AvionTEq HEATCON HCS9000B User manual

HCS9000B/HCS9200B-OMI-40518 November 2013
This Technical Manual Applies to HCS9000B and HCS9200B Revision 16
Composite Repair Sets (Hot Bonders) with Serial Numbers listed below:
Serial Numbers –1611XXXX and Subsequent
HCS9000B / HCS9200B
Composite Repair Set; Hot Bonder
Operation and Maintenance Manual
with
Illustrated Parts Catalog
To buy, sell, rent or trade-in this product please click on the link below:
http://www.avionteq.com/Heatcon-HCS9200B-Single-Dual-Zone-Hot-bonder-Composite-Bonding-Repair-System.aspx
www.avionteq.com

HCS9000B/HCS9200B Proprietary Notice
Hot Bonder/Controller
HCS9000B/HCS9200B-OMI-405 HEATCON® COMPOSITE SYSTEMS A
Manual Title: "HCS9000B/HCS9200B Operation and Maintenance Manual with Illustrated Parts Catalog"
Copyright 24 October 2011
All rights reserved. No part of this publication may be reproduced, transmitted, transcribed, stored on a
retrieval system, or translated into any language in any form by any means without the expressed written
permission of HEATCONCOMPOSITE SYSTEMS.
Manual Number:HCS9000B/HCS9200B-OMI-405
Changes/Revisions: Original –24 October 2011
Revision 1 –28 August 2012
Revision 2 –20 September 2012
Revision 3 –18 November 2013
Orders: Additional Copies May be Obtained From:
HEATCONCOMPOSITE SYSTEMS
600 Andover Park East
Seattle, WA 98188-7610
Phone: [phone]
Fax: [phone]
Email: [email protected]
HEATCONCOMPOSITE SYSTEMS Europe
Blackstone Road
Stukeley Meadows Ind. Est.
Huntingdon (CAMBS)
PE29 6EF England
Phone: [phone]
Fax: [phone]
Email: [email protected]
PROPRIETARY NOTICE
The drawings and related information contained herein are derived in part from proprietary and
patent data of HEATCONCOMPOSITE SYSTEMS and/or its suppliers. Reproduction and/or use of
this information is restricted to use by the original purchaser or its duly assigned agents solely for the
expressed purposes of installing, operating, or maintaining the equipment described herein. This
information may not be used for the purposes of re-procurement or manufacture of the equipment
described herein.

Change Record HCS9000B/HCS9200B
Hot Bonder/Controller
B HEATCON® COMPOSITE SYSTEMS HCS9000B/HCS9200B-OMI-405
CHANGE PAGE
RECORD
NOTE: A vertical line in the outer margins of the page indicates the portions of this
manual affected by changes.
Dates of issue for the original and changed pages are:
Original –24 October 2011
Revision 1 –28 August 2012
Revision 2 –20 September 2012
Revision 3 –18 November 2013
Total number of pages in this document is 84 pages consisting of:
Page. Revision
No.
A-B..................................................................1
i-iv...................................................................2
v-70.................................................................3

HCS9000C/HCS9200C Front Matter
Hot Bonder/Controller
Change 2 iii
TABLE OF CONTENTS
TABLE OF CONTENTS....................................................................................................................................I
LIST OF FIGURES..........................................................................................................................................III
LIST OF TABLES ...........................................................................................................................................IV
ABBREVIATIONS AND ACRONYMS.............................................................................................................V
WARNINGS AND CAUTIONS......................................................................................................................VIII
TECHNICAL SPECIFICATIONS .....................................................................................................................X
CHAPTER 1 —GENERAL...........................................................................................................................1
1.0 Introduction..........................................................................................................................................1
1.1 Related Publications............................................................................................................................1
1.2 Overview..............................................................................................................................................1
1.3 Quick Start Guide................................................................................................................................2
CHAPTER 2 —FUNCTIONAL DESCRIPTION ............................................................................................4
2.0 AC Power Control................................................................................................................................4
2.1 DC Control Power................................................................................................................................4
2.2 Central Processor Unit ........................................................................................................................4
2.3 Sensor Input and Signal Conditioning.................................................................................................4
2.4 Operator Interface and Display ...........................................................................................................4
2.5 Printer..................................................................................................................................................5
2.6 Vacuum System ..................................................................................................................................5
2.6.1 Internal Pneumatic Vacuum System...................................................................................................5
2.6.2 Internal Electric Vacuum Pump System (HCS9200B-EV Option).......................................................5
2.6.3 Internal Electric Vacuum Pump System (HCS9000B-EV Only)..........................................................5
2.7 Proportional, Integral And Derivative (PID) Control ............................................................................6
2.7.1 PID Control Basics ..............................................................................................................................6
2.7.2 Proportional.........................................................................................................................................6
2.7.3 Integral.................................................................................................................................................6
2.7.4 Derivative ...........................................................................................................................................7
2.8 Network Operation .............................................................................................................................7
CHAPTER 3 —OPERATION........................................................................................................................9
3.0 Controls and Indicators .......................................................................................................................9
3.1 Equipment Setup and Power-On.......................................................................................................12
3.1.1 Equipment Setup...............................................................................................................................12
3.1.2 Power-On Procedure.........................................................................................................................15
3.2.1 Setup - Internal Electric Vacuum Pump System (HCS9200B-EV Option)........................................15
3.2.2 Operation - Internal Electric Vacuum Pump System ((HCS9000B-EV Option) ................................15
3.3 Security Password Protection (Option) .............................................................................................16
3.3.1 Password Control Levels...................................................................................................................16
3.3.2 Password Assignment.......................................................................................................................17
3.4 Operator Graphic User Interface Screens.........................................................................................18
3.4.1 Welcome Screen...............................................................................................................................18
3.4.2 Main Menu and Status Monitor Screen.............................................................................................19
3.4.3 User Settings Screen.........................................................................................................................21
3.4.3.1 Temperature Control Modes Screen.................................................................................................22
3.4.3.2 Thermocouple Mode Options Screen................................................................................................23
3.4.3.3 Thermocouple Control and Display Modes Screen...........................................................................23
3.4.3.4 Printer Options Screen......................................................................................................................24
3.4.3.5 Display Options Screen.....................................................................................................................25
3.4.3.6 Segment Completion Signal Screen .................................................................................................26
3.4.3.7 USB Import & Export Options Screen...............................................................................................27
3.4.3.8 Import &Export Cure Program Library Screen…………………………………………….................….28
3.4.3.9 Date and Time Settings Screen ........................................................................................................29
3.4.3.10Advanced Options Screen.................................................................................................................30
3.4.3.11Alternate PID Settings.......................................................................................................................31
3.4.4 Program Selection Screen ................................................................................................................32
3.4.4.1 Edit Program Screen.........................................................................................................................33

