Colnatec Eon-LT User manual

PC-based controller
user manual
eon-ltTM

WARNING All electrical components are to be considered extremely
dangerous if tampered with in any way. Colnatec is not liable for any injury
resulting from product misuse, modication, or disassembly.
WARRANTY LABEL If the warranty label has been tampered with, “VOID”
will appear where the warranty label was originally placed. If this is visible
at the time of arrival, it is important that you contact Colnatec immediately
after receiving the product.
© Copyright 2014 Colnatec
All information contained within this
technical manual and accompanying
pages are copyright of Colnatec.
All rights reserved. It is a breach of
copyright if this technical manual is
copied, distributed, or reproduced,
in whole or part, using any means
whatsoever, without the prior written
approval of Colnatec.
Colnatec gives no condition or
warranty, expressed or implied,
about the tness of this technical
manual or accompanying hardware
product. Colnatec reserves the right
to make changes to this technical
manual or accompanying hardware
or design without notice to any
person or company.
Colnatec shall not be liable for any
indirect, special, consequential or
incidental damages resulting from
the use of this technical manual
or the accompanying hardware or
design whether caused through
Colnatec’s negligence or otherwise.
May 2014
Version 3.0

EXAMINE YOUR NEW EON-LT™ FOR ANY SIGNS OF PHYSICAL
DAMAGE. ALSO, ENSURE THAT THE TAMPER-EVIDENT LABELS
ARE INTACT Before shipping, your Eon-LT™ was calibrated and tested
by Colnatec to meet the highest quality standards. It is important that you
take a few minutes to inspect the product to ensure that your equipment
was not damaged or otherwise tampered with during transit.
About Eon-LT™
With the ability to sense deposition and temperature with high precision, the
Eon-LT™ thin lm controller is one of the newest advancements in Thin Film
deposition controllers. The Eon-LT™provides features that help improve
measurement accuracy for better process control.
LabVIEW® Interface
The Eon-LT™offers a simple LabVIEW® interface that provides control and
operation that is intuitive, efcient, and impressive.
Software Updates
The Eon-LT™interface software can be upgraded on site to provide
software improvements. There will be notications when these updates
become available.
Inspection & Initial Setup
Examine Eon-LT™for any signs of physical damage. Also, make sure
that the tamper-evident labels are intact. In order to ensure safe, correct
operation of your Eon-LT™, please follow the step-by-step instructions
presented in the Eon-LT™ Quick Start guide.
Warranty
Eon-LT™is warranted to the original purchaser to be free of any
manufacturing-related defects for one year from the date of purchase.
Colnatec reserves the right to repair or replace the unit after inspection.
Contact [email protected] for more information.
What Is the Eon-LT™Thin-Film Controller?
ii

The Warranty Label........................................................................................................
Safety Information..........................................................................................................
Copyright........................................................................................................................
About Eon-LT™..............................................................................................................
Software Updates...........................................................................................................
Inspection and Initial Setup.............................................................................................
Warranty.........................................................................................................................
Section 1: System Components and Connections
1.0 Eon-LT™ Package Contents..................................................................
1.1 Phoenix™ System Components.............................................................
Section 2: Hardware and Design
2.0 Connecting Inputs...................................................................................
2.1 Connecting Outputs................................................................................
Section 3: Front Panel Controls and Displays
3.0 Controls..................................................................................................
3.1 Status Displays.......................................................................................
3.2 Graphs....................................................................................................
Section 4: Layer Controls/Selections
4.0 Setup Menu: Layer Tab..........................................................................
Section 5: Process Controls/Selections
5.0 Setup Menu: Process Tab......................................................................
Section 6: Device Parameters
6.0 Setup Menu: Device Parameters Tab.....................................................
Section 7: Manual Power
7.0 Setup Menu: Manual Power Tab............................................................
Section 8: First Start
8.0 Communication Port Selection...............................................................
8.1 Procedure...............................................................................................
Section 9: Using the Software
9.0 Adding a Layer........................................................................................
9.1 Adding a Process....................................................................................
9.2 Starting a Deposition...............................................................................
Contents
p. 1
p. 2
p. 4
p. 4
p. 5-6
p. 6-7
p. 7
p. 8-10
p. 11-12
p. 13-14
p. 15
p. 16
p. 16
p. 17
p. 17-18
p. 18
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ii
ii
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ii

