DFI CS170-Q370/C246 User manual

CS170-Q370/C246/H310
Mini-ITX Industrial Motherboard
User’s Manual

www.d.com
CS170-Q370/C246/H310
2
Copyright
This publication contains information that is protected by copyright. No part of it may be re-
produced in any form or by any means or used to make any transformation/adaptation without
the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no
representations or warranties with respect to the contents or use of this manual and specifi-
cally disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this docu-
ment. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions
or changes.
Changes after the publication’s first release will be based on the product’s revision. The web-
site will always provide the most updated information.
© 2020. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reason-
able protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encour-
aged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for compli-
ance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.

www.d.com
CS170-Q370/C246/H310
3
Table of Contents
Copyright ��������������������������������������������������������������������������������������������������������� 2
FCC and DOC Statement on Class B����������������������������������������������������� 2
Warranty���������������������������������������������������������������������������������������������������������� 4
Static Electricity Precautions����������������������������������������������������������������������� 4
Safety Measures���������������������������������������������������������������������������������������������� 4
Chapter 1 - Introduction����������������������������������������������������������������������������� 6
Specifications...........................................................................6
Features..................................................................................8
Watchdog Timer.............................................................................8
DDR4.............................................................................................8
Graphics ........................................................................................8
PCI Express ...................................................................................8
Serial ATA ......................................................................................8
Gigabit LAN....................................................................................8
Audio.............................................................................................8
Wake-On-LAN.................................................................................8
Wake-On-USB ................................................................................8
RTC Timer .....................................................................................8
ACPI STR.......................................................................................8
Power Failure Recovery...................................................................8
USB...............................................................................................8
Chapter 2 - Hardware Installation ������������������������������������������������������������ 9
Board Layout...........................................................................9
System Memory.......................................................................9
Installing the SODIMM Module......................................................10
CPU ......................................................................................11
Installing the CPU ........................................................................12
Installing the Fan and Heat Sink ...................................................14
Jumper Settings.....................................................................15
Clear CMOS Data JP1 ...................................................................15
COM1/2 Power Selection JP4/5 .....................................................15
LVDS Backlight Power JP7.............................................................16
LVDS Panel Power JP8..................................................................16
LVDS Inverter Power JP10 ............................................................17
Rear Panel I/O Ports ..............................................................18
RJ45 LAN Ports ............................................................................18
USB Ports ....................................................................................19
Graphics Interfaces.......................................................................19
COM (Serial) Ports........................................................................20
Audio...........................................................................................20
Internal I/O Connectors ......................................................... 21
SATA (Serial ATA) Connectors .......................................................21
Cooling Fan Connector..................................................................22
Digital I/O....................................................................................22
LVDS LCD Panel ...........................................................................23
Chassis Intrusion Connector .........................................................24
Front Panel Connector ..................................................................24
Expansion Slots............................................................................25
Installing the M.2 Module .............................................................25
Front Audio Connector..................................................................26
LPC Connector .............................................................................27
SMBus Connector ........................................................................27
Battery ........................................................................................28
+12V Power.................................................................................28
USB.............................................................................................29
Chapter 3 - BIOS Setup�����������������������������������������������������������������������������30
Overview ..............................................................................30
Main .....................................................................................31
Advanced .............................................................................32
RC ACPI Settings..........................................................................32
CPU Configuration ........................................................................33
Power & Performance...................................................................34
PCH-FW Configuration ..................................................................34
Trusted Computing .......................................................................37
PTN3460 Configuration .................................................................37
NCT6116D Super IO Configuration ...............................................38
NCT6116D HW Monitor.................................................................39
Serial Port Console Redirection......................................................40
USB Configuration ........................................................................41
CSM Configuration........................................................................42
USB Power Control .......................................................................42
Network Stack Configuration.........................................................43
Chipset.................................................................................. 44
Security................................................................................. 48
Boot...................................................................................... 49
Save & Exit ........................................................................... 49
Updating the BIOS.................................................................50
Notice: BIOS SPI ROM ........................................................... 50
Chapter 4 - RAID����������������������������������������������������������������������������������������51
RAID Levels Introduction........................................................51
Settings.................................................................................51
Chapter 5 - Intel AMT Settings����������������������������������������������������������������53
Overview ..............................................................................53