Reference Pages HCS9000B/HCS9200B
Hot Bonder/Controller
iv HEATCON® COMPOSITE SYSTEMS HCS9000B/HCS9200B-OMI-405
3.4.4.2 Run Program Screen.........................................................................................................................34
3.4.4.3 8 Step Cure Configuration.................................................................................................................35
3.4.5 Graph Screen ....................................................................................................................................36
3.4.6 Precure Operational Test Screen......................................................................................................37
3.5 Changing an Active Program.............................................................................................................39
3.6.1 Slave Mode........................................................................................................................................39
3.6.2 20 TC Mode.......................................................................................................................................40
3.7 Alarms................................................................................................................................................41
3.7.1 Max Power Warning & Alarm ............................................................................................................43
3.7.2 Event Log...........................................................................................................................................45
3.8 Data Logging Mode ...........................................................................................................................46
3.9 Cure Data Export...............................................................................................................................48
3.10 Cure Data Reprint..............................................................................................................................49
3.11 Autotune Function..............................................................................................................................50
3.12 Power Loss During a Cure ................................................................................................................50
3.13 Setting PID Values for Dual PID Operation.......................................................................................51
3.13.1 Modifying PID Settings .....................................................................................................................51
CHAPTER 4 —MAINTENANCE.................................................................................................................53
4.0 Scheduled Maintenance....................................................................................................................53
4.1 Preventive Maintenance....................................................................................................................53
4.2 Equipment Maintenance....................................................................................................................53
4.2.1 Chassis Removal...............................................................................................................................53
4.2.2 Chassis Installation............................................................................................................................53
4.3 Inspection and Test Procedures........................................................................................................54
4.3.1 Equipment Requirements..................................................................................................................54
4.4 Operational Test................................................................................................................................55
4.4.1 Operational Test Procedure ..............................................................................................................55
4.5 Printer Maintenance...........................................................................................................................57
4.5.1 Printer Ribbon Replacement .............................................................................................................57
4.5.2 Printer Paper Replacement ...............................................................................................................58
CHAPTER 5 —TROUBLESHOOTING........................................................................................................59
5.0 General Troubleshooting...................................................................................................................59
5.1 Test Equipment Requirements..........................................................................................................59
CHAPTER 6 —PARTS LIST.......................................................................................................................61
6.0 Using The Parts List ..........................................................................................................................61
ADDENDUM A —VACUUM BAGGING TIPS ..........................................................................................70
Vacuum Bagging Materials.............................................................................................................................70

HCS9000C/HCS9200C Front Matter
Hot Bonder/Controller
Change 2 v
LIST OF FIGURES
Figure Title Page
2-1 HCS9200B Display Screen Under Network Control .......................................................................7
2-2 Network Port Location (HCS9000B) ............................................................................................... 8
2-3 Network Controller (HCS9300NW) .................................................................................................8
3-1 Controls and Indicators HCS9000B - Single Zone .........................................................................9
3-2 Controls and Indicators HCS9200B - Dual Zone.......................................................................... 11
3-3 Bonder Connection Diagram .........................................................................................................14
3-4 Vacuum Bag to Bonder Connection Diagram ...............................................................................14
3-5 Password Sign-In Screen ..............................................................................................................16
3-6 Set New Passwords ......................................................................................................................17
3-7 Welcome Screen ...........................................................................................................................18
3-8 Main Menu and Status Monitor Screen .........................................................................................20
3-9 User Settings Screen ....................................................................................................................21
3-10 Temperature Control Mode Options Screen..................................................................................22
3-11 Thermocouple Mode Options Screen ...........................................................................................23
3-12 Thermocouple Control and Display Modes Screen ......................................................................24
3-13 Printer Options Screen ..................................................................................................................25
3-14 Display Options Screen .................................................................................................................26
3-15 Segment Completion Signal...........................................................................................................27
3-16 USB Import & Export Options Screen ...........................................................................................28
3-17 Import & Export Cure Program Library Screen .............................................................................29
3-18 Date and Time Settings Screen ....................................................................................................29
3-19 Advanced Settings Screen.............................................................................................................30
3-20 Alternate PID Settings Screen .......................................................................................................31
3-21 Program Selection Screen............................................................................................................ 32
3-22 Edit Program Screen .....................................................................................................................33
3-23 Run Program Screen .....................................................................................................................34
3-24 Edit Program Screen (8-Step) .......................................................................................................35
3-25 Edit Cure Step Popup (8-Step) .....................................................................................................35
3-26 Graph Screen ................................................................................................................................37
3-27 Precure Operational Test Screen .................................................................................................38
3-28 Slave Mode Graph Screen ..........................................................................................................410
3-29 Alarms Popup Window ..................................................................................................................41
3-30 Max Output Power Warning Popup Window..................................................................................43
3-31 Max Output Power Alarm Popup Window......................................................................................44
3-32 No Output Power Detected Popup Window...................................................................................44
3-33 Event Log Screen ..........................................................................................................................45
3-34 Data Logging Parameters Screen .................................................................................................46
3-35 Data Logging Mode Graph Screen ...............................................................................................47
3-36 Export Data to USB Flash Drive Screen........................................................................................48
3-37 Reprint Completed Cure Screen....................................................................................................49
4-1 Printer Ribbon Installation .............................................................................................................57
4-2. Printer Paper Installation ...............................................................................................................58
6-1. HCS9000B Replaceable Parts.......................................................................................................61
6-3. HCS9200B Replaceable Parts ......................................................................................................64
6-4. HCS9200B / HCS9200B Accessories........................................................................................... 67
A-1. Vacuum Bag Layup Materials .......................................................................................................70

