Delta Electronics Delphi DNT04 User manual

Delphi DNT04, Non-Isolated Point of Load
DC/DC Power Modules: 2.4~5.5Vin, 0.75~3.63Vo, 3A out
The Delphi Series DNT04, 2.4-5.5V input, single output, non-isolated
Point of Load DC/DC converters are the latest offering from a world
leader in power systems technology and manufacturing —Delta
Electronics, Inc. The DNT04 series provides a programmable outpu
t
voltage from 0.75V to 3.63V via external resistors. This product family is
available in surface mount or SIP package and provides up to 3A o
f
output current in an industry standard footprint. With creative design
technology and optimization of component placement, these converters
possess outstanding electrical and thermal performance, as well as
extremely high reliability under highly stressful operating conditions.
The DNT04, 3A modules have excellent thermal performance and can
provide full output current at up to 85℃ambient temperature with no
airflow.
OPTIONS
 Positive On/Off logic
 SMD or SIP package
APPLICATIONS
 Telecom/DataCom
 Distributed power architectures
 Servers and workstations
 LAN/WAN applications
 Data processing applications
FEATURES
 High Efficiency: 94%@ 5Vin, 3.3V/3A out
 Small size and low profile:
0.80” x 0.45” x 0.27” (SMD)
0.90” x 0.40” x 0.25” (SIP)
 Standard footprint and pinout
 Resistor-based trim
 Output voltage programmable from
0.75V to 3.63V via external resistors
 Pre-bias startup
 No minimum load required
 Fixed frequency operation
 Input UVLO, OCP
 Remote ON/OFF
 ISO 9001, TL 9000, ISO 14001, QS 9000,
OHSAS 18001 certified manufacturing
facility
 UL/cUL 60950 (US & Canada) Recognized,
and TUV (EN60950)- pending
 CE mark meets 73/23/EEC and 93/68/EEC-
pending
PRELIMINARY DATASHEET
DS_DNT04SIP03_09262007

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TECHNICAL SPECIFICATIONS
(TA = 25°C, airflow rate = 300 LFM, Vin = 2.4Vdc and 5.5Vdc, nominal Vout unless otherwise noted.)
PARAMETER NOTES and CONDITIONS DNT04S0A0R03NFA
Min. Typ. Max. Units
ABSOLUTE MAXIMUM RATINGS
Input Voltage (Continuous) 0 5.8 Vdc
Operating Temperature Refer to Figure 32 for measuring point -40 125 °C
Storage Temperature -55 125 °C
INPUT CHARACTERISTICS
Operating Input Voltage Vo ≦Vin
–
0.5V 2.4 5.5 V
Input Under-Voltage Lockout
Turn-On Voltage Threshold 2.1 V
Turn-Off Voltage Threshold 2.0 V
Maximum Input Current Vin=4.5V Vo=3.3V, Io=Io,max 2.5 A
No-Load Input Current 30 45 mA
Off Converter Input Current 1 m
A
Inrush Transient Vin=2.4V to 5.5V, Io=Io,min to Io,max 0.1 A2S
Recommended Input Fuse TBD A
OUTPUT CHARACTERISTICS
Output Voltage Set Point Vin=5V, Io=Io, max -2.0 Vo,set +2.0 % Vo,set
Output Voltage Adjustable Range 0.7525 3.63 V
Output Voltage Regulation
Over Line Vin=2.4V to 5.5V 0.3 % Vo,set
Over Load Io=Io,min to Io,max 0.4 % Vo,set
Over Temperature Ta=-40℃to 85℃0.4 % Vo,set
Total Output Voltage Range Over sample load, line and temperature -3.0 +3.0 % Vo,set
Output Voltage Ripple and Noise 5Hz to 20MHz bandwidth
Peak-to-Peak Full Load, 1µF ceramic, 10µF tantalum 25 50 mV
RMS Full Load, 1µF ceramic, 10µF tantalum 10 15 mV
Output Current Range 0 3 A
Output Voltage Over-shoot at Start-up 5 % Vo,set
Output DC Current-Limit Inception 220 % Io
Output Short-Circuit Current (Hiccup Mode) Io,s/c 3 Adc (rms)
DYNAMIC CHARACTERISTICS
Dynamic Load Response 10µF Tantalum & 1µF Ceramic load cap, 2.5A/µs
Positive Step Change in Output Current 50% Io, max to 100% Io, max 220 mV
Negative Step Change in Output Current 100% Io, max to 50% Io, max 220 mV
Setting Time to 10% of Peak Devitation 25 µs
Turn-On Transient Io=Io.max
Start-Up Time, From On/Off Control Von/off, Vo=10% of Vo,set 7 ms
Start-Up Time, From Input Vin=Vin,min, Vo=10% of Vo,set 7 ms
Maximum Output Startup Capacitive Load Full load; ESR ≧1mΩ1000 µF
Full load; ESR ≧10mΩ3000 µF
EFFICIENCY
Vo=3.3V Vin=5V, 100% Load 94.0 %
Vo=2.5V Vin=5V, 100% Load 92.5 %
Vo=1.8V Vin=5V, 100% Load 90.0 %
Vo=1.5V Vin=5V, 100% Load 88.5 %
Vo=1.2V Vin=5V, 100% Load 87.0 %
Vo=0.75V Vin=5V, 100% Load 81.5 %
FEATURE CHARACTERISTICS
Switching Frequency 300 kHz
ON/OFF Control, (Negative logic)
Logic Low Voltage Module On, Von/off -0.2 0.3 V
Logic High Voltage Module Off, Von/off 2.5 Vin.max V
Logic Low Current Module On, Ion/off 10 µA
Logic High Current Module Off, Ion/off 0.2 1 mA
GENERAL SPECIFICATIONS
MTBF Io=100% of Io, max; Ta=25°C TBD M hours
Weight 2.3 grams

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ELECTRICAL CHARACTERISTICS CURVES
Figure 1: Converter efficiency vs. output current (5Vin/3.3Vout) Figure 2: Converter efficiency vs. output current (5Vin/2.5Vout)
Figure 3: Converter efficiency vs. output current (5Vin/1.8Vout) Figure 4: Converter efficiency vs. output current (5Vin/1.5Vout)
Figure 5: Converter efficiency vs. output current (5Vin/1.2Vout) Figure 6: Converter efficiency vs. output current (5Vin/0.75Vout)

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ELECTRICAL CHARACTERISTICS CURVES (CON.)
Figure 7: Output ripple & noise at 5Vin, 3.3V/3A out, 50mV/div Figure 8: Output ripple & noise at 5Vin, 2.5V/3A out, 50mV/div
Figure 9: Output ripple & noise at 5Vin, 1.8V/3A out, 50mV/div Figure 10: Output ripple & noise at 5Vin, 1.5V/3A out, 50mV/div
Figure 11: Output ripple & noise at 5Vin, 1.2V/3A out, 50mV/div Figure 12: Output ripple & noise at 5Vin, 0.75V/3A out, 50mV/div

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ELECTRICAL CHARACTERISTICS CURVES (CON.)
Figure 13: Turn on delay time at 5Vin, 3.3V/3A out
Top: Vout, 2V/div, Bottom: Vin, 5V/div; 2mS/div Figure 14: Turn on delay time at 5Vin, 2.5V/3A out
Top: Vout, 2V/div, Bottom: Vin, 5V/div; 2mS/div
Figure 15: Turn on delay time at 5Vin, 1.8V/3A out
Top: Vout, 1V/div, Bottom: Vin, 5V/div; 2mS/div
Figure 16: Turn on delay time at 5Vin, 1.5V/3A out
Top: Vout ,1V/div, Bottom: 5V/div; 2mS/div
Figure 17: Turn on delay time at 5Vin, 1.2V/3A out
Top: Vout , 1V/div, Bottom: Vin, 5V/div; 2mS/div Figure 18: Turn on delay time at 5Vin, 0.75V/3A out Top: Vout, 0.5V/div, Bottom: Vin ,5V/div; 2mS/div

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ELECTRICAL CHARACTERISTICS CURVES
Figure 19: Typical transient response to step load change at
2.5A/µS from 100% to 50% of Io, max at 5Vin, 3.3Vout
(Cout = 1uF ceramic, 10µF tantalum), 0.1V/div
Figure 20: Typical transient response to step load change at
2.5A/µS from 50% to 100% of Io, max at 5Vin, 3.3Vout
(Cout =1uF ceramic, 10µF tantalum), 0.1V/div
Figure 21: Output short circuit current 5Vin, 0.75Vout
20A/div,10mS/div
Figure 22:Turn on with Prebias 5Vin, 3.3V/0A out, Vbias =1.0Vdc
2V/div,10mS/div
Vbias=1V

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DESIGN CONSIDERATIONS
Input Source Impedance
The power module should be connected to a low
ac-impedance input source. Highly inductive source
impedances can affect the stability of the module. An
input capacitance must be placed close to the modules
input pins to filter ripple current and ensure module
stability in the presence of inductive traces that supply
the input voltage to the module.
Safety Considerations
For safety-agency approval the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standards.
For the converter output to be considered meeting the
requirements of safety extra-low voltage (SELV), the
input must meet SELV requirements. The power module
has extra-low voltage (ELV) outputs when all inputs are
ELV.
The input to these units is to be provided with a
adequate time-delay fuse in the ungrounded lead.
TEST CONFIGURATIONS
V I (+)
V
I (-)
BATTERY
2
100uF
Tantalum
L
TO OSCILLOSCOPE
Note: Input reflected-ripple current is measured with a
simulated source inductance. Current is measured at the input
of the module.
Figure 23: Input reflected-ripple test setup
Vo
GND
COPPER STRIP
10uF
tantalum 1uF ceramic SCOPE Resistive
Load
Note: Use a 10µF tantalum and 1µF capacitor. Scope
measurement should be made using a BNC connector.
Figure 24: Peak-peak output noise and startup transient
measurement test setup.
SUPPLY
I
I
V I Vo
GND
Io
LOAD
CONTACT AND
DISTRIBUTION LOSSES
CONTACT RESISTANCE
Figure 25: Output voltage and efficiency measurement test
setup
Note: All measurements are taken at the module terminals.
When the module is not soldered (via socket), place
Kelvin connections at module terminals to avoid
measurement errors due to contact resistance.
%100)( ×
×
×
=IiVi IoVo
η

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FEATURES DESCRIPTIONS (CON.)
Over-Temperature Protection
The over-temperature protection consists of circuitry that
provides protection from thermal damage. If the
temperature exceeds the over-temperature threshold
the module will shut down. The module will try to restart
after shutdown. If the over-temperature condition still
exists during restart, the module will shut down again.
This restart trial will continue until the temperature is
within specification.
OutputVoltageProgramming
The output voltage of the DNT can be programmed to any
voltage between 0.75Vdc and 3.3Vdc by connecting one
resistor (shown as Rtrim in Figure 28) between the TRIM
and GND pins of the module. Without this external
resistor, the output voltage of the module is 0.7525 Vdc.
To calculate the value of the resistor Rtrim for a particular
output voltage Vo, please use the following equation:
Ω
⎥
⎦
⎤
⎢
⎣
⎡−
−
=5110
7525.0
21070
Vo
Rtrim
For example, to program the output voltage of the DNS
module to 1.8Vdc, Rtrim is calculated as follows:
Ω=Ω
⎥
⎦
⎤
⎢
⎣
⎡−
−
=KRtrim 155110
7525.08.1 21070
DNT can also be programmed by apply a voltage
between the TRIM and GND pins (Figure 29). The
following equation can be used to determine the value of
Vtrim needed for a desired output voltage Vo:
()
7525.01698.07.0 −×
−
=
VoVtrim
For example, to program the output voltage of a DNT
module to 3.3 Vdc, Vtrim is calculated as follows
()
VVtrim 267.07525.03.31698.07.0
=
−×
−
=
Vo
TRIM
GND
RLoad
Rtrim
Figure28: Circuit configuration for programming output voltage
using an external resistor
FEATURES DESCRIPTIONS
Remote On/Off
The DNT series power modules have an On/Off pin for
remote On/Off operation. Both positive and negative
On/Off logic options are available in the DNT series
power modules.
For positive logic module, connect an open collector
(NPN) transistor or open drain (N channel) MOSFET
between the On/Off pin and the GND pin (see figure 26).
Positive logic On/Off signal turns the module ON during
the logic high and turns the module OFF during the logic
low. When the positive On/Off function is not used, leave
the pin floating or tie to Vin (module will be On).
For negative logic module, the On/Off pin is pulled high
with an external pull-up resistor (see figure 27). Negative
logic On/Off signal turns the module OFF during logic
high and turns the module ON during logic low. If the
negative On/Off function is not used, leave the pin
floating or tie to GND. (module will be On)
Vo
On/Off
Vin
GND
Q1
RL
I
ON/OFF
Figure 26: Positive remote On/Off implementation
Vo
On/Off
Vin
GND
Q1
RL
Rpull-
up
I
ON/OFF
Figure 27: Negative remote On/Off implementation
Over-Current Protection
To provide protection in an output over load fault
condition, the unit is equipped with internal over-current
protection. When the over-current protection is
triggered, the unit enters hiccup mode. The units operate
normall
y
once the fault condition is removed.