www.d.com
CS170-Q370/C246/H310
4
Warranty
1. Warranty does not cover damages or failures that arise from misuse of the product, inabil-
ity to use the product, unauthorized replacement or alteration of components and product
specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper instal-
lation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circum-
stances, attempt to perform service, adjustments or repairs on the product, whether in or
out of warranty. It must be returned to the purchase point, factory or authorized service
agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequential damages to the
product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in han-
dling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are
ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, contacts
or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or con-
nectors by their ends.
Safety Measures
To avoid damage to the system:
• Use the correct AC input voltage range.
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis cover for installation or servic-
ing. After installation or servicing, cover the system chassis before plugging the power
cord.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other
components. Perform the upgrade instruction procedures described at an ESD
workstation only. If such a station is not available, you can provide some ESD pro-
tection by wearing an antistatic wrist strap and attaching it to a metal part of the
system chassis. If a wrist strap is unavailable, establish and maintain contact with
the system chassis throughout any procedures requiring ESD protection.

www.d.com
CS170-Q370/C246/H310
5
About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• One CS170-Q370/C246/H310 motherboard
• One Serial ATA data cable (Length: 500mm)
• One I/O shield
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance to the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Optional Items
• USB port cable (Length: 200mm)
• Serial ATA data cable (Length: 500mm)
• Thermal solution (For 35W, Height: 37.3mm)
• Thermal solution (For 65W, Height: 72.8mm)
• Thermal solution (For 80W, Height: 77.1mm)
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance to the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
Before using the system board, prepare basic system components.
If you are installing the system board in a new system, you will need at least the following
internal components.
• A CPU
• Memory module
• Storage devices such as hard disk drive, etc.
You will also need external system peripherals you intend to use which will normally include at
least a keyboard, a mouse and a video display monitor.

www.d.com
Chapter 1 - Introduction
6
CS170-Q370/C246/H310
SYSTEM Processor 9th Generation Intel® Core™ Processors, LGA 1151 Socket,
TDP up to 95W
• Xeon E-2278GE Processor (Core 8; Max speed 4.7 GHz;
TDP 80W) (support ECC memory)
• i9-9900K Processor (Core 8, Max speed 5.0 GHz; TDP
95W)
• i7-9700E Processor (Core 8; Max speed 4.4 GHz; TDP
65W)
• i7-9700TE Processor (Core 8; Max speed 3.8 GHz; TDP
35W)
• i5-9500E Processor (Core 6; Max speed 4.2 GHz; TDP
65W)
• i5-9500TE Processor (Core 6; Max speed 3.6 GHz; TDP
35W)
• i3-9100E Processor (Core 4; Max speed 3.7 GHz; TDP
65W) (support ECC memory)
• i3-9100TE Processor (Core 4; Max speed 3.2 GHz; TDP
35W) (support ECC memory)
8th Generation Intel® Core™ Processors, LGA 1151 Socket,
TDP up to 95W
• Xeon E-2176G Processor (Core 6; Max speed 4.7 GHz;
TDP 80W) (support ECC memory)
• i7-8700 Processor (Core 6; Max speed 4.6 GHz; TDP
65W)
• i7-8700T Processor (Core 6; Max speed 4.0 GHz; TDP
35W)
• i5-8500 Processor (Core 6; Max speed 4.1 GHz; TDP
65W)
• i5-8500T Processor (Core 6; Max speed 3.5 GHz; TDP
35W)
• i3-8100 Processor (Core 4; Max speed 3.6 GHz; TDP
65W) (support ECC memory)
• i3-8100T Processor (Core 4; Max speed 3.1 GHz; TDP
35W) (support ECC memory)
• Pentium G5400 Processor (Core 2; Max speed 3.7 GHz;
TDP 58W) (support ECC memory)
• Celeron G4900 Processor (Core 2; Max speed 3.1 GHz;
TDP 54W) (support ECC memory)
Memory Dual Channel DDR4 2400/2666MHz
C246: Two 260-pin ECC/non-ECC SODIMM up to 32GB
(Core™ i5/i7 only support non-ECC)
Q370/H310: Two 260-pin non-ECC SODIMM up to 32GB
Chipset Intel® Q370/C246/H310 Chipset
BIOS AMI SPI 128Mbit
GRAPHICS Controller Intel® UHD Graphics 630 (only Pentium G5400, Celeron
G4900 support 610 )
Chapter 1 - Introduction
Feature OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG,
HEVC/H265, VP8, VP9
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8,
VP9
Display 1 x LVDS up to 1920x1200 @ 60Hz
1 x VGA up to 1920x1200 @ 60Hz
2 x DP++ up to 4096x2304 @ 60Hz
Triple-
Displays
(LVDS & VGA & DP++), (LVDS & DP++ & DP++),
(VGA & DP++ & DP++)
EXPANSION Interface Q370/C246:
1 x PCIe x16 (Gen 3)
1 x M.2 2280 M Key (PCIe x4/SATA) (support NVMe and
Intel® Optane memory)
1 x M.2 2230 E Key (USB/PCIe) (bottom side)
H310:
1 x PCIe x16 (Gen 3)
1 x M.2 2280 M Key (PCIe) (support NVMe)
1 x M.2 2230 E Key (USB/PCIe)
AUDIO Audio
Codec
Realtek ALC887S-VD2-GR
ETHERNET Controller Q370/C246:
1 x Intel® I219LM PHY with iAMT12 and vPro
(10/100/1000Mbps) (Core i7/i5 supports iAMT)
1 x Intel® I211AT PCIe (10/100/1000Mbps)
H310:
1 x Intel® I219V PHY (10/100/1000Mbps)
1 x Intel® I211T PCIe (10/100/1000Mbps)
REAR I/O Ethernet 2 x GbE (RJ-45)
USB Q370/C246:
2 x USB 3.1 Gen2
4 x USB 3.1 Gen1
H310:
4 x USB 3.1 Gen1
2 x USB 2.0
Display 1 x VGA (DB-15)
2 x DP++
►Specifications

www.d.com
Chapter 1 - Introduction
7
CS170-Q370/C246/H310
Serial 2 x RS-232 (DB-9)
Audio Audio 1 x Line-out, 1 x Mic-in,
1 x Line-in (available upon request)
Internal I/O Display 1 x LVDS
Audio 1 x Front Audio (2.00mm pitch)
USB 2 x USB 2.0 (2.00mm pitch)
SATA 2 x SATA 3.0 (up to 6Gb/s) RAID 0/1/5
DIO 1 x 8-bit DIO, 1 x DIO Power
SMBus 1 x SMBus
LPC 1 x LPC
WATCHDOG
TIMER Output &
Interval
System Reset, Programmable via Software from 1 to 255
Seconds
SECURITY TPM dTPM2.0 (available upon request)
POWER Type ATX
Connector 4-pin ATX 12V power, 24-pin ATX power
RTC Battery CR2032 Coin Cell
OS
SUPPORT
Windows /
Linux
Microsoft Windows 10 IoT Enterprise 64-bit
Linux
Environment Temerature Operating: -5 to 65°C
Storage: -40 to 85°C
Humidity Operating: 5 to 90% RH
Storage: 5 to 90% RH
MECHANICAL Dimensions Mini-ITX Form Factor
170mm (6.7") x 170mm (6.7")
Height PCB: 1.6mm
Top Side: 20mm
Bottom Side: 3mm
►Specifications

www.d.com
Chapter 1 - Introduction
8
CS170-Q370/C246/H310
►Features
Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set
time interval. If the system hangs or fails to function, it will reset at the set time interval so
that your system will continue to operate.
DDR4
DDR4 delivers increased system bandwidth and improves performance at a lower power than
DDR3/DDR2.
Graphics
The integrated Intel®UHD graphics engine delivers an excellent blend of graphics performance
and features to meet business needs. It provides excellent video and 3D graphics with out-
standing graphics responsiveness. These enhancements deliver the performance and compat-
ibility needed for today’s and tomorrow’s business applications.
PCI Express
PCI Express is a high bandwidth I/O infrastructure that possesses the ability to scale speeds
by forming multiple lanes. The PCI Express architecture also supports high performance graph-
ics infrastructure by enhancing the capability.
Serial ATA
Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of
up to 6Gb/s (SATA 3.0), it improves hard drive performance faster than the standard parallel
ATA whose data transfer rate is 100MB/s.
Gigabit LAN
Two Intel®Gigabit LAN controllers (Intel®I211AT PCIe and Intel®I219V PCIe) support up to
1Gbps data transmission. (CS170-H310)
Two Intel®Gigabit LAN controllers (Intel®I211AT PCIe and Intel®I219LM PCIe) support up to
1Gbps data transmission. (CS170-Q370/C246)
Audio
The Realtek ALC887S-VD2-GR audio codec provides High Definition audio output.
Wake-On-LAN
This feature allows the network to remotely wake up a Soft Power Down (Soft-Off) PC. It is
supported via the onboard LAN port or via a PCI LAN card that uses the PCI PME (Power Man-
agement Event) signal. However, if your system is in the Suspend mode, you can power-on
the system only through an IRQ or DMA interrupt.
Wake-On-USