Dell External OEMR R810 Quick start guide

Dell
PowerEdge R810
Technical Guide
Version 2
March 18, 2010
The PowerEdge R810
is designed with a
purpose—to make the
customer’s life easier.
PowerEdge gives you
the confidence to do
your job.

Dell
Dell PowerEdge R810 Technical Guide 1
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Initial Release July 2010

Dell
Dell PowerEdge R810 Technical Guide 2
Table of Contents
1Product Comparison ...........................................................................................6
1.1 Overview ..................................................................................................6
1.2 Comparison ...............................................................................................7
2New Technologies..............................................................................................8
2.1 Overview ..................................................................................................8
2.2 Detailed Information ....................................................................................8
2.2.1 Intel 7500 Chipset..................................................................................8
2.2.2 Intel Xeon Processor 6500 and 7500 Series .....................................................8
2.2.3 Dell FlexMem Bridge ...............................................................................8
2.2.4 Internal Dual SD Module...........................................................................8
3System Information ............................................................................................9
4Mechanical .................................................................................................... 11
4.1 Chassis Description..................................................................................... 11
4.2 Chassis ................................................................................................... 11
4.3 Dimensions and Weight................................................................................ 12
4.4 Front Panel View and Features ...................................................................... 12
4.5 Back Panel View and Features ....................................................................... 13
4.6 Power Supply Indicators............................................................................... 13
4.7 NIC Indicators........................................................................................... 13
4.8 Side View................................................................................................ 13
4.9 Internal Chassis Views ................................................................................. 14
4.10 Rails and Cable Management ......................................................................... 15
4.11 Rack View ............................................................................................... 15
4.12 Fans ...................................................................................................... 16
4.13 Cabling................................................................................................... 17
4.14 Control Panel/LCD ..................................................................................... 17
4.15 Security.................................................................................................. 18
4.15.1 Cover Latch ....................................................................................... 18
4.15.2 Bezel ............................................................................................... 18
4.15.3 Hard Drive......................................................................................... 18
4.15.4 Trusted Platform Module (TPM) ................................................................ 18
4.15.5 Power Off Security ............................................................................... 18
4.15.6 Intrusion Alert .................................................................................... 18
4.15.7 Secure Mode ...................................................................................... 19
4.16 USB Key.................................................................................................. 19
4.17 Battery................................................................................................... 19
4.18 Field Replaceable Units (FRU)........................................................................ 19
4.19 User Accessible Jumpers, Sockets, and Connectors............................................... 19
5Power, Thermal, Acoustic .................................................................................. 20
5.1 Power Subsystem....................................................................................... 20
5.1.1 Power Distribution Board ....................................................................... 20
5.2Power Efficiency ....................................................................................... 20

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Dell PowerEdge R810 Technical Guide 3
5.3 Power Supplies ......................................................................................... 21
5.4 Heat Dissipation ........................................................................................ 21
5.5 Environmental Specifications......................................................................... 22
5.6 ENERGY STAR®Compliance ........................................................................... 22
5.7 Thermal and Acoustics ................................................................................ 22
5.7.1 Thermal............................................................................................ 22
5.7.2 Acoustical ......................................................................................... 23
5.8 PCI Express Riser Connectors......................................................................... 24
5.9 Super I/O Controller ................................................................................... 24
6Processors..................................................................................................... 25
6.1 Overview ................................................................................................ 25
6.2 Features ................................................................................................. 25
6.3 Supported Processors.................................................................................. 26
6.4 Processor Configurations.............................................................................. 26
6.5 FlexMem Bridge ........................................................................................ 26
7Memory ........................................................................................................ 28
7.1 Overview ................................................................................................ 28
7.2 DIMMs Supported ....................................................................................... 28
7.3 Key Features of the R810 Memory System.......................................................... 28
7.4 Memory Speed Limitations............................................................................ 29
7.5 Slots/Risers ............................................................................................. 29
7.6 Memory Access ......................................................................................... 30
7.7 FlexMem Bridge ........................................................................................ 31
7.8 Memory RAS Support................................................................................... 32
7.8.1 Sparing............................................................................................. 32
7.8.2 Mirroring........................................................................................... 32
7.9 Memory RAID............................................................................................ 33
7.10 Supported Memory Configurations................................................................... 33
8Chipset ........................................................................................................ 35
8.1 Intel Boxboro I/O Hub (IOH) .......................................................................... 35
8.2 IOH PCI Express (PCIe)................................................................................. 35
8.3 Enterprise Southbridge Interface (ESI).............................................................. 35
8.4 Intel I/O Controller Hub 10 (ICH10) ................................................................. 35
9BIOS ............................................................................................................ 36
9.1 Overview ................................................................................................ 36
9.2 Supported ACPI States................................................................................. 36
10 Embedded NICs/LAN on Motherboard (LOM) ............................................................. 37
11 I/O Slots ....................................................................................................... 38
11.1 Overview ................................................................................................ 38
11.2 Quantities and Priorities .............................................................................. 38
11.2.1 IO Planar PCI Express Slots...................................................................... 38
11.2.2 PCI Express Risers ................................................................................ 38
11.2.3 Additional Riser Restrictions.................................................................... 39
11.3 Boot Order .............................................................................................. 39
11.4 NICs and External Controller Cards.................................................................. 39
11.5 PCI Card Dimensions ................................................................................... 41
11.5.1 Riser 1 ............................................................................................. 41

