XIMEA xiQ series User manual

xiQ
[ksi-kju: or sai-kju:]
•USB 3.0 camera series
Technical Manual
Version 1.02, July 1st, 2013

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1. Introduction
1.1. About This Manual
Dear customer,
Thank you for purchasing a product from XIMEA.
We hope that this manual can answer your questions, but should you have any further questions or if you wish to claim a
service or warranty case, please contact your local dealer or refer to the XIMEA Support on our website:
www.ximea.com/support
The purpose of this document is to provide a description of the XIMEA xiQ-Series cameras and to describe the correct way to
install related software and drivers and run it successfully. Please read this manual thoroughly before operating your new
camera for the first time. Please follow all instructions and observe the warnings.
This document is subject to change without notice.
1.2. About XIMEA
XIMEA is one of the worldwide leaders for innovative camera solutions with a 20-year history of research, development and
production of digital image acquisition systems. Based in Slovakia, Germany and the US and with a global distributor network,
XIMEA offers their cameras worldwide. In close collaboration with customers XIMEA has developed a broad spectrum of
technologies and cutting-edge, highly competitive products.
XIMEA's camera centric technology portfolio comprises a broad spectrum of digital technologies, from data interfaces such as
FireWire, USB 2.0 and USB 3.0, to cooled digital cameras with CCD and CMOS sensors, as well as smart cameras with
embedded PCs, and X-ray cameras. XIMEA has three divisions –generic machine vision and integrated vision systems,
scientific imaging and OEM/custom.
XIMEA cameras find use in many industrial applications, such as motion control, robotics, or quality control in manufacturing.
The broad spectrum of cameras also includes thermally stabilized X-ray cameras, and specialty cameras for medical
applications, research, surveillance and defense.
1.2.1. Contact XIMEA
XIMEA is a worldwide operating Company
Headquarter
Sales worldwide
XIMEA GmbH
Hansestraße 81
48165 Münster
Germany
Tel: [phone]
Fax: [phone]
Sales America, Australia,
New Zealand
XIMEA Corp.
2102 Beech Court
Golden, CO 80401
USA
Tel: [phone]
Fax: [phone]
R&D, Production
XIMEA s.r.o.
Lesna 52
900 33 Marianka
Slovakia
Internet www.ximea.com
General inquiries [email protected]om
Sales [email protected]om
Support [e-mail]

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1.3. Standard Conformity
The xiQ cameras have been tested using the following equipment:
•A shielded USB 3.0 cable ref. CBL-U3-3M0 (3m)
•A shielded I/O Sync cable ref. CBL-MQSYNC-3M0 (3m)
Warning: Changes or modifications to the product may render it ineligible for operation under CE, FCC or other jurisdictions.
XIMEA recommends using the above configuration to ensure compliance with the following standards:
1.3.1. CE Conformity
The xiQ cameras described in this manual comply with the requirements of the
•EC EMC Directive 2004/108/EEC
electromagnetic compatibility of equipment
Used harmonized European standards and technical specifications:
•EN 55022:2006 + A2:2010)
Information technology equipment –Radio disturbance characteristics –Limits and methods of measurement
•EN 55024:2010
Information technology equipment - Immunity characteristics - Limits and methods of measurement
•EN 61000-6-2:2005 Electromagnetic compatibility (EMC). Generic standards. Immunity for industrial environments
•EN 61000-6-3:2007 + A1:2011
Generic standards –Emission standard for residential, commercial and light-industrial environments
•EN 61000-6-4:2007 + A1:2011
Electromagnetic compatibility (EMC) - Part 6-4: Generic standards - Emission standard for industrial environments
•EN 61000-4-2:2009 Electrostatic discharge immunity test
•EN 61000-4-3:2006 + A2:2010
Radiated, radio-frequency electromagnetic field immunity test
•EN 61000-4-4:2012 Electrical fast transient/burst immunity test
•EN 61000-4-6:2009 Immunity to conducted disturbances, induced by radio frequency fields
•EN 61000-6-1:2007 Generic standards –Immunity for residential, commercial and light-industrial environments
1.3.2. For customers in the US: FCC Conformity
The xiQ cameras described in this manual have been tested and found to comply with Part 15 of the FCC rules, which states
that:
Operation is subject to the following two conditions:
•This device may not cause harmful interference, and
•This device must accept any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for Class A digital device, pursuant to part 15 of the FCC
rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in
a commercial environment. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used
in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the users will be required to correct the interference at
their own expense.
You are cautioned that any changes or modifications not expressly approved in this manual could void your authority to operate
this equipment under above jurisdictions. The shielded interface cable recommended in this manual must be used with this
equipment in order to comply with the limits for a computing device pursuant to Subpart J of Part 15 of FCC Rules.

