.0
–10.0 40.00
NOISE FIGURE –dB
10.0 20.0 30.0
20.0
15.0
10.0
238MHz
313MHz
133MHz
Figure 17. IF Amplifier Noise Figure vs. Gain
OBSOLETE

REV. B
AD6122
–10–
FREQUENCY –MHz
40
20
–80
50 350100
GAIN –dB
150 200 250 300
0
–20
–60
–40
VGAIN = 2.5V
VGAIN = 2.0V
VGAIN = 1.5V
VGAIN = 1.0V
VGAIN = 0.5V
Figure 18. IF Amplifier Gain vs. Frequency for
VGAIN = 2.5 V, 2.0 V, 1.5 V, 1.0 V
A
–40
–130
–120
–110
–100
–90
–80
–70
–60
–50
CL1
1
CU1
CO
CO
–46.78dBm
130.38000000MHz
–31.93dBm
–66.95dB
–68.95dB
–0.28 dB
330.66132265kHz
(T1)
1
CH PWR
ACP UP
AVE LOW
REF LEV
–30dBm
CENTER 130.38MHz 600kHz/DIV SPAN 6MHz
RBW
VBW
SWT
30kHz
300kHz
2s UNIT dBm
–30
1(T1)
1
POWER –dBm
Figure 20. ACPR of Cascaded Modulator, 20 dB Pad and IF
Amplifier: Spectral Plot
VGAIN –V
18.0
16.0
8.0
0.5 2.5
TOTAL CURRENT CONSUMPTION –mA
1.0 1.5 2.0
14.0
12.0
10.0
Figure 19. Total Current Consumption vs. VGAIN
OBSOLETE

REV. B
AD6122
–11–
THEORY OF OPERATION
The CDMA Transmitter IF Subsystem (Figure 21) consists of
an I and Q modulator with a divide-by-two quadrature genera-
tor, high dynamic range IF amplifiers with voltage-controlled
gain, a low dropout regulator and power-down control inputs.
I and Q Modulator
The I and Q modulator accepts differential quadrature baseband
inputs from CDMA baseband converters. The LO is injected at
twice the IF frequency. A divide-by-two quadrature generator
followed by dual polyphase filters ensures ±1°quadrature accu-
racy (Figure 22).
For 500 mV p-p differential I and Q input signals, the output
power of the modulator will be –21 dBm referred to 1 kΩwhen
the output of the modulator is loaded with a 1 kΩdifferential
load. With the maximum input conditions stated above, the
modulator outputs are a 225 µA p-p differential current; conse-
quently, the output load will greatly affect the output power of
the modulator.
ⴜ2
180ⴗ
ⴜ2
POLYPHASE
FILTERS
I
Q
I
Q
2 ⴛIF
LO INPUT
QUADRATURE
OUTPUT TO
MODULATOR
Figure 22. Simplified Quadrature Generator Circuit
The I and Q modulator also provides a common mode reference
signal at the MODCMREF pin. This voltage is a dc voltage set
to 1.408 V when a 2.7 V supply is used. It is used to dc bias
the output of the DAC that provides I and Q inputs to the
modulator.
IF Amplifiers and Gain Control
The IF amplifiers provide an 86 dB linear in dB gain control
range. The input stage uses a differential, continuously variable
attenuator based on Analog Devices’ patented X-AMP™ topol-
ogy. This low noise attenuator consists of a differential R-2R
ladder network, linear interpolator and a fixed gain amplifier.
The IF amplifier’s input impedance is 1 kΩdifferential. Similar
to the I and Q modulator’s output, the IF amplifier’s output is a
differential current, which will vary depending upon the gain
control voltage. In order to achieve the specified gain, the out-
put of the IF amplifiers should be loaded with a 1 kΩdifferen-
tial load.
The gain control circuits contain both temperature compensa-
tion circuitry and a choice of internal or external reference for
adjusting the gain scale factor. The gain control input accepts
an external gain control voltage input from a DAC. It provides
97 dB of gain control range with a nominal 75 dB/V scale factor.
The external gain control input signal should be a clean signal.
It is recommended to filter this signal in order to eliminate the
noise that results from the DAC. If a noisy signal is used for the
gain control voltage, VGAIN inband and adjacent channel noise
peaking can occur at the output of the AD6122. A simple RC
filter can be employed, but care should be taken with its design.
If too big a resistor is used, a large voltage drop may occur
across the resistor, resulting in lower gain than expected (as a
result of a lower voltage reaching the AD6122). An RC filter
with a 20 kHz bandwidth, employing a 1 kΩresistor is appropri-
ate. This results in an 8.2 nF capacitor. The resulting circuit
is shown in Figure 23. Note that the input resistance at the
VGAIN pin is approximately 100 kΩ.
FROM
BASEBAND
CONVERTER
AD6122
VGAIN
1k⍀
8.2nF 109k⍀
Figure 23. Gain Voltage Filtering
I INPUT
Q INPUT
LOCAL
OSCILLATOR
INPUT
ATTENUATOR
COMMON-MODE
REFERENCE
OUTPUT
VREG
POWER-
DOWN 1 1.23 V
REFERENCE
OUTPUT
VPOS
TEMPERATURE
COMPENSATION
GAIN CONTROL
VOLTAGE
INPUT
GAIN CONTROL
REFERENCE
VOLTAGE
INPUT
TRANSMIT
OUTPUT
IF AMPLIFIERS
QUADRATURE MODULATOR
VCC
POWER-
DOWN 2
IF AMPLIFIER
INPUT
QUADRATURE
MODULATOR
OUTPUT
ⴜ2
AD6122
GAIN
CONTROL
SCALE
FACTOR
LOW
DROPOUT
REGULATOR
Figure 21. Block Diagram
X-AMP is a trademark of Analog Devices, Inc.
OBSOLETE

REV. B
AD6122
–12–
The AD6122’s overall gain, expressed in decibels, is linear in
dB with respect to the automatic gain control (AGC) voltage,
VGAIN. Either REFOUT or an external reference voltage con-
nected to REFIN may be used to set the voltage range for VGAIN.
When the internal 1.23 V reference, REFOUT, is connected to
REFIN , VGAIN will control the entire AGC range when it is
typically set between 0.5 V and 2.5 V. Minimum gain occurs at
minimum voltage on VGAIN and maximum gain occurs at maxi-
mum voltage on VGAIN. The maximum and minimum gain
will not change with a change in voltage at REFIN. Rather, the
slope of the gain curve will change as a result of a change in the
required range for VGAIN. Figure 24 shows the piecewise linear
approximation of the gain curve for the AD6122.
MINIMUM
GAIN
MAXIMUM
GAIN
GAIN –V/V
VGAIN –V
Figure 24. Piecewise Linear Approximation for the
AD6122 Gain Curve
Because the minimum and maximum gain from the AD6122
are constant, we can approximate the VGAIN range for a
given REFIN voltage by using Equation 1.
VGAIN GAIN MinGain REFIN
MaxGain MinGain REFIN=×+
(–).
–.
16 04
(1)
Where MaxGain is the maximum gain (+34 dB) in dB, MinGain
is the minimum gain (–63 dB) in dB, REFIN is the reference
input voltage, in volts, VGAIN is the gain control voltage input,
in volts, and GAIN is the particular gain, in dB, we would have
for a given REFIN and VGAIN. Consequently, for any REFIN
we choose, we can calculate the VGAIN range by solving
Equation 1 for VGAIN. For example, in order to determine the
VGAIN value for the maximum gain condition, given a 1.23 V
REFIN, we can solve Equation 1 for VGAIN by substituting
+34 dB for GAIN and MaxGain, –63 dB for MinGain and 1.23 V
for REFIN. VGAIN can then be calculated to be 2.46 V, or
approximately 2.5 V. For the minimum gain condition, we can
determine the VGAIN value by substituting 34 dB for MaxGain,
–63 dB for GAIN and MinGain and 1.23 V for REFIN. VGAIN
can then be calculated to be 0.492 V or approximately 0.5 V.
Power-Down Control
The AD6122 can be operated with the IF amplifiers and quadra-
ture modulator both powered up, both powered down or with
the IF amplifiers powered up and the modulator powered down.
The AD6122 cannot operate with only the modulator powered
up. The control is provided via two control pins, PD1 and PD2.