Section 10: Troubleshooting..........................................................................................
Section 11: Specications
11.0 Device Parameters.................................................................................
11.1 Deposition Settings.................................................................................
11.2 Measurement.........................................................................................
11.3 Process Display......................................................................................
11.4 Communications.....................................................................................
11.5 Deposition Settings.................................................................................
Index...............................................................................................................................
Contents
p. 19
p. 20
p. 20
p. 21
p. 21
p. 21
p. 22
p. 23

Tables
1 Coating Specications....................................................................................
2 Troubleshooting..............................................................................................
3 Device Specications......................................................................................
4 Coating Specications.....................................................................................
5 Measurement Specications...........................................................................
6 Process Display Specications.......................................................................
7 Communication Specications........................................................................
8 Input and Output Specications......................................................................
Figures
A Eon-LT™System Components......................................................................
B Phoenix™System Package Contents............................................................
C Connections Between Phoenix System Components....................................
D Eon-LT™ Front Hardware Connections..........................................................
E Eon-LT™Rear Hardware Connections...........................................................
F Front Panel Controls and Displays.................................................................
G Layer Tab.........................................................................................................
H Process Tab.....................................................................................................
I Device Parameters Tab...................................................................................
J Manual Power Tab...........................................................................................
K ComPort Selection Prompt..............................................................................
Tables & Figures
p. 12
p. 19
p. 20
p. 20
p. 21
p. 21
p. 21
p. 22
p. 1
p. 2
p. 2
p. 3
p. 3
p. 5
p. 8
p. 11
p. 13
p. 15
p. 16

Section 1 System Components and Connections
Power Supply Cable
North America standard plug
(Europlug available on request)
Power Supply
Input: 100-200VAC, 50/60Hz, 2.0A
Output: 24V-3.75A, 90W MAX
Eon-LT™ Thin Film Controller
Eon- LT™Controller, BNC Sensor
Inputs, Type K Thermocouple
Inputs, Power Input, and RS-232
ComPort for connection to PC
Eon-LT™Quick Start Guide Eon-LT™Software Disc
Eon LT™ software, Labview
runtime, USB drivers, and manual.
Software requires administrative
privileges to install and run.
BNC to Microdot Cable
USB to RS-232 Adaptor
RS-232 Extension Cable
Standard, male-to-female
serial cable
Quartz Crystals
Figure A: Eon-LT™Package Components

Phoenix Sensor Head
Phoenix™ temperature measuring
sensor head
substrate
source
shutter
Eon-LTTM software
installed on your PC
Eon-LTTM Controller
PhoenixTM Sensor Head
Figure B: Phoenix™ Sensor Head
Figure C: Connections Between Phoenix™ System Components
Phoenix™ System
2

Figure D: Eon-LT™Front Hardware Connections
Section 2 Hardware and Design
Figure E: Eon-LT™Rear Hardware Connections
LED Indicator
Variable Stat Indicator
RS-232
For connecting Eon-LT™to PC
Power Input
24 VDC Power Input
3
BNC Sensor Inputs
For connecting to sensor head
Outputs
For relay and source outputs
Type K Thermocouple Inputs
For temperature measurement

