Colnatec EON-ID User manual

user guide
eon-ID
controller w/ integrated touchscreen
TM
for vers. 3.1.0.63 software

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Chapter 1: Eon-ID™ at a Glance
Exterior Features
Accessories
Chapter 2: Getting Started
Eon-ID™ System Assembly
Using Virtual Keyboards
Chapter 3: Program Control
Program Control Screen
Process List
Process Layers
New/Edit Layer Screen
Layer Properties
Layer Properties (Dened)
Chapter 4: Settings
Settings Screen
Notify Settings
Log Screen
Sensor Zeroing
Relay Control
Auto Abort on Max Power
Software Monitor Screen
Reduce Resources Control
About
Input Control
Chapter 5: Manual Mode
Manual Control
Adjusting Source
Exiting Manual Mode
Contents
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Contents

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Chapter 6: Vertical Tool Bar
Using the Vertical Tool Bar
Starting a Deposition
Aborting a Process
Resume or Restart an Aborted Process
Logging Eon-ID™ Status
Zeroing the Sensors
Activating Relays
Exiting Eon-ID™ Software
Chapter 7: Resuming Processes
Resuming Processes Screen
Resume Aborted
Chapter 8: Status
Status Screen
Health, Layer, Material, Frequency, Rate, and Thickness
Zero Sensor
Percentage Complete
Source Power
Temperatures
Manual Zeroing of Individual Sensors
Chapter 9: Green Status Bar
Status Indicator, Time Indicator, and Process Selector
Chapter 10: Graphs
Graph Screen
Adjusting Min/Max Range of Graphs
Graphs
Color Key
Contents
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Contents

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Chapter 11: Screen Lock
Password Protection
Screen Lock Button
Locking a Screen
Setting a New Password
Forgotten Password
Resetting the Password
Chapter 12: Troubleshooting
Chapter 13: Specications
Coating
Communications
Measurement
Display
Inputs and Outputs
Software
Dimensions
Power Supply
Contents
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Contents

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Appendix A: Eon-ID™ System
Eon-ID™ System Conguration
Appendix B: Safety, Handling, & Support
About Eon-ID™
LabVIEW Interface
Software Updates
Inspection & Initial Setup
Warranty
Appendix C: Tooling Factor Method 1
Distance/Angle Method
Appendix D: Tooling Factor Method 2
Thickness/Substrate Method
Appendix E: Mass-to-Frequency Correlation Formula
Mass-to-Frequency Correlation Formula (Sauerbrey equation [modied])
Appendix F: Input Control
Input Control
Appendix G: Quick Setup
Quick Setup
Appendix H: Setting Up RS232
Setting up RS232
Appendix I: RS232 Commands
RS232 Commands
Appendix J: DB37 Relay Board Pin Diagram (Female)
DB37 Relay Board Pin Assignment
Appendices
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Appendices

122 Index
Miscellaneous
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Appendices & Miscellaneous
Appendices & Miscellaneous
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Appendix K: DB9 I/O Pin Diagram
DB9 I/O Pin Diagram
Appendix L: Source Power Supply Signal
Source Power Supply Signal (Illustrated)

Exterior Features
Eon-ID™ at a Glance 1
This guide describes Eon-ID™ controller with temperature control (3rd generation) and
the pre-installed Eon™ software.
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Chapter 1 Eon-ID™ at a Glance
Front
Back
USB Connector
Integrated Display
Touchscreen for
using Eon™ software
BNC Sensor Inputs
Connects to sensor
head via external
oscillator.
I/O
For relay and
Source Power
Supply Signal
output
Main Power Switch
Turns Eon-ID™ on
and off
Air Intake Duct
Type K Thermocouple
Inputs
Measures temperature
using thermocouples.
Power Input
Connects to
24 VDC
power input
Power Button
Powers CPU
and operating
system
Reset Button
Resets controller
electronics
Master Fuse
Surge
Protection
USB Ethernet
Grounding
Post
Reduces
electrical
noise
Relay Connector
Relay & I/O port

WARNING Make sure the correct hardware is used with Eon-ID™
inputs and outputs. See proper setup procedures in this manual and in
the Eon-ID™ quick reference guide.
WARNING Only the provided power supply should be used with Eon-ID™.
Not doing so will damage product and void warranty. Make sure power supply has
a 24 VDC.
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Chapter 1 Eon-ID™ at a Glance