Table I shows the operating modes of the AD6122.
Table I. Operating Modes
PD1 PD2 IF Amp Modulator
0 0 ON ON
0 1 ON OFF
1 0 INVALID STATE INVALID STATE
1 1 OFF OFF
Low Dropout Regulator
The AD6122 incorporates an integrated low dropout regulator.
The regulator accepts inputs from 2.9 V to 4.2 V and supplies a
constant 2.7 V reference output at LDOC. The 2.7 V signal can
be used to provide the dc voltages required for the DVCC,
TXVCC and IFVCC dc supplies. In order to configure the low
dropout regulator, an external pass transistor is required. A pnp
bipolar junction transistor with a minimum h
FE
of 100 and a
maximum h
FE
of 300 and a VCE
SAT
of –0.4 V is required. In
order to use the low dropout regulator, configure the transistor as
shown in Figure 25. The 18 pF capacitor in Figure 25 is used for
decoupling the 2.7 V dc signal.
In addition to the low dropout regulator, a band-gap voltage
reference produces a 1.23 V reference voltage at REFOUT.
This reference voltage will be present whenever a 2.7 V dc sig-
nal is present on pin LDOC. This 1.23 V reference voltage can
then be used to provide the gain reference signal required for
REFIN and the reference voltage for the transmit DACs in a
baseband converter.
AD6122
LDOE
LDOC
LDOB
18pF
2.9V –4.2V
2.7V
REFOUT 1.23V
PASS
TRANSISTOR
Figure 25. Configuring the Low Dropout Regulator
It is possible to bypass the low dropout regulator on the AD6122
and use an external regulator instead. In order to bypass the
integrated low dropout regulator, connect pins LDOE, LDOB
and LDOC together and then connect them all to the 2.7 V
external regulator voltage. This configuration is shown in
Figure 26. Even when the low dropout regulator is bypassed,
the 1.23 V reference voltage at pin REFOUT is still present.
OBSOLETE

REV. B
AD6122
–13–
FROM EXTERNAL
VOLTAGE REGULATOR
AD6122
LDOE
LDOC
LDOB
REFOUT 1.23V
Figure 26. Configuration for Bypassing the Low Dropout
Regulator
ROOFING FILTER
Because the outputs of the AD6122 modulator are open collec-
tor, the parasitic capacitances seen at the output of the modula-
tor, and inputs of the IF amplifiers, are high enough to create a
low-pass filter, which may attenuate the IF signal. Consequently,
the parasitic capacitance must be cancelled by using external
inductors to form a parallel resonant circuit. The external in-
ductors and the internal parasitic capacitors form what is known
as the roofing filter, with the resonant frequency given by
Equation 2.
f
LC
PAR
0
1
2
=π
(2)
where f
0
is the IF frequency, in Hertz, C
PAR
is the total parasitic
capacitance in Farads, and Lis the value of external inductors,
in henrys.
The roofing filter may be composed of the pull-up inductors
required on the open collector outputs of the I and Q modula-
tor. This configuration is shown in Figure 27. The 10 nF ca-
pacitors are used for ac coupling.
AD6122
MODOPP
MODOPN
IFINP
IFINN
L/2
2CPAR
2CPAR
ATTENUATOR
10nF
L/2 10nF
PARALLEL
RESONANT
CIRCUIT
10nF
VCC
Figure 27. Roofing Filter Configuration
The attenuator is discussed in the next section entitled Measur-
ing Adjacent Channel Protection Ratio (ACPR).
In order to confirm whether the roofing filter has been correctly
designed, sweep the LO frequency and view the output of the IF
amplifier on a spectrum analyzer. The signal should peak at the
IF frequency if the inductor value is correct. The Q of the filter
should be low enough so that variations in the parasitic capaci-
tances should be negligible.
The value of inductor required will be a function of the IF fre-
quency at which we are operating. The values of inductors used
during characterization at Analog Devices are shown in Table
II. Because the exact value will also be a function of printed
circuit board layout, we will have to vary the value from those in
Table II to those required for our board.
