Dell EMC PowerEdge R740xd2 User manual

Dell EMC PowerEdge R740xd2
The Dell EMC PowerEdge R740xd2 is an enterprise content server
designed to address demanding, data-heavy workloads and
applications, such as media streaming, Software Dened Storage
(SDS), and on-premise e-mail/messaging. The R740xd2 oers
exible capacity and performance resources that help you meet
increasing business and storage demands in a high-capacity,
space-saving 2U rack server. Bring compute closer to storage with
the R740xd2 to deliver fast response times.
Technical Guide

© 2018 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other
trademarks may be trademarks of their respective owners.
2018 - 10
Rev. A0X

Contents
1 Product overview.............................................................................................................5
Introduction........................................................................................................................................................................ 5
New technologies...............................................................................................................................................................5
2 Product features............................................................................................................. 6
Product specications........................................................................................................................................................ 6
3 Chassis views and features............................................................................................. 8
Front view of the system....................................................................................................................................................8
Rear view of the system.....................................................................................................................................................8
Inside the system.............................................................................................................................................................. 10
4 Processor...................................................................................................................... 13
Processor features............................................................................................................................................................ 13
Supported processors....................................................................................................................................................... 13
Chipset..............................................................................................................................................................................13
5 Memory......................................................................................................................... 15
Supported memory........................................................................................................................................................... 15
Memory speed..................................................................................................................................................................15
Memory congurations..................................................................................................................................................... 15
Memory RAS features.......................................................................................................................................................16
6 Storage.......................................................................................................................... 17
Drives................................................................................................................................................................................17
Storage controller specications....................................................................................................................................... 18
Internal Dual SD Module (IDSDM).....................................................................................................................................18
Boot Optimized Storage Subsystem (BOSS).............................................................................................................. 18
7 External storage.............................................................................................................19
Optical drive......................................................................................................................................................................19
Tape drive......................................................................................................................................................................... 19
8 Networking and PCIe.................................................................................................... 20
9 Power, thermal, and acoustics....................................................................................... 21
Power supply units............................................................................................................................................................ 21
Power supply eciency...............................................................................................................................................21
Thermal............................................................................................................................................................................ 22
Thermal design...........................................................................................................................................................22
Acoustical design..............................................................................................................................................................22
10 Supported operating systems...................................................................................... 23
3

11 Dell EMC OpenManage systems management..............................................................24
iDRAC with Lifecycle controller........................................................................................................................................ 24
iDRAC features and comparison.................................................................................................................................25
Agent-free management.................................................................................................................................................. 29
Agent-based management............................................................................................................................................... 29
Dell EMC consoles............................................................................................................................................................29
Dell EMC OpenManage systems management tools, utilities and protocols...................................................................... 31
OpenManage Integrations................................................................................................................................................ 32
OpenManage Connections...............................................................................................................................................32
12 Appendix A. Additional specications...........................................................................34
Chassis dimensions...........................................................................................................................................................34
Video specications..........................................................................................................................................................35
USB ports specications.................................................................................................................................................. 35
Environmental specications............................................................................................................................................ 36
13 Appendix B. Standards compliance.............................................................................. 37
14 Appendix C Additional resources..................................................................................38
15 Appendix D. Support and deployment services............................................................ 39
ProDeploy Enterprise Suite and Residency Services.........................................................................................................39
ProDeploy Plus........................................................................................................................................................... 39
ProDeploy...................................................................................................................................................................39
Basic Deployment.......................................................................................................................................................39
Residency Services.................................................................................................................................................... 40
Deployment services........................................................................................................................................................ 40
Remote Consulting Services............................................................................................................................................ 40
Data Migration Service.....................................................................................................................................................40
ProSupport Enterprise Suite.............................................................................................................................................40
ProSupport Plus................................................................................................................................................................41
ProSupport....................................................................................................................................................................... 41
ProSupport One for Data Center...................................................................................................................................... 41
Support Technologies.......................................................................................................................................................42
SupportAssist.............................................................................................................................................................42
TechDirect.................................................................................................................................................................. 42
Additional professional services........................................................................................................................................ 42
Dell Education Services.................................................................................................................................................... 42
Dell EMC Global Infrastructure Consulting Services......................................................................................................... 43
Dell EMC Managed Services............................................................................................................................................ 43
4