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Figure 30: Circuit configuration for output voltage margining
Vo
On/Off
Vin
GND
Trim
Q2
Q1
Rmargin-up
Rmargin-down
Rtrim
Vo
TRIM
GND
RLoad
Vtrim
+
_
Figure 29: Circuit Configuration for programming output voltage
using external voltage source
The amount of power delivered by the module is the
voltage at the output terminals multiplied by the output
current. When using the trim feature, the output voltage of
the module can be increased, which at the same output
current would increase the power output of the module.
Care should be taken to ensure that the maximum output
power of the module must not exceed the maximum rated
power (Vo.set x Io.max ≤P max).
Voltage Margining
Output voltage margining can be implemented in the DNT
modules by connecting a resistor, R margin-up, from the Trim
pin to the ground pin for margining-up the output voltage
and by connecting a resistor, Rmargin-down, from the Trim pin
to the output pin for margining-down. Figure 30 shows the
circuit configuration for output voltage margining. If
unused, leave the trim pin unconnected.
A
calculation tool
is available from the evaluation procedure which
computes the values of R margin-up and Rmargin-down for a
specific output voltage and margin percentage.
FEATURE DESCRIPTIONS (CON.)

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Note: Wind Tunnel Test Setup Figure Dimensions are in millimeters and (Inches)
Figure 31: Wind tunnel test setup
THERMAL CONSIDERATIONS
Thermal management is an important part of the system
design. To ensure proper, reliable operation, sufficient
cooling of the power module is needed over the entire
temperature range of the module. Convection cooling is
usually the dominant mode of heat transfer.
Hence, the choice of equipment to characterize the
thermal performance of the power module is a wind
tunnel.
Thermal Testing Setup
Delta’s DC/DC power modules are characterized in
heated vertical wind tunnels that simulate the thermal
environments encountered in most electronics equipment.
This type of equipment commonly uses vertically mounted
circuit cards in cabinet racks in which the power modules
are mounted.
The following figure shows the wind tunnel
characterization setup. The power module is mounted on
a test PWB and is vertically positioned within the wind
tunnel. The height of this fan duct is constantly kept at
25.4mm (1’’).
Thermal Derating
Heat can be removed by increasing airflow over the
module. To enhance system reliability, the power module
should always be operated below the maximum operating
temperature. If the temperature exceeds the maximum
module temperature, reliability of the unit may be affected.
DNT04S0A0R03(standard) Output Current vs. Ambient Temperature and Air Velocity
@Vin=5V Vout=0.75~3.3V (Through PCB Orientation)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
25 30 35 40 45 50 55 60 65 70 75 80 85
Natural
Convection
Output Current (A)
Ambient Temperature (℃)
Figure 33: Output current vs. ambient temperature and air
velocity @ Vin=5V, Vout=0.75V~3.3V(Through PCB Orientation)
THERMAL CURVES
Figure 32: Temperature measurement location
The allowed maximum hot spot temperature is defined at 125
℃
MODULE
A
IR FLOW
12.7 (0.5”)
50.8
(
2.0”
)
FACING PWB PWB
AIR VELOCITY
AND AMBIENT
TEMPERATURE
MEASURED BELOW
THE MODULE
25.4 (1.0”)