Table II. Roofing Filter Inductor Values
Value of Roofing Filter
IF Frequency (MHz) Inductor (nH)
50–125 470
126–200 150
201–275 68
276–350 27
It should be noted that the roofing filter is only required when
cascading the output from the I/Q modulator to the input of the
IF amplifiers. If we are driving into the IF amplifiers directly, no
roofing filter is required, however, pull-up inductors are required
in order to set the dc voltage of the open collector modulator
outputs.
MEASURING ADJACENT CHANNEL POWER RATIO
(ACPR)
At maximum IF gain and specified input conditions (500 mV
p-p baseband inputs), the output of the I/Q modulator is 11 dB
greater than the P1 dB (one dB compression point) of the IF
amplifiers. This configuration maximizes the ratio of signal to
LO feedthrough and also maximizes the signal to noise ratio.
Once these ratios are maximized, we can attenuate the noise,
signal and LO feedthrough without affecting the ratios. There-
fore, attenuation is required between the I/Q modulator and the
IF amplifiers.
In order to determine exactly how much attenuation is required,
we must recognize that ACPR is a function of the attenuation
from the modulator outputs to the IF amplifier inputs. As a
result, in order to determine how much attenuation is required,
we must first know how good an ACPR performance is desired.
If too much attenuation is applied, the ACPR will be very good,
but, the IF amplifier’s output power level will be low, possibly
resulting in poor signal to noise ratio and possibly requiring
additional amplification external to the AD6122.
An appropriate method that can be used to provide the correct
amount of attenuation between the modulator outputs and the
IF amplifier inputs is a simple differential voltage divider. The
topology and its design equations are shown in Figure 28 and
Equations 3 and 4. The input impedance of the IF amplifiers is
typically 1 kΩ. As a result, if we design resistor R2 to be much
less than 1 kΩ, we can neglect the effects of the IF amplifier’s
input impedance on the attenuator.
OBSOLETE

REV. B
AD6122
–14–
R2
R1
MODOPP
MODOPN
IFINP
IFINN
ZIN
R1
RSHUNT >>R2
AD6122
Figure 28. Pad Topology
LR
RR
=
+
20
1
1
1
1
1
22
log
/
(3)
ZRR
IN =+21 2
(4)
where Lis the transducer loss (or loss through the pad) in dB
and Z
IN
is the desired input resistance in ohms. Using these
equations, we can design the attenuator circuit to provide what-
ever amount of attenuation we require.
I
Q
LO
MODULATORS
500mV p-p
DIFFERENTIAL
500mV p-p
DIFFERENTIAL
100mV p-p
DIFFERENTIAL
20dB
ATTENUATOR
VGAIN = 2.5V
GAIN = +34dB
TRANSMIT
OUTPUT
IF AMPLIFIERS
–21dBm
(REFERRED TO 1k⍀)
252.1mV p-p DIFFERENTIAL
–41dBm
(REFERRED TO 1k⍀)
25.21mV p-p
DIFFERENTIAL
–7dBm
(REFERRED TO 1k⍀)
1.263V p-p DIFFERENTIAL
MODOP IFIN
Z
OUT
= 1k⍀
1k⍀
ⴜ2
Z
IN
= 1k⍀
VCC
Figure 29. Level Diagram
This circuit is very sensitive to parasitic capacitances. As a re-
sult, extra care should be taken to ensure minimum and equal
printed circuit board transmission lines. We should also try to
keep R2 small in order to minimize the effects of printed circuit
board parasitic capacitance on loading the output of the pad.
In conclusion, we have to develop a system-level ACPR budget
for our radio, and from that budget determine how much ACPR
performance we desire from the AD6122. We then need to imple-
ment the appropriate attenuation network to get that ACPR
performance.
LEVEL DIAGRAM
Figure 29 is provided to better understand the different voltage
levels you can expect to see at different points of the AD6122. It
represents the voltage and power levels expected for a maximum
input condition of 500 mV p-p at the I and Q modulator and
maximum gain in the IF amplifiers. When trying to make these
measurements, a high impedance (10 MΩ) active FET probe
(for example, the Tek P6204, from Tektronix) should be used to
minimize the effects of loading the circuit with the probe.
In order to produce these results, the attenuator is designed to
have a 1 kΩinput impedance and the output of the IF amplifiers
are loaded with 1 kΩ. The roofing filter is designed to resonate
the parasitic capacitance at the IF frequency.
OBSOLETE

REV. B
AD6122
–15–
INPUT INTERFACES
The AD6122 interfaces to CDMA baseband converters provid-
ing either IF or baseband outputs. The baseband input is pro-
vided by direct connection of the baseband converter’s baseband
output to the baseband input of the AD6122 (Figure 30). The
IF amplifier’s gain control is provided by connection of the
transmit AGC DAC’s output on the baseband converter, through a
low-pass filter to the VGAIN pin on the AD6122.
GAIN
CONTROL
SCALE
FACTOR
LOW
DROPOUT
REGULATOR
VCC
TEMPERATURE
COMPENSATION
TXVCC
IFINN
PD1
ⴜ2
AD6122
PD2
IFINP
TX AGC DAC
CDMA
BASEBAND
IC
EXT REF IN
IOUTPUT
IOUTPUT
VCM REF IN
QOUTPUT
QOUTPUT
IFVCC
IFGND
IIPP
IIPN
QIPN
QIPP
MODCMREF
MODOPN
MODOPP
REFOUT
REFIN
VGAIN
I
Q
TXOPN
TXOPP
IFGND
DVCC
LOIPN
LOIPP
DGND
LDOGND
LDOC
LDOB
LDOE
VCC VCC
Figure 30. Typical Connections to Baseband IC Using I and Q Inputs with SSOP Package
OBSOLETE

REV. B
AD6122
–16–
AD6122 Evaluation Board
The AD6122 Evaluation Board consists of an AD6122, I/O con-
nectors, a 20-pin dual header, 2-pin headers and four AD830
high speed video difference amplifiers. It allows the user to
evaluate the AD6122’s IF amplifier and modulator together or
separately. Because the AD6122 may be used at any IF from 50
MHz to 350 MHz, pads are provided on the LOIPP input,
TXOP output, MODOP output and IFIP inputs to allow the
user to add matching networks. The board is configured for an
IF frequency of 130.38 MHz when shipped. There is no differ-
ence between the configuration of the boards with the SSOP or
LPCC package.
The AD830s are used to provide single-ended to differential
conversion and the appropriate phase shift for the I and Q data
input pins. As a result, a single-ended signal generator can be
used to generate these signals.
In order to test the power-down modes of the AD6122, locate
the two pin headers on the AD6122 evaluation boards labeled
PD1 and PD2. By open-circuiting the pins labeled PD1, the IF
amplifiers power down. By open-circuiting the pins labeled
PD2, the modulator powers down. Note that the IF amplifiers
and modulator are powered down unless the pins on the two pin
headers, PD1 and PD2, are short circuited.
The IF input port impedance match used during characteriza-
tion of the AD6122 at Analog Devices is as follows:
IFINP
IFINN
AD6122
SIGNAL
GENERATOR
511⍀
383⍀
383⍀
50⍀
1k⍀
1:8
Figure 31. IF Input Port Impedance Match Used During
Characterization at ADI
This is a broadband lossy match used for characterization over
the 50 MHz to 350 MHz frequency range. All dBm references
in the characterization data collected using this match are refer-
enced to 1 kΩ. Note that the 1:8 ratio in Figure 31 is an imped-
ance ratio and not a voltage ratio.
The IF output port impedance match used during characteriza-
tion at Analog Devices is as follows:
TXOPP
AD6122
SPECTRUM
ANALYZER
205⍀
453⍀
453⍀
50⍀
1k⍀
4:1
TXOPN
Figure 32. IF Output Port Impedance Match Used During
Characterization at ADI
This is a broadband lossy output match for the 50 MHz to
350 MHz frequency range. The 4:1 ratio in Figure 32 is an
impedance ratio and not a voltage ratio.
As shipped, the board is configured as follows:
1. J1 is open and J2 is shorted. This enables the LDO regulator.
The external PNP transistor should remain in place even
when the regulator is bypassed (the Pin LDOB is pulled up
by the transistor).
2. X11, X25, X18 and X26 are shorted and X12, X14, X19
and X21 are opened in order to connect the output of the
modulator to the input of the IF amplifiers.
