Dell EMC VNXe Series Owner's manual

EMC®VNXe™Series
VNXe3100™
Hardware Information Guide
P/N 300-012-289
REV 03

EMC VNXe3100 Hardware Information Guide
2
Copyright © 2012 EMC Corporation. All rights reserved. Published in the USA.
Published June, 2012
EMC believes the information in this publication is accurate as of its publication date. The information is subject to change without
notice.
The information in this publication is provided as is. EMC Corporation makes no representations or warranties of any kind with respect
to the information in this publication, and specifically disclaims implied warranties of merchantability or fitness for a particular
purpose. Use, copying, and distribution of any EMC software described in this publication requires an applicable software license.
EMC2, EMC, and the EMC logo are registered trademarks or trademarks of EMC Corporation in the United States and other countries.
All other trademarks used herein are the property of their respective owners.
For the most up-to-date regulatory document for your product line, go to the technical documentation and advisories section on the
EMC online support website.

EMC VNXe3100 Hardware Information Guide 3
CONTENTS
Preface
Chapter 1 Overview
VNXe3100 platform..................................................................................... 11
Front view ............................................................................................. 12
Rear view .............................................................................................. 12
Hardware features................................................................................. 13
System component description................................................................... 14
Disk processor enclosure ...................................................................... 14
Front view ............................................................................................. 16
Rear view .............................................................................................. 17
Cache Protection Module ...................................................................... 35
Disk-array enclosure ............................................................................. 36
Specifications ............................................................................................. 52

4 EMC VNXe3100 Hardware Information Guide
Contents

EMC VNXe3100 Hardware Information Guide 5
Preface
As part of an effort to improve its product lines, EMC periodically releases revisions of its
software and hardware. Therefore, some functions described in this document might not
be supported by all versions of the software or hardware currently in use. The product
release notes provide the most up-to-date information on product features.
Contact your EMC representative if a product does not function properly or does not
function as described in this document.
Note: This document was accurate at publication time. New versions of this document
might be released on the EMC online support website. Check the EMC online support
website to ensure that you are using the latest version of this document.
About this book
This guide describes the EMC®VNXe3100™. The VNXe3100 platform supports a disk
processor enclosure (DPE) with one to two storage processors (SPs).
In a single SP configuration, a Cache Protection Module is provided. This Cache Protection
Module is used in the event of an outage. The data in the VNXe3100 platform write cache
is safely stored in the Flash memory of the Cache Protection Module, eliminating
time-limited battery backup and external power supplies. The Cache Protection Module
capacity is 1 GB.
In the VNXe3100 platform, the DPE uses a 12 drive, 3.5-inch disk 2U enclosure. The DAEs
in the VNXe3100 platform use either a 12 drive, 3.5-inch disk 2U enclosure or a 25 drive,
2.5-inch disk 2U enclosure (DAE5S).
Note: The 2U 25, (2.5-inch) disk drive DAE is only supported when you have VNXe
Operating Environment (OE) software version 2.3.x and above installed.
In a dual SP configuration, a 2U, 12 drive (3.5-inch) DPE and DAE can support up to seven
2U, 12 drive (3.5-inch) DAEs, thus supporting a maximum of 96 disk drives
. In a dual SP
configuration, a 2U, 12 drive (3.5-inch) DPE with a 2U, 25 drive (2.5-inch) DAE and a 2U,
12 drive (3.5-inch) DAE, the configuration can support up to three 2U, 25 drive (2.5-inch)
DAEs and one 2U, 12 drive (3.5-inch) DAE, thus supporting a maximum of 99 disk drives.
In a single SP configuration, a 2U, 12 drive (3.5-inch) DPE and DAE can support a
maximum of three 2U, 12 drive (3.5-inch) DAEs or 48 disk drives. In a single SP
configuration, a 2U, 12 drive (3.5-inch) DPE with a 2U, 25 drive (2.5-inch) DAE and a 2U,
12 drive (3.5-inch) DAE, thus supporting a maximum 49 disk drives.