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Chapter 1 Eon-ID™ at a Glance
Accessories
Eon-ID™ ships with the following accessories:
Power Supply and cable. Input 100-200 VAC, 50/60Hz, 2 A. Output 24V, 3.75 A,
90W Max.
External Oscillator. Amplies crystal drive signal.
Euro
US

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Chapter 2 Getting Started
Getting Started 2
Eon-ID™ System Assembly
The following guide will describe in detail how to integrate the Eon-ID™ controller into a
basic QCM conguration. The QCM depicted below is the Colnatec Phoenix™ sensor
head featuring temperature control technology. If using an alternative QCM, skip the step
highlighted in red. (See Appendix A for connection map of a fully assembled
Eon-ID™ system).
2. Connect 10’ BNC Coaxial Cable
to Eon-ID™
Slide coaxial connector onto
BNC.
1. Connect 6” SMA-to-BNC
Coaxial Cable to Sensor
Spin cable in place using cable
shaft until resistance is felt.
(Twisting cable shaft past point
of resistance may damage
cable). Roll ngertip over
connector to tighten.

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Chapter 2 Getting Started
4. Connect TC to Eon-ID™ and
Sensor (skip this step if using
a sensor not manufactured by
Colnatec™)
Plug thermocouple connector
on sensor into female end of
thermocouple extension cable.
Plug the male end of
thermocouple extension cable
into thermocouple connector on
back panel of the Eon-ID™.
5. Connect Power to Eon-ID™
Plug Eon-ID™ power adapter
into AC outlet. Then plug DC
connector into the Eon-ID™.
3. Unite Sensor and Eon-ID™
with Oscillator
Attach Eon-ID™ BNC cable to
connector marked “Eon”. Then,
attach sensor BNC cable to
oscillator connector marked
Crystal (or “XTAL”).

7. Launching Software
Once powered up,
Eon-ID™ automatically
launches Eon™ software.
Using Virtual Keyboards
Eon-ID™ is pre-loaded with Eon-ID™ software designed specically for touchscreen
interactivity. In instances where a physical keyboard would normally be required, virtual
alpha and numeric keyboards can be accessed. To use the virtual keyboards, touch and
hold text input eld until the text entry window appears.
Type in text as usual. To use special characters in the alpha keyboard, select the Shift
button (turns green while active). To return to the regular keyboard, deselect the Shift
button.
6. Powering on Eon-ID™
Flip the master power
switch on the back of
Eon-ID™ to power on
unit.
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Chapter 2 Getting Started

Program Control 3
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Chapter 3 Program Control
Program Control Screen
Select <PROGRAM> in the Screen Selection Tool Bar to access the Program Control
screen. With this section, user will be able to create a new process, and copy, edit, or
delete an existing process, as well as add or remove layers and layer properties.
Process List
Create a new process, and copy, edit or delete an existing process. The list contains
all of the available processes.
To enter text, touch and hold the text eld until virtual keyboard
appears.
Process List
Vertical
Tool bar
Screen Selection Tool Bar
Create a new
process.
Copy, edit,
or delete
an existing
process.
Note: Process selector will automatically change to the process selected in the
Process List when a process is not running.

Process Layers
Accessing the Layers of a Process.To add a layer or access the existing layer(s) of a
process, touch and hold a process name. This will open the Layer List Screen (shown
below).
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Chapter 3 Program Control
Editing a Process. On the Process Screen, select an existing process in the Process
List and press <EDIT>.
Deleting a Process.Pressing <DELETE> will permanently delete a process.
To enter text, touch and hold the text eld until virtual keyboard
appears.
Creating a New Process.Selecting <NEW> brings up the New Process Screen. Enter
a name in the text eld and select either sequential or co-dep. When <OK>, is pressed,
the process will appear on the Process List.

Adding a Layer to a Process.Press <NEW>. This will take the user to the New Layer
Screen. (See “New/Edit Layer Screen” on page 16).
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Chapter 3 Program Control
Copying a Layer.Pressing <COPY> produces a copy of the layer on the Layers List.
Editing a Layer.Select a layer on the Layers List, then press <EDIT>. Use the Layer Edit
Screen to edit the properties of a layer. (See “New/Edit Layer Screen” on page 16).
Removing a Layer.Select a layer, then press <DELETE>. This removes the layer from
the Layers List. (Note: Once a layer is removed, it can always be retrieved using the Use
Stored Layer feature. For more on this, see “Use Stored Layer” on page 16 for more
details).