Reference Pages HCS9000B/HCS9200B
Hot Bonder/Controller
vi HEATCON® COMPOSITE SYSTEMS HCS9000B/HCS9200B-OMI-405
LIST OF TABLES
Table Title Page
1Technical Specification...................................................................................................................viii
3-1 Controls and Indicators HCS9000B - Single Zone.........................................................................10
3-2 Controls and Indicators HCS9200B - Dual Zone ...........................................................................11
3-3 Alarm Popup Windows...................................................................................................................42
4-1 Equipment Required for Testing.....................................................................................................54
5-1 Troubleshooting Guide...................................................................................................................59
6-1 HCS9000B Replaceable Parts List ................................................................................................64
6-2 HCS9200B Replaceable Parts List ................................................................................................68
6-3 HCS9200B / HCS9200B Accessories List .....................................................................................70

HCS9000B/HCS9200B Abbreviations and Acronyms
Hot Bonder/Controller
HCS9000B/HCS9200B-OMI-405 HEATCON® COMPOSITE SYSTEMS vii
ABBREVIATIONS AND ACRONYMS
ASCII American Standard Code for Information Interchange
AC Alternating Current
bit Binary digit (one bit of data - either 0 or 1)
CAGE Contractor and Government Entity (Code)
CB Circuit Breaker
CCA Circuit Card Assembly
cfm Cubic feet per minute
COM Communication
COTS Commercial off The Shelf
CPU Central Processor Unit (Computer)
cu. ft. Cubic foot/feet
DC Direct current
DEG Degree
Dev Deviation
ENT ENTER Key
ESC ESCAPE Key
FIFO First-In-First-Out
GUI Graphical User Interface
HCS HEATCON®Composite Systems
ºF Degree Fahrenheit
ºC Degree Celsius
Hi High
Hz Hertz (cycles)
In. Hg. Inches of Mercury
ID Identification
I/O Input/Output
LCD Liquid Crystal Display
LED Light Emitting Diode
Lo Low
mb Millibars
KPa Kilo Pascal
No. Number
OEM Original Equipment Manufacturer
PB Proportional Bandwidth
P/N Part Number
Par Paragraph
PC Personal Computer
PID Proportional Integral Derivative
psi Pounds per square inch
QD Quick Disconnect
S/N Serial Number
Sniffer Vacuum through-bag- connector with check valve
SSD Solid State Flash Disk
TC Thermocouple
USB Universal Serial Bus
V Volt

Warnings and Cautions HCS9000B/HCS9200B
Hot Bonder/Controller
viii HEATCON® COMPOSITE SYSTEMS HCS9000B/HCS9200B-OMI-405
WARNINGS AND CAUTIONS
WARNINGS and CAUTIONS are used throughout this manual to alert personnel to the hazards associated
with the operation and use of the HCS9000B/HCS9200B Composite Repair Set (Hot Bonder), and with the
materials and processes used to repair composite structures.
A WARNING statement is used where serious personal injury or death may result if the instructions are not
observed.
A CAUTION statement is used where injury to personnel, damage to equipment or improper results might
occur if the instructions are not observed.
Below are the WARNINGS and CAUTIONS used in this manual. Before operating this equipment read and
understand these WARNINGS and CAUTIONS.
WARNING
USE OF THIS EQUIPMENT IN A MANNER NOT IN ACCORDANCE WITH THE MANUFACTURER’S
PROCEDURES AND/OR DIRECTIVES SPECIFIED IN THIS MANUAL MAY IMPAIR OR NEGATE
THE PERSONNEL AND EQUIPMENT PROTECTION FEATURES PROVIDED BY THIS
EQUIPMENT.
WARNING
BEFORE CONNECTING ELECTRICAL POWER TO THE HOT BONDER/CONTROLLER, ENSURE
THAT THE POWER PLUG INSTALLED ON THE INPUT POWER CABLE IS OF AN APPROVED
TYPE, WITH PROPER RATINGS FOR THE INTENDED USE, AND IN ACCORDANCE WITH
LOCAL ELECTRICAL CODES AND ACCEPTED INDUSTRY SAFETY STANDARDS. (REFER TO
LOCAL CODES)
WARNING
BEFORE CONNECTING ELECTRICAL POWER TO THE HOT BONDER/CONTROLLER, ENSURE
THE FACILITY SOURCE POWER IS RATED FOR THE REQUIRED AMPERAGE AND THAT THE
HOT BONDER/CONTROLLER IS EQUIPPED WITH A POWER CABLE AND PLUG CAPABLE OF
THAT AMPERAGE. (REFER TO LOCAL CODES)
WARNING
LETHAL VOLTAGES ARE PRESENT IN THE UNIT IS CONNECTED TO THE SOURCE POWER.
ENSURE ALL ELECTRICAL POWER IS REMOVED FROM THE UNIT BEFORE ATTEMPTING
ANY MAINTENANCE ACTION. ONLY PROPERLY TRAINED TECHNICAL PERSONNEL SHALL
PERFORM INTERNAL CHECKS.
WARNING
THE POSSIBILITY OF FIRE AND/OR SERIOUS DAMAGE TO THE AIRCRAFT STRUCTURE MAY
RESULT FROM IMPROPERLY PLACING THERMOCOUPLES OUTSIDE THE FOOTPRINT OF
THE HEAT BLANKET. ALWAYS ENSURE THERMOCOUPLES ARE PLACED UNDER THE HEAT
BLANKET AND INSIDE THE 2-INCH BOUNDARY OF THE USABLE AREA OF THE HEAT
BLANKET.