2.0 - 2.1 Connecting Inputs & Outputs
4
Eon-LT™has been designed so that ONLY the correct hardware can be
plugged into the appropriate input or output. The following is a guideline on
how hardware should be connected in order to prevent damage to Eon-LT™.
2.1 Connecting Output
The Eon-LT™utilizes one (1) output. Make sure the correct hardware
is used with this output.
2.1.1 DB9 Connector
Connects the two SPST relays and two source outputs.
2.0 Connecting Inputs
The Eon-LT™utilizes four (4) inputs. Make sure the correct hardware
is used with these inputs.
2.0.1 Power
Only the provided power supply should be used with Eon-LT™.
Not doing so will cause hardware damage to Eon-LT™that will
not be covered by warranty. Ensure that the power supply has a
24 VDC.
2.0.2 ComPort
Connect an RS232 cable to this port. Always use the provided
USB to RS232 cable.
2.0.3 BNC
Eon-LT™has a built in oscillator. (Colnatec also offers an
external oscillator for purchase). The cable between Eon-LT™
and the crystal should remain as short as possible to avoid
noise. The advisable maximum acceptable length for this is one
(1) foot or 30 cm.
2.0.4 TC Connection
Eon-LT™uses a thermocouple probe to measure the
temperature of the sensor head.

Section 3 Front Panel Controls and Displays
Figure F: Front Panel
3.0 Controls
Change settings,
activate controls, and
halt process runs.
3.0.1 Start
Initiates the selected deposition process. Each time a deposition process
is initiated, a new log le is created.
3.0.2 Abort
Manually cancels the deposition process and closes the log le.
3.0.3 Log
Logs the current running process. New log les can be found on the hard
drive under “Eon Log” les.
3.0.4 Zero Thickness (ZT)
The interface contains three ZT buttons - one on each sensor tab (2) and
one on the control tab. The control tab ZT button zeroes both sensors
simultaneously.
3.0.5 Relay 1
Actuates Relay 1.
5

3.0.7 Setup
Change settings to materials, processes, etc.
3.0.8 Process
Select the active process
3.0 - 3.1 Front Panel Controls and Displays
3.0.6 Relay 2
Actuates Relay 2.
3.1.1 Film
Displays the current lm being deposited.
3.1.2 Rate
Displays the current rate of deposition in angstroms per second.
3.1.3 Temperature
Displays the TC temperature reading numerically and graphically (the ll
bar covers a range of 0°C to 500°C).
3.1.4 Thickness
Displays the current thickness of the material in kilo-angstroms or
angstroms.
3.1.5 Frequency
Displays the current frequency of the crystal in hertz.
3.1.6 Health
Displays the crystal health in graphical and numeric form (the ll bar
covers a range of 0 to 100%).
3.1 Status Displays
6

3.1.7 Crystal
Displays if the crystal health is below 50%.
3.1.8 Source 1
Displays if Source 1 is active (above 0% power) for the current sensor.
3.1.9 Source 2
Displays if Source 2 is active (above 0% power) for the current sensor.
3.1 - 3.2 Front Panel Displays and Graphs
3.2 Graphs
These items represent the same values as the indicators, but in graphical form. Click
on the tabs (graph titles) to switch between graphs. During the run you have the
ability to change the scale of the x-axis and y-axis.
7
*Unit time is dependent on sample period
3.2.1 Rate Graph
Displays a graphical representation of the rate as a function of time*.
3.2.2 Temperature
Displays a graphical representation of TC temperature as a function of
time*.
3.2.3 Thickness Graph
Displays a graphical representation of thickness as a function of time*.
3.2.4 Frequency
Displays a graphical representation of frequency as a function of time*.

4.0.1 Save Layer
Saves the deposition settings under a new layer named as stated.
4.0.2 Load Layer
Loads the layer name selected under the Layer Select dropdown menu.
4.0.3 Update Layer
Updates any changes to the selected layer.
4.0.4 Clear All Layers
Clears all of the saved layers.
4.0.5 Finish
Closes the Setup Menu.
4.0.6 Material
Dropdown option enables selection of the material being deposited.
4.0.7 Density
Density of the material to be deposited is automatically populated when a
material is selected. For custom densities, select “Custom” under material
and enter the desired density.
4.0 Setup Menu:
Layer Tab
Change layer
materials, display
material density,
and Z-Factor
Figure G: Layer Tab
Section 4 Layer Controls/Selections
8

