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  9. Broadcom AFBR-39 RZ Series Installation and operating instructions

Broadcom AFBR-39 RZ Series Installation and operating instructions

Broadcom Proprietary. Not for distribution outside the company
- 1 -
Introduction
AFBR-39xxyyRZ devices consisting of an optical transmitter
and receiver operating at 650-nm wavelength are short optical
transmission links and provide galvanic insulation up to 17-kV
(peak) working voltage and 50-kV (peak) transient voltage.
Figure 1 Pinning Schematic
Dry Packing
The AFBR-39xxyyRZ is packed in an anti-static tube shipped
inside a Moisture Barrier Bag (MBB) together with desiccants
and an indicator according JEDEC J-STD-33B, to keep the
device protected against humidity in the environment. The
label depicted in Figure 2 indicates moisture sensitivity.
Figure 2 Moisture Warning Label
Floor Life and Maximum Storage Time
(Shelf Life)
The moisture sensitivity classification is MSL3 according to
JEDEC J-STD-020D.
Unopened moisture barrier bagged devices can be stored up
to 12 months in an environment with a temperature between
5°C and 40°C and a relative humidity (RH) not exceeding 90%.
Unpacked devices can be kept in a production environment up
to 168 hours provided a temperature not exceeding 30°C and a
relative humidity (RH) not exceeding 60%.
Handling
The AFBR-39xxyyRZ device is designed to cover all reasonable
mechanical stresses in the application (mechanical shock and
vibration tests according IEC 60068-26 and IEC 60068-2-27
applied). However, applying bending forces to the device is
improper use and must be avoided. This is indicated with the
label shown in Figure 3.
Figure 3 Warning Label
Top View
TX RX
1
2
3
48
7
6
5
IMPORTANT NOTE:
AFBR-3905xxRZ devices must not be bent under any circumstances.
AFBR-39xxyyRZ
High Voltage Galvanic Insulation Link Family for DC
(up to) 50 MBaud
Application Note
Electrical Circuits, Handling, Storage Operating and
Processing Procedures
Broadcom Proprietary. Not for distribution outside the company
- 2 -
AFBR-39xxyyRZ
Application Note
Application Note
Baking
When the device is inserted and soldered to a PCB up to 1 week
after it has been taken out of the Moisture Barrier Bag, then the
moisture level in the mold material is low enough to ensure
minimum mechanical stress while soldering.
If the device is kept on the production floor for more than
1 week as described in the last paragraph, it is advised to bake
the module before soldering.
Baking is done by removing the devices from the tube and
placing them in a shallow container so that the package bodies
do not touch each other. Then, the devices are placed in the
bake oven, heating the devices to 100°C for 24 hours. After this
procedure, the moisture content of the devices is low and the
moisture-induced stress during soldering is reduced. As a
general guideline, baking is recommended before every
soldering attempt.
The baking procedure can be done as often as necessary.
Electrostatic Discharge (ESD) Protection
The devices are sensitive to electrostatic discharges and
therefore must be handled with care in an ESD protected area,
indicated with the sign shown in Figure 4.
Figure 4 Warning Sign for ESD Protected Area
An ESD event may damage or degrade the device
performance. The standard DIN 61340-5-1 has to be
considered. The following ESD preventions should be applied.
Any smaller ESD prevention program might be unsuitable to
prevent ESD damages.
ESD floors
ESD tables, ESD work surfaces and ESD storage facilities
(e.g., trolleys and carts)
ESD wrist straps/connectors for wrist straps
ESD footwear and garments (cotton or special released
materials)
ESD gloves or finger cots
ESD chairs
ESD tools (e.g., nippers)
ESD preventions at equipment parts (Equipment parts
which may directly contact the device leads must be made
of dissipative materials, wherever possible. If dissipative
materials cannot be used for technical reasons metals
must be used whose natural non-conductive surface layer
is sufficiently thin (breakdown voltage <10V). Conducting
machine parts which may contact the device leads directly
must be connected to ground without a series resistor.