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Dell PowerEdge R810 Technical Guide 4
11.5.2 System Board ..................................................................................... 41
11.5.3 Riser 2 ............................................................................................. 41
11.6 PCIe Block Diagram .................................................................................... 42
12 Storage ........................................................................................................ 43
12.1 Overview ................................................................................................ 43
12.2 Persistent Storage...................................................................................... 43
12.2.1 iDRAC6 Express ................................................................................... 44
12.2.2 Unmanaged Persistent Storage................................................................. 45
12.2.3 Flash BIOS memory............................................................................... 46
12.3 Backplane ............................................................................................... 46
12.4 Supported Drives ....................................................................................... 46
12.5 RAID Configurations.................................................................................... 46
12.6 Storage Controllers .................................................................................... 48
12.6.1 PERC H200......................................................................................... 48
12.6.2 PERC H700......................................................................................... 48
12.6.3 PERC H800......................................................................................... 48
12.7 LED Indicators .......................................................................................... 49
12.8 Optical Drives........................................................................................... 49
12.9 External Storage Support and Tape Drives ......................................................... 49
13 Video and Audio.............................................................................................. 50
13.1 Video..................................................................................................... 50
13.2 Audio..................................................................................................... 50
14 Rack Information............................................................................................. 51
14.1 Overview ................................................................................................ 51
14.2 Rails ...................................................................................................... 51
14.3 Cable Management Arm (CMA) ....................................................................... 52
14.4 Rack View ............................................................................................... 52
15 Operating Systems ........................................................................................... 54
16 Virtualization ................................................................................................. 55
17 Systems Management........................................................................................ 56
17.1 Overview ................................................................................................ 56
17.2 Server Management.................................................................................... 56
17.3 Embedded Server Management ...................................................................... 57
17.4 Lifecycle Controller and Unified Server Configurator ............................................ 57
17.5 Integrated Dell Remote Access Controller.......................................................... 58
17.6 iDRAC Express........................................................................................... 58
17.7 iDRAC6 Enterprise...................................................................................... 58
1.7 iDRAC6 Enterprise with Virtual Flash (vFlash) Media................................................. 58
18 Peripherals.................................................................................................... 61
18.1 USB Peripherals......................................................................................... 61
18.2 External Storage........................................................................................ 61
Appendix A. Technical Specifications Summary.......................................................... 62
Appendix B. Regulatory Certifications and Standards Compliance .................................... 64
Appendix C. Statement of Volatility ....................................................................... 67

