C-DOT DSS MAX-XL User manual

C-DOT DSS MAX-XL
INSTALLATION MANUAL

System
Practices
Section No. 401-305-0496
Draft 03, August 1999
C-DOT DSS MAX-XL
INSTALLATION MANUAL
© 1999, C-DOT
Printed in India

C-DOT DSS MAX-XL
INSTALLATION MANUAL
DRAFT 03
AUGUST1999
BHADRA2056
SERIES 300 : INSTALLATION
CSP SECTION NO. 401-305-0496
THIS C–DOT SYSTEM PRACTICE REFERS TO THE C–DOT DIGITAL SWITCHING SYSTEM
MAIN AUTOMATIC EXCHANGE (ABBREVIATED AS C-DOT DSS MAX-XL IN THE REST OF
THISPUBLICATION).
THE INFORMATION IN THIS SYSTEM PRACTICE IS FOR INFORMATION PURPOSES AND IS
SUBJECT TO CHANGE WITHOUTNOTICE.
A COMMENT FORM HAS BEEN INCLUDED AT THE END OF THIS PUBLICATION FOR
READER'S COMMENTS. IF THE FORM HAS BEEN USED, COMMENTS MAY BE ADDRESSED
TO THE DIRECTOR (SYSTEMS ), CENTRE FOR DEVELOPMENT OF TELEMATICS, 39, MAIN
PUSA ROAD, NEW DELHI -110 005
©1999 BY C–DOT, NEW DELHI.

PREFACE
The objective of this manual is to guide and provide the installer with the necessary
information about the installation of the C-DOT MAX-XL. It is for this reason that
more emphasis has been put on the overall installation information than the
detailed step by step procedures.
This manual includes various chapters on floor marking, grouting, iron work
installation, cable preparation and laying, IOP installation etc. Each chapter covers
a brief introduction about the activity, material and tools required for performing
the task and a description of the installation procedure. It is hoped this manual will
serve as a useful reference to the installer.

Table of Contents
Chapter 1. Floor Marking...........................................................................................................................9
1.1. Introduction.......................................................................................................................9
1.2. Standard Terms ................................................................................................................9
1.3. Material & Tools Required.............................................................................................10
1.4. Marking Procedure for Switch Room & IOP Room.......................................................10
1.5. Marking of Suite Lines & Grouting Holes.....................................................................12
1.6. Marking of IOP Room.....................................................................................................15
Chapter 2. Grouting..................................................................................................................................19
2.1. Introduction.....................................................................................................................19
2.2. Material & Tools Required.............................................................................................19
2.3. Drilling.............................................................................................................................19
2.4. Hole Preparation.............................................................................................................19
2.5. Expansion Bolt................................................................................................................20
2.6. Insertion of the Bolt........................................................................................................20
2.7. Tightening of the Bolt.....................................................................................................20
Chapter 3. Iron Work Installation...........................................................................................................23
3.1. Introduction.....................................................................................................................23
3.2. Material and Tools Required..........................................................................................23
3.3. Iron Work Fixing.............................................................................................................25
3.4. Assembly Items...............................................................................................................39
Chapter 4. IDP & DC Distribution Panel................................................................................................47
4.1. Introduction.....................................................................................................................47
4.2. List of Material and Tools Required..............................................................................47
4.3. Intermediate Distribution Panel (IDP) .........................................................................47
4.4. DC Distribution Panels [DCDP's]..................................................................................49
Chapter 5. Cabinet Installation...............................................................................................................53
5.1. Introduction.....................................................................................................................53
5.2. Material & Tools Required.............................................................................................53
5.3. Unpacking Cabinet.........................................................................................................54
5.4. Cabinet on Castors..........................................................................................................57

5.5. Moving the Cabinet on Basemount................................................................................57
5.6. Levelling/Mounting the Cabinet on Basemount...........................................................57
5.7. Ganging the Cabinets.....................................................................................................57
Chapter 6. MDF Installation....................................................................................................................63
6.1. Introduction.....................................................................................................................63
6.2. Marking ...........................................................................................................................63
6.3. MDF Installation ............................................................................................................63
Chapter 7. IOP & ADP Installation.........................................................................................................78
7.1. Introduction.....................................................................................................................78
7.2. IOP Installation ..............................................................................................................78
7.3. MM-ADP Installation.....................................................................................................79
Chapter 8. Power Distribution Panel and its FBI Mounting.................................................................85
8.1. Introduction.....................................................................................................................85
8.2. PDP Installation .............................................................................................................85
8.3. Mounting of FBI Card.....................................................................................................86
Chapter 9. IOP -PDP and OMA Installation .........................................................................................92
9.1. Introduction.....................................................................................................................92
9.2. Installation of IOP-PDP..................................................................................................92
9.3. OMA Panel Assembly Installation.................................................................................95
Chapter 10. Cable Preparation and Laying..............................................................................................99
10.1. Introduction...................................................................................................................99
10.2. Crimping Procedure......................................................................................................99
10.3. Cable Preparation.......................................................................................................100
10.4. Ground Cables.............................................................................................................100
10.5. DC Cables....................................................................................................................115
10.6. Signal Cables...............................................................................................................190
10.7. MDF Cables.................................................................................................................276
10.8. MAX MDF Wiring (General).....................................................................................304
10.9. Cable List.....................................................................................................................306