HCS9000B/HCS9200B Warnings and Cautions
Hot Bonder/Controller
HCS9000B/HCS9200B-OMI-405 HEATCON® COMPOSITE SYSTEMS ix
USE CAUTION WHEN REMOVING THE CHASSIS FROM CASE. THE CHASSIS IS ATTACHED
TO THE CASE BY THE VACUUM EXHAUST HOSE(S). ENSURE THAT VACUUM HOSES ARE
DISCONNECTED AND ALL CABLES AND WIRES ARE CLEAR OF THE CASE FLANGE WHEN
THE CHASSIS IS REMOVED.
USE CAUTION WHEN THE CHASSIS IS BEING INSTALLED TO ENSURE THAT ANY CABLES OR
WIRES ARE CAREFULLY INSERTED INTO THE CASE AND NOT CAUGHT ON THE FLANGE, .
ALSO ENSURE VACUUM EXHAUST HOSE(S) ARE NOT KINKED OR TRAPPED UNDER THE
BASEPLATE. VACUUM SYSTEM PERFORMANCE WILL BE DEGRADED IF A HOSE IS
RESTRICTED.
USE CAUTION WHEN REMOVING THE PRINTER COVER. APPLY GENTLE PRESSURE WHEN
REMOVING COVER. EXCESSIVE FORCE MAY DAMAGE THE PRINTER ASSEMBLY AND
BREAK THE RETAINING TABS.
TO PREVENT VACUUM BAG FAILURE AND POSSIBLE DAMAGE TO STRUCTURES, ALWAYS
CONSULT THE ORIGINAL EQUIPMENT MANUFACTURER (OEM) STRUCTURAL REPAIR MANUAL
(SRM) OR MATERIAL SUPPLIER’S TECHNICAL DATA SHEETS FOR SPECIFICATIONS AND
CAPABILITIES OF ANY MATERIALS USED IN THE VACUUM BAGGING PROCESS.

Technical Specifications HCS9000B/HCS9200B
Hot Bonder/Controller
xHEATCON® COMPOSITE SYSTEMS HCS9000B/HCS9200B-OMI-405
TECHNICAL SPECIFICATIONS
Table 1. Technical Specifications
FEATURE
HCS9000B
HCS9200B
Power: (Voltage)
90 –264 Volts AC,
47 –63; 400 Hz
90 –264 Volts AC,
47 –63; 400 Hz
Current: (Amperage)
Maximum Input: 30 Amps
Maximum Output 30 Amps
Maximum Input: 30 Amps (per zone)
Maximum Output 30 Amps (per zone)
Operating Environmental Limitations:
Temperature:
Relative Humidity: (Non condensing)
32 –122 F
0 –93%
32 –122 F
0 –93%
Cure Temperatures Range:
Ambient to 1400 F (Type J)
Ambient to 2000 F (Type K)
Ambient to 1400 F (Type J)
Ambient to 2000 F (Type K)
Control Parameters:
Internal System Control Resolution:
Display Resolution:
Program Resolution:
Temperature Accuracy:
Vacuum Resolution:
Vacuum Accuracy:
½ F
1 F
1 F
±1 F
1 In/Hg
±1 In/Hg
½ F
1 F
1 F
±1 F
1 In/Hg
±1 In/Hg
Control Methods:
Hottest Thermocouple
Coolest Thermocouple
Thermocouple Average
TC No. 1 or
TC No. 2
Hottest Thermocouple
Coolest Thermocouple
Thermocouple Average
TC No. 1 or
TC No. 2
Electric Vacuum Pump
Optional
90 –264 Volts AC Facility Power
Input Operates internal 12 Volt DC
Pump. FLOW = 0.7 cfm at 27
In/Hg).
90 –264 Volts AC Facility Power Input
Operates 12 Volt DC Pump in Lid.
Two-Position Switch Provides MAX
FLOW (0.7 cfm) or MAX VAC (27
In/Hg).
Operator Interface:
Menu Selected / Real Language
Screens on 6.75" X 5.125" display
Languages Supported: English,
French, Mandarin Chinese
Menu Selected / Real Language
Screens on 6.75" X 5.125" display
Languages Supported: English, French,
Mandarin Chinese
Power Failure / Recovery
Programmable 1-15 Minute Auto-
Recovery with Continued Program
Operation. Default 2 Min.
Programmable 1-15 Minute Auto-
Recovery with Continued Program
Operation. Default 2 Min.
Alarm Volume:
90 dB, Adjustable Volume
90 dB, Adjustable Volume
Programs Stored to Memory:
30 Separate, Operator Entered
Programs
30 Separate, Operator Entered
Programs
Dimensions & Weight:
18" x 13" x 5.75"
457 mm x 355 mm x 203 mm
15 lb. (10 Kg)
21.75" x 14.25" x 6.5"
552.5 mm x 362 mm x 165.1 mm
28 lb. (12.7 Kg)
.

HCS9000B/HCS9200B Functional Description
Hot Bonder/Controller
HCS9000B/HCS9200B-OMI-405HEATCON® COMPOSITE SYSTEMS 1
Change 1
CHAPTER 1
GENERAL
1.0 INTRODUCTION
The HCS9000B/HCS9200B Composite Repair Set (Hot Bonder) is a computer monitored and controlled
electrical heating composite repair system with multiple sensor inputs and various graphical status display
screens with complete process documentation printout. The HCS9000B is a single zone unit and the
HCS9200B is a dual zone unit. Each unit provides finite control of heat application, vacuum and time
necessary to cure critically sensitive composite resins and adhesives. The controller is compact and
portable.
1.1 RELATED PUBLICATIONS
HCS9000B-HCS9200B-R15-CAL; Calibration Manual.
1.2 OVERVIEW
The HCS9000B/HCS9200B Hot Bonder provides the world of composite repair and fabrication with the latest
state-of-the-art process control technology. The equipment is extremely user friendly, using a high
technology combination of hardware and software to provide the composite repair technician with complete
control of the hot bond cure process. Control parameters are entered using straightforward English (foreign
language versions available) with Graphic User Interface (GUI) display of the repair process. Hard copy
documentation of the cure process is provided via dot matrix, plain paper printer in text and graphic format.
Cure data is downloadable via Universal Serial Bus (USB) port at the back of the display.
All control features are accessible via a menu system with easy keypad input. The user has fingertip control
over temperature, vacuum, time, alarm parameters, and units of measurement. All cure parameters can be
modified at any time, including during the cure. Changes during a cure are not retained in the original
program upon completion of the modified cure, thus maintaining the integrity of the cure profile library.
A brief explanation of the Menu System is provided below. A detailed explanation is provided in Chapter 3
(Operation) of this manual. It will also be found that the majority of menu operations and entries are self-
explanatory, with instructions presented on the screen. The first screen presented upon power-up is a
Welcome screen. Pressing the “ESC” key will bring the user to the Main Menu and Status Monitor Screen.
The MAIN MENU AND STATUS MONITOR SCREEN provides the operator with an immediate readout of the
condition and temperature of all Thermocouples (TCs) and vacuum levels. The MAIN MENU AND STATUS
MONITOR SCREEN provides options to access the PROGRAM SELECT SCREEN, USER SETTINGS
SCREEN, and GRAPH SCREEN(S). It is from these screens that the process is controlled and monitored.
The PROGRAM SELECT SCREEN is used to run, enter and edit cure programs. After a program is selected for
use, the user is presented with a screen for entry of operator identification, serial number, and part number
associated with the cure to be executed.
The USER SETTINGS SCREEN is used to control the printer print interval, set the clock and date, select the
display units of measurement, and turn on/off the segment completion signal. The methods of TC control and
monitor modes are also selectable from this screen.
The GRAPH SCREEN shows the real-time presentation of the cure process. The program cure profile is
displayed along with a plot of the actual cure cycle. Also presented are TC temperature readouts, vacuum level,
time remaining, and alarm conditions. From this screen, the operator can start and stop the cure, initiate a
HOLD” condition, “EDIT” the running cure, printout the cure real time status, and “REPRINT THE CURE”
hardcopy at the conclusion of the cure.
In addition to the above listed screens, there are submenu popup windows and screens that provide many more
features than have previously been available on the HCS9000/HCS9200 series hot bonders. For detailed
descriptions of these menus refer to Chapter 3, Operation.

General HCS9000B/HCS9200B
Hot Bonder/Controller
2HEATCON® COMPOSITE SYSTEMS HCS9000B/HCS9200B-OMI-405
1.3 QUICK START GUIDE
The following is a brief explanation of a simple cure scenario to familiarize a new user with the basic
operation of the bonder. More detailed explanations of bonder functions and theory of operation are
available in Chapter 3, Operation. The novice user should not feel intimidated by the bonder, as the
Graphical User Interface (GUI) menu system is designed to be self-explanatory, with basic operation as a top
priority. Advanced functions are available with a few additional keystrokes, but are not required to run the
bonder under normal circumstances. The “ESC”key is used in all of the menu systems to take the user back
out of an area without changing the current selections. Normal Quick Start operations are listed below:
ENSURE THAT ALL TCs ARE UNDER WITH THE HEATER BLANKET, INSIDE THE 2-INCH
BORDER AROUND THE BLANKET PERIMETER. FAILURE TO PLACE TCs PROPERLY CAN
CAUSE OVERHEATING AND DAMAGE TO THE PART OR EQUIPMENT. ADVANCED TC
CONTROL OPTIONS MAY ALLOW ALTERNATE TC PLACEMENT, BUT ONLY BY TRAINED
PERSONNEL UNDER THE DIRECTION OF SUPERVISORY AUTHORITY. ENSURE THAT TC
ENDS ARE ELECTRICALLY INSULATED FROM THE REPAIR SURFACE AND EACH OTHER,
THIS CAN BE ACCOMPLISHED BY USE OF A PIECE OF FLASH TAPE WRAPPED OVER THE
END AND A PIECE OF TAPE BETWEEN THE PART SURFACE AND WHERE THE TC ENDS ARE
PLACED
NOTE
Refer Paragraph 3.1.1, Setup and Figures 3-3 and 3-4 for additional information on vacuum
bagging and equipment setup).
a. Perform the composite lay-up in accordance with the established procedures for the repair
provided by the Structural Repair Manual (SRM), engineering, or local authority.
b. Ensure the vacuum bag has no leaks and is pulled down tight over the repair area (no bridging).
A poor vacuum bag will not provide adequate contact between the thermocouples, heat blanket, and repair
area to allow proper heat transfer for uniform heating and stable control. Special attention may be required
at the areas where the electrical leads and TCs penetrate the vacuum bag sealant tape and pass-through at
the perimeter.
c. Connect the input power cable to the Zone 1 bonder faceplate connector and plug into the
facility power outlet.
NOTE
On HCS9200B Dual-Zone units, a power cable MUST BE connected to the Zone 1 power input
for the system to operate. If Zone 2 is to be used, a second power cable must be connected
to the Zone 2 power input connection.
d. Connect an Output Power Cable to the Zone 1 or Zone 2 output power connector on the
faceplate as required. Ensure the Output Power Circuit Breaker is in the “ON” (UP) position.
e. Plug heat blanket into the Output Power Cable receptacles(s). The standard output cable has
receptacles for two (2) 15-amp blanket power plugs. If the heat blanket requires more than 15 amps, a
single receptacle 30-amp output cable is required.
IF OPERATING TWO (2) ZONES, ENSURE THAT THE TCs FROM ONE ZONE ARE NOT
CONNECTED TO THE OTHER ZONE. DAMAGE TO THE EQUIPMENT OR PART MAY RESULT
IF TCs ARE CROSSED BETWEEN ZONES.