1
Product overview
Introduction
The Dell EMC PowerEdge R740xd2 helps you plan for future growth with large internal storage and cost-ecient drive capacities.
Deliver two-socket compute performance with ash and fast networking options to meet streaming demands. Simplify management
of large data sets with automated administration and front-serviceable drives. The R740xd2 lets you keep your data safely on-
premise with built-in security, even as you scale capacity.
The R740xd2 is Dell EMC's latest 2-socket, 2U rack server designed to run data-heavy workloads using scalable memory, I/O, and
network options. The systems feature the Intel® Xeon® Processor Scalable Family, up to 16 DIMMs, PCIe 3.0 enabled expansion
slots, and a choice of OCP technologies.
New technologies
The following table shows new technologies incorporated in the PowerEdge R740xd2:
Technology Detailed Description
Intel® Xeon® Processor Scalable
Family
The Intel® Xeon® processor scalable family has advanced features that deliver
exceptional performance and value. See the processors section for more information .
Intel® C621 Chipset Series The R740xd2 incorporates the Intel® Platform Controller Hub (PCH) chip. See the
chipset section for more information.
2666 MT/s DDR4 Memory The Intel® Xeon® processor scalable family support 2666 MT/s memory. The R740xd2
supports two DIMMs per channel at 2666 MT/s with these processors. See the memory
section for more information.
iDRAC9 w/ Lifecycle Controller The embedded systems management solution for Dell EMC Servers features hardware
and rmware inventory and alerting, in- depth memory alerting, faster performance, a
dedicated gigabit port and many more features.
5

2
Product features
Product specications
The following table shows the technical specications of the PowerEdge R740xd2:
Features Specications
Form Factor 2U
Scalability (Sockets) 2 sockets
Processors Intel® Xeon® Scalable processor server CPU
Processor TDP Up to 140W
Processor Cores Up to 22
Chipset Intel® C621 chipset
VGA Embedded in BMC (integrated VGA chip)
Memory technology 8GB/16GB/32GB DDR4
DIMMs per socket (total DIMMs) 16 DIMM slots
DIMM Type RDIMM
Memory Bandwidth 2666 MT/s
PCIe slots Up to 5 x Gen3 slots (x16)
PCIe Gen Gen 3
Power supplies • Platinum: 750W or 1100W
• HVDC: 750W or 1100W hot plug power supplies with full redundancy option
• 6 fans with N +1 redundancy
USB Front 2 x USB 2.0 : Micro USB iDRAC x1 + 1 x USB 2.0
USB Rear 2 x USB 3.0
USB Internal 1 x USB 3.0
Serial Port Yes
Video Yes, 1x standard VGA (Rear)
SATA ports (from PCH) Up to 12 SATA ports. 2 rear drives onboard SATA Support
Disk Drives • 3.5" hard disk drives/2.5" SSD drives with 3.5" carrier, hot pluggable
• Front drive bays: Up to 24 x 3.5” SAS/ SATA (HDD) max 336TB, or up 16 x 3.5”
SAS/SATA (HDD) plus up to 8 x 2.5” SAS (SSD) max 285.44TB
• Rear drive bays: Up to 2 x 3.5” SAS SATA (HDD) max 28TB or up to 2 x 2.5” SAS
(SSD) drives max 15.36TB
Storage controllers • Internal Controllers: PERC H730P, H330
• Software RAID (SWRAID): S140
• Boot Optimized Storage Subsystem: HWRAID 2 x M.2 SSDs, 240GB or 480GB
6

Features Specications
• 12Gbps SAS HBAs (non-RAID): Internal - HBA330
Optical Drive Optional external USB DVD-ROM
Embedded Management (Remote) iDRAC9 with Lifecycle Controller
Systems Management OpenManage, iDRAC
7