Chapter 11. Fuse Details & Placement...................................................................................................312
11.1. Introduction.................................................................................................................312
11.2. Fuses Used in BM-XL.................................................................................................312
11.3. Fuses Used in LM.......................................................................................................313
11.4. Fuses Used in IOPs (IOP0 & IOP1)..........................................................................313
11.5. Fuses Used for ADP....................................................................................................313
11.6. Fuses Used in CM-XL.................................................................................................313
11.7. Fuses/MCBs Used in Suite PDP................................................................................313
11.8. Fuses/MCBs Used in IOP-PDP..................................................................................314
11.9. Fuses/MCB Used in DCDP.........................................................................................314
11.10. Consolidated List of Fuses and MCBs.....................................................................314
Chapter 12. Operator Positions ...............................................................................................................316
Chapter 13. Invertor Arrangement..........................................................................................................317
13.1. Introduction.................................................................................................................317
13.2. Inverter Input..............................................................................................................317
13.3. Inverter Output Supply Distribution ........................................................................317
Chapter 14. Sign Writing.........................................................................................................................320
14.1. Introduction.................................................................................................................320
14.2. Sign Writing Format...................................................................................................320
Chapter 15. VDU & Printer Setting........................................................................................................323
15.1. Introduction.................................................................................................................323
15.2. VDU Setting................................................................................................................323
15.3. Printer Setting ............................................................................................................326
Chapter 16. Jumper Settings...................................................................................................................328
16.1. Introduction.................................................................................................................328
16.2. Description of Jumper Types......................................................................................328
16.3. Jumper Settings IN BM-XL/LM ................................................................................329
16.4. Jumper Settings in CM-XL ........................................................................................339
16.5. Jumper Settings in IOP..............................................................................................341
Chapter 17. Power-ON Procedure ...........................................................................................................345
17.1. Introduction.................................................................................................................345
17.2. Visual Inspection.........................................................................................................345

17.3. Electrical Tests............................................................................................................346
Chapter 18. Functional Testing...............................................................................................................348
18.1. Introduction.................................................................................................................348
18.2. Software Installation..................................................................................................348
18.3. AM Testing..................................................................................................................349
18.4. AM Diagnostics ...........................................................................................................350
18.5. SCU Testing ................................................................................................................351
18.6. SCU Diagnostics .........................................................................................................352
18.7. BM Equipping .............................................................................................................354
18.8. BTU Testing................................................................................................................354
18.9. SSU Testing.................................................................................................................357
18.10. BM Testing Set up ....................................................................................................358
18.11. SUM and ISTU Testing............................................................................................361
18.12. System Initialisation in Different Configurations..................................................362
18.13. Inter BM Testing.......................................................................................................362
18.14. Alarm Testing............................................................................................................363
18.15. System Stability........................................................................................................364
18.16. Load Testing..............................................................................................................368
18.17. Exchange Synchronisation with Network Clock.....................................................369
Appendix-IBM Equipage Procedure......................................................................................................371
Appendix -II Modifications for Enhanced Subscriber Service Unit (ESU) Equipment.........................376
Appendix -III ISTU Related Remarks........................................................................................................377
Appendix -IV Procedure for Network Synchronization ............................................................................378
F:\HOME\MAX-XL\WORD\XLINSTMN.DOC September 27, 2000

INSTALLATION MANUAL 9
Chapter 1.
Floor Marking
1.1. INTRODUCTION
As a first step towards the installation of Exchange equipment (iron work, IOP-
PDP), the floor should be marked as per the exchange layout. Floor markings are
done in Switch Room where the main switching equipment is placed and IOP Room
where the input output processors with consoles are placed. The main aim of this
marking is to locate the exact position of the grouting holes which are used for
fixing the equipment in the respective rooms. This chapter covers the materials and
tools required and the detailed marking procedure. However, before carrying out
the floor marking, certain standard terms need to be understood and are therefore
defined.
1.2. STANDARD TERMS
1.2.1. Floor
Floor means the normal floor covered with suitable antistatic material.
1.2.2. Datum Line
A datum line is a straight line drawn through the maximum no. of points
located at a distance, say D, from the wall of the Switch Room/IOP Room.
1.2.3. Reference Point
It is a point on the Switch Room/IOP Room floor to which the datum lines
and subsequent measurements are related. It is also defined as the
intersection point of the two datum lines drawn at right angles to each other.
1.2.4. Suite End Line
This is the line drawn parallel to one of the datum line from which the suite
will begin or start growing.