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1.3.3. For customers in Canada
The xiQ cameras comply with the Class A limit s for radio noise emissions set out in Radio Interference Regulations.
1.3.4. RoHS Conformity
The xiQ cameras comply with the requirements of the RoHS (Restriction of Hazardous Substances) Directive 2011/65/EU.
1.3.5. WEEE Conformity
The xiQ cameras comply with the requirements of the WEEE (waste electrical and electronic equipment) Directive 2003/108/EC.
1.3.6. AIA standard USB3 Vision
The xiQ cameras are compliant with the USB 3.0 SuperSpeed specification and are designed to be compliant with the AIA
USB3 Vision standard.
1.3.7. GenICam GenTL API
GenICam standard transport layer interface, grabbing images. GenICam/GenTL provides an agnostic transport layer interface
to acquire images or other data and to communicate with a device. Each XIMEA camera can be GenTL Producer.
1.4. Helpful Links
•XIMEAHomepage http://www.ximea.com/
•xiQ USB3 Vision Camera Zone http://www.ximea.com/usb3zone
•USB3 Hardware Compatibility http://www.ximea.com/support/wiki/usb3/Compatible_hardware
•xiAPI stable versions download https://www.ximea.com/support/documents/4
•xiAPI beta versions download https://www.ximea.com/support/documents/14
•Frequently Asked Questions http://www.ximea.com/support/wiki/allprod/Frequently_Asked_Questions
•Knowledge Base http://www.ximea.com/support/wiki/allprod/Knowledge_Base
•Vision Libraries http://www.ximea.com/support/projects/vision-libraries/wiki
•XIMEA Registration http://www.ximea.com/en/products/register
•XIMEA Live Support http://www.ximea.com/support/wiki/allprod/XIMEA_Live_Support
•XIMEA General Terms & Conditions http://www.ximea.com/en/corporate/generaltc

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1.4.1. Table of Contents
1. Introduction................................................................................................................................................................1
1.1. About This Manual.............................................................................................................................................2
1.2. About XIMEA .....................................................................................................................................................2
1.2.1. Contact XIMEA..........................................................................................................................................2
1.3. Standard Conformity ..........................................................................................................................................3
1.3.1. CE Conformity...........................................................................................................................................3
1.3.2. For customers in the US: FCC Conformity ...................................................................................................3
1.3.3. For customers in Canada...........................................................................................................................4
1.3.4. RoHS Conformity.......................................................................................................................................4
1.3.5. WEEE Conformity ......................................................................................................................................4
1.3.6. AIA standard USB3 Vision..........................................................................................................................4
1.3.7. GenICam GenTL API..................................................................................................................................4
1.4. Helpful Links .....................................................................................................................................................4
1.4.1. Table of Contents......................................................................................................................................5
2. xiQ Camera Series....................................................................................................................................................11
2.1. What is xiQ......................................................................................................................................................11
2.2. Advantages .....................................................................................................................................................11
2.3. USB3 Vision Camera Applications .....................................................................................................................12
2.4. Common features ............................................................................................................................................12
2.5. Model Nomenclature........................................................................................................................................13
2.6. Models Overview, sensor and models ...............................................................................................................14
2.7. Options ...........................................................................................................................................................14
2.8. Accessories.....................................................................................................................................................15
3. Hardware Specification .............................................................................................................................................16
3.1. Power Supply ..................................................................................................................................................16
3.2. General Specification .......................................................................................................................................16
3.2.1. Environment ...........................................................................................................................................16
3.2.2. Firmware / Host driver / API features........................................................................................................16
3.3. Lens Mount.....................................................................................................................................................17
3.3.1. Screws...................................................................................................................................................17
3.4. Optical path.....................................................................................................................................................18
3.4.1. Monochrome and near infrared extended camera models..........................................................................18
3.4.2. Color camera models ..............................................................................................................................18
3.5. Model Specific Characteristics..........................................................................................................................19
3.5.1. MQ003xG-CM ........................................................................................................................................19
3.5.1.1. Sensor and camera parameters ......................................................................................................19
3.5.1.2. Quantum efficiency curves [%]........................................................................................................20
3.5.1.3. Mechanical drawings (C-mount [with C/CS mount module B])...........................................................20
3.5.1.4. Mechanical drawings (CS-mount [without C/CS mount module B]) ....................................................21
3.5.1.5. Referenced documents...................................................................................................................21
3.5.1.6. Sensor features..............................................................................................................................21
3.5.2. MQ013xG-E2 .........................................................................................................................................22
3.5.2.1. Sensor and camera parameters ......................................................................................................22
3.5.2.2. Quantum efficiency curves [%]........................................................................................................23
3.5.2.3. Mechanical drawings (C-mount [with C/CS mount module B])...........................................................24