6 EMC VNXe3100 Hardware Information Guide
Preface
IMPORTANT
In a dual SP system, when calculating the number of drives for your VNXe3100 platform,
the DPE is included in the total drive slot quantity of from 96 to 99 drives in a dual SP
system. If the total drive slot quantity exceeds from 96 to 99, you will not be able to add
another DAE.
In a single SP system, when calculating the number of drives for your VNXe3100 platform,
the DPE is included in the total drive slot quantity of from 48 to 49 drives in a single SP
system. If the total drive slot quantity exceeds from 48 to 49, you will not be able to add
another DAE.
The “Disk-array enclosure” section on page 36 provides details about the number of DAEs
supported in a VNXe3100 platform.
This guide is available online at www.emc.com/vnxesupport. On this page, click
Documentation. On the page that appears, under VNXe Series, click VNXe3100. On the
next page that appears, under Content type, click Manuals and Guides. On the right side
of the page that appears, a list of all the VNXe3100 product guides will appear. Select the
VNXe3100 Hardware Information Guide from this list. The guide and other related VNX
Series guides can be downloaded from here.
Revision history
The following table presents the revision history of this document:
Revision Date Description
A03 June, 2012 Following items were changed in this
release:
• First release of the
VNXe3100 Hardware
Information Guide
in the new EMC look
and feel
• Added information about the “Two-port
10-Gb/s copper Ethernet I/O personality
module” on page 28
• Added information about the “2U, 25
(2.5-inch) DAE” on page 45
A02 May, 2011 Added information to Table 3 on page 24.
A01 February, 2011 First release of the
VNXe3100 Hardware
Information Guide

EMC VNXe3100 Hardware Information Guide 7
Preface
How this document is organized
The major sections of this guide are listed in the following table.
Audience
This document is designed for personnel who install, configure, and maintain the
VNXe3100. To use this hardware publication, you should be familiar with digital storage
and networking equipment. Within the document an overview of the architecture,
features, and components of the VNXe3100 platform are presented. The specific aspects
of the VNXe3100 platform and its major components include the front and rear LED
indicators and the connectors on the DPE and the DAE.
Related documentation
The following EMC publication provides additional information:
◆ EMC VNXe3100 System Installation Guide
This guide is available online at www.emc.com/vnxesupport. On this page, click
Documentation. On the page that appears, under VNXe Series, click VNXe3100. On the
next page that appears, under Content type, click Manuals and Guides. On the right side
of the page that appears, a list of all the VNXe3100 product guides will appear. Select the
guide you are interested in from this list.
Title Description
“Overview” on page 11 Describes the software and hardware features of a typical
VNXe3100 along with a front view example of the VNXe3100.
“VNXe3100 platform” on
page 11
Describes and shows the front and rear views of a typical
VNXe3100.
“System component
description” on page 14
Provides a description of the components that comprise a
VNXe3100. Along with a description, illustrations of each
component are also shown.
“Disk processor enclosure” on
page 14
Describes and illustrates the front and rear views of a DPE and
the components that comprise the DPE.
“Cache Protection Module” on
page 35
Describes and illustrates the Cache Protection Module.
“Disk-array enclosure” on
page 36
Describes and illustrates the two types of DAEs available for the
VNXe3100.

8 EMC VNXe3100 Hardware Information Guide
Preface
Conventions used in this document
EMC uses the following conventions for special notices:

DANGER indicates a hazardous situation which, if not avoided, will result in death or
serious injury.

WARNING indicates a hazardous situation which, if not avoided, could result in death or
serious injury.

CAUTION, used with the safety alert symbol, indicates a hazardous situation which, if not
avoided, could result in minor or moderate injury.

NOTICE is used to address practices not related to personal injury.
Note: A note presents information that is important, but not hazard-related.
IMPORTANT
An important notice contains information essential to software or hardware operation.
Typographical conventions
EMC uses the following type style conventions in this document:
Normal Used in running (nonprocedural) text for:
• Names of interface elements (such as names of windows, dialog boxes,
buttons, fields, and menus)
• Names of resources, attributes, pools, Boolean expressions, buttons,
DQL statements, keywords, clauses, environment variables, functions,
utilities
• URLs, pathnames, filenames, directory names, computer names,
filenames, links, groups, service keys, file systems, notifications
Bold Used in running (nonprocedural) text for:
• Names of commands, daemons, options, programs, processes,
services, applications, utilities, kernels, notifications, system calls,
man pages
Used in procedures for:
• Names of interface elements (such as names of windows, dialog boxes,
buttons, fields, and menus)
• What user specifically selects, clicks, presses, or types
Italic
Used in all text (including procedures) for:
• Full titles of publications referenced in text
• Emphasis (for example a new term)
•Variables

EMC VNXe3100 Hardware Information Guide 9
Preface
Where to get help
EMC support, product, and licensing information can be obtained as follows.
Product information — For documentation, release notes, software updates, or for
information about EMC products, licensing, and service, go to the EMC Online Support
website (registration required) at:
http://Powerlink.EMC.com
Technical support — For technical support, go to
EMC Online Support and choose Support. On the Support page, you will see several
options, including one for making a service request. Note that to open a service request,
you must have a valid support agreement. Please contact your EMC sales representative
for details about obtaining a valid support agreement or with questions about your
account.
Your comments
Your suggestions will help us continue to improve the accuracy, organization, and overall
quality of the user publications. Please send your opinion of this document to:
[email protected]
If you have issues, comments, or questions about specific information or procedures,
please include the title and, if available, the part number, the revision (for example, A01),
the page numbers, and any other details that will help us locate the subject you are
addressing.
Courier Used for:
• System output, such as an error message or script
• URLs, complete paths, filenames, prompts, and syntax when shown
outside of running text
Courier bold Used for:
• Specific user input (such as commands)
Courier italic Used in procedures for:
• Variables on command line
• User input variables
< > Angle brackets enclose parameter or variable values supplied by the user
[ ] Square brackets enclose optional values
|Vertical bar indicates alternate selections - the bar means “or”
{ } Braces indicate content that you must specify (that is, x or y or z)
... Ellipses indicate nonessential information omitted from the example

10 EMC VNXe3100 Hardware Information Guide
Preface

Overview 11
Overview
The VNXe Series provides an integrated storage platform for small and medium
businesses as well as remote offices and departments in larger enterprise businesses.
Providing significant advancements in efficiency and simplicity, the VNXe Series facilitates
complete storage consolidation with advanced file and block functionality as well as a
simple, application-driven approach to managing shared storage.
Supporting high availability through the use of redundant components—power supplies,
fans, storage processors—as well as dynamic failover and failback, the VNXe Series also
supports the ability to upgrade system software or hardware while the VNXe platform is
running1.
The VNXe3100 platform is one of three models that make up the VNXe Series. This
platform is ideal for businesses with physical server infrastructures, as well as those
making the move to server virtualization to drive consolidation and greater efficiency. The
VNXe3100 platform also shares a comprehensive set of features including exceptional
capacity utilization, data protection and availability solutions, and advanced support
capabilities. Figure 1 shows an example of the VNXe3100 platform with a front bezel.
Figure 1 Example of a VNXe3100 platform with front bezel
VNXe3100 platform
The VNXe3100 platform is available in two versions:
◆A 2U DPE with a single storage processor (SP A) and a Cache Protection Module
◆A 2U DPE with two storage processors (SP A and B)
This section shows an example of the front and rear views of a VNXe3100 platform with a
single SP and Cache Protection Module as well as a dual SP version.
1. Applies to a dual SP platform.
VNX-000098

12 EMC VNXe3100 Hardware Information Guide
Overview
Note: A fully configured dual SP VNXe3100 platform includes up to seven DAEs supporting
a maximum of from 96 to 99 disk drives depending on the type and mix of the DAEs used
(for configuration information, see “DPE and DAE configuration rules” on page 37).
Front view
Figure 2 shows an example of the front view of the VNXe3100 platform having a 2U, 12
(3.5-inch) disk drive DPE.
Figure 2 Example of a VNXe3100 platform with a 2U, 12 (3.5-inch) disk drive DPE (front view)
Rear view
Looking from left to right, Figure 3 shows an example of the rear view of a VNXe3100
platform having a 2U DPE with a Cache Protection Module and a single storage processor
(SP A), respectively.
Figure 3 Example of a VNXe3100 2U DPE with a Cache Protection Module and a single SP,
respectively (rear view)
Looking from left to right, Figure 4 shows an example of the rear view of a VNXe3100
platform having a 2U DPE with two storage processors (SP B and A), respectively.
Figure 4 Example of a VNXe3100 2U DPE with two SPs (rear view)
Installation
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
VNX-000080
1
1
1
1 GBE
01
X4
6Gb SAS
6Gb SAS
23
1
0
e3e0 e1 e2
1 GbE
VNX-000088
1
1 GBE
01
X4
6Gb SAS
6Gb SAS
23
1
0
e3e0 e1 e2
1 GbE
1
1 GBE
01
X4
6Gb SAS
6Gb SAS
23
1
0
e3e0 e1 e2
1 GbE
VNX-000084

VNXe3100 platform 13
Overview
Hardware features
Contained in a 2U platform architecture, the VNXe3100 platform weighs approximately
60.5 lb (26.4 kg). It measures 3.5 inches high x 17.5 inches wide x 19.75 inches deep
(8.89 cm x 44.45 cm x 50.16 cm). Between the front and rear of the enclosure, a midplane
distributes power and signals to all the enclosure components. The VNXe3100 platform
2U DPE SPs and the power supply modules plug directly into the midplane connections.
Note: The previously mentioned dimensions are approximate and do not include a rack or
cabinet enclosure.
“Specifications” on page 52 provides the physical, environmental, and power details that
make up the VNXe3100 platform.
Configured for AC-input power, the VNXe3100 platform includes the following hardware
features:
◆One 2U DPE:
• On the front of the 2U DPE, two types of disk drives are supported in one type of
disk drive carrier; a 2U, 12 (3.5-inch) disk drive carrier. The disk drives supported
are Serial attached-SCSI (SAS)
and near-line SAS (NL-SAS). For more information
about the supported disk drives for the VNXe3100, refer to the
EMC
®
VNXe™
Series Storage Systems Disk and OE Matrix
document.
• On the rear of the 2U DPE, a single SP (SP A) with a hot-swappable 1-GB Cache
Protection Module or a dual SP (A and B) is supported; each SP consists of:
– A CPU module with an Intel Xeon Dual Core 1.73-GHz processor with two
Double Data Rate Three (DDR3) synchronous dynamic RAM (SDRAM) slots
supporting 4 GB of memory per SP; an optional 8-GB memory upgrade for a
dual SP configurations is available
Note: The SDRAM or memory modules reside on the SP printed circuit board
(motherboard) within the SP. To replace or upgrade a memory module, you
must first remove the SP from the DPE, and then remove the top cover on the SP
to gain access to the SP components. The
Replacing a VNXe3100 Memory
Module
document provides more information.
– One four-port 1-Gb/s copper Ethernet I/O personality module
Note: A two-port 10-Gb/s copper Ethernet I/O personality module is available
as an upgrade. However, this I/O personality module is only supported in a
dual SP configuration.
– Two 1-GbE iSCSI (host IP connect) ports
– Two integrated four lane 6-Gb/s SAS x4 ports (labeled 6GB 0 x4 and 1 x4);
supported speeds are 1.5, 3, and 6 Gb/s
Note: 6GB SAS port 1 x4 is not used at this time.
– One RS-232/EIA 232 serial (up to 115 K baud) service laptop (micro DB-9) port
– One RS-232/EIA 232 serial standby power supply (SPS) management (micro
DB-9) port
– One 10/100/1000 LAN management (RJ-45) port

14 EMC VNXe3100 Hardware Information Guide
Overview
– One 10/100/1000 LAN service (RJ-45) port (not used)
–OneUSBport(notused)
– One power supply module
◆Either a 2U, 12 (3.5-inch) disk drive DAE or a 2U, 25 (2.5-inch) disk drive DAE is
supported in several configurations (for more DPE/DAE configuration information, see
Table 16 on page 37 or Table 17 on page 37)
Note: The 2U 25, (2.5-inch) disk drive DAE is only supported when you have VNXe
Operating Environment (OE) software version 2.3.x and above installed.
◆Any required cables including a serial mini-DB-9 cable.
◆Mounting rails with hardware
◆Front bezel with VNXe3100 badge
System component description
This section describes the VNXe3100 platform components. These details include
illustrations and descriptions of the front and rear connectors and the LED indicators.
Note: In the following sections, the illustrations and corresponding tables describe these
individual components. These descriptions are for illustrative purposes only.
Disk processor enclosure
As previously described, the VNXe3100 platform consists of a 2U disk processor
enclosure (DPE). Up to seven 2U, 12 (3.5-inch) disk drive DAEs with a maximum of 99 disk
drives2in a dual SP configuration.
IMPORTANT
In a dual SP system, when calculating the number of drives for your VNXe3100 platform,
the DPE is included in the total drive slot quantity of from 96 to 99 drives. If the total drive
slot quantity exceeds from 96 to 99, you will not be able to add another DAE.
In a single SP system, when calculating the number of drives for your VNXe3100 platform,
the DPE is included in the total drive slot quantity of from 48 to 49 drives. If the total drive
slot quantity exceeds from 48 to 49, you will not be able to add another DAE.
“Disk-array enclosure” on page 36 provides details about the available DAEs for the
VNXe3100 platform.
Each VNXe3100 2U DPE consists of the following components:
◆Drive carrier
◆Disk drives
2. In a single SP configuration, the VNXe3100 platform can support up to three DAEs or a maximum
of 49 disk drives.

System component description 15
Overview
◆Midplane
◆Storage processor (SP)
◆Power supply module
◆Cache Protection Module (single SP configuration only)
◆EMI shielding
Drive carrier
Disk drive carriers are plastic assemblies that provide smooth, reliable contact with the
enclosure slot guides and midplane connectors. Each carrier has a handle with a latch and
spring clips. The latch holds the disk drive in place to ensure proper connection with the
midplane. The “Front view” section on page 16 shows the disk drive ready LEDs that are
integrated into the chassis that the carrier is in. These LEDs primarily show the disk drive
readiness as well as activity.
Disk drives
You can visually distinguish between drive types by their different latch and handle
mechanisms and by the type, capacity, and speed labels on each drive. You can add or
remove a disk drive while the DPE is powered up, but you should exercise special care
when removing drives while they are in use. Disk drives are extremely sensitive electronic
components. For more information about the supported disk drives for the VNXe3100,
refer to the
EMC
®
VNXe™ Series Storage Systems Disk and OE Matrix document.
Midplane
A midplane separates the front-facing disk drives from the rear-facing SPs. It distributes
power and signals to all components in the enclosure. SPs and disk drives plug directly
into the midplane.
Storage processor
The storage processor (SP) is the intelligent component of the disk processor enclosure
(DPE). Basically, it acts as the control center. Each SP includes status LEDs, an I/O
personality module, LAN ports, and so on. Two latches on the SP lock it into place to
ensure proper connection. The “SP” section on page 19 provides more information about
the location and description of the connectors and LEDs.
Power supply module
When viewed from the rear, the power supply module is located on the top, left and right
of the DPE. This module is an auto-ranging, power-factor-corrected, multi-output, off-line
converter with its own line cord. Each power supply module includes status LEDs. A latch
on the power supply module locks it into place to ensure proper connection. The “AC
power supply/cooling module” section on page 21 provides more information about the
location and description of the connectors and LEDs.
Cache Protection Module
In a single SP configuration, the Cache Protection Module provides mirrored VNXe
Operating Environment (OE) cache memory that is not possible with a single SP. The Cache
Protection Module capacity is 1 GB.