3
Chassis views and features
Front view of the system
Figure 1. Front view of 24 x 3.5-inch drive system
1. Left control panel 2. Drives (12)
3. Right control panel 4. Right release latch
5. Left release latch
Rear view of the system
Figure 2. Back panel features of 24 x 3.5-inch + 2 x 3.5-inch (rear) drive system with Low-prole risers
1. Serial port 2. Drives (2)
3. Low-prole riser 1 (slot 2) 4. Low-prole riser 2 (slot 3)
5. Power supply unit (PSU 1) 6. Information tag
7. Power supply unit (PSU 2) 8. LOM ethernet port (2) (slot 1)
9. Ethernet port (Gb1) 10. Ethernet port (Gb2)
8

11. USB 3.0 port (2) 12. iDRAC9 dedicated network port
13. VGA port 14. System identication button
Figure 3. Back panel features of 24 x 3.5-inch + 2 x 3.5-inch (rear) drive system with full-height riser
1. Serial port 2. Drive (2)
3. Full-height riser slot (slot 2) 4. Power supply unit (PSU 1)
5. Information tag 6. Power supply unit (PSU 2)
7. LOM ethernet port (2) (slot 1) 8. Ethernet port (Gb1)
9. Ethernet port (Gb2) 10. USB 3.0 port (2)
11. iDRAC9 dedicated network port 12. VGA port
13. System identication button
Figure 4. Back panel features of 24 x 3.5-inch drive system with buttery riser
1. Serial port 2. Buttery riser full-height (slot 2)
3. Buttery riser low-prole (slot 3) 4. Low-prole PCIe expansion card (slot 4)
5. Low-prole PCIe expansion card (slot 5) 6. Low-prole PCIe expansion card (slot 6)
7. Power supply unit (PSU 1) 8. Information tag
9. Power supply unit (PSU 2) 10. LOM ethernet port (2) (slot 1)
11. Ethernet port (Gb1) 12. Ethernet port (Gb2)
13. USB 3.0 port (2) 14. iDRAC9 dedicated network port
15. VGA port 16. System identication button
9

Figure 5. Back panel features of 24 x 3.5-inch drive system without risers
1. Serial port 2. Low-prole PCIe expansion card (slot 4)
3. Low-prole PCIe expansion card (slot 5) 4. Low-prole PCIe expansion card (slot 6)
5. Power supply unit (PSU 1) 6. Information tag
7. Power supply unit (PSU 2) 8. LOM ethernet port (2) (slot 1)
9. Ethernet port (Gb1) 10. Ethernet port (Gb2)
11. USB 3.0 port (2) 12. iDRAC9 dedicated network port
13. VGA port 14. System identication button
Inside the system
NOTE: Components that are hot swappable are marked orange and touch points on the components are marked blue.
10

Figure 6. Inside the system with buttery riser
1. Drive bay 1
2. Drive bay 2
3. Cooling fans
4. Memory module
5. Processor and heatsink module 1
6. Processor and heatsink module 2
7. System board
8. LOM riser card
9. Internal PERC riser
10. Air shroud
11. Buttery riser
11

Figure 7. Inside the system with rear drive cage
1. Drive bay 1 2. Drive bay 2
3. Cooling fans 4. Memory module
5. Processor and heatsink module 1 6. Processor socket 2
7. System board 8. 1 x Full height riser (or 2 x Low-prole riser)
9. Internal PERC riser 10. Drive cage (rear)
11. Air shroud (24 x 3.5 inch + 2 x 3.5 inch rear hard drive
system)
12