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3.5.2.4. Mechanical drawings (CS-mount [without C/CS mount module B]) ....................................................24
3.5.2.5. Referenced documents...................................................................................................................25
3.5.2.6. Sensor features..............................................................................................................................25
3.5.2.7. Note: horizontal image lines (MQ013CG-E2, MQ013MG-E2).............................................................25
3.5.2.8. Note: triggered exposure ................................................................................................................25
3.5.2.9. Frame rate examples......................................................................................................................25
3.5.3. MQ013xG-ON.........................................................................................................................................26
3.5.3.1. Sensor and camera parameters ......................................................................................................26
3.5.3.2. Quantum efficiency curves [%]........................................................................................................27
3.5.3.3. Mechanical drawings (C-mount [with C/CS mount module B])...........................................................27
3.5.3.4. Mechanical drawings (CS-mount [without C/CS mount module B]) ....................................................28
3.5.3.5. Camera orientation.........................................................................................................................28
3.5.3.6. Referenced documents...................................................................................................................28
3.5.3.7. Sensor features..............................................................................................................................28
3.5.4. MQ022xG-CM ........................................................................................................................................29
3.5.4.1. Sensor and camera parameters ......................................................................................................29
3.5.4.2. Quantum efficiency curves [%]........................................................................................................30
3.5.4.3. Mechanical drawings (C-mount [with C/CS mount module B])...........................................................31
3.5.4.4. Mechanical drawings (CS-mount [without C/CS mount module B]) ....................................................31
3.5.4.5. Referenced documents...................................................................................................................32
3.5.4.6. Sensor features..............................................................................................................................32
3.5.5. MQ042xG-CM ........................................................................................................................................33
3.5.5.1. Sensor and camera parameters ......................................................................................................33
3.5.5.2. Quantum efficiency curves [%]........................................................................................................34
3.5.5.3. Mechanical drawings (C-mount [with C/CS mount module B])...........................................................35
3.5.5.4. Mechanical drawings (CS-mount [without C/CS mount module B]) ....................................................35
3.5.5.5. Referenced documents...................................................................................................................36
3.5.5.6. Sensor features..............................................................................................................................36
3.5.5.7. Frame rate examples......................................................................................................................36
3.6. User interface –LEDs ......................................................................................................................................37
3.7. xiQ USB 3.0 Interface.......................................................................................................................................38
3.7.1. Location .................................................................................................................................................38
3.7.2. Pinning...................................................................................................................................................38
3.8. xiQ Digital Input / Output (GPIO) Interface ..........................................................................................................39
3.8.1. Location .................................................................................................................................................39
3.8.2. IO Connector Pinning ..............................................................................................................................39
3.8.3. Digital Input ............................................................................................................................................39
3.8.3.1. Digital Input - General info..............................................................................................................39
3.8.3.2. Digital Input –signal levels .............................................................................................................40
3.8.3.3. Digital Input –Internal Schematic....................................................................................................40
3.8.3.4. Digital Input –Wiring......................................................................................................................40
3.8.3.5. Digital Input –Timing .....................................................................................................................41
3.8.4. Digital Output .........................................................................................................................................41
3.8.4.1. Digital Output - General info............................................................................................................41
3.8.4.2. Digital Output –signal levels...........................................................................................................41
3.8.4.3. Digital Output –Internal schematic..................................................................................................42

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3.8.4.4. Digital Output –Wiring ...................................................................................................................42
3.8.4.5. Digital Output –Timing...................................................................................................................47
3.9. CBL-U3-3M0 / CBL-U3-5M0 / CBL-U3-8M0.....................................................................................................48
3.10. CBL-U3-3M0-ANG...........................................................................................................................................49
3.11. CBL-MQSYNC-3M0 .........................................................................................................................................51
3.12. Tripod Adapter –MQ-BRACKET-T.....................................................................................................................52
3.12.1. Mechanical drawings (Brackets for MQ013xG-yy and MQ042xG-CM)........................................................52
3.12.2. Mechanical drawings (universal) ..............................................................................................................53
3.13. U3PE-FL1009..................................................................................................................................................54
3.14. U3PE-D720202-X4..........................................................................................................................................55
4. Operation.................................................................................................................................................................57
4.1. System Requirements ......................................................................................................................................57
4.1.1. Software Requirements ...........................................................................................................................57
4.1.2. Hardware Requirements ..........................................................................................................................57
4.1.2.1. System Configuration .....................................................................................................................57
4.1.2.2. USB 3.0 Host Adapter ....................................................................................................................58
4.1.2.3. Cables...........................................................................................................................................58
4.2. Video Formats .................................................................................................................................................58
4.2.1. Full Resolution ........................................................................................................................................58
4.2.2. ROIs –Region Of Interest ........................................................................................................................58
4.2.3. Downsampling Modes.............................................................................................................................59
4.2.3.1. Binning..........................................................................................................................................59
4.2.3.2. Skipping ........................................................................................................................................59
4.2.4. Color and Mono Modes ...........................................................................................................................59
4.3. Acquisition modes ...........................................................................................................................................60
4.3.1. Free-Run................................................................................................................................................60
4.3.2. Triggered Acquisition ..............................................................................................................................60
4.3.2.1. Software Trigger ............................................................................................................................60
4.3.2.2. Hardware Trigger ...........................................................................................................................60
4.3.2.3. Triggered mode without overlap ......................................................................................................61
4.3.2.4. Triggered mode with overlap...........................................................................................................62
4.4. Camera Parameters and Features.....................................................................................................................64
4.4.1. Exposure ................................................................................................................................................64
4.4.2. Gain.......................................................................................................................................................64
4.4.3. Auto Exposure –Auto Gain......................................................................................................................64
4.4.4. White Balance ........................................................................................................................................64
4.4.4.1. Assisted Manual White Balance ......................................................................................................64
4.4.4.2. Auto White Balance........................................................................................................................64
4.4.5. Gamma..................................................................................................................................................64
4.4.6. Sharpness ..............................................................................................................................................64
4.4.7. Color Correction Matrix............................................................................................................................64
4.4.8. Bad pixel Correction................................................................................................................................65
4.4.9. HDR.......................................................................................................................................................66
5. Software ..................................................................................................................................................................69
5.1. Accessing the Camera .....................................................................................................................................69
5.1.1. Proprietary API........................................................................................................................................69

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5.1.2. Standard Interface ..................................................................................................................................69
5.1.2.1. GenICam .......................................................................................................................................69
5.1.2.2. USB3 Vision...................................................................................................................................69
5.1.2.3. DirectShow....................................................................................................................................69
5.1.3. Vision Library Integration .........................................................................................................................69
5.2. Supported Vision Libraries................................................................................................................................69
5.2.1. 3DExpress..............................................................................................................................................70
5.2.2. ActiveGeni ..............................................................................................................................................70
5.2.3. Adaptive Vision Studio.............................................................................................................................70
5.2.4. Aforge.NET Framework............................................................................................................................70
5.2.5. AQSENSE SAL3D ....................................................................................................................................70
5.2.6. Astroart 5.0............................................................................................................................................71
5.2.7. Cognex VisionPro....................................................................................................................................71
5.2.8. Digital Optics V++ ..................................................................................................................................71
5.2.9. EVT - EyeVision.......................................................................................................................................71
5.2.10. ImageWarp.............................................................................................................................................72
5.2.11. Integrating Vision Toolkit..........................................................................................................................72
5.2.12. Intopii Pinta ............................................................................................................................................72
5.2.13. Keyetech ................................................................................................................................................72
5.2.14. libdmtx...................................................................................................................................................72
5.2.15. Matrox Imaging Library (MIL) ...................................................................................................................73
5.2.16. MathWorks MATLAB ...............................................................................................................................73
5.2.17. Micro-Manager.......................................................................................................................................73
5.2.18. MVTec HALCON......................................................................................................................................73
5.2.19. National Instruments LabVIEW Vision Library.............................................................................................74
5.2.20. NeuroCheck............................................................................................................................................74
5.2.21. Neurotechnology SentiSight .....................................................................................................................74
5.2.22. StreamPix...............................................................................................................................................74
5.2.23. OpenCV..................................................................................................................................................75
5.2.24. RoboRealm.............................................................................................................................................75
5.2.25. STEMMER IMAGING Common Vision Blox.................................................................................................75
5.2.26. SANXO Modular-X...................................................................................................................................75
5.2.27. ThirdSight...............................................................................................................................................76
5.2.28. Tordivel Scorpion ....................................................................................................................................76
5.2.29. VisionLab ...............................................................................................................................................76
5.2.30. Voyant Vision..........................................................................................................................................76
5.3. Windows software package ..............................................................................................................................76
5.3.1. Contents ................................................................................................................................................76
5.3.2. Installation..............................................................................................................................................77
5.3.3. XIMEA Viewer .........................................................................................................................................80
5.3.3.1. xiViewer ........................................................................................................................................80
5.3.3.2. New CCD Test ...............................................................................................................................81
5.4. Linux Software Package ...................................................................................................................................81
5.4.1. Contents ................................................................................................................................................81
5.4.2. Installation..............................................................................................................................................82
5.5. Mac OS X Software Package ............................................................................................................................84

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5.5.1. Contents ................................................................................................................................................84
5.5.2. Installation..............................................................................................................................................84
5.5.3. Usage ....................................................................................................................................................86
5.6. Programming ..................................................................................................................................................87
5.6.1. XIMEA APIs.............................................................................................................................................87
5.6.2. xiAPI Overview ........................................................................................................................................87
5.6.3. xiAPI Functions Description......................................................................................................................87
5.6.4. xiAPI Parameters Description...................................................................................................................88
5.6.5. xiAPI Examples .......................................................................................................................................88
5.6.5.1. Connect Device..............................................................................................................................88
5.6.5.2. Parameterize Device.......................................................................................................................88
5.6.5.3. Acquire Images..............................................................................................................................89
5.6.5.4. Control Digital Input / Output (GPIO) ................................................................................................89
5.6.6. xiAPI Auto Bandwidth Calculation.............................................................................................................90
5.6.7. USB3 Vision............................................................................................................................................90
5.6.8. GenICam ................................................................................................................................................90
5.7. XIMEA Control Panel ........................................................................................................................................91
6. Appendix..................................................................................................................................................................92
6.1. Troubleshooting and Support............................................................................................................................92
6.1.1. Worldwide Support..................................................................................................................................92
6.1.2. Before Contacting Technical Support........................................................................................................92
6.1.3. Frequently Asked Questions.....................................................................................................................92
6.1.3.1. What is USB 3.0 SuperSpeed?........................................................................................................92
6.1.3.2. What is the real transfer speed?......................................................................................................93
6.1.3.3. Why can I not achieve maximum transfer speed?.............................................................................93
6.1.3.4. What voltage should be applied to Digital Input of xiQ to turn it on/off? ..............................................93
6.1.3.5. What is the implementation of Digital Output (VDO) of xiQ? ...............................................................93
6.2. Product service request (PSR)...........................................................................................................................94
6.2.1. Step 1 - Contact Support.........................................................................................................................94
6.2.2. Step 2 - Create Product Service Request (PSR).........................................................................................94
6.2.3. Step 3 - Wait for PSR Approval ................................................................................................................94
6.2.4. Step 4 - Sending the camera to XIMEA.....................................................................................................94
6.2.5. Step 5 - Waiting for Service Conclusion....................................................................................................94
6.2.6. STEP 6 - Waiting for return delivery .........................................................................................................94
6.3. Safety instructions and precautions...................................................................................................................95
6.3.1. Disassembling ........................................................................................................................................95
6.3.2. Mounting / Screwing ...............................................................................................................................95
6.3.3. Connections ...........................................................................................................................................95
6.3.4. Power supply..........................................................................................................................................95
6.3.5. Environment / protect against water.........................................................................................................95
6.3.6. Recommended light conditions. ...............................................................................................................95
6.3.7. Protect the optical components................................................................................................................96
6.3.8. Mechanical loads....................................................................................................................................96
6.3.9. Camera / lens cleaning............................................................................................................................96
6.3.10. Protect against static discharge (ESD) ......................................................................................................96
6.3.11. Safety instructions for board level cameras...............................................................................................96