16 EMC VNXe3100 Hardware Information Guide
Overview
In the event of a power failure, the backup battery in the Cache Protection Module
provides the power necessary to write the entire contents of the mirrored cache memory to
non-volatile storage or Flash memory in the Cache Protection Module. The “Cache
Protection Module” section on page 35 provides move information about the location and
description of the connectors and LEDs.
EMI shielding
EMI compliance requires a properly installed electromagnetic interference (EMI) shield in
front of the DPE disk drives. The VNXe3100 platform requires a front bezel that has a
locking latch and integrated EMI shield. You must remove the bezel/shield to remove and
install disk drives.
Front view
On the front of the VNXe3100 platform, the 2U, 12 (3.5-inch) disk drive DPE carrier
includes the following:
◆3.5-inch 6-Gb/s SAS or 6-Gb/s NL-SAS disk drives (hot-swappable)3
◆Status LEDs
Note: In the following sections, the illustrations and corresponding tables describe these
individual components. These descriptions are for illustrative purposes only.
Figure 5 shows the location of these disk drives and the status LEDs.
Figure 5 VNXe3100 platform DPE (front view)
3. You can add or remove a disk drive while the DPE is powered up, but you should exercise special
care when removing drives while they are in use. Disk drives are extremely sensitive electronic
components.
13.5-inch SAS drives1
1. The VNXe3100 platform also supports 6-Gb/s NL-SAS drives. For more information about the disk drives
supported in the VNXe3100, refer to the
EMC
®
VNXe™ Series Storage Systems Disk and OE Matrix
document.
3Disk drive ready/activity LED (blue)
2DPE power on LED (blue)
Installation
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
12
3VNX-000090

System component description 17
Overview
Table 1 describes the VNXe3100 platform 2U DPE and the disk drive status LEDs.
Rear view
On the rear, the VNXe3100 platform includes one of two versions of the following
hardware components:
◆One 2U DPE with a single storage processor (SP A):
•OneSP
• Two power supply modules
• One Cache Protection Module; 1 GB
◆One 2U DPE with two storage processors (SP A and B):
•TwoSPs
• Two power supply modules
Note: In the following sections, the illustrations and corresponding tables describe these
individual components. These descriptions are for illustrative purposes only.
Table 1 VNXe3100 platform 2U, 12 (3.5-inch) DPE and disk drive LEDs
LED Color State Description
DPE power (location 2) Blue On Powering and powered up
— Off Powered down
Disk drive ready/activity
(location 3)
Note: The disk drive LED (a
left or right triangle symbol)
points to the disk drive that
it refers to.
Blue On Powering and powered up
Blinking, mostly
on
Disk drive is on with I/O activity
Blinking at
constant rate
Disk drive is spinning up or down
normally
Blinking, mostly
off
Disk drive is powered up but not
spinning
Note: This is a normal part of the
spin-up sequence, occurring
during the spin-up delay of a
slot.
— Off Disk drive is powered down

18 EMC VNXe3100 Hardware Information Guide
Overview
Figure 6 shows an example of the rear view of a 2U DPE with a Cache Protection Module
and a single storage processor (SP A), respectively.
Figure 6 Example of a VNXe3100 platform 2U DPE with a Cache Protection Module and a single SP,
respectively (rear view)
Figure 7 shows an example of the rear view of a 2U DPE with two storage processors (SP B
and SP A), respectively.
Figure 7 Example of a VNXe3100 platform 2U DPE with two SPs (rear view)
1DPE 3SP (for a closer view, see Figure 8 on
page 20)
2Power supply module (for a closer view,
see Figure 9 on page 21)
4Cache Protection Module (for a closer
view, see Figure 23 on page 35)
12
1
1
1
1 GBE
01
X4
6Gb SAS
6Gb SAS
23
1
0
e3e0 e1 e2
1 GbE
43VNX-000086
1DPE 3SP A (for a closer view, see Figure 8 on
page 20)
2Power supply module (for a closer view,
see Figure 9 on page 21)
1
1 GBE
01
X4
6Gb SAS
6Gb SAS
23
1
0
e3e0 e1 e2
1 GbE
1
1 GBE
01
X4
6Gb SAS
6Gb SAS
23
1
0
e3e0 e1 e2
1 GbE
12
3VNX-000085

System component description 19
Overview
SP
Viewing from the rear of the DPE, each SP (B and A), respectively, consists of connectors,
status LEDs, latch handles, and so on.
◆AC power supply module:
• Power in (recessed) connector (plug)
• Power supply status LEDs (power on and fault)
• Power supply latch handle
◆SP B and A:
•USB
• Two 1-GbE iSCSI (host IP connect) ports
• Two 6-Gb/s SAS x4 ports (labeled 6Gb SAS 0 x4 and 1 x4)
Note: 6Gb SAS port 1 x4 is not used at this time.
• Optional four-port 1-Gb/s copper Ethernet I/O personality module
• Two (RJ-45) LAN connectors (labeled with a network management symbol and a
wrench symbol)
Note: The RJ-45 LAN connector with a wrench symbol is not used at this time.
• Two (micro DB-9) RS-232/EIA connectors (labeled with a battery symbol and a
wrench symbol)
Note: The DB-9 connector with a battery symbol is not used at this time.
•SPstatusLEDs
• RS-232/EIA
• SP latch handles (top of SP left and right)
Figure 8 on page 20 shows the location of these SP components.

20 EMC VNXe3100 Hardware Information Guide
Overview
Figure 8 Example of SP components (rear view)
1AC power in connector (recessed plug) 10 SP unsafe to remove LED (white)
2RS-232/EIA (micro DB-9) connector
(labeled with a wrench symbol)
11 SP power LED (green)
3Power supply module 12 SP status/fault LED (amber/blue1)
1. The SP fault status LED (amber or blue), flashes at different rates, depending on the current status of the SP.
In a normal, operational state, it will be off.
4Power supply latch handle (top, middle) 13 1. Shows an example of a four-port 1-Gb/s
copper Ethernet I/O personality module
(labeled e0, e1, e2, and e3)2
2. Also available in a dual SP configuration is the two-port 10-Gb/s copper Ethernet I/O personality module
(with the ports labeled e0 and e1).
5Power supply module status LEDs 14 Service LAN (RJ-45) port (labeled with a
wrench symbol); not used at this time
6SP latch handle (middle, left and right) 15 Management LAN (RJ-45) port (labeled
with a network management symbol)
7Two 1-GbE iSCSI (host IP connect) ports
(labeled 2and 3)
16 RS-232/EIA (micro DB-9) connector
(labeled with a battery symbol); not used
at this time
8NMI3(password reset) push button
3. NMI = non-maskable interrupt
17 Two 6-Gb/s SAS ports (labeled 6Gb SAS
0x4and 1 x4); 1 x4 is not used
9CRU fault LED (amber)4
4. CRU fault LED lights amber when an internal CRU is faulted.
18 SP CPU
1 GBE
01
X4
6Gb SAS
6Gb SAS
23
1
0
e3e0 e1 e2
1 GbE
7
10
11
12
16
17 9
541 3
1
14
15
2
18
6
13
VNX-000082
8