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Dell PowerEdge R810 Technical Guide 5
Tables
UTable 1.UUProduct ComparisonU..................................................................................7
UTable 2.UUSummary of R810 FeaturesU..........................................................................9
UTable 3.UUPower Supply Status IndicatorU.................................................................... 21
UTable 4.UUEnvironmental SpecificationsU..................................................................... 22
UTable 5.UUComparison of acoustical performance for 2 vs. 4 socket configurationsU.................. 23
UTable 6.UUProcessor Cache Sizes (Package LGA1567)U...................................................... 25
UTable 7.UUSupported ProcessorsU............................................................................... 26
UTable 8.UUPowerEdge R810 Sparing and MirroringU.......................................................... 32
UTable 9.UUR810 CPU Memory ConfigurationsU................................................................ 33
UTable 10.UUAvailable Add-In Cards and Controllers with Slot Priority and Max Supported InformationU
39
UTable 11.UUMixing of Drive TypesU.............................................................................. 43
UTable 12.UUSupported Drives for R810U......................................................................... 46
UTable 13.UUSingle Drive Type RAID ConfigurationsU........................................................... 47
UTable 14.UUMixed SSD and SAS RAID ConfigurationsU......................................................... 48
UTable 15.UUStorage Card Support MatrixU...................................................................... 49
UTable 16.UUSupported Video ModesU............................................................................ 50
UTable 17.UUUnified Server Configurator Features and DescriptionU........................................ 57
UTable 18.UUFeatures List for BMC, iDRAC and vFlashU........................................................ 59
UTable 19.UUIndustry StandardsU.................................................................................. 64
UTable 20.UUProduct Safety Certifications and MarksU........................................................ 65
UTable 21.UUElectromagnetic CompatibilityU................................................................... 66
UTable 22.UUErgonomics, Acoustics and HygienicsU............................................................ 66
Figures
UFigure 1.UUFront View (with Bezel)U............................................................................ 11
UFigure 2.UUR810 Chassis DimensionsU........................................................................... 12
UFigure 3.UUFront of R810U........................................................................................ 12
UFigure 4.UUBack Panel View and FeaturesU.................................................................... 13
UFigure 5.UUChassis Side ViewU................................................................................... 14
UFigure 6.UUInternal Chassis ViewU............................................................................... 14
UFigure 7.UUServer Extended for ServicingU..................................................................... 15
UFigure 8.UUFront and Rear Rack Mount and Rail Views Showing CMA and Support TrayU............... 16
UFigure 9.UUR810 Fan Gantry LocationU......................................................................... 16
UFigure 10.UUUSB PortU........................................................................................... 19
UFigure 11.UUR810 Power SupplyU.............................................................................. 21
UFigure 12.UUDiagram of FlexMem Bridge RoutingU.......................................................... 27
UFigure 13.UUR810 DIMM Naming and NumberingU............................................................ 30
UFigure 14.UUDrive Bay Memory AccessU....................................................................... 31
UFigure 15.UUFlexMem BridgeU.................................................................................. 31
UFigure 16.UUPowerEdge R810 2P MirroringU.................................................................. 32
UFigure 17.UUR810 4P MirroringU................................................................................ 33
UFigure 18.UUPCIe Riser/PCIe Expansion Slot Block DiagramU.............................................. 42
UFigure 19.UUPersistent Storage Block DiagramU............................................................. 44
UFigure 20.UUInternal Dual SD Module Shown with a Single CardU......................................... 45
UFigure 21.UUR810 ReadyRails Sliding Rails with Optional CMAU........................................... 51
UFigure 22.UUR810 Mounted in the B2 Sliding RailsU......................................................... 53
UFigure 23.UUR810 CMA Mounted on the Side Opposite the Power Supplies (Recommended)U........ 53