Chapter 1.
10 C-DOT DSS MAX-XL
1.2.5. Suite Lines
These are the lines drawn parallel to the other datum line (one referred in
suite end line) perpendicular to suite end line and coincide with the periphery
of the Base mount Assembly.
1.2.6. IOP Lines
These are the lines drawn parallel to one of the datum lines, and coincide
with the periphery of the IOP cabinet.
1.3. MATERIAL & TOOLS REQUIRED
S. NO. DESCRIPTION QUANTITY
1. T Square (1 meter) 1
2. One meter long flat steel scale 2
3. String (silk thread) for marking 10 M
4. Ultra marine indigo or Blue ink for temporary
marking 1
5. Highlight marking pens of black ink 4 Kg
6. Steel measuring tape of 15M length 2
7. Set Square 1
8. Brass Screws (2mm to 3mm with a cut on top) 30
1.4. MARKING PROCEDURE FOR SWITCH ROOM & IOP ROOM
1.4.1. Marking of First Datum Line
Mark some points along the length of the room at a distance of 600mm from
the wall. Draw a line such that it passes through a maximum number of the
points. To draw the line, soak a silk string of required length in ultra marine
indigo or blue ink. Place it over the points by holding the string tightly at
both the ends. Pull the string from the middle and release it so that it leaves
an impression on the floor. This line is called the first datum line. Refer Fig.
1.1.
1.4.2. Locating Reference Point
Mark a point on the first datum line at a distance of 600mm from the
adjacent wall. This point is called the Reference Point. Fix a brass screw at
the Reference point to mark it permanently. This point is denoted as `X' in
Fig. 1.1.

FLOOR MARKING
INSTALLATION MANUAL 11

Chapter 1.
12 C-DOT DSS MAX-XL
1.4.3. Marking the Second Datum Line
The second datum line should be perpendicular to the first datum line. To
ensure this, the 3-4-5-triangle rule is adopted and the second datum line is
drawn passing through the reference point.
With a steel tape measure a length of 900mm or a multiple of 300mm (say
Nx300mmm) from the reference point and mark a point on the first datum
line. Let us call this point as 'Y'. (Fig. 1.2).
From the reference point 'X' draw an arc at a distance of 1200mm or a
multiple of 400mm (say Nx400 mm) in the direction approximately
perpendicular to the first datum line. To draw an arc use a pen tied to one
end of a string. Draw another arc at a distance of 1500mm or a multiple of
500mm (say Nx500mm) from the point 'Y' on the first datum line such that it
intersects the earlier arc. Let us call the intersection point as 'Z'. Obtain
several points in a similar way. Draw a line from the reference point such
that it passes through maximum number of these points. To draw the line
use the string dipped in ultra marine indigo or blue ink.
Fix some brass screws along the datum lines with a clearance of 2M between
them.
1.5. MARKING OF SUITE LINES & GROUTING HOLES
The suite lines are drawn as shown in Fig. 1.3 as per the procedure outlined in
section 1.4. The length and width of a full suite are 8590 mm and 624 mm
respectively. The inter-suite distance is maintained at 1000 mm. The clearance
between wall and first suite is fixed at 1000 mm. The minimum clearance between
the wall and the last suite shall be more than 1000 mm.
1.5.1. Marking of Suite Lines
Draw a line parallel to the second datum line at a distance of 1600 mm from
it. This is referred to as the suite end line as shown in Fig. 1.3. Now draw a
line at a distance of 400 mm from and parallel to the first datum line. This is
referred as the suite line. Now other suite lines can be drawn parallel to this
suite line at a distance of 624 mm, 1624 mm, 2248 mm, 3248 mm, 3872 mm,
4872 mm, 5496 mm, 6496 mm and 7120 mm. These suite lines should be of
8590 mm length.
1.5.2. Marking of Grouting Holes
Fig. 1.3 shows a typical switch room grouting hole markings for a five suite
configuration of C-DOT MAX-XL. These holes are used for fixing the iron
work on the floor.