4.0 Layer Controls/Selections
4.0.8 Z-Factor
Z-Factor of Material 1. The eld automatically populates with the value
selected under Material 1. The Z-Factor can be manually adjusted using
the dropdown arrows.
4.0.9 Proportional
Indicates the Proportional of the source.
4.0.10 Integral
Indicates the Integral of the source.
4.0.11 Derivative
Indicates the Derivative of the source.
4.0.12 Rise to Soak Time
Sets the rise to soak power in seconds.
4.0.13 Soak Time
Sets the amount of soak time in the soak power.
4.0.14 Soak Power
Sets Soak power.
4.0.15 Rise to Predeposit
Sets the Rise to Predeposit power in seconds.
4.0.16 Predeposit Time
Sets the amount of Predeposit Time in predeposit power.
4.0.17 Predeposit Power
Sets the Predeposit Power.
4.0.18 Tooling Factor
Sets the Tooling Factor for the material.
9

4.0 Layer Controls/Selections
4.0.19 Source Select
Sets the source which will control the material deposition.
4.0.20 Sensor Select
Sets the sensor that will monitor the deposition.
4.0.21 Dwell Time
Sets the time delay between the predeposit and automatic deposition.
Effective when a relay is used.
10

11
5.0.1 Set Process Name
Enter a process name.
5.0.2 Process List
This list contains the current saved processes.
5.0.3 Save Process
When a new process name is entered, this button will be enabled to save a
new process.
5.0.4 Load Process
When a process is selected from the process list, this button will be
enabled to load the process. Processes are automatically loaded. If the
process is changed, press the Load Process button to reload the previous
settings.
5.0.5 Update Process
When the process has been changed, press the update process button to
save the changes.
5.0.6 Clear Process List
This button deletes all of the saved processes.
Section 5 Process Controls/Selections
5.0 Setup Menu:
Process Tab
Create a deposition
process. Multiple
layers (up to 10)
can be added in
sequence. Two layers
can be selected for
codeposition.
Figure H: Process Tab

12
5.0 Process Controls/Selections
5.0.7 Finish
This exits the setup window. Save any changing before pressing Finish.
5.0.8 Select Layer
Select the layer for the process.
5.0.9 Process Type
Selected if user intends to add multiple layers.
5.0.10 Add layer
Adds the currently selected layer.
5.0.11 Delete layer
Deletes the current “remove layer” number.
5.0.12 Remove layer
Selects the layer to be removed after pressing the “Delete Layer” button.
5.0.13 Clear settings
Clears all of the currently active processes settings.
5.0.14 Layer
Displays the name of the layer to receive deposition.
5.0.15 Rate [A/s]
The target deposition rate for the active layer.
5.0.16 Thickness [KA]
The target thickness for the active layer. (This eld displays information
only and cannot be changed).

13
Section 6 Device Parameters
6.0 Setup Menu:
Device Parameters
Tab
Change tooling factor,
name log le, select
crystal frequency type,
and adjust period
manually
Figure I: Device Parameters Tab
6.0.1 Append Log Name
Log les can be named in the Append Log Name box.
6.0.2 Filter Size
The buffer size for averaging time.
6.0.3 Alpha
Alpha is a data-smoothing parameter. Increase Alpha for quicker
response. Decrease Alpha for smoother response.
6.0.4 Crystal Frequency
Crystal frequency range can be selected on the dropdown (6MHz or 5
MHz option).
6.0.5 Zero Before Run
Zeros the thickness before a process starts.
6.0.6 Zero S1 before PID
Zeros Sensor 1 before entering into automatic deposition.

14
Function Description
Manual No automatic action. The relay button must be pressed to actuate
Start Triggers the relay when a process is started
After Predeposit Triggers the relay after a predeposit is complete
Predeposit Trigger Triggers the relay when the predeposit starts.
6.0 Device Parameters
6.0.8 Relay 1: Operation mode for relay
Actuates Relay 1 (see Table 1 for functions).
6.0.9 Relay 2: Operation mode for relay
Actuates Relay 2 (see Table 1 for functions).
6.0.10 Update Parameters
Updates Eon-LT™ with any changes made in the Device Parameters
tab. In order to implement any changes to the device parameters, Update
Parameters must be selected.
Table 1 - Coating
6.0.7 Zero S2 before PID
Zeros Sensor 2 before entering into automatic deposition.