3. L4 and L5, the roofing filter components are optimized for
an IF frequency of 130.38 MHz.
4. R14, R15 and R16 set the attenuation between the modula-
tor outputs and the IF amplifier inputs to 20 dB.
5. PD1 and PD2 are pulled low by the jumpers on the two pin
headers. To power down the chip, set PD1 and PD2 high by
removing the jumpers.
In order to look at the modulator and IF amplifiers separately,
disconnect the output of the modulator from the input of the IF
amplifiers. This is accomplished by short circuiting X12, X14,
X19 and X20 and open circuiting X11, X18, X25 and X26.
OBSOLETE

REV. B
AD6122
–17–
Table III describes the high frequency signal connectors on the
AD6122 customer sample boards.
Table III. Evaluation Board SMA Signal Connector
Description
Connector Description
I CH I Modulator Input. 250 mV p-p into 50 Ω
termination, dc coupled. The level shifting and
phase splitting is done on board by the AD830
amplifiers.
Q CH Q Modulator Input. 250 mV p-p into 50 Ω
termination, ac coupled. The level shifting and
phase splitting is done on board by the AD830
amplifiers.
MODOP Modulator Output. The differential-to-single
ended conversion is performed by a balun on
the board. Impedance matched to 50 Ωfor
130.38 MHz IF frequency.
IFIP IF Amplifier Input. Single-ended-to-differential
conversion performed by a balun on board.
Impedance matched to 50 Ωfor 130.38 MHz IF
frequency.
TXOP IF Amplifier Output. Differential-to-single-
ended conversion performed by a balun on
board. Impedance matched to 50 Ωfor 130.38
MHz IF frequency.
LOIPP Local oscillator positive input at 2 ×IF
frequency.
Table IV lists the connections for the 20-pin power-supply
connector.
Table IV. 20-Pin Power Supply Connection Information
Pin # Function
1 VPOS for AD6122; 2.9 V to 4.2 V using regulator; 2.7 V
to 4.2 V bypassing regulator.
2 VPOS for AD6122; 2.9 V to 4.2 V using regulator; 2.7 V
to 3.6 V bypassing regulator.
3 Ground.
4 Ground.
5 Ground.
6 Regulated Output or Input Voltage; Connects to Pin 5
on AD6122.
7 Ground.
8 Ground.
9 Ground.
10 Ground.
11 Ground.
12 PD1; Power-Down 1 Input.
13 Ground.
14 1.23 V Reference Voltage from AD6122.
15 Ground.
16 VGAIN; Gain Control Voltage Input.
17 –15 V Supply for AD830 Differential Amplifier.
18 +15 V Supply for AD830 Differential Amplifier.
19 MODCMREF; common-mode reference output for
baseband converter common-mode reference input.
20 PD2; Power-Down 2 Input.
A schematic diagram of the evaluation board is on the next two
pages.
OBSOLETE

REV. B
AD6122
–18–
VREG OUT
FMMT4403CT-ND
VPOS
2.9V –4.2V
LOIPP
X1
L2
220nH
X6
3pF
X5
100nH 1:8
T1
TXOP
DVCC
X4
L3
220nH
C25
10nF
VCC
TXVCC
C10
10nF
C9
10nF
X12
X13
X14
C30