ESD packing materials.
ESD Classification
The devices passed the following ESD test: Electrostatic
Discharge to the Electrical Pins Human Body Model (HBM) with
U = ±2000V according MIL-STD-883 Method 3015.
Device Mounting
The devices are designed for through-hole mounting on a PCB.
The minimum distance from the package to the PCB is
mechanically defined by the design of the housing which is
given as drawing in the product data sheet
Solderability/Soldering Process
The qualification test, Resistance to soldering heat - Standard
soldering technique (RSH-ST), was done with a solder
temperature of 260°C for 10 seconds (distance to package:
3 mm) according to JEDEC standard JESD22-B106D.
Hand Soldering/ Rework
Hand soldering or rework is not allowed during production
process.
If hand soldering is necessary, the following guidelines must be
observed:
Heat the devices to 100°C for 24 hours.
Soldering time must be below 350°C and limited to less
than 3 seconds.
Do not allow the lead temperature measured on the lead
close to the mold package to exceed 350°C.
Note: Hand soldering and rework is a badly reproducible
process. Hand soldering may cause stresses in the mold
package, which affects optical performance and/or reliability if
the above guidelines are not observed.
ATTENTION
ESD PROTECTED AREA
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHANGE
SENSITIVE
DEVICES
Broadcom Proprietary. Not for distribution outside the company
- 3 -
AFBR-39xxyyRZ
Application Note
Application Note
Washing
The washing process shall be done by using easily vaporizing
materials like methyl, isopropyl, or isobutyl.
After washing the part(s), it is mandatory to take care of
sufficient drying time at high temperature.
Recommended chemicals:
Alcohols like methyl, isopropyl, isobutyl
Aliphatics like hexane or heptane
Soap solutions
Naphtha
De-ionized water
Do not use chemicals including:
(Partially) halogenated hydrocarbons
Ketones (e.g., MEK)
Acetone
Chloroform
Ethyl acetate
Phenol
Methylene chloride
Methylene dichloride
N-methylpyrrolidone
In general, it is sufficient to use simple cleaning agents like
alcohols or soap solutions. More aggressive chemicals like
halogenated hydrocarbons are needlessly demanding to the
environment and are hazardous to human health. Therefore,
these should be avoided whenever possible.
Maximum Temperature at FOT
The maximum ambient temperature must not exceed 85°C.
Guidelines for Optimum Heat Transfer to
PCB
The board should be designed for optimum heat transfer from
the device interior via the leads to the PCB. The distance of the
device body to the solder joint on the PCB shall also be
minimized and the dimensions of the conductors on the PCB
shall be maximized. Convection airflow around the devices
shall not be obstructed. Other heat generating devices shall
not be placed near the devices.
Galvanic Insulation
AFBR-39xxyyRZ is a certified optocoupler according to EN
60747-5-5:2011. Insulation values are:
For further details, refer to the data sheet.
Flammability Classification
The Flammability class is UL94-V0.
Eye Safety
The device emits light with a wavelength of 650 nm (red). This
product is designed to avoid damage to the unprotected eye.
To indicate the classification of the light source, a label as
depicted in Figure 5 can be used. However these labels are not
mandatory on the product according to IEC 60825 version 1.2
paragraph 1.1.
Figure 5 LED Source Label
EMI Immunity
The AFBR-39xxyyRZ devices tolerate electrical noise
interferences in the range of 1 MHz up to 1000 MHz with an
electrical field strength of higher than 100 V/m.