4
Processor
Processor features
The Intel Xeon Processor Scalable Family provides the foundation for a powerful datacenter platform. The key features are as
follows:
•Higher Per-Core Performance: Up to 28 cores (22 cores with R740xd2), delivery high performance and scalability for compute-
intensive workloads across compute, storage & network usages.
•Greater Memory Bandwidth/Capacity: 50% increased memory bandwidth and capacity. 6 memory channels vs. 4 memory
channels of previous generation for memory intensive workloads.
•Expanded I/O: 48 lanes of PCIe 3.0 bandwidth and throughput for demanding I/O-intensive workloads.
•Intel Ultra Path Interconnect (UPI): Up to three Intel UPI channels increase scalability of the platform to as many as eight
sockets, as well as improves inter-CPU bandwidth for I/O intensive workloads.
•Intel Advanced Vector Extensions 512 (Intel AVX-512) with a single AVX512 fused multiply add (FMA) execution units. SKUs
which support Advanced RAS enable a 2nd FMA execution unit.
•Security without Compromise: Near-zero encryption overhead enables higher performance on all secure data transactions.
Supported processors
The following table shows the supported processors for the PowerEdge R740xd2:
Medal Processor Frequency
(GHz)
Cores/
Threads
Cache (M) UPI (GT/s) Turbo TDP (W)
Gold 6152 2.1 22/44 30 10.4 Y 140
Gold 6140 2.3 18/36 25 10.4 Y 140
Gold 6130 2.1 16/32 22 10.4 Y 125
Gold 5120 2.2 14/28 19 10.4 Y 105
Gold 5118 2.3 12/24 16 10.4 Y 105
Gold 5117 2.0 14/28 16 10.4 Y 105
Gold 5115 2.4 10/20 14 10.4 Y 85
Silver 4116 2.1 12/24 16 9.6 Y 85
Silver 4114 2.2 10/20 14 9.6 Y 85
Silver 4110 2.1 8/16 11 9.6 Y 85
Bronze 3104 1.7 6/6 8 9.6 N 85
Chipset
The following lists the features of the Intel C621 chipset:
• ACPI Power Management Logic Support, Revision 4.0a
• PCI Express* Base Specication Revision 3.0
13

• Integrated Serial ATA host controller, supports data transfer rates of up to 6 Gb/s on all ports.
• xHCI USB controller with SuperSpeed USB 3.0 ports
• Direct Media Interface
• Serial Peripheral Interface
• Enhanced Serial Peripheral Interface
• Flexible I/O-Allows some high speed I/O signals to be congured as PCIe* root ports, PCIe* uplink for use with certain PCH
SKUs, SATA (and sSATA), or USB 3.0
• General Purpose Input Output (GPIO)
• Low Pin Count interface, interrupt controller, and timer functions
• System Management Bus Specication Version 2.0
• Integrated Clock Controller / Real Time Clock Controller
• Intel® High Denition Audio and Intel® Smart Sound Technology
• Integrated 10/1 Gb Ethernet
• Integrated 10/100/1000 Mbps Ethernet MAC
• Supports Intel® Rapid Storage Technology Enterprise
• Supports Intel® Active Management Technology and Server Platform Services
• Supports Intel® Virtualization Technology for Directed I/O
• Supports Intel® Trusted Execution Technology
• JTAG Boundary Scan support
• Intel® Trace Hub for debug
14

5
Memory
The PowerEdge R740xd2 supports up to 16 DIMMs, with up to 512GB of memory and speeds of up to 2666MT/s.
Supported memory
The table below lists the memory technologies supported by the PowerEdge R740xd2:
Table 1. Supported memory technologies
Features Description
DIMM types RDIMM
Transfer speed 2666MT/s
2400MT/s
2133MT/s
1866MT/s
Voltage 1.2V (DDR4)
Memory speed
The PowerEdge R740xd2 support memory speeds of 2666MT/s, 2400MT/s, 2133MT/s, and 1866MT/s depending on the DIMM
types installed and the conguration. All memory on all processors and channels run at the same speed and voltage. By default, this
speed will be the highest common supported speed between the CPUs and DIMMs. The operating speed of the memory is also
determined by the maximum speed supported by the processor, speed settings in BIOS, and operating voltage of the system.
The following table lists the memory conguration and performance details based on the quantity and type of DIMMs per memory
channel:
Table 2. DIMM performance details
DIMM type DIMM ranking Capacity DIMM rated voltage, speed
RDIMM 1R / 2R 8GB, 16GB, 32GB DDR4 (1.2V), 2666
Memory congurations
The PowerEdge R740xd2 servers support exible memory congurations ranging from capacities of 8GB(minimum) to
512GB(maximum). CPU1 support up to 10 DIMMs sand CPU2 support up to 6 DIMMs.
Both systems support a exible memory conguration, according to the following population rules:
• Speed: If DIMMs of dierent speeds are mixed, all channels across all processors operate at the slowest DIMM's common
frequency.
• DIMM type: Only one type of DIMM is allowed per system: RDIMM.
• DIMMs with dierent data widths (x4 and x8) can be mixed.
• Can mix DIMMs with dierent capacities.
– Population rules require the largest capacity DIMM be placed rst (slot A1 populated rst, then A2, and so on. The second
CPU mirrors the rst CPU population).
15