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Dell PowerEdge R810 Technical Guide 6
10BProduct Comparison
1.1 18BOverview
The Dell™ PowerEdge™ R810 provides performance and rack density in a scalable 2U, two- or four-
socket server, allowing workload consolidation or high virtualization machine density.
FlexMem Bridge Technology delivers compute resources; more memory per processor solves growing
memory demand needs for database and virtualization applications.
Built with highly reliable Intel®Xeon®processors 7500 and 6500 series, high-capacity DDR3 memory,
and enterprise-class manageability, the PowerEdge R810 provides outstanding price for performance
with excellent memory capacity per processor.
Purposeful Design, Uncommon Reliability
The PowerEdge R810 is built for reliability, from new Intel Advanced RAS (Reliability, Availability,
Serviceability) features and dual internal SD modules to embedded diagnostics and industrial-quality
materials. Dual internal SD modules provide failover capability for the embedded hypervisor; this
feature was designed based on customer reliability feedback. Dell listened and delivered.
With the Dell Lifecycle Controller, persistent diagnostics eliminate technicians having to load
diagnostics from media, minimizing downtime.
Every fully configured Dell server is tested (and re-tested) before it leaves the factory.
Our ―one-touch‖ process is designed to ensure one person is responsible for the entire server build,
resulting in greater quality control.
Efficient Infrastructure
The PowerEdge R810 follows the 11th Generation PowerEdge behavioral specifications with the same
system design commonality and usability true to the entire portfolio. All 11th Generation servers are
designed to make the user experience easier while saving time and money.
Energy-efficient system design built with Energy Smart technologies includes power management
features enabling power capping, power inventory, and power budgeting within your specific
environment. Logical component layout of the internal components aids with airflow direction,
helping to keep the server cool.
Intelligent Platforms, Connected Foundation
FlexMem Bridge technology scales memory capacity allowing two Intel Xeon 7500 or 6500 Series
Processors access to all 32 Memory DIMM Slots delivering more memory resources for outstanding
application performance. This patent-pending Dell innovation allows customers to scale memory to
take full advantage of the resources that matter most.
Dell system management solutions focus on simplicity, efficiency, cost containment and reduction,
and an adherence to open standards. Our solutions are complemented by, connected to, and
integrated with 3rd-party offerings, thereby delivering comprehensive solutions across the complete
solutions stack.
The Lifecycle Controller is a chip that is integrated on the server. It helps to simplify administrator
tasks by performing a complete set of provisioning functions such as system deployment, system
updates, hardware configuration, and diagnostics in a pre-OS environment—all from a single,
intuitive interface called the Unified Server Configurator (USC).

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Dell PowerEdge R810 Technical Guide 7
The PowerEdge R810 is designed with a purpose—to make the customer’s life easier. PowerEdge gives
you the confidence to do your job.
1.2 19BComparison
The R810 does not have a direct predecessor. It is a new class of server for Dell—a highly scalable 2U
2S rack server intended to fill the gap between the general purpose 2U 2S and the 4U 4S server
space. The R810 is scalable to 4S if required, with 32 DIMM slots available in both 2S and 4S
configurations.
Comparison to the R710 and R900 servers is in Table 1.
Table 1. Product Comparison
Feature
PowerEdge R710
PowerEdge R900
PowerEdge R810
Chipset
Intel®5520
Intel®7300
Intel®7500
Processor
Intel®5500/5600
Intel®7400
Intel®6500/7500
Socket
2S
4S
2S or 4S
Memory
Up to 18 x DDR3
Up to 32 x FBD
Up to 32 x DDR3
DIMM Capacity
1, 2, 4, and 8 GB
512 MB, 1, 2, 4, and 8 GB
1, 2, 4, 8, and 16 GB
Slots
2 PCIe x8 + 2 PCIe x4
G2
Or 1 x16 + 2 x4 G2
7 (4 x8 + 3 x4)
All Gen 1
4 Full-Length slots
5 PCIe x8 + 1 PCIe x4
G2
HDD
6 x 3.5‖ or 8 x 2.5‖
Hot-swap
8x 2.5‖ or 5x 3.5‖
Hot-swap
6 x 2.5‖
Hot Swap
Power Supply
Hot-swap, Redundant
Hot-swap, Redundant
Hot-swap, Redundant
LOM
4 x TOE
4 X TOE
4 x TOE & iSCSI
DIAGNOSTIC
LCD
LCD
LCD
Management
Advanced
Manageability
BMC+DRAC 5
Advanced
Manageability
Persistent
Storage
Yes, Managed
NO
Yes, Managed
Security
TPM 1.2/TCM
TPM
TPM 1.2/TCM

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Dell PowerEdge R810 Technical Guide 8
21BNew Technologies
2.1 20BOverview
The R810 uses a number of new technologies
Intel 7500 chipset
Intel processor 6500 and 7500 series
Dell patent-pending FlexMem Bridge
Internal Dual SD module
2.2 21BDetailed Information
2.2.1 101BIntel 7500 Chipset
The 7500 chipset is designed to support Intel®Xeon®processor 6500 and 7500 series 4S family, Intel®
QPI Interconnect, DDR3 memory technology, and PCI Express Generation 2 (PCIe 2). The 7500 chipset
consists of the IOH QuickPath Interconnect (QPI), Intel®7500 Scalable Memory Buffer, and the ICH10
South Bridge.
2.2.2 102BIntel Xeon Processor 6500 and 7500 Series
The processor features up to eight-core processing to with maximize performance (expected up to
3.8x performance improvements) and performance/watt and significant energy efficiency
improvements for data center infrastructures and highly dense deployments. Additionally, the Intel
Xeon processor 6500 and 7500 series features the Intel®64 Architecture for flexibility in 64-bit and
32-bit applications and operating systems.
2.2.3 103BDell FlexMem Bridge
The PowerEdge R810 also introduces a new, Dell patent-pending, technology which will allow
flexibility in processor and memory scalability—FlexMem Bridge. The FlexMem Bridge allows the full
amount of addressable DIMMs on 4-Socket systems with Intel Xeon processor 7500 and 6500 series to
be accessed, even when only 2 of the processors are in place, in a completely passive solution (no
active components).
2.2.4 104BInternal Dual SD Module
The PowerEdge R810 also offers a second internal USB port dedicated for embedded Hypervisor for
virtualization operating systems like Citrix®and VMware®through a dual SD-to-USB daughter card
called an Internal Dual SD Module. The IDSM port is located behind the control panel. The SD Flash
Cards contains a bootable OS image for virtualized platforms. IDSM consists of up to two SD cards
that are mirrored when set in the redundant mode for the higher availability.

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Dell PowerEdge R810 Technical Guide 9
32BSystem Information
Table 2. Summary of R810 Features
Feature
Details
Form Factor
2U rack
Processors
Up to Eight-Core Intel®Xeon®processors 7500 and 6500 series
Processor Sockets
1, 2, or 4
Front Side Bus or
HyperTransport
Intel®QuickPath Interconnect (QPI)
Cache
Up to 24MB
Chipset
Intel®7500 Chipset
Memory
Up to 512GBs (32 DIMM slots) 1GB/2GB/4GB/8GB/16GB DDR3 1066MHz
I/O Slots
6 PCIe G2 slots:
Five x8 slot
One x4 slot
One storage x4 slot
RAID Controller
Internal Controllers:
PERC H200 (6Gb/s)
PERC H700 (6Gb/s) with 512MB battery-backed cache; 512MB, 1GB Non-
Volatile battery-backed cache
External Controllers:
PERC H800 (6Gb/s) with 512MB of battery-backed cache; 512MB, 1GB Non-
Volatile battery-backed cache
PERC 6/E with 256MB or 512MB of battery-backed cache
External HBAs (non-RAID):
6Gbps SAS HBA
SAS 5/E HBA
LSI2032 PCIe SCSI HBA
Drive Bays
Hot-Swap Option Available:
Up to six 2.5‖ SAS or SATA drives, including SATA SSD
Maximum Internal
Storage
Up to 3TB
Hard Drives
2.5‖ SATA SSD: 50GB, 100GB
2.5‖ SAS HDD (15K): 73GB, 146GB
2.5‖ SAS HDD (10K): 146GB, 300GB, 600GB
2.5‖ (7.2K) SATA HDD: 160GB
2.5‖ (7.2K) Nearline SAS HDD: 500GB
Network Interface
Cards
Broadcom®57710 Single Port 10GbE NIC, Copper CAT6 PCIe-8
Intel®DA 10GbE NIC, Dual Port, Optical, PCIe-8

