CEL MeshConnect ZICM0868P0-1C Instruction Manual

Page 1
MeshConnect™ Sub-G Module Series
CEL's MeshConnect™ Sub-G modules are built on the Si1000
and Si1002 highly integrated wireless SoC's from Silicon Labs.
Targeting dense operating environments, CEL’s MeshConnect
Sub-G modules deliver superior range and performance. Their
low power consumption enables longer battery life and their link
budgets provide reliable transmission in non line of sight ap-
plications such as lighting control, industrial sensor networks,
serial wire replacement, metering, irrigation and more. At +13
and +20 dBm power outputs, the new Sub-G modules offer 868
MHz (Europe) and 915 MHz (Americas) ISM band options. As
certied and qualied modules, the MeshConnect Sub-G solu-
tions eliminate the need for costly certications, reducing overall
system cost and accelerating time to market.
Development Kits Available:
ZICM0868P0-KIT1-1 and ZICM0900P2-KIT1-1
The information in this document is subject to change without notice, please conrm data is current
Document No: 0009-00-07-00-000 (Issue ES)
Date Published: June 1st, 2011
PRELIMINARY DATA SHEET
DESCRIPTION
ZICM0868P0
ZICM0900P2
868 / 900 MHz System-on-Chip (SoC) Based Modules
•FrequencyRange:
902- 928 MHz 
868 MHz
•LinkBudgetupto-140dB
(for +20 dBm module)
 +20 dBm and +13 dBm available
output powers 
•MaxOutputPower:
+ 13 dBm @ 3.5 VDC (ZICM0868P0)
+ 20 dBm @ 3.5 VDC (ZICM0900P2)
•DataRate:0.123to150kbps

•GeneralPurposeI/Os:21

•HighSpeed8051MCU:
25 MHz - single cycle instruction execution
4kB RAM / 64 kB Flash
•10-BitADC:
300 ksps, 18-ch inputs
•SerialCommunication:
UARTs, SPI (Master/Slave)
SMBus, PCA

•Add1MBadditionalFlashmemory
 toenableOverTheAir(OTA)
 programming(Optional) 
FEATURES
•Modulation:  
FSK, GFSK, OOK
•RFPowerConsumption 
24 mA Receive
18 mA @ + 1 dBm transmit 
42 mA @ + 13 dBm transmit
97 mA @ + 19 dBm transmit
•SleepCurrent1.2µATYP

•Upto6milesofrange
 (lineofsight)

•OperatingTemperatureRange:
-40 to +85ºC
•SoftwarePlatforms:
Synapse SNAP Embedded Firmware
Wireless M-Bus (868 MHz Only)
CEL Application Programming
Interface (API)
Silicon Labs EZMac

•FCC,CEandICcerticationsin
 Progress
Multiple antenna options
FSK Modulation Only
•ROHScompliant
MeshConnect™Sub-G Modules
ZICM0868P0 ZICM0900P2
APPLICATIONS
• Long Range
• Low Power Consumption
• 868 and 900 MHz Frequency Ranges
• 1MB additional Flash Memory option enables
Over the Air (OTA) Programming
•LightingControl
•Irrigation
•Serialwirereplacement
•IndustrialSensorNetworks
•WirelessM-BusMetering
•HomeAutomation&SmartPlugs
•Security
•Andmore...

MeshConnect™ Sub-G Module Series
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ORDERING INFORMATION
Part Number Order Number Description
MeshConnect™
Sub-G Module
(868 MHz)
ZICM0868P0-1CU 868 MHz Module, +13dBm SoC with U.FL connector for external antenna
ZICM0868P0-1CS 868 MHz Module, +13dBm SoC with RP-SMA connector for external antenna
ZICM0868P0-1C 868 MHz Module, +13dBm SoC with 1/4 wave wire antenna
MeshConnect™
Sub-G Module
(902-928 MHz)
ZICM0900P2-1CU 900 MHz Module, +20dBm SoC with U.FL connector for external antenna
ZICM0900P2-1CS 900 MHz Module, +20dBm SoC with RP-SMA connector for external antenna
ZICM0900P2-1C 900 MHz Module, +20dBm SoC with 1/4 wave wire antenna
ZICM0900P2-1CU-SN 900 MHz Module, +20dBm SoC with U.FL connector for external antenna with SNAP
Operating System software
ZICM0900P2-1CS-SN 900 MHz Module, +20dBm SoC with RP-SMA connector for external antenna
with SNAP Operating System software
ZICM0900P2-1C-SN 900 MHz Module, +20dBm SoC with 1/4 wave wire antenna with SNAP Operating
System software
MeshConnect™ Sub-G
Development Kits
ZICM0868P0-KIT1-1 868 MHz Evaluation board for +13dBm SoC module
ZICM0900P2-KIT1-1 900 MHz Evaluation board for +20dBm SoC module

MeshConnect™ Sub-G Module Series
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MODULE BLOCK DIAGRAM
ANT
SI100x
T/R
Switch
External
Memory
Low Pass
Filter
Sub-G
Optional
DEVELOPMENT KIT
CEL's Development Kit assist users in both evaluation and
development. As a stand-alone radio system, the kit allows
users to place the modules into the target environment
and evaluate performance on-site. The Development Kit
also serves as an invaluable aid in application develop-
ment. Through the many interface headers on the board,
the user has access to all of the MeshConnect module
pins, enabling easy connection to target systems for ap-
plication development.
The interface board features a serial communication
interface, a power management module, and peripherals
such as a buzzer, push-button switches, LEDs, and GPIO
headers.
For more detail information regarding MeshConnect
Development Kits, refer to the respective development
kit user guides documents. (Available at CEL’s website:
www.cel.com/MeshConnect)Kit Contents:
• EvaluationBoards(2)
• MeshConnectSub-GModulesw/DaughterCards(4)
Modules with RPSMA connectors and 0dBi Antennas (2)
Modules with 1/4 Wave Wire Antennas (2)
•USBCables(1)
•AABatteries(4)
•Software&TechnicalInformation(1)
MeshConnect™
Sub-G Module Development Kit
DEVELOPMENT KIT ORDERING INFORMATION
Part Number Order Number Description
MeshConnect™ Sub-G
Development Kits
ZICM0868P0-KIT1-1 868 MHz Evaluation board for +13dBm SoC module
ZICM0900P2-KIT1-1 900 MHz Evaluation board for +20dBm SoC module

MeshConnect™ Sub-G Module Series
Page4
Introduction and Overview
Description.............................................................................................................................................................................................. 1
Features.................................................................................................................................................................................................. 1
Applications............................................................................................................................................................................................ 1
OrderingInformation............................................................................................................................................................................. 2
Module Block Diagram........................................................................................................................................................................... 3
Development Kit..................................................................................................................................................................................... 3
System Level Function
Transceiver IC......................................................................................................................................................................................... 5
Antenna................................................................................................................................................................................................... 5
Additional Flash Memory....................................................................................................................................................................... 5
ElectricalSpecication
Absolute Maximum Ratings................................................................................................................................................................... 6
Recommended (Operating Condition).................................................................................................................................................. 6
DC Characteristics.................................................................................................................................................................................. 6
RF Characteristics.................................................................................................................................................................................. 4
PinSignal&Interfaces
PinSignalsI/OConguration................................................................................................................................................................ 8
I/O Pin Assignment................................................................................................................................................................................. 8
Software/Firmware.................................................................................................................................................................................. 9
Module Dimensions................................................................................................................................................................................ 10
Module Footprint.................................................................................................................................................................................... 11
Processing......................................................................................................................................................................................... 12
AgencyCertications................................................................................................................................................................... 13
Shipment,Storage&Handling................................................................................................................................................. 15
Quality.................................................................................................................................................................................................. 15
References&RevisionHistory................................................................................................................................................. 16
TABLE OF CONTENTS

MeshConnect™ Sub-G Module Series
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TRANSCEIVER IC
The MeshConnect Sub-G modules are based on the Silicon Labs Si1000 and Si1002 wireless SoCs ICs. These devices
incorporate the RF transceiver with the baseband modem, a hardwired MAC, and an embedded 8051 microcontroller,
offering a high performance solution for all Sub-G applications.
For more information about the Silicon Labs ICs, visit http://www.silabs.com.
ANTENNA
The MeshConnect Sub-G modules include RF connectors for external antenna options only (There is no trace antenna
option). The following options are supported by CEL:
• U.FL connector to support cabled antenna
• RP-SMA connector
• 1/4 wave wire antenna in place of RP-SMA
Here are some design guidelines to help ensure antenna performance:
• Never place the antenna close to metallic objects.
• In the overall design, ensure that wiring and other components are not placed near the antenna.
• Do not place the antenna in a metallic or metalized plastic enclosure.
• Keep plastic enclosures 1cm or more from the antenna in any direction.
• Antenna performance may be improved if module is mounted on carrier board with large ground plane
(3 in x 3in) provided clearance is allowed for center pin of RPSMA or Wire
ADDITIONAL FLASH MEMORY (Optional)
The Silicon Labs Transceiver ICs (Si1000 and Si1002) have an embedded 64kB of ash. Additional Flash memory (1MB)
can be mounted on each module (as an option) to enable Over The Air (OTA) programming capability.
This option is available for all part numbers, but must be specied at the time of ordering.

MeshConnect™ Sub-G Module Series
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ABSOLUTE MAXIMUM RATINGS
Description MeshConnect™ Sub-G Module Unit
Min Max
Power Supply Voltage (VDD) -0.3 3.6 VDC
Voltage on any I/O Line -0.3 VDD + 0.3 VDC
RF Input Power –10 dBm
Storage Temperature Range -40 125 °C
Reow Soldering Temperature – 260 °C
Note: Module has built in TXdisabling feature when VCC = 3.6VDC.
Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED (OPERATING CONDITIONS)
Description MeshConnect™ Sub-G Module Unit
Min Typ Max
Power Supply Voltage (VDD)1.8/2.7* 3.3 3.5 V
Frequency Range (ZICM0868P0) 865 –870 MHz
Frequency Range (ZICM0900P2) 902 – 928 MHz
Ambient Temperature Range -40 25 85 °C
Note: * 2.7v is the min voltage if an additional memory IC was ordered.
DC CHARACTERISTICS (@ 25°C, VDD = 3.5V, ZICM0868P0 TX power max)
Description MeshConnect™ Sub-G Module Unit
Min Typ Max
Transmit Mode Current (@ 13dBm) – 42 – mA
Receive Mode Current – 24 – mA
Sleep Mode Current – 1.2 – µA
DC CHARACTERISTICS (@ 25°C, VDD = 3.5V, ZCM0900P2 TX power max)
Description MeshConnect™ Sub-G Module Unit
Min Typ Max
Transmit Mode Current(@ 20dBm) –97 – mA
Receive Mode Current –24 – mA
Sleep Mode Current – 1.2 – µA

MeshConnect™ Sub-G Module Series
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RF CHARACTERISTICS (@ 25°C, VDD = 3.5V, ZICM0868P0)
Description MeshConnect™ Sub-G Module Unit
Min Typ Max
General Characteristics
RF Frequency Range 865 – 870 MHz
Transmitter
Maximum Output Power – 13 – dBm
Minimum Output Power – -12 – dBm
FSK Error – 15 – %
Deviation – 75 – KHz
Receiver
Sensitivity (1% PER, 150kbps) – -99 – dBm
Saturation (maximum input level) – – 10 dBm
RF CHARACTERISTICS (@ 25°C, VDD = 3.5V, ZICM0900P2)
Description MeshConnect™ Sub-G Module Unit
Min Typ Max
General Characteristics
RF Frequency Range 902 –928 MHz
Transmitter
Maximum Output Power –19 – dBm
Minimum Output Power – -5 – dBm
FSK Error – 15 – %
Deviation – 75 – KHz
Receiver
Sensitivity (1% PER, 150kbps) – -99 – dBm
Saturation (maximum input level) ––10 dBm

MeshConnect™ Sub-G Module Series
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PIN SIGNALS I/O PORT CONFIGURATION
MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions
shows the layout of the 56 edge castellations.
MeshConnect I/O PIN ASSIGNMENTS
Number Name Notes SI100x
Pin
1 GND
2 GND
3 GND
4 GND
5 GND
6 GND
7 GND
8 NC
9 ANTA Available: Not used for any module funconality 21
10 GPIO0 Available: Not used for any module funconality 24
11 GPIO2 Available: Not used for any module funconality 26
12 P0.7/IREF Internally connected to SDN 29
13 P0.6/
CNVSTR Used as Chip Select for Memory on CEL Eval. Board 30
14 P0.5/RXD Module's Internal UART RXD 31
15 P0.4/TXD Module's UART TXD 32
16 WP Write Protect Pin of Memory Chip on Module N/A
17 NC
18 GND
19 GND
20 NC
21 NC
22 NC
23 P0.3 Used as Chip Select for Memory IC on the CEL Module 33
24 P0.2 Memory IC MISO signal pin 34
25 P0.1 Connected to NIRQ 35
26 P0.0 Memory IC Clock Signal 36
27 GND 23, 37
28 VCC 28, 38
29 RST/C2CK Debug Clock 39
30 P2.7/C2D Debug Data
31 P2.6 GPIO connected to Buzzer on CEL Eval Board 41
32 P2.5 GPIO connected to Switch 3 on CEL Eval board 2
33 P2.4 GPIO connected to LED3 on CEL Eval board 3

MeshConnect™ Sub-G Module Series
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34 P2.3 GPIO connected to Switch 2 on CEL Eval Board 4
35 NC
36 NC
37 GND
38 GND
39 GND
40 GND
41 GND
42 P2.2 GPIO connected to LED2 on CEL Eval board 5
43 P2.1 GPIO connected to Switch 1 on CEL Eval Board 6
44 P2.0 GPIO connected to LED1 on CEL Eval board 7
45 P1.7 GPIO connected to Switch 0 on CEL Eval Board 8
46 P1.6 GPIO connected to LED0 on CEL Eval board 9
47 P1.5 Memory IC MOSI 10
48 NIRQ External Interrupt Request. This is internally connected to P0.1 for SNAP rmware
to be operaonal. 11
49 SDN Radio Shutdown (Acve High); Internally connected to P0.7 15
50 GND
51 GND
52 GND
53 GND
54 GND
55 GND
56 GND
MeshConnect I/O PIN ASSIGNMENTS (Continued)
Number Name Notes SI100x
Pin
SOFTWARE/FIRMWARE
The Sub-G modules support the following software:
 • SynapseSNAPEmbeddedFirmware
• WirelessM-Bus(868MHzOnly)
 • CELApplicationProgrammingInterface(API)
 • SiliconLabsEZMac
The MeshConnect Sub-G Development Kits provide an excellent platform to evaluate the hardware as well as develop ap-
plication code for the various software solutions supported. It also provides a set of demo applications to conduct several
tests. Below is the list of the demo software features:
Note: The CEL Sub G module has internal connections between Castellation Pins 12 & 49 and 25 & 48 to allow stand alone operation
with both SNAP and CEL rmware images.

MeshConnect™ Sub-G Module Series
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SOFTWARE/FIRMWARE (Continued)
MODULE DIMENSIONS
MeshConnect™ Sub-G Module with U.FL Connector for external antenna
MeshConnect™ Sub-G Module with RPSMA Connector for external Antenna
• Self Healing (Orphan handling)
• Point-to-Point network formation
• Point-to-Multipoint (Star) network formation
• Mesh network formation*
• ACK
• Wakeup Modes (Si100X)
• Frequency Hopping
• Unicast Addressing using 16-bit device IDs
• Broadcast Addressing
• Packet Forwarding (Master node only)
• Forwarding Table Aging (Master node only)
• Listen Before Talk (LBT)
• RSSI
• Packet Filtering
• Pairing/Joining
• Network Synchronization
• Command line interface for debug/testing/conguration
• Push buttons for Range or PER packet test on an Eval board
• Save conguration to ash
• Save conguration to external ash
• Low Battery detection
* Under development.
For layout recommendation for optimum antenna performance, refer to Antenna section in this document.
1.000” REF.
1.413” REF.
0.462” MAX
Sub-G Module
868 / 900 MHz
0.195”
1.413”
0.062”
RF Shield

MeshConnect™ Sub-G Module Series
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MODULE LAND FOOTPRINT
Note: Unless otherwise specied. Dimensions are in Inches [mm].
1.413
1.300
1.200
1.100
1.021
1.005 KEEP OUT
Ø.0.150
1
19
20 37
56
56X 0.50 x 0.040
0.050 PITCH
38
0.065
0.000 0.050 0.055 0.400 0.500 0.600 0.794 0.945 0.950 1.000
0.050
0.000
KEEP OUT
EVALUATION BOARD
CEL provides an Evaluation board to allow easy testing of the Module. The Evaluation board provides power via:
• AA cell batteries
• USB
• AC Adapter regulated down to 3.3VDC
• External Lab Power Supply (A jumper is also provided for the purposes of monitoring the DC current of
the module under various modes of operation).
Also included on the evaluation board are four momentary push button switches and four LEDs, a piezo buzzer, a potenti-
ometer, and a SPI memory IC. The peripherals are connected to GPIO of the module (see notes in Pin denitions) through
slide switches. If the user would wants to connect user specic circuits to the GPIO, slide switches can be used to discon-
nect the evaluation board peripherals.
The purpose of the evaluation board is to demonstrate simple applications of using GPIO, communicating with the device
and also allow exibility for user specic needs.
TOP VIEW

MeshConnect™ Sub-G Module Series
Page 12
PROCESSING
RecommendedReowProle
Parameters Values
Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max
Minimum Soak Temperature 150ºC
Maximum Soak Temperature 200ºC
Soak Time 60-120 sec
TLiquidus 217ºC
Time above TL 60-150 sec
Tpeak 250ºC
Time within 5º of Tpeak 20-30 sec
Time from 25º to Tpeak 8 min max
Ramp down rate 6ºC/sec max
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Speci-
cation. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated Terminations section.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering ux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two housings, which
is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring pads, or vias.
RepeatingReowSoldering
Only a single reow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.

MeshConnect™ Sub-G Module Series
Page 13
PROCESSING (Continued)
AGENCY CERTIFICATIONS (PENDING)
Hand Soldering
Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711)
Rework
The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be programmable
and the solder joint and module should not exceed the maximum peak reow temperature of 250 ºC.
Caution If temperature ramps exceed the reow temperature prole, module and component damage may occur due to
thermal shock. Avoid overheating.
Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will
terminate warranty coverage.
Additional Grounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is
done at the customer's own risk. The numerous ground pins at the module perimeter should be sufcient for optimum
immunity to external RF interference.
FCCComplianceStatement(Part15.19)Section7.15ofRSS-GEN
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that may cause undesired operation.
Warning (Part 15.21)
Changes or modications not expressly approved by CEL could void the user's authority to operate the equipment.
20 cm Separation Distance
To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this
transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located
or operating in conjunction with any other antenna or transmitter.
OEM Responsibility to the FCC Rules and Regulations
The MeshConnect Module has been certied per FCC Part 15 rules for integration into products without further testing or
certication. To fulll the FCC certication requirements, the OEM of the MeshConnect Module must ensure that the
information provided on the MeshConnect Label is placed on the outside of the nal product. The MeshConnect Module is
labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then
the outside of the device into which the module is installed must also display a label referring to the enclosed module. This
exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: TBD” or “Contains FCC ID:
TBD”
The OEM of the MeshConnect Module must only use the approved antenna, that has been certied with this module. The
OEM of the MeshConnect Module must test their nal product conguration to comply with Unintentional Radiator Limits be-
fore declaring FCC compliance per Part 15 of the FCC rules.

MeshConnect™ Sub-G Module Series
Page14
AGENCY CERTIFICATIONS (Continued)
ICCertication—IndustryCanadaStatement
The term "IC" before the certication / registration number only signies that the Industry Canada technical specications
were met.
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two con-
ditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference
that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur
de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement
Section14ofRSS-210
The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF eld in
excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's
website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php
CECertication—EuropeZICM0868P0(PENDING)
The MeshConnect 868MHz RF modules will be tested and certied for the European Union.
OEM Responsibility to the European Union Compliance Rules
If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the nal product to the
European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of
these standards and kept on le as described in Annex II of the R&TTE Directive.
The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining
European Union Compliance. If any of the specications are exceeded in the nal product, the OEM is required to
make a submission to the notied body for compliance testing.
OEM Labeling Requirements
The `CE' mark must be placed on the OEM product in a visible location.
The CE mark shall consist of the initials “CE” with the following form:
· If the CE marking is reduced or enlarged, the proportions given in the above graduated
drawing must be adhered to.
· The CE mark must be a minimum of 5mm in height
· The CE marking must be afxed visibly, legibly, and indelibly. Since the 868 MHz
band is not harmonized by a few countries throughout Europe, the Restriction sign must be
placed to the right of the “CE” marking as shown in the picture

MeshConnect™ Sub-G Module Series
Page 15
QUALITY
CEL modules offer the highest quality at competitive prices. Our modules are manufactured in compliance with the IPC-A-610
specication, Class II. Our modules go through JESD22 qualication processes which includes high temperature operating life
tests, mechanical shock, temperature cycling, humidity and reow testing. CEL conducts 100% RF and DC factory testing on
all production parts and also conducts sample testing on all device lots.
CEL’s builds the quality into our products giving our customers the condence when integrating our products into their systems.
SHIPMENT, HANDLING, AND STORAGE
Shipment
The MeshConnect Modules are delivered in trays of 28.
Handling
The MeshConnect Modules are designed and packaged to be processed in an automated assembly line.
Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD
protection may destroy or damage the module permanently.
Warning The MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are
summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.

MeshConnect™ Sub-G Module Series
Page 16
REFERENCES&REVISIONHISTORY
Previous Versions Changes to Current Version Page(s)
0008-00-07-00-000
(Issue ES) April 5, 2011 Initial preliminary datasheet. N/A
0008-00-07-00-000
(Issue ES) June 1st, 2011 IC Certication. N/A
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