HCS9000B/HCS9200B Functional Description
Hot Bonder/Controller
HCS9000B/HCS9200B-OMI-405HEATCON® COMPOSITE SYSTEMS 3
f. Plug the TCs from the vacuum bag repair area into the TC jacks on the bonder faceplate.
g. Energize the bonder by placing the POWER rocker power switch to the “ON” position. The
bonder will present the WELCOME screen. Keypad instructions are displayed at the bottom of each screen.
The WELCOME screen provides the software version installed in the unit and the Calibration Due Date.
Press “ESC”to continue to the MAIN MENU AND STATUS MONITOR screen.
h. The MAIN MENU AND STATUS MONITOR screen provides TC temperature readings, vacuum
level display, zone status, and navigation keys to further operation. On the keypad, press the number “1”to
RUN a cure program. A cure program can be selected for use by either entering the number of the program
with the number keys or by using the UP/DOWN (“” or “”) arrow keys to move the blue cursor to the
desired program and pressing “ENT”.
i. A menu will appear for selecting to either Run (1), Edit (2) or Delete (3) the Program. Press 1
and the RUN PROGRAM screen will be displayed.
j. The RUN PROGRAM Screens shows the program parameters, allows selection of the zone (if
operating a two zone unit), and allows entry of data such as Part Number, Serial Number, and Operator
Identification for records, tracking and quality control. Make the Zone selection (if required), and enter data
as necessary.
k. If the program parameters are correct and the data entry complete, the cursor will highlight the
RUN command. Pressing the “ENT”key will initialize the program for final confirmation to run. If the
program parameters are NOT correct, press the “ESC” key to return to the RUN PROGRAM screen and
select another program, or select “EDIT”to modify the program.
l. If “RUN”is selected, the GRAPH Screen for the zone in use (Zone 1 or Zone 2) will be
displayed, with a line of the proposed cure displayed as a green trace. This screen provides a visual
indication of the program to be run, along with TC and vacuum readings. The flashing cursor bar will be over
the START THE PROGRAM selection, awaiting final confirmation to run the program. Press the “ENT”key to
start the cure.
m. The program will start and present a pop-up window showing the progress of the Pre-cure Lay-
up Test. The Pre-cure Lay-up test checks a series of parameters before the cure is allowed to start. The test
checks the electrical circuit to the heater blanket to make sure the circuit is complete. A power output test
and TC RISE test checks for TC response to the heat blanket heat up. If either test fails, the operator has
the option of aborting the cure to correct the problem or continuing the cure in spite of the test failure.
n. Upon satisfactory completion of the Pre-cure Lay-up test, the cure will continue as
programmed. The setpoint or desired temperature is displayed along with the actual temperature of the
connected thermocouples. The setpoint and actual temperatures should remain close together. If they do
not agree, temperature alarms will occur, which will put the cure in a HOLD status until the alarm conditions
are corrected.
o. The theoretical time for the cure to run (with no alarms) will be displayed, along with the time for
the current step to complete and the total time remaining for the total cure. The menu in the lower right
changes to provide control options during the running cure. The actual progress of the cure will be displayed
as a yellow trace on the graph. In theory, the yellow trace should track very closely over the green trace.
p. If the lay-up is satisfactory and normal ambient conditions prevail during the cure cycle, the
program will progress as programmed and complete without intervention. The paper tape will print in
accordance with the printer settings selected in the USER SETTINGS screen menus (Fig 3-8) and print the
completed graph of the cure at the end of the tape.

Functional Description HCS9000B/HCS9200B
Hot Bonder/Controller
4HEATCON® COMPOSITE SYSTEMS HCS9000B/HCS9200B-OMI-405
CHAPTER 2
FUNCTIONAL DESCRIPTION
2.0 AC POWER CONTROL
Alternating Current (AC) source power is brought into the hot bonder through the front panel input power
connector(s). AC power for the control circuitry is then routed through the front panel power switch to the
Direct Current (DC) power supply (ref. par 2.1). The AC power used to operate the heating devices of each
respective zone is routed from the input power connector through the output power Circuit Breaker (CB) on
the front panel, to the power control mechanical safety backup relays. From the mechanical safety backup
relay(s), AC power is routed to a solid-state relay. AC power is then sent to the output power connector on
the front panel. Each output CB is a two-pole device used to break both sides of the AC line in case of an
over-current condition. Each CB is rated at 30 Amps; the maximum power handling capability of each zone.
If a fault condition causes the CB to trip, the breaker must be manually reset to restore output power.
2.1 DC CONTROL POWER
The HCS9000B/HCS9200B Hot Bonder utilizes an integrated multiple output DC power supply to provide the
necessary voltages for operation of the internal electronics. The DC power supply has a universal AC input
that allows operation with an input power voltage between 90 and 264 volts AC and a frequency between 47
Hz and 63 Hz. 400 Hz operation is also possible.
2.2 CENTRAL PROCESSOR UNIT
The computer Central Processing Unit (CPU) is a dedicated micro-controller that provides the intelligence
behind the system. The CPU receives inputs from the keypad on the front panel. Printer control information
is sent from the CPU to the printers via the parallel ports built into the CPU Carrier CCA. The flat panel
display is driven by a video driver CCA.
The operational program, user settings, calibration information and cure profiles are stored in solid-state
flash memory. Flash memory is non-volatile and does not need battery power backup to retain the
information.
2.3 SENSOR INPUT AND SIGNAL CONDITIONING
The Thermocouples (TCs) and vacuum transducers produce analog voltages that must be amplified,
buffered, and converted into digital data before the CPU can process the information. The TC signals are
routed from the front panel jacks to the Zone 1 and Zone 2 Analog Input and Conversion Circuit cards which
are interfaced to the CPU Carrier CCA via a high-speed serial communications link. Both vacuum
transducers connect to the Carrier CCA for processing, similar to the TC readings.
2.4 OPERATOR INTERFACE AND DISPLAY
The operator interfaces with the system via a 16-key keypad on the front panel and Liquid Crystal Display
(LCD) flat panel display screen. The operator enters commands and data via the keypad and views the
information on the display screen. The keypad is interfaced to the computer through a ribbon cable to the
CPU Carrier CCA. The display screen is a flat panel display with a resolution of 800 X 600 pixels. The
display is an integrated package consisting of the actual display glass with a backlight inverter attached to
the backside. The panel is driven from the LVDS Video Driver CCA, via a multi-conductor cable. A non-
glare tempered glass window is bonded to the front surface of the actual display to protect it from damage
and reduce reflections.