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6.4. Warranty .........................................................................................................................................................97
6.5. Disclaimer of Warranty.....................................................................................................................................97
6.6. List Of Trademarks ..........................................................................................................................................97
6.7. Standard Terms & Conditions of XIMEA GmbH...................................................................................................97
6.8. Copyright ......................................................................................................................................................103
6.9. Revision History .............................................................................................................................................103
7. Glossary.................................................................................................................................................................104
8. list of figures ..........................................................................................................................................................105
9. list of tables ...........................................................................................................................................................107

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2. xiQ Camera Series
2.1. What is xiQ
xiQ [ksi-kju: or sai-kju:] is an ultra-compact USB 3.0 Industrial camera family with outstanding features:
•Extremely small footprint
•Lowe thermal dissipation
•Single PC board electronics
•USB3 Vision Standard compatible
•sensors: VGA, 1.3 MP, 2 MP, 2.2 MP and 4.2 MP, b/w, color and NIR extended
•frame rates: VGA @ >500 fps to 4.2 MP @ 90 fps
2.2. Advantages
Industry standard interface
Compliant with USB 3.0 SuperSpeed specification
AIA standard compatibility
USB3 Vision standard
small
fits into places where no other camera can fit
Cool
low power consumption, 1.0 to 1.8 W
Powerful
5Gb/s interface up to 450Mpix/s data throughput
Fast
high speed, high frame rate: >500fps at VGA and 90fps at 4Mpix resolutions
Robust
full metal housing, no sheet metal covers
Lightweight
facilitates increased performance of robotic arms and gimbals
Connectivity
Programmable opto-isolated input and output, 3 status LEDs
Compatibility
support for Windows, Linux and MacOS, various Image Processing Libraries
Software interfaces
GenICam / GenTL and highly optimized xiAPI SDK
Economical
excellent value and price, low TCO and fast ROI
table 2-1, advantages

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2.3. USB3 Vision Camera Applications
•Automation
•Ultra-fast 3D scanning
•Miniature and fast robotic arms
•Mobile devices
•In-situ optical inspection camera
•Material and Life science microscopy
•Ophthalmology and Retinal imaging
•Broadcasting
•Fast process capture, e.g. golf club swings
•Intelligent Transportations Systems (ITS) and traffic monitoring
2.4. Common features
Sensor Technology
CMOS, Global shutter
Acquisition Modes
Continuous, software and hardware trigger, defined fps, triggered exposure (*1) and
burst
Partial Image Readout
ROI, Skipping and Binning modes supported (model specific)
Image data formats
8, 10 or 12 bit RAW pixel data
Color image processing
Host based de-Bayering, sharpening, Gamma, color matrix, true color CMS
Hot/blemish pixels correction
On camera storage of up to 5000 pixel coordinates, host assisted correction
Auto adjustments
Auto white balance, auto gain, auto exposure
Flat field corrections
Host assisted pixel level shading and lens corrections
Image Data and Control Interface
USB 3.0 standard Micro B with screw lock threads compliant to USB3 Vision standard
General Purpose I/O
1x opto-isolated input, 1x opto-isolated output, power LED, 2x LED software
programmable
Signal conditioning
Programmable debouncing time
Synchronization
Hardware trigger input, software trigger, exposure strobe output, busy output
Housing and lens mount
Standard C-mount. Available options are CS mount, and board level
Power requirements
1 to 1.8W, supplied via USB 3.0 interface
Environment
Operating 0°C to 50°C on housing, RH 80% non-condensing, -30°C to 60°C storage
Ingress Protection: IP40
Operating systems
Windows 7 SP1 (x86 and x64), Linux Ubuntu, MacOS 10.8
Software support
xiAPI SDK, adapters and drivers for various image processing packages
Firmware updates
Field firmware updatable
table 2-2, common features
Notes:
(*1): triggered exposure not available for models MQ013xG-E2