L6
X11
0⍀X25
0⍀
C8
10nF
QIPP
L4
180nH
L5
180nH
8:1
X17
X15
4pF
T2
X16
100nH MODOP
X8
0⍀
C3
10nF
X10
0⍀
X7 X9
C4
10nF
VGAIN
REFOUT
IFVCC
VREG OUT
C24
0.1F
X3
C1
10nF
X2
0⍀
C2
10nF
C23
18pF
PD1
PD2
J1
J2
0⍀
C11
10nF R13
R16
R15
R14
X19
X20
X21
X18
0⍀
X26
0⍀
IIPP
IIPN
QIPN
MODCMREF
C29
10nF
IFIP
R14 = 442⍀
R15 = 100⍀
R16 = 442⍀
C27
10nF
C26
10nF
VREG OUT
R12
0⍀
X24
X23
27nH
T3
X22
56nH
VCC
C28
10nF
AD6122
PD1
PD2
LDOE
LDOB
LDOC
LDOGND
DGND
LOIPP
LOIPN
DVCC
TXOPP
TXOPN
TXVCC
IFGND
MODCMREF
IIPN
IIPP
IFGND
IFVCC
REFOUT
REFIN
VGAIN
QIPN
QIPP
MODOPP
MODOPN
IFINP
IFINN
Q1
8:1
Figure 33. Schematic Diagram of the Evaluation Board
OBSOLETE

REV. B
AD6122
–19–
2
5
AD830
ICH C16
0.1F
MODCMREF
A=1
V–1
1
3
4
8
7
2
5
AD830
A=1
1
3
4
+15V
C17
0.1F
8
7
TO
IIPP
R7
50⍀
R6
50⍀
MODCMREF
C18
0.1F
TO
IIPN
U2
U3
C15
0.1F
+15V
R8
50⍀
–15V
–15V
SOIC PACKAGE
V–1
V–1
V–1
P1
3
7
11
15
19
1
5
9
13
17
L1
470nH
REFOUT
VGAIN
FROM VPOS
2.9V–4.2V
VREG OUT
+15V
PD2
P2
4
8
12
16
20
2
6
10
14
18
–15V
MODCMREF
R4
10k⍀
R5
10k⍀
PD1 PD2
VPOS
PD1
C6
18pF
R1
10⍀
C13
0.01F
C5
18pF
R2
10⍀
C12
0.01F
C7
18pF
R3
10⍀
C14
0.01F
TO
DVCC
TO
IFVCC
TO
TXVCC VREG OUT
2
5
AD830
QCH C20
0.1F
MODCMREF
A=1
1
3
4
8
7
2
5
AD830
A=1
1
3
4
+15V
C21
0.1F
8
7
TO
QIPP
R10
50⍀
R9
50⍀
MODCMREF
C22
0.1F
TO
QIPN
U4
U5
C19
0.1F
+15V
R11
50⍀
–15V
–15V
SOIC PACKAGE
V–1
V–1
V–1
V–1
NOTES:
1. TO USE THE LDO REGULATOR, SHORT J2 AND OPEN J1.
2. TO BYPASS THE REGULATOR, SHORT J1 AND OPEN J2
3. TO CONNECT THE OUTPUT OF THE MODULATOR TO THE
INPUT OF THE IF AMP, SHORT J5 AND J6.
TO TEST THE MODULATOR AND THE IF AMP SEPARATELY,
OPEN J5 AND J6.
4. INDICATES A 50⍀TRACE.
Figure 34. Schematic Diagram of the Evaluation Board
OBSOLETE

REV. B
–20–
C00946a–.5–6/00 (rev. B)
PRINTED IN U.S.A.
AD6122
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
28-Lead SSOP
(RS-28)
28 15
141
0.407 (10.34)
0.397 (10.08)
0.311 (7.9)
0.301 (7.64)
0.212 (5.38)
0.205 (5.21)
PIN 1
SEATING
PLANE
0.008 (0.203)
0.002 (0.050)
0.07 (1.79)
0.066 (1.67)
0.0256
(0.65)
BSC
0.078 (1.98)
0.068 (1.73)
0.015 (0.38)
0.010 (0.25) 0.009 (0.229)
0.005 (0.127)
0.03 (0.762)
0.022 (0.558)
8°
0°
32-Leadless Chip Scale Package (LPCC)
(CP-32)
1
32
9
8
17
BOTTOM
VIEW
25
24
16
0.018 (0.45)
0.016 (0.40)
0.014 (0.35)
0.138 (3.50) BSC
PIN 1
INDICATOR
0.015 (0.38)
0.012 (0.30)
0.009 (0.23)
0.128 (3.25)
0.106 (2.70)SQ
0.049 (1.25)
0.020 (0.50)
BSC
0.039 (1.00)
0.035 (0.90)
0.031 (0.80)
0.002 (0.05)
0.001 (0.02)
0.000 (0.00)
0.010
(0.25)
REF
0.205 (5.20)
0.197 (5.00) SQ
0.189 (4.80)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS
DIMENSIONS MEET JEDEC MO-220-VHHD-2
OBSOLETE
This manual suits for next models
4
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