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Dell PowerEdge R810 Technical Guide 10
Intel®10GbE Single Port 10GbE NIC, Copper, PCIe-8
Broadcom®NetXtreme II 5709 Gigabit NIC w/TOE & iSOE, Quad Port, Copper, PCIe-4
Broadcom®5709 Dual Port 1GbE NIC w/TOE PCIe-4, Low Profile
Broadcom®5709 Dual Port 1GbE NIC w/TOE iSCSI, PCIe-4, Low Profile
Broadcom®5709 Dual Port 1GbE NIC w/TOE iSCSI, PCIe-4
Broadcom®NetXtreme II 5709 Gigabit NIC w/TOE & iSOE, Quad Port, Copper, PCIe-4,
Low Profile
Broadcom®5709 Dual Port 1GbE NIC w/TOE PCIe-4
Broadcom®NetXtreme®II 57711 10GbE NIC w/TOE & iSOE, Dual Port, SFP+, PCIe-8
Intel®Gigabit ET NIC, Dual Port, Copper, PCIe-4, Low Profile
Intel®Gigabit ET Dual Port NIC, PCIe-4
Intel®Gigabit ET NIC, Quad Port, Copper, PCIe-4, Low Profile
Broadcom®5709 Dual Port 1GbE NIC w/TOE PCIe-4, Low Profile
Intel®Gigabit ET Quad Port NIC, PCIe-4
Embedded Network Controllers:
Emulex®OCe10102-FX-D CNA Standup HBA adapter
Emulex®OCE10102-IX-D CNA iSCSI HBA stand up adapter
See Dell.com for the most current available network cards.
Power Supply
Optional two redundant 1100W hot-plug power supplies
Availability
Hot-plug hard drives and redundant power, ECC memory, Dual Internal SD Module
Video
Matrox®G200eW w/ 8MB memory
Remote Management
iDRAC6 Express
IDRAC 6 Enterprise (optional)
iDRAC 6 Enterprise vFlash (optional)
Systems Management
BMC, IPMI2.0 compliant
Dell™ OpenManage™ featuring Dell Management Console
Unified Server Configurator
Lifecycle Controller enabled via iDRAC6 Express, iDRAC6 Enterprise, and vFlash
Rack Support
ReadyRails™ sliding rails with optional cable management arm for 4-post racks
(optional adapter brackets required for threaded hole racks)
Operating Systems
Microsoft®Windows®Essential Business Server 2008
Microsoft Windows®Server 2008 SP2, x86/x64 (x64 includes Hyper-V™ )
Microsoft Windows®Server 2008 R2, x64 (includes Hyper-V™ v2)
Microsoft®Windows®HPC Server 2008
Novell®SUSE®Linux Enterprise Server
Red Hat®Enterprise Linux
Optional Embedded Hypervisors:
Citrix®XenServer™
Microsoft®Hyper-V™ via Microsoft®Windows Server®2008
VMware®vSphere™ 4.1 (including VMware ESX®4.1 or VMware ESXi™ 4.1)
For up-to-date information, see the UOperating System Support Matrix for Dell
PowerEdge SystemsU.

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Dell PowerEdge R810 Technical Guide 11
43BMechanical
4.1 22BChassis Description
The PowerEdge R810 chassis is a 2U rack-mount design constructed primarily of steel. It includes a
handle at the rear of the chassis. The optional front bezel is also safety rated as a handle (when
properly installed) so that the server can be easily lifted using the bezel and rear handle.
4.2 23BChassis
The PowerEdge R810 fits in a rack-mount 2U chassis. The R810 chassis provides new features such as:
Slide-out drive bay section to allow servicing of DIMMs below drives
Updated industrial design including a new LCD screen, bezel, and hard drive carriers
Toolless rack latches
Pull-out tray for Express Service Tag and customer labels
Support for persistent storage (internal USB and SD card slots and external SD card slot)
Updated power supply removal process (see UPower SuppliesUin the Hardware Owner’s
Manual)
Figure 1. Front View (with Bezel)

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Dell PowerEdge R810 Technical Guide 12
4.3 24BDimensions and Weight
Figure 2 details the dimensions of the R810 chassis.
Xa
Xb
Y
Za
w/ bezel
Za
w/o bezel
Zb
Zc
482.4mm
443.1mm
86.4mm
35.0mm
23.5mm
717.5mm
720.6mm
Figure 2. R810 Chassis Dimensions
The R810 maximum configuration weight is 26.1 kg (57.54 lb)
4.4 25BFront Panel View and Features
Figure 3. Front of R810
For detailed information, see UFront-Panel Features and IndicatorsUin the Hardware Owner’s Manual.