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2.5. Model Nomenclature
Order numbers name conventions for the different models:
MQxxxyG-zz[-OPT]n
MQ: xiQ family name
xxx: Resolution in 0.1 MPixel. E.g. 1.3 MPixel Resolution: xxx = 013
y: y=C: color model
y=M: black & white model
y=R: black & white, Infrared-extended model
zz: Vendor of the sensor
zz = E2: E2V
zz = CM: CMOSIS
zz = ON: Onsemi
[-OPT]: Options
OPT = TP: sensor with taped sensor glass
OPT = BRD: board level camera

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2.6. Models Overview, sensor and models
Model
Resolution
Pixel size
ADC [bit]
DR
Optical
size
Sensor
diagonal
FPS
MQ003MG-CM
b/w
648x488
7.4 µm
10/12
66 dB
1/3”
6.0 mm
>500
MQ003CG-CM
Color
MQ013MG-E2
b/w
1280x1024
5.3 µm
10
66 dB
1/1.8”
8.7 mm
60
MQ013CG-E2
Color
MQ013RG-E2
b/w NIR
MQ013MG-ON
b/w
1280x1024
4.8 µm
10
60 dB
1/2”
7.9 mm
150
MQ013CG-ON
Color
MQ022MG-CM
b/w
2048*1088
5.5 µm
10/12
60 dB
2/3”
12.8 mm
180
MQ022CG-CM
Color
MQ022RG-CM
b/w NIR
MQ042MG-CM
b/w
2048x2048
5.5 µm
10/12
60 dB
1”
15.9 mm
90
MQ042CG-CM
Color
MQ042RG-CM
b/w NIR
table 2-3, models overview
Note: Maximum frame rate measured at 8 bits per pixel
2.7. Options
All models are available in board level version
The models MQ042MG-CM and MQ042CG-CM can be ordered with taped sensor glass.

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2.8. Accessories
The following accessories are available:
Item P/N
Description
CBL-U3-3M0
3.0m USB 3.0 cable
CBL-U3-3M0-ANG
3.0m USB 3.0 cable, angled micro USB3 connector
CBL-U3-5M0
5.0m USB 3.0 cable
CBL-U3-8M0
8.0m USB 3.0 cable
CBL-MQSYNC-3M0
3.0m xiQ series I/O sync cable, pig tail
MQ-BRACKET-T
xiQ series tripod mounting bracket
U3PE-FL1009
PCI express adapter, 2x USB 3.0 ports
U3PE-D720202-X4
PCI express adapter, 4x USB 3.0 ports, PCIe x4 slot
table 2-4, accessories

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3. Hardware Specification
3.1. Power Supply
The xiQ cameras are powered via the USB 3.0 Micro-B connector. The input voltage is 5 V DC. The power consumption is 1.0 -
1.8W depending on the xiQ model.
Power supply, via USB 3.0 system connector:
•5 V (nominal)
•4.45 V to 5.25 V (at the connector of hub or root port)
3.2. General Specification
3.2.1. Environment
Description
Symbol
Value
Optimal ambient temperature operation
Topt
+10 to +25 °C
Ambient temperature operation
Tmax
-10 - +55 °C
Ambient temperature for storage and transportation
Tstorage
-25 - +70 °C
Relative Humidity, non-condensing
RH
80 %
table 3-1, environment
Housing temperature must not exceed +65°C. The following parameters are not guaranteed if the camera is operated outside
the optimum range:
•Dark current
•Dynamic Range
•Linearity
•Acquisition and readout noise
•S/N ratio, durability
3.2.2. Firmware / Host driver / API features
Description
Value
Interpolation methods
9331, SHT_advanced
White balance coefficients ranges
0.0 to 3.9
Sharpness filter
0 to 100 %
Gamma
0.3 to 1.0
Full color correction matrix (3+1)x3 coefficients ranges
-3.9 to 3.9
table 3-2, firmware / API features
More details on API/SDK features are available at XIMEA support pages: http://www.ximea.com/support

