CEL ZICM0868P Series Instruction Manual

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MeshConnect™ Sub-G Module Series
CEL's MeshConnect™ Module Series provides high performance
and low cost Sub-G modules for a broad range of wireless net-
works. The MeshConnect certied and qualied modules enable
customers to accelerate time to market by greatly reducing design
and certication phases of development.
CEL's MeshConnect™ Sub-G modules (868/900MHz) are based
on the Silicon Labs SoC ICs (single-chip solutions). Each IC con-
sists of an RF transceiver with baseband modem, a hard-wired
MAC and an embedded 8051 microcontroller with internal RAM
(4kB) and Flash (64kB) memory. The device provides numer-
ous general-purpose I/O pins and peripheral functions such as
timers and UARTs.
The MeshConnect Sub-G modules have 2 different output powers
(+12dBm and +19dBm). They provide a reliable transmission, to
reduce the number of nodes in a network. They are especially
useful for open outdoor applications where the nodes are physi-
cally far apart. The higher power Modules have an outstanding
118dB link budget ensuring high quality connections even in
harsh environments.
Development Kits Available:
ZICM0868P2-KIT1-1 and ZICM0900P2-KIT1-1
The information in this document is subject to change without notice, please conrm data is current
Document No: 0009-00-07-00-000 (Issue ES)
Date Published: December 7, 2010
PRELIMINARY DATA SHEET
DESCRIPTION
ZICM0868Px
ZICM0900Px
868 / 900 MHz Transceiver Based Modules
•FrequencyRange:
 902- 928 MHz 
868 MHz
•Sensitivity:-99dBm
•MaxOutputPower:
+ 12 dBm @ 3.6 VDC (ZICM0xxxP0)
+ 19 dBm @ 3.6 VDC (ZICM0xxxP2)
•DataRate:0.123to150kbps
•Upto21GPIOPins
•HighSpeed8051MCU:
30 MHz
4kB RAM / 64 kB Flash
•10-BitADC:
300 ksps, 18-ch inputs
•SerialCommunication:
UARTs, SPI (Master/Slave)
SMBus, PCA
•Modulation:  
FSK
FEATURES
•RFPowerConsumption 
24 mA Receive
18 mA @ + 1 dBm transmit 
30 mA @ + 12 dBm transmit
90 mA @ + 19 dBm transmit
•Auto-FrequencyCalibration(AFC)
•FrequencyHoppingCapability
•Upto12milesofrange
•OperatingTemperatureRange:
-40 to +85ºC
•SoftwareSupport:
Synapse SNAP Embedded Firmware
Wireless M-Bus (868MHz Only)
Silicon Labs EZMac
CEL Protocol
•FCC,CEandICcerticationsin
 Progress
•ROHScompliant
MeshConnect™Sub-G Modules
ZICM0868Px ZICM0900Px
APPLICATIONS
• Metering
• RFID
• RemoteKeylessEntry
• HomeAutomation
• Security
• Irrigation
• WeatherStations
• Andmore...
Best Reliable Performance
• Good sensitivity providing longer range for Non-line-of-site
aplications
• Low operating (receive) current

MeshConnect™ Sub-G Module Series
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ORDERING INFORMATION
Part Number Order Number Description
MeshConnect™ Sub-G
(Eruope Only)
ZICM0868P0-1CU 868 MHz Module, +12dBm output power with U.FL connector for external antenna
ZICM0868P2-1CU 868 MHz Module, +19dBm output power with U.FL connector for external antenna
ZICM0868P0-1CS 868 MHz Module, +12dBm output power with RP-SMA connector for external antenna
ZICM0868P2-1CS 868 MHz Module, +19dBm output power with RP-SMA connector for external antenna
ZICM0868P0-1C 868 MHz Module, +12dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA)
ZICM0868P2-1C 868 MHz Module, +19dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA)
ZICM0868P0-1CU-SN 868 MHz Module, +12dBm output power with U.FL connector for external antenna
with SNAP Operating System software and MAC address
ZICM0868P2-1CU-SN 868 MHz Module, +19dBm output power with U.FL connector for external antenna
with SNAP Operating System software and MAC address
ZICM0868P0-1CS-SN 868 MHz Module, +12dBm output power with RP-SMA connector for external antenna
with SNAP Operating System software and MAC address
ZICM0868P2-1CS-SN 868 MHz Module, +19dBm output power with RP-SMA connector for external antenna
with SNAP Operating System software and MAC address
ZICM0868P0-1C-SN 868 MHz Module, +12dBm output power for 1/4 wave wire antenna (in place of
RP-SMA) with SNAP Operating System software and MAC address
ZICM0868P2-1C-SN 868 MHz Module, +19dBm output power for 1/4 wave wire antenna(in place of
RP-SMA) with SNAP Operating System software and MAC address
MeshConnect™ Sub-G
ZICM0900P0-1CU 900 MHz Module, +12dBm output power with U.FL connector for external antenna
ZICM0900P2-1CU 900 MHz Module, +19dBm output power with U.FL connector for external antenna
ZICM0900P0-1CS 900 MHz Module, +12dBm output power with RP-SMA connector for external antenna
ZICM0900P2-1CS 900 MHz Module, +19dBm output power with RP-SMA connector for external antenna
ZICM0900P0-1C 900 MHz Module, +12dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA)
ZICM0900P2-1C 900 MHz Module, +19dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA)
ZICM0900P0-1CU-SN 900 MHz Module, +12dBm output power with U.FL connector for external antenna
with SNAP Operating System software and MAC address
ZICM0900P2-1CU-SN 900 MHz Module, +19dBm output power with U.FL connector for external antenna
with SNAP Operating System software and MAC address
ZICM0900P0-1CS-SN 900 MHz Module, +12dBm output power with RP-SMA connector for external antenna
with SNAP Operating System software and MAC address
ZICM0900P2-1CS-SN 900 MHz Module, +19dBm output power with RP-SMA connector for external antenna
with SNAP Operating System software and MAC address
ZICM0900P0-1C-SN 900 MHz Module, +12dBm output power for 1/4 wave wire antenna (in place of
RP-SMA) with SNAP Operating System software and MAC address
ZICM0900P2-1C-SN 900 MHz Module, +19dBm output power for 1/4 wave wire antenna (in place of
RP-SMA) with SNAP Operating System software and MAC address
MeshConnect™ Sub-G
Development Kits
ZICM0868P2-KIT1-1 868 MHz Evaluation board for +19 dBm module
ZICM0900P2-KIT1-1 900 MHz Evaluation board for +19 dBm module

MeshConnect™ Sub-G Module Series
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MODULE BLOCK DIAGRAM
ANT
SI100x
T/R
Switch
External
Memory
Low Pass
Filter
Sub-G
Optional
DEVELOPMENT KIT
CEL's Development Kit assist users in both evaluation and
development. As a stand-alone radio system, the kit allows
users to place the modules into the target environment
and evaluate performance on-site. The Development Kit
also serves as an invaluable aid in application develop-
ment. Through the many interface headers on the board,
the user has access to all of the MeshConnect module
pins, enabling easy connection to target systems for ap-
plication development.
The interface board features a serial communication
interface, a power management module, and peripherals
such as a buzzer, push-button switches, LEDs, and GPIO
headers.
For more detail information regarding MeshConnect
Development Kits, refer to the respective development
kit user guides documents. (Available at CEL’s website
http://www.cel.com)Kit Contents:
• Evaluation Boards w/Module (2)
• USB Cables (1)
• AA Batteries (4)
• Software & Technical Information CD (1)
MeshConnect™
Sub-G Module Development Kit
DEVELOPMENT KIT ORDERING INFORMATION
Part Number Order Number Description
MeshConnect™ Sub-G
Development Kits
ZICM0868P2-KIT1-1 868 MHz Evaluation board for +19dBm module
ZICM0900P2-KIT1-1 900 MHz Evaluation board for +19dBm module

MeshConnect™ Sub-G Module Series
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Introduction and Overview
Description.............................................................................................................................................................................................. 1
Features.................................................................................................................................................................................................. 1
Applications............................................................................................................................................................................................ 1
Ordering Information............................................................................................................................................................................. 2
Module Block Diagram........................................................................................................................................................................... 3
Development Kit..................................................................................................................................................................................... 3
System Level Function
Transceiver IC......................................................................................................................................................................................... 5
Antenna.................................................................................................................................................................................... 5
Additional Flash Memory....................................................................................................................................................................... 5
Electrical Specication
Absolute Maximum Ratings................................................................................................................................................................... 6
Recommended (Operating Condition).................................................................................................................................................. 6
DC Characteristics.................................................................................................................................................................................. 6
RF Characteristics.................................................................................................................................................................................. 7
Pin Signal & Interfaces
Pin Signals I/O Conguration................................................................................................................................................................ 8
I/O Pin Assignment................................................................................................................................................................................. 8
Software/Firmware.................................................................................................................................................................................. 9
Module Dimensions................................................................................................................................................................................ 10
Module Footprint.................................................................................................................................................................................... 11
Processing......................................................................................................................................................................................... 12
Agency Certications................................................................................................................................................................... 13
Shipment, Storage & Handling................................................................................................................................................. 14
References & Revision History................................................................................................................................................. 15
TABLE OF CONTENTS

MeshConnect™ Sub-G Module Series
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TRANSCEIVER IC
The MeshConnect Sub-G modules are based on the Silicon Labs Si1000 and Si1002 SOC transceiver ICs. These ICs
incorporate the RF transceiver with the baseband modem, a hardwired MAC, and an embedded 8051 microcontroller,
offering a high performance solution for all Sub-G applications.
For more information about the Silicon Labs ICs, visit http://www.silabs.com.
ANTENNA
The MeshConnect Sub-G modules include RF connectors for external antenna options only (There is no trace antenna
option). The following options are supported by CEL:
• U.FL connector
• RP-SMA connector
• A Connection for 1/4 wave wire antenna in place of RP-SMA
Here are some design guidelines to help ensure antenna performance:
• Never place the antenna close to metallic objects.
• In the overall design, ensure that wiring and other components are not placed near the antenna.
• Do not place the antenna in a metallic or metalized plastic enclosure.
• Keep plastic enclosures 1cm or more from the antenna in any direction.
ADDITIONAL FLASH MEMORY (Optional)
The Silicon Labs Transceiver ICs (Si1000 and Si1002) have an embedded 64kB of ash. Additional memory (1MB) can be
mounted on the module (as an option) to enable Over The Air (OTA) programming capability.
This is a custom solution as an option for all part numbers.

MeshConnect™ Sub-G Module Series
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ABSOLUTE MAXIMUM RATINGS
Description MeshConnect™ Sub-G Module Unit
Min Max
Power Supply Voltage (VDD) -0.3 3.6 VDC
Voltage on any I/O Line -0.3 VDD + 0.3 VDC
RF Input Power – 10 dBm
Storage Temperature Range -40 125 °C
Reow Soldering Temperature – 260 °C
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED (OPERATING CONDITIONS)
Description MeshConnect™ Sub-G Module Unit
Min Typ Max
Power Supply Voltage (VDD)1.8/2.7* 3.3 3.6 V
Input Frequency 863 –870 MHz
Input Frequency 902 – 928 MHz
Ambient Temperature Range -40 25 85 °C
Note: * 2.7v is the min voltage if an additional memory IC was placed on the module.
DC CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP2 TX power max)
Description MeshConnect™ Sub-G Module Unit
Min Typ Max
Transmit Mode Current – 90 – mA
Receive Mode Current – 24 – mA
Sleep Mode Current – TBD – µA
DC CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP0 TX power max)
Description MeshConnect™ Sub-G Module Unit
Min Typ Max
Transmit Mode Current – 35 – mA
Receive Mode Current – 24 – mA
Sleep Mode Current – TBD – µA

MeshConnect™ Sub-G Module Series
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RF CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP2)
Description MeshConnect™ Sub-G Module Unit
Min Typ Max
General Characteristics
RF Frequency Range 863 –928 MHz
Transmitter
Maximum Output Power – 19 – dBm
Minimum Output Power – -5 – dBm
FSK Error TBD – TBD %
Carrier Offset TBD – TBD KHz
Deviation – 75 – KHz
Receiver
Sensitivity (1% PER, 156kbps) –-99 TBD dBm
Saturation (maximum input level) ––10 dBm
RF CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP0)
Description MeshConnect™ Sub-G Module Unit
Min Typ Max
General Characteristics
RF Frequency Range 863 – 928 MHz
Transmitter
Maximum Output Power – 12 – dBm
Minimum Output Power – -12 – dBm
FSK Error TBD – TBD %
Carrier Offset TBD – TBD KHz
Deviation – 75 – KHz
Receiver
Sensitivity (1% PER, 156kbps) – -99 TBD dBm
Saturation (maximum input level) – – 10 dBm

MeshConnect™ Sub-G Module Series
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PIN SIGNALS I/O PORT CONFIGURATION
MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions
shows the layout of the 56 edge castellations.
MeshConnect I/O PIN ASSIGNMENTS
Number Name Notes
1 GND
2 GND
3 GND
4 GND
5 GND
6 GND
7 GND
8 NC
9 ANTA Available: Not used for any module funconality
10 GPIO0 Available: Not used for any module funconality
11 GPIO2 Available: Not used for any module funconality
12 P0.7/IREF Must be connected to SDN for SNAP rmware
13
P0.6/
CNVSTR Used as Chip Select for Memory on CEL Eval. Board
14 P0.5/RXD UART TXD
15 P0.4/TXD UART RXD
16 WP Write Protect Pin of Memory Chip on Module
17 NC
18 GND
19 GND
20 NC
21 NC
22 NC
23 P0.3 Used as Chip Select for Memory IC on the CEL Module
24 P0.2 Memory IC MISO signal pin
25 P0.1 Must be connected to NIRQ for SNAP rmware
26 P0.0 Memory IC Clock Signal
27 GND
28 VCC
29 RST/C2CK Debug Clock
30 P2.7/C2D Debug Data
31 P2.6 GPIO connected to Buzzer on CEL Eval Board
32 P2.5 GPIO connected to Switch 3 on CEL Eval board
33 P2.4 GPIO connected to LED3 on CEL Eval board
34 P2.3 GPIO connected to Switch 2 on CEL Eval Board

MeshConnect™ Sub-G Module Series
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35 NC
36 NC
37 GND
38 GND
39 GND
40 GND
41 GND
42 P2.2 GPIO connected to LED2 on CEL Eval board
43 P2.1 GPIO connected to Switch 1 on CEL Eval Board
44 P2.0 GPIO connected to LED1 on CEL Eval board
45 P1.7 GPIO connected to Switch 0 on CEL Eval Board
46 P1.6 GPIO connected to LED0 on CEL Eval board
47 P1.5 Memory IC MOSI
48 NIRQ External Interrupt Request
49 SDN Radio Shutdown (Acve High)
50 GND
51 GND
52 GND
53 GND
54 GND
55 GND
56 GND
MeshConnect I/O PIN ASSIGNMENTS (Continued)
Number Name Notes
SOFTWARE/FIRMWARE
The Sub-G modules support the following software:
 • SynapseSNAPEmbeddedFirmware
• WirelessM-Bus(868MHzOnly)
 • SiliconLabsEZMac
 • CELProtocol
The MeshConnect Sub-G Development Kit provides a guide on how to access the Si100x IC and utilize the Silicon Labs
software development environment. It also provides a set of demo applications to conduct several tests. Below is the list of
the demo software features:

MeshConnect™ Sub-G Module Series
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SOFTWARE/FIRMWARE (Continued)
MODULE DIMENSIONS
MeshConnect™ Sub-G Module with U.FL Connector for external antenna
MeshConnect™ Sub-G Module with RPSMA Connector for external Antenna
• Self Healing (Orphan handling)
• Point-to-Point network formation
• Point-to-Multipoint (Star) network formation
• Self Healing (Orphan handling)
• Point-to-Point network formation
• Point-to-Multipoint (Star) network formation
• ACK
• Wakeup Modes (Si100X) – most likely software will just use one of the wakeup modes
• Frequency Hopping
• Unicast Addressing using 16-bit device IDs
• Broadcast Addressing
• Packet Forwarding (Master node only)
• Forwarding Table Aging (Master node only)
• Promiscuous Mode (TBD – later release)
• Listen Before Talk (LBT)
• RSSI
• Packet Filtering
• Pairing/Joining
• Network Synchronization through beacon messages to coordinate sleep/wake cycles
- Master node needs to send out beacon as well as gure out when to go to sleep and when to wake up
- End node wakes up and looks for beacon to gure out when to go to sleep and wake up
• Command line interface for debug/testing/conguration
• Push buttons for Range or PER packet test on a Eval board
• Save conguration to ash
• Save conguration to external ash
• Over-the-air programming of the image to another device (TBD – later release)
• Low Battery detection
For layout recommendation for optimum antenna performance, refer to Antenna section in this document.