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Dell PowerEdge R810 Technical Guide 13
The PowerEdge R810 supports the following USB devices:
DVD (bootable; requires two USB ports)
USB Key (bootable)
Keyboard (only one USB keyboard is supported)
Mouse (only one USB mouse is supported)
4.5 26BBack Panel View and Features
Figure 4. Back Panel View and Features
For detailed information, see UBack-Panel Features and IndicatorsUin the Hardware Owner’s Manual.
The following components are located on the rear panel of the R810 enclosure:
15-pin VGA connector
DB-9 Serial Port connector
(4) RJ-45 10/100/1000 Ethernet connectors
Rear System ID button
Rear System Status/ID blue/amber LED
Active ID Cable Management Arm (CMA) external led jack
(4) USB ports
(Optional) RJ-45 iDRAC6 Enterprise connector
(Optional) vFlash slot on iDRAC6 Enterprise
4.6 27BPower Supply Indicators
The power supplies have indicators that show whether power is present or whether a power fault has
occurred. For more information, see UPower Indicator CodesUin the Hardware Owner’s Manual.
4.7 28BNIC Indicators
Embedded NICs (LOMs) display indicators as detailed in the UNIC Indicator CodesUsection of the
Hardware Owner’s Manual.
4.8 29BSide View
Figure 5 shows a side view of the R810.

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Dell PowerEdge R810 Technical Guide 14
Figure 5. Chassis Side View
4.9 30BInternal Chassis Views
Figure 6 shows an internal view of the chassis with key features labeled.
Figure 6. Internal Chassis View

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Dell PowerEdge R810 Technical Guide 15
4.10 31BRails and Cable Management
The PowerEdge R810 uses the same rails and cable management arm (CMA) as the PowerEdge R910.
It does not share rails with other Dell 2U servers. Only sliding ReadyRails™are offered for the R810.
Static ReadyRails are not supported
Sliding ReadyRails™ for 4-post Racks support the following:
Toolless installation in 19‖ EIA-310-E compliant square or unthreaded round hole 4-post racks
including all Dell 42xx & 24xx racks (Threaded 4-post racks and 2-post racks require Dell’s
fixed shelf or 3rd party conversion kits available through Dell Software & Peripherals.)
Full extension of the system out of the rack to allow serviceability of key internal components
Optional cable management arm (CMA)
Measurements and adjustment ranges for the rack:
Rail depth without the CMA: 755 mm
Rail depth with the CMA: 883 mm
Square-hole rack adjustment range: 686–883 mm
Round-hole rack adjustment range: 672–876 mm
Cable Management Arm Features include:
Large U-shaped baskets to support dense cable loads
Fully reversible (can be mounted on either side) with no conversion required
Uses hook-and-loop straps rather than plastic tie wraps to eliminate risk of cable damage
during cycling
Includes low profile support tray to eliminate CMA sag
Both CMA and tray mount toollessly via simple and intuitive snap-in designs
See Section 15 for more information.
4.11 32BRack View
Rails allow the server to be extended out from the rack for servicing as shown in Figure 7.
Figure 7. Server Extended for Servicing

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Dell PowerEdge R810 Technical Guide 16
The Cable Management Arm (shown in Figure 8) organizes the cords and cables at the back of the
server and unfolds to allow the server to extend out from the rack without removing cables.
Figure 8. Front and Rear Rack Mount and Rail Views Showing CMA and Support Tray
4.12 33BFans
Six hot-swappable fans are mounted in a fan gantry that is located in the chassis behind the
processors. Each fan has a blind mate 2x2 connector that plugs directly into the CPU Board. There is
an additional fan integrated in each power supply to cool the power supply subsystem and also
provide additional cooling for the whole system.
Figure 9. R810 Fan Gantry Location