HCS9000B/HCS9200B Functional Description
Hot Bonder/Controller
HCS9000B/HCS9200B-OMI-405HEATCON® COMPOSITE SYSTEMS 5
2.5 PRINTER
The HCS9000B/HCS9200B series Hot Bonders employ dot matrix, impact type printers to produce a hard
copy record of the repair process. The HCS9200B has a printer for each zone. The printers are self-
contained units mounted in the front panel assembly. The printer is interfaced to the CPU Carrier CCA
parallel ports. Other connections are the +5 V DC power input and a PAPER FEED pushbutton located
adjacent to the printer on the front panel assembly.
2.6 VACUUM SYSTEM
2.6.1 INTERNAL PNEUMATIC VACUUM SYSTEM
The internal pneumatic vacuum system consists of a single air inlet Quick-Disconnect fitting, a vacuum
regulator needle valve, vacuum pump (Venturi vacuum generator), a check valve, a vacuum pressure
transducer, and a VACUUM OUT Quick Disconnect. The internal vacuum system utilizes shop air at 90-100
pounds per square inch (psi) at 2-4 Cubic Feet (cu. ft.) Per Minute (cfm) to generate the desired vacuum for
the repair. Each zone of the HCS9200B has its own independent vacuum system. Both zones receive shop
air through one input, which is located on the zone 1 side of the unit.
Shop air is connected to the front panel air fitting and routed to the vacuum regulating needle valve(s). The
pressurized airflow is metered by the regulator valve and piped to the input of the vacuum pump, producing
the vacuum level desired for the repair. The pump has no moving parts. Vacuum is generated when the
pressurized air passes through a venturi, which creates a low-pressure area. The exhaust air is then vented
through an exhaust muffler enclosed in a vent box that is located on the back of the bonder. The muffler
reduces the noise level of the air exhaust. The vent box directs the exhaust out of the case interior to
prevent contamination of the interior components. The generated vacuum passes through a check valve and
is routed to the front panel VACUUM OUT Quick Disconnect. The check valve is used to prevent the
vacuum from being lost back through the pump if the shop air is turned off or lost.
The vacuum level transducer is attached directly to the VACUUM MONITOR fitting on the front panel
assembly. The vacuum sensor is a solid-state, strain gauge, bridge type transducer. The input to the
transducer is +5 V DC. The low-level electrical output signal is connected to the CPU Carrier CCA where it
is amplified and converted into digital data.
2.6.2 INTERNAL ELECTRIC VACUUM PUMP SYSTEM (HCS9200B-EV OPTION)
The HCS9200B-EV series Hot Bonders are available with an internal electrical vacuum pump installed in the
case lid as an option. When installed, vacuum is available at the VACUUM OUT Quick Disconnect located on
the upper lid panel assembly when operating the electric vacuum pump. RETURN VACUUM MONITORING is
the same as with the internal pneumatic vacuum system.
The internal vacuum pump is a two-head, 12 V DC electrical pump. The pump input power is connected to a
universal power supply (90-264 VAC input) that is enclosed within the unit via a connector on the faceplate. A
rocker switch on the electric pump panel assembly powers an electrical selector valve that allows the operator to
switch between parallel head operation for maximum flow—approximately 0.7 cfm; or series head operation for
maximum vacuum level—up to approximately 29 In/Hg.
2.6.3 INTERNAL ELECTRIC VACUUM PUMP SYSTEM (HCS9000B-EV ONLY)
The HCS9000B-EV Hot Bonder is designed with an internal electrical vacuum pump installed in the case.
Vacuum is available at the VACUUM OUT Quick Disconnect on the front panel assembly the same as with the
standard pneumatic vacuum system. RETURN VACUUM MONITORING is the same as with the internal
pneumatic vacuum system.
The internal electric vacuum pump is a two-head, 12 V DC pump. The pump input power is connected to a
universal power supply (90-264 V AC input) that is enclosed within the unit. A rocker switch on the front panel
controls ON/OFF power to the electric pump. The pump provides a maximum vacuum level up to approximately
27 In/Hg.