Maximum Transient Voltage,
peak
VIOTM_1inch 15
kV
VIOTM_2inch 27
VIOTM_3inch 40
VIOTM_4inch 50
Maximum Transient Voltage,
effective
VISO_1inch 10.5
kV
VISO_2inch 19
VISO_3inch 28.1
VISO_4inch 35.2
Maximum Working Voltage,
peak
VIORM_1inch 4.25
kV
VIORM_2inch 8.5
VIORM_3inch 12.75
VIORM_4inch 17.00
Maximum Working Voltage,
effective
VIOWM_1inch 3
kV
VIOWM_2inch 6
VIOWM_3inch 9
VIOWM_4inch 12
CLASS 1 LED PRODUCT
Broadcom Proprietary. Not for distribution outside the company
- 4 -
AFBR-39xxyyRZ
Application Note
Application Note
Recommended Electrical Application Circuits
Figure 6 Recommended Electrical Application Circuit AFBR-3905yyRZ (Top View)
Table 1 AFBR-3905yyRZ Pin Description
Pin Number Transmitter Pin Number Receiver
1Anode 5
No functiona
2Cathode 6 VCC
3No functiona
a. It is recommended to connect this pin to signal ground.
7GND
4No functiona8Data_out
TX Value Tolerance
R1 4.7 kΩ 5%
R2 390Ω 1%
C1 0.1 μF 20%
C2 1.0 μF 20%
RX Value Tolerance
C3 0.1 μF 20%
R1 R2 C1 C2
1/2 SN75451
4
56
7
8
VCC TX
Data_IN
2
3
4
1
C3
V
CC
RX
Data_out
6
7
8
5
TX Value Tolerance
R1 47Ω 5%
R2 1 kΩ 5%
R3 390Ω 2%
R4 150Ω 2%
C1 0.1 μF 20%
C2 1.0 μF 20%
RX Value Tolerance
C3 0.1 μF 20%
C3
V
CC
RX
Data_out
6
7
8
5
R1
R3 C1 C2
V
CC
TX
Data_in
2
3
4
1
R2
2N7002E
R4
Broadcom Proprietary. Not for distribution outside the company
- 5 -
AFBR-39xxyyRZ
Application Note
Application Note
Figure 7 Recommended Electrical Application Circuit AFBR-3950yyRZ (Top View)
Figure 8 Device Marking
Table 2 AFBR-3950yyRZ Pin Description
Pin Number Transmitter Pin Number Receiver
1V
CCTX 5 No functiona
2No functiona
a. It is recommended to connect this pin to signal ground.
6V
CCRX
3 GND 7 GND
4 Data_in 8 Data_out
TX Value Tolerance
C1 10 μF 20%
C2 10 μF 20%
C3 100 nF 20%
R1 4.7 kΩ 5%
RX Value Tolerance
C4 100 nF 20%
VCC TX
Data_In
2
3
4
1
6
7
8
5
C2 C3 R1
GND
GND
C1
L1
C5 10 μF 20%
L2 1 μH 20%
C6 10 μF 20%
L1 1 μH 20%
VCC RX
Data_Out
C5 C6
GND
C4
GND
L2
Avago Logo
Date Code
xxyy
xx: year
yy: calender week
Part Number AFBR-39xxyyRZ
xx:
05 = 5 MBaud
50 = 50 MBaud
yy:
25 = 1 inch ≈ 25 mm
50 = 2 inch ≈ 50 mm
75 = 3 inch ≈ 75 mm
00 = 4 inch ≈ 100 mm
R = Transmission medium Rod
Z = RoHS compliant
VDE mark:
certied according
EN 60747-5-5:2011
TX Side Indication
RX Side Indication
For product information and a complete list of distributors, please go to our web
site: www.broadcom.com.
Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago,
and the A logo are among the trademarks of Broadcom and/or its affiliates in the
United States, certain other countries and/or the EU.
Broadcom Proprietary and Confidential. Copyright © 2017 by Broadcom. All
Rights Reserved.
The term "Broadcom" refers to Broadcom Limited and/or its subsidiaries. For
more information, please visit www.broadcom.com.
Broadcom reserves the right to make changes without further notice to any
products or data herein to improve reliability, function, or design.
Information furnished by Broadcom is believed to be accurate and reliable.
However, Broadcom does not assume any liability arising out of the application
or use of this information, nor the application or use of any product or circuit
described herein, neither does it convey any license under its patent rights nor
the rights of others.
AFBR-39xxyyRZ-AN100 – January 23, 2017

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