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Dell PowerEdge R810 Technical Guide 17
The Embedded Server Management logic in the system monitors the speed of the fans. A fan failure
or over-temperature in the system results in a notification by iDRAC6. All system fans are pulse width
modulated fans. Redundant cooling is supported with one fan failing at a time.
4.13 34BCabling
R810 cabling incorporates service loops to allow the upper front chassis to translate forward for
memory access.
Cables for R810 platform include:
2x30 Control Panel cable
oVGA, LCD, I2C, cables for power and NMI buttons
2x6 IO power cable
oDistributes +12V to IO planar from PDB.
SATA data cable
SAS Interface cables
oSAS0 and SAS1 cables connect SAS adapter to Backplane
2x10 bundled cables
o2-wire SATA device power cable
o5-wire USB data cable
o2x7 Backplane power cable
LCD cable
Optional cable for Internal Dual SD module
4.14 35BControl Panel/LCD
The system control panel is located on the front of the system chassis to provide user access to
buttons, display, and I/O interfaces. Features of the system control panel include:
ACPI-compliant power button with an integrated green power LED (controlled by iDRAC6)
128x20 pixel LCD panel with controls:
oTwo navigation buttons
oOne select button
oOne system ID button
Non-Maskable Interrupt (NMI) button (recessed)
Ambient temperature sensor
Two external USB 2.0 connectors (with an internal USB connector and Optional Internal SD
Module)
15-pin VGA connector

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Dell PowerEdge R810 Technical Guide 18
The LCD panel is a graphics display controlled by iDRAC6. Error codes can be sent to the display by
either iDRAC6 or BIOS.
BIOS will have the ability to enter a ―Secure Mode‖ through Setup, which will lock the Power and NMI
buttons. When in this mode, pressing either button has no effect but does not mask other sources of
NMI and power control.
The control panel board is connected to the planar via a 60-wire ribbon cable and a separate 5-wire
cable for USB signals only. The LCD plugs into the control panel through a 20-pin ZIF connector and
flex cable.
4.15 36BSecurity
4.15.1 105BCover Latch
A tooled entry latch is provided on the top of the unit to secure the top cover to the chassis as shown
in the UOpening and Closing the SystemUsection of the Hardware Owner’s Manual.
4.15.2 106BBezel
A metal bezel is mounted to the chassis front to provide the Dell ID. A lock on the bezel is used to
protect un-authorized access to system peripherals and the control panel as shown in the URemoving
the BezelUsection of the Hardware Owner’s Manual. System status on the LCD is viewable even when
the bezel is installed. The bezel is optional for R810 systems.
4.15.3 107BHard Drive
The optional front bezel of the system contains a lock. A locked bezel secures the system hard
drives.
4.15.4 108BTrusted Platform Module (TPM)
The TPM is used to generate/store keys, protect/authenticate passwords, and create/store digital
certificates. TPM can also be used to enable the BitLocker™hard drive encryption feature in Windows
Server 2008.
TPM is enabled through a BIOS option and uses HMAC-SHA1-160 for binding. A Trusted Computing
Module (TCM) version of the planar is available for use where TCM is the standard, for example, in
China.
4.15.5 109BPower Off Security
The control panel is designed such that the power switch cannot be accidentally activated. The lock
on the bezel secures the switch behind the bezel. In addition, there is a setting in the CMOS setup
that disables the power button function.
4.15.6 110BIntrusion Alert
A switch mounted on the left riser board is used to detect chassis intrusion. When the cover is
opened, the switch circuit closes to indicate intrusion to Embedded System Management (ESM). When
enabled, the software can provide notification to the customer that the cover has been opened. The
PowerEdge R810 only supports up to 5 minutes of operation with the cover off.

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Dell PowerEdge R810 Technical Guide 19
4.15.7 Secure Mode
BIOS has the ability to enter a secure boot mode via Setup. This mode includes the option to lock out
the power and NMI switches on the Control Panel or set up a system password.
4.16 37BUSB Key
An optional USB memory key installed inside your system can be used as a boot device, security key,
or mass storage device. The USB connector must be enabled by the Internal USB Port option in the
Integrated Devices screen of the System Setup program.
Figure 10. USB Port
4.17 38BBattery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the ICH10 chip.
4.18 39BField Replaceable Units (FRU)
Both planars contain a serial EEPROM to contain FRU information including Dell part number, part
revision level, and serial number. The iDRAC6 Enterprise contains a FRU EEPROM. The backplane SEP
and the power supply microcontroller are also used to store FRU data.
4.19 User Accessible Jumpers, Sockets, and Connectors
For information on user accessible jumpers, sockets, and connectors, see UJumpers and ConnectorsUin
the Hardware Owner’s Manual.