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Chapter 3 Program Control
New/Edit Layer Screen
Enter the layer name using the alphanumeric keypad, and the rate and thickness using
the numeric keypad. Select <USE STORED LAYER> to access an archive of saved
layers.
Use Stored Layer. On the New Layer Screen select <USE STORED LAYER> to use a
previously saved layer. The properties of the stored layers are predened, but rate and
thickness will still need to be entered.
Select the previously saved layer and press <OK> to use it in the current process.
Press <DELETE> to delete the layer. The Delete Layer Screen warns that the layer will
be permanently deleted.
When is selected, the layer will be deleted permanently and universally
from any process containing it as well as from the device itself.

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Chapter 3 Program Control
Layer Properties
Entering or Changing Values for Layers. The Layer Properties window allows you to
enter or change the values of a layer’s properties.
Selecting a Layer. Touch a layer to select it.
Changing Order of Layers. On the Layers List touch and hold a layer, drag the layer
up or down the list, and release the layer where desired.
The list can be reordered by touching
and dragging.
Opening Layer Properties Window. In the layers list, press and hold a layer (this can
be done at any time, even during a process run). The Layer Properties screen will open.
Note: Layers can be repositioned while a process is running. Any repositioning of the
layers during a process will go into effect after the current layer has been completed.
Layers are run according to their position on the list, moving downward sequentially.
Note: Layer properties can be altered and the
alterations applied to a process in progress, unless
the layer is currently being run. Any alterations made
to layer properties while a layer is in use will only go
into effect after the layer is no longer being run.

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Chapter 3 Program Control
Selecting a Material. On the Layer Properties screen, touch and hold the Material
Name, Density, or Z-Factor elds to open the Materials List screen.
Select one of four congurations:
• Sensor 1 èSource 1
• Sensor 1 èSource 2
• Sensor 2 èSource 1
• Sensor 2 èSource 2
On the Material List Screen, select the applicable material. The correct density and
Z-Factor is automatically set.
If the material being applied in your process is unlisted, then press <ADD> to add a
custom material.
Selecting a Source / Selecting a Sensor. On the layer Properties Screen, the Sensor
selection keys determine which of the two sensor inputs will be used to control the
source power supply signal. The Source selection keys determines which of the two
source power supply signal outputs will be used to control the power supply of the
deposition control source based on the input of the selected Sensor. (For more
information about the source power supply signal, see “Source Power” on page 121).
To enter text, touch and hold the text eld until virtual keyboard
appears.

Deleting a Material. On the Materials List Screen select the material to be deleted and
press <DELETE>, taking the user to the Delete Material Screen.
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Chapter 3 Program Control
Adding a Material. On the Materials List Screen, press <ADD> to add a new material.
The Add a Material Screen will open.
Give the new material a name and adjust the Density and Z-Factor according to your
preference. Select <OK> to create the new material.
Press to permanently delete the material.
To enter text, touch and hold the text eld until virtual keyboard
appears.

• Materials
The material being applied during the deposition process.
• Density
The density of the selected material being applied.
• Z-Factor
Acoustic impedance factor which is used to compensate for dense
materials and is predened based on the selected material.
• Tooling [%]
The geometric relationship between the substrate and the positioning
of the sensor. This property is used to correct error in thickness due to
the relative location of the sensor head and source vs the substrate and
source. (See “Tooling Factor Calculation Method 1” on page 61; and
“Tooling Factor Calculation Method 2” on page 62).
• Max Power [%]
Species the maximum voltage output allowed on the source control signal
based on a percentage of its total voltage of 5v. For example, because the
maximum voltage of the source control signal is 5v, setting a maximum
power of 50% would apply a source control signal output of 2.5v to the
source power supply.
• Proportional
The proportional coefcient that controls the material deposition rate during
the PID phase.
• Integral
The integral time constant that controls the material deposition rate during
PID phase.
• Derivative
The derivative time constant that controls the material deposition rate
during the PID phase.
• Source
For selecting the Source Power Supply Signal that will be used to control
the Deposition Control Source. The Eon-ID features two Source Power
Supply Signal outputs accessed via the I/O port. These are classied as
Source 1 and Source 2. (See “DB9 I/O Pin Diagram” on page 120; and
“Source Power” on page 121).
Sensor
Determines which of the two sensors will be used to control the Source
Layer Properties (Dened)
The following is a list of settings that denes the parameters of the deposition. All
settings must be set correctly for the software to function properly.
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Chapter 3 Program Control