Dell SE2416H Manual

SE2416H 1
1
1. Disassembly Procedures:
.
Step Figure Remark
S1. The FRONT
VIEW
Turn off power,
Unplug external cables
from product
S2. Remove the
STAND-BASE
ASS’Y
To remove the stand:
1. Press and hold the
stand release button.
2. Lift the stand up and
away from the monitor.
Note:
To prevent scratches on
the LCD screen while
removing the stand,
ensure that the monitor is
placed on a soft, clean
surface.

SE2416H 2
S3. Remove the
REAR COVER
Use a Philips-head
screwdriver to remove 2
screws for unlocking
mechanisms.
(No.1~2 screw
size=M3x4;
Torque=4±1kgf.cm)
Use Penknife to
separate the bezel and
rear cove follow the
arrows in sequence, then
you can take out rear
cover.
S4. Disconnect
the FFC cable
S5. Remove the
VGA
Use a hex screwdriver to
remove 2 screws for
unlocking mainboard.
(No.1~2 is Hex-screw,
Torque= 4.5±0.5kgf.cm)
1 2
12

SE2416H 3
3
S6. Remove the
FFC cable
S7. Remove the
tape
and panel FFC
cable
S8. Remove the
MAIN FRAME
Remove and turn over it.

SE2416H 4
S9. Remove the
MAIN &POWER
BOARD
Use a Philips-head
screwdriver to remove 5
screws for unlocking
mainboard and power
board
(No.1~4 screw
size=M4x8;
Torque= 6±1kgf.cm;
No.5 screw size=D3x6;
Torque= 6±1kgf.cm)
S10. Remove the
KEY BOARD
Use a Philips-head
screwdriver to remove 4
screws for unlocking Key
board.
(No.1~4 screw size=
M2x2.5
Torque=0.9±0.4kgf.cm)
1
2
34
5
1 2 34

SE2416H 5
5
S11. The PANEL
S12. Remove the
screw
Use a Philips-head
screwdriver to remove
1screws for unlocking
main frame
(No.1 screw size= Q3x6
Torque=4±1kgf.cm)
S13. The MAIN
FRAME
S14. The BEZEL
1

SE2416H 6
S15.Remove
capacitors
Remove electrolyte
capacitors (red mark)
from printed circuit
boards
Take out bulk cap. pin
solder with soldering
iron and absorber
Lift the bulk cap. up
and away from the
PCB

SE2416H 7
7
2. Product material information
The following substances, preparations, or components should be disposed of or recovered
separately from other WEEE in compliance with Article 4 of EU Council Directive 75/442/EEC.
Capacitors / condensers (containing
PCB/PCT)
No used
Mercury containing components No used
Batteries No used
Printed circuit boards (with a surface
greater than 10 square cm)
Product has printed circuit boards (with a
surface greater than 10 square cm)
Component contain toner, ink and liquids No used
Plastic containing BFR No used
Component and waste contain asbestos No used
CRT No used
Component contain CFC, HCFC, HFC
and HC
No used
Gas discharge lamps No used
LCD display > 100 cm2 Product has an LCD greater than 100 cm2
External electric cable Product has external cables
Component contain refractory ceramic
fibers
No used
Component contain radio-active
substances
No used
Electrolyte capacitors (height
> 25mm, diameter > 25mm)
Product has electrolyte capacitors
(height > 25mm, diameter > 25mm)
3. Tools Required
List the type and size of the tools that would typically can be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description:
- Phillip head Screwdriver
- Hex Screwdriver
- Penknife
- Soldering iron and absorber