Functional Description HCS9000B/HCS9200B
Hot Bonder/Controller
6HEATCON® COMPOSITE SYSTEMS HCS9000B/HCS9200B-OMI-405
2.7 PROPORTIONAL, INTEGRAL AND DERIVATIVE (PID) CONTROL
2.7.1 PID CONTROL BASICS
The heat control system used in the hot bonders is referred to as a Closed Loop System. This means that
the heat output is controlled by feedback from the input thermocouples, which are in contact with the heat
load. The controller constantly measures the difference (error) between the setpoint (expected) temperature
and the actual (measured) temperature, attempting to correct for the difference. The amount and speed of
the correction is regulated by PID control. As with any control system, too little or too much corrective action
can result in poor system performance and stability. Properly selected PID parameters help to minimize
undershoot and overshoot of the setpoint by the actual cure temperature.
Many variables can influence the performance of the heat control system. The major factors are, heat
source, heat load, sensor placement and response, and environmental conditions. Heat sources can be
heat blankets, infrared lamps, coil type air heaters, and fiberglass mesh type mat heaters. Each of these
sources converts electrical energy into heat and applies that heat to the load. Heat loads vary by the type of
material to be cured, the thermal mass of the part, the size and surface area of the part, and the ability of the
part to transfer heat. Temperature sensor placement is critical to the control loop to accurately reflect the
part temperature. Environmental conditions affect the amount of heat loss during the cure, the ability of the
heat to be distributed evenly, and the stability of the process.
Properly selected PID control parameters can adjust for many of the variables encountered in the composite
curing process. The basic PID parameters used in the standard hot bonder/controller configuration are
suitable for the majority of composite cure situations, using silicone rubber heating blankets. When the hot
bonder/controller is used to control a heat source other than blankets, the PID control parameters usually
have to be adjusted to provide stable, accurate control of the cure process. Selection of the optional
“SPECIAL PID CONTROL” mode of operation in the ADVANCED USER SETTINGS Screen allows an
alternate set of PID parameters to be used by the bonder for heat output calculations.
The initials PID stand for PROPORTIONAL, INTEGRAL, and DERIVATIVE and are standard throughout the
control industry. Explanations of the terms and their effect are listed below:
2.7.2 PROPORTIONAL Also known as “gain”. This is the amount of input change (error) required to
produce a 100% change in the output of the controller. This is expressed in F. The number of degrees
assigned to the “P” value is called the proportional bandwidth. A proportional bandwidth of 10 degrees
means that the controller output will change proportionally from 0 to 100% over a range of 10 degrees. If the
setpoint is 250 F, and the actual temperature is below 240 F (more than 10error), the output will be 100%.
If the actual is 245 F, the output will be 50%. At 250 F actual (0error), the output will be 0%. If the
proportional bandwidth is too small, the process will oscillate around the setpoint and be unstable. The
actual temperature will overshoot setpoint, and then undershoot. This will continue indefinitely. Making the
proportional bandwidth wider will eventually eliminate the oscillation, but the process will never actually reach
setpoint. The actual temperature would stabilize at some point below the setpoint. In order to reach
setpoint, the next parameter, INTEGRAL, is used.
2.7.3 INTEGRAL Integral is the “I” in PID, is also known as “reset”. The term reset is actually more
descriptive of the control action that occurs. The PID control attempts to “Reset” the setpoint to force the
system to achieve the desired setpoint. In the bonder graphic displays (screens), the term reset is used, and
is expressed as “Minutes per Reset”. In effect, the reset action is applied every X number of minutes,
depending on the number assigned to the reset value. Slow processes require long reset intervals and fast
processes require shorter reset intervals. When using Proportional control with reset, the actual temperature
will actually overshoot the setpoint by some amount before the reset becomes inactive and the process is
allowed to stabilize. In a properly tuned system, the overshoot will be minimal and usually is tolerable. If
overshoot is unacceptable, then the next parameter, DERIVATIVE, is used.

HCS9000B/HCS9200B Functional Description
Hot Bonder/Controller
HCS9000B/HCS9200B-OMI-404 HEATCON® COMPOSITE SYSTEMS 7
2.7.4 DERIVATIVE Derivative is the “D” in PID, is more commonly known as “rate”. The function of
rate is to prevent overshoot of the setpoint by the process. It does this by slowing the rate of approach of the
actual temperature to the setpoint. The rate time is expressed in minutes and is how long the rate function is
applied to the output. After the rate time is up, the rate function is removed from the output, returning control
to the Proportional bandwidth and reset function. The higher the rate number, the longer the rate function is
applied and the faster the output is reduced, thus preventing overshoot. Too high of a setting of the rate
value will result in undershooting of the setpoint and sluggish control of the process.
All three parameters (PID) interact with each other and proper selection of the values may be difficult.
Scientific determination of PID values is usually the work of process control engineers or other personnel
familiar with temperature control processes. However, there are methods of tuning a PID system by
experimentation and observation of trends and control action.
2.8 NETWORK OPERATION
The network connection port is located on the back of the screen bezel next to the USB port. This
connection allows multiple hot bonders to be remotely operated from a common control point where multiple
zones of control are required. Examples include large area repairs where a single bonder cannot supply the
power required, or thermally complex repairs where multiple independent PID loops are required to run a
common cure. Network operation requires no intervention or configuration from the bonder interface. Once
a network controller is connected to the port, a connection will be established automatically.
While connected to a network controller, the bonder will still operate independently of the network until the
controller initiates a cure program. Once a network cure program is started, the bonder display will be fixed
on the MAIN MENU & STATUS MONITOR screen and the keypad will be disabled. The unit will not retain
data from cures run in network mode. All data will be stored on the network controller.
Figure 2-1. HCS9200B Display Screen under Network Control

Functional Description HCS9000B/HCS9200B
Hot Bonder/Controller
8HEATCON® COMPOSITE SYSTEMS HCS9000B/HCS9200B-OMI-405
Figure 2-2. Network Port Location (HCS9000B)
Figure 2-3. Network Controller (HCS9300NW)