FLOOR MARKING
INSTALLATION MANUAL 13

Chapter 1.
14 C-DOT DSS MAX-XL

FLOOR MARKING
INSTALLATION MANUAL 15
Basemount assemblies of the first suite will be placed on the first and second
suite line. Basemount assemblies of the second suite will be placed on the
third and fourth suite line and so on.
A typical MAX-XL switch room layout for a five suite configuration is shown
in Fig. 1.4. It is to be noted that number of suites required depends on the
capacity and configuration of the switch.
A typical TAX-XL switch room layout for a 6K trunk configuration is shown
in Fig. 1.4 (a). For higher capacity (>6K) TAX one more suite will be added
and CM will then be installed in third suite.
1.6. MARKING OF IOP ROOM
Datum lines are drawn in the IOP room as per the procedure adopted above. Refer
Fig. 1.5. Marking of IOP lines has to be made in such a way that the clearance
between the two IOPs is not less than 750 mm, and also the clearance between the
wall and any of the two IOPs is not less than 750 mm. IOP-PDP is also mounted in
the IOP room for the distribution of DC power to the IOPs.
For marking of IOP-PDP position in IOP room, draw a line parallel to second datum
line at a distance of 150 mm away from it. Next draw a line perpendicular to the
second datum line at a distance of 500 mm from the first datum line. The placement
of IOPs, console tables and IOP-PDP are shown in Fig. 1.5.

Chapter 1.
16 C-DOT DSS MAX-XL

FLOOR MARKING
INSTALLATION MANUAL 17
\DESIGN\DSSMAX\MAX-XL\MAX-XLIM\MXI-EL1

Chapter 1.
18 C-DOT DSS MAX-XL

INSTALLATION MANUAL 19
Chapter 2.
Grouting
2.1. INTRODUCTION
This chapter describes the procedure for preparation of holes used for fixing the iron
work of the multimodule MAX-XL on the floor.
2.2. MATERIAL & TOOLS REQUIRED
S. NO. DESCRIPTION QUANTITY
1. Expansion Bolts 16 per suite
2. Concrete Electrical drilling machine with accessories 1
3. Carbide tip spiral drilling bit (32mm) Chromium steel drilling
bit (for hand holes) 1
4. A flat mild steel plate 150mmx150mmx6mm thick 1
5. Cement + some quick drying compound for repair of hole 1 Kg
6. Vacuum Cleaner 1
7. Steel Rod (length of 200mm, dia 32mm) 1
2.3. DRILLING
The marked points ‘+’ (refer Fig. 1.5) serve as the centre point for drilling. An
electrical concrete drilling machine with 32 mm carbide tip spiral bit is used for
drilling on concrete floor. During drilling, care is taken for the hole to be straight
and there is no chipping/cracking of the mosaic tiles.
2.4. HOLE PREPARATION
Fixing of the iron work on the floor requires preparation of hole of exactly 32mm
diameter. During drilling of the holes with 32mm drilling bit the hole may not have
a proper shape. A steel rod of 32mm diameter is used to check proper shape and
depth of the hole. If a hole gets cracked during drilling, ordinary cement mixed with
a little quick drying compound like plaster of paris can be used to repair it. A hole
with a minimum depth of 105mm should be drilled. The extra drilled portion of the
hole gets filled with the cement. This gives strength to the hole to sustain the

Chapter 2.
20 C-DOT DSS MAX-XL
expansion of the grouting bolt. To clear material from the hole a vacuum cleaner is
used.
2.5. EXPANSION BOLT
The Expansion Bolt of high grade malleable iron consists of segmented shield with
an internal expander nut (same as the English Rawl bolt specification). The steel
ferrule (cup) fitted on the top provides for a limited amount of compression which
enables the machinery/equipment to be clamped tightly against the mounting
surface.
In Bolt Projecting type (BP type) expansion bolt which has an internal expander
nut, the fixing is done by tightening of the nut over the projecting bolts after the
equipment is lifted into the position. A typical projecting type bolt is shown in Fig.
2.1.
2.6. INSERTION OF THE BOLT
The Expansion Bolt is inserted into the hole completely, with the expander nut
leading in. A flat steal plate of 150mm x 150mm x 6mm is used to flatten the steel
ferrule prior to loading on the bolt. At the time of insertion care is taken that the
bolt is kept straight and perpendicular to the floor. Refer A in Fig. 2.2.
2.7. TIGHTENING OF THE BOLT
The hexagonal nut is tightened along with a washer. This is done with a proper
spanner. During tightening the expander nut is drawn up the shield assembly on
account of complimentary tapers given, thus forcing the segments apart. During
tightening care is taken not to exceed the maximum tightening torque specified.
Refer B and C of Fig. 2.2.
After the nut is tightened to the fullest extent, the nut is removed from the bolt. The
flat plate used for flattening the steel ferrule is also removed.
The installation/erection of the basemount is done on the bolts thus grouted on the
floor. Refer D of Fig. 2.2.