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3.3. Lens Mount
The xiQ cameras are compatible with C-mount and CS-mount lenses.
figure 3-1, position C/CS-Mount module B
The cameras are delivered with C-mount back focal length. By removing the “C/CS-Mount module B” (see the figure above) the
camera can be rebuilt to CS-mount compatibility. The required M2x8mm special screws are part of the camera delivery.
The length of the lens thread is 6.5 mm.
Note: The distance between the threaded flange and the surface of the filter glass is 11.9 mm in case of C-Mount and 6.9 mm
in case of CS-Mount. To avoid damaging of the filter glass, nothing may extend deeper into the housing.
Lens mount adapter configuration:
•C-Mount (with C/CS Mount module B)
•CS-Mount (without C/CS Mount module B)
3.3.1. Screws
All mounting screws are customized M2 screws with different lengths.
Technical details:
Material
Steel
Surface
Black zinc
Thread
M2
Driver
PH 00
Avail. Lengths
2mm –24 mm
table 3-3, custom screws, technical details
Drawings, e.g. with 10mm length:
figure 3-2, xiQ mounting screws
Note: Never exceed a maximum torque of 0.3Nm when fastening the M2 mounting screws.
4 x M2 max . depth 2.9 mm mod.: 19 x 18 mm C-mount 14 x 18 mm CS-mount C/CS-Mount moduleA
Remove this module for CS mount back focal distance
C/CS-Mount module B
front view side view

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3.4. Optical path
3.4.1. Monochrome and near infrared extended camera models
Used filter brand
BK7 AR2x
Thickness
1.0±0.1 mm
Coating
Anti-reflex both sides
table 3-4, monochrome camera - filter glass parameter
figure 3-3, monochrome camera - filter glass transmission curve
3.4.2. Color camera models
Used filter brand
ICR650
Thickness
1.0±0.1 mm
Coating
NA
table 3-5, color camera - filter glass parameter
figure 3-4, color camera - filter glass transmission curve
0
10
20
30
40
50
60
70
80
90
100
350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050
Transmittance (%)
Wavelength (nm)
BK7 AR2x - Transmission Curve
0
10
20
30
40
50
60
70
80
90
100
350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050
Transmittance (%)
Wavelength (nm)
ICR650 - Transmission Curve

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3.5. Model Specific Characteristics
3.5.1. MQ003xG-CM
3.5.1.1. Sensor and camera parameters
xiQ model
MQ003CG-CM
MQ003MG-CM
Sensor parameter (*1)
Brand
CMV300ES-3E7C1WP
CMV300ES-3E7M1WP
Color filter
RGB Bayer mosaic
None
Type
Global shutter, overlap mode
Pixel Resolution (H × V) [pixel]
648 × 488
Active area size (H × V) [mm]
4.8 × 3.6
Sensor diagonal [mm]
5.9
Optical format [inch]
1/3
Pixel Size (H × V) [µm]
7.4 × 7.4
ADC resolution [bit]
10, (12 TBD)
FWC [ke-]
20
Dynamic range [dB]
60
SNR Max [dB]
>40 (TBD)
Dark noise [e-]
20 (RMS)
Dark current [e-/s]
125 (25°C)
DSNU [LSB10/s]
3
Sensitivity [V/(Lux s)]
6
Camera parameters
Digitization [bit]
12
Supported bit resolutions [bit/pixel]
8, 10, (12)
Exposure time (EXP)
7.4µs to 10sec, in steps of 7.4µs (*1)
Variable Gain Range (VGA) [dB]
8.4
Refresh rate (MRR) [fps]
90
Supported standard readout modes
Binning/skipping
pixels
fps (*2)
Bit/px
0
1x1
648 × 488
548
8
1
1x1
648 × 488
548
10
Power consumption
typical [W]
1.2
Maximum [W]
1.3
Mechanical
height [mm]
26.4
width [mm]
26.4
depth [mm]
24.6 (with C/CS Mount module B)
19.6 (without C/CS Mount module B)
weight [g]
26.4 (with C/CS Mount module B)
22.4 (without C/CS Mount module B)
3.4 (board level camera)
table 3-6, MQ003xG-CM, sensor and camera parameters
Notes:
(*1) defined for max. bandwidth. By decreasing bandwidth the minimum exposure time and exposure step will
increase
(*2) the maximum frame rate depends on the temperature of the sensor. The sensor manufacturer guarantees only
480 fps at higher sensor temperatures (e.g. 50-70 °C).

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3.5.1.2. Quantum efficiency curves [%]
figure 3-5, CMV300-mono, quantum efficiency curve, ©CMOSIS
3.5.1.3. Mechanical drawings (C-mount [with C/CS mount module B])
figure 3-6, mechanical drawing MQ003xG-CM, C-Mount housing
0%
10%
20%
30%
40%
50%
60%
70%
80%
350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050
Quantum Efficiency (%)
Wavelength (nm)
CMV300 - Spectral Response
Monochrome