– Maximum of two dierent capacity DIMMs allowed in a system
• Can mix DIMMs with dierent ranks.
– Maximum of two dierent rank DIMMs allowed in a system
Memory RAS features
Reliability, Availability, and Serviceability (RAS) features help keep the system online and operational without signicant impact to
performance and can decrease data loss and crashing due to errors. RAS aids in rapid, accurate diagnosis of faults which require
service.
The following table describes the memory RAS features supported on the PowerEdge R740xd2:
Feature Description
Dense conguration optimized prole Increased memory reliability can be a result from this selectable
platform prole that adjusts parameters to reduce faults
regarding refresh rates, speed, temperature and voltage
Memory demand and patrol scrubbing Demand scrubbing is the ability to write corrected data back to
the memory once a correctable error is detected on a read
transaction. Patrol scrubbing proactively searches the system
memory, repairing correctable errors.
Recovery from single DRAM device failure (SDDC) Recovery from Single DRAM Device Failure (SDDC) provides
error checking and correction that protects against any single
memory chip failure as well as multi-bit errors from any portion
of a single memory chip.
Failed DIMM isolation This feature provides the ability to identify a specic failing
DIMM channel pair, thereby enabling the user to replace only the
failed DIMM pair.
Memory mirroring Memory mirroring is a method of keeping a duplicate (secondary
or mirrored) copy of the contents of memory as a redundant
backup for use if the primary intra-socket memory fails. The
mirrored copy of the memory is stored in memory of the same
processor socket.
Memory address parity protection This feature provides the ability to detect transient errors on the
address lines of the DDR channel.
Memory sparing (rank) Memory sparing allocates one rank per channel as a spare. If
excessive correctable errors occur in a rank or channel, they are
moved to the spare area while the operating system is running to
prevent the errors from causing an uncorrectable failure.
Memory thermal throttling This feature helps to optimize power/performance and can also
be used to prevent DIMMs from overheating.
16

6
Storage
The chassis design for the PowerEdge R740xd2 supports four dierent storage congurations with max 24, or 26 drive options
depending on the rear drive option selected. The following table shows the storage options available:
Table 3. Storage options
Conguration Details Topology comment
Cong 0 24x 3.5-inch, (12+12 Single PERC) No rear drives to allow for max number of PCIe
slots
Cong 1 24x3.5-inch + 2x3.5-inch (12+12+2 Single PERC) All drives on a single controller for max capacity on
data drives
Cong 2 24x3.5-inch and 2x3.5-inch SATA (12+12 PERC
with rear 2 CS SATA drives)
Supports SATA drives in the rear for boot or as a
hot tier (2.5-inch SATA SSDs would have to be
hosted in a 3.5-inch carrier)
Cong 3 24x3.5-inch and 2x3.5-inch (12+12 1st PERC and
2x3.5-inch 2nd PERC)
Front 24 drives on Mini PERC controller, rear two
drives on adapter PERC controller. Rear drives for
boot or as a hot tier (2.5-inch SATA SSDs would
have to be hosted in a 3.5-inch carrier).
Drives
The Dell EMC PowerEdge R740xd2 system supports:
• Up to 24 x 3.5-inch (SATA or Nearline SAS drives) front accessible drives in slots 0 through 23.
• Up to 2 x 3.5-inch (SATA or Nearline SAS drives) rear accessible drives in slots 24 through 25.
• Up to 8 x 2.5-inch (SAS, SATA SSDs) front accessible drives placement rule must install SSD at slot 23 rst and backward end at
slot 16.
NOTE: 2.5-inch drives in 3.5-inch carriers are supported for SAS, and SATA SSD drives.
The following table list the support hard drives for the PowerEdge R740xd2.
Table 4. Supported HDD and SSD
Form factor Type Speed Rotational speed Capacities
2.5" SATA/SSD 6Gb NA 240GB, 400GB, 480GB, 800GB, 960GB, 1600GB,
1920GB, 3840GB
2.5" SATA/SSD 12Gb NA 400GB, 480GB, 800GB, 960GB, 1600GB, 1920GB,
3840GB, 7.68TB 1920GB (SED FIPS)
3.5" SATA/SSD 6Gb 7.2K 1TB, 2TB, 4TB, 8TB, 12TB, 14TB
3.5" SATA/SSD 12Gb 7.2K 2TB, 4TB, 4TB (SED FIPS), 8TB, 8TB (SED FIPS) 12TB,
12TB (SED FIPS)
NOTE: Visit dell.com/support for the latest supported drives.
17

Storage controller specications
The PowerEdge R740xd2 system supports the following controller cards.
Table 5. Dell EMC PowerEdge R740xd2 system controller cards
Internal controllers External controllers Software RAID
• PERC H730P mini
• PERC HBA330 mini
• PERC H330
• 12 Gbps SAS HBA
• PERC H840
• S140 (SATA) - software RAID SATA
Internal Dual SD Module (IDSDM)
The Internal Dual SD Module (IDSDM) and vFlash card are combined into a single card module in the latest PowerEdge systems. The
following are options available for PowerEdge R740xd2 systems:
• vFlash only
• IDSDM only
• vFlash and IDSDM
NOTE: The IDSDM only option is available with vFlash hardware and requires an iDRAC Enterprise license to enable the
feature.
The IDSDM with vFlash module is installed in a Dell-proprietary PCIe x1 slot using a USB 3.0 interface as the host. In this generation
of servers, the IDSDM and vFlash card features microSD in place of an SD card The supported capacities for the IDSDM microSD
cards are 16/32/64 GB while for vFlash the capacity is limited to 16 GB only. The write-protect switch is built on the IDSDM with
vFlash module.
Boot Optimized Storage Subsystem (BOSS)
BOSS is oered as a means of booting 14G servers to a full OS when:
• A solution such as IDSDM may be desired, but the target OS is a full OS (not just a hypervisor)
• The user does not wish to trade o standard hot plug drive slots for OS install
• A separate hardware RAID is required for OS boot so that data drives can be in Passthrough mode with an HBA
BOSS is a PCIe card located at the rear of the system to support up to two 80mm or 110mm M.2 SATA or PCIe x1 devices.
18

7
External storage
The R740xd2 supports the external storage device types listed in the table below:
Device Type Description
External Tape Supports connection to external SAS or FC tape products
NAS/IDM appliance Software Supports NAS software stack
JBOD Supports connection to 12Gb MD-series JBODs
External RD1000 Supports external USB RD1000 drive
Optical drive
The R740xd2 supports on the following external optical drive options.
• DVD-ROM
Tape drive
The PowerEdge R740xd2 do not support internal tape drives. However, external tape backup devices will be supported. The list
below shows the supported external tape drives:
• External RD1000 USB
• External LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives
• 114X rack mount chassis with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives
• TL1000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives
• TL2000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS and 8Gb FC tape drives
• TL4000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS and 8Gb FC tape drives
• ML6000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS and 8Gb FC tape drives
19

8
Networking and PCIe
The following lists the supported LOM for the PowerEdge R740xd2:
• 2x1GbE
• 2x10GbE
• 2x10GbE SFP+
• 2x25GbE SFP28
The following list the supported PCIe slots:
• Slot‐6: PCie Gen3 x4 from PCH
• Slot‐5: PCie Gen3 x4 from CPU1
• Slot‐4: PCie Gen3 x16 from CPU2 (left riser : slot 3)
• Slot-3: PCIe Gen3 x8 from CPU1 (Right riser: riser 1 slot)
• Slot-2: PCIe Gen3 x8 (or x16) from CPU1 (Right riser: riser 1 slot)
• Slot-1: LOM riser connector A x8 from CPU1.
• Internal PERC Slot: PCie Gen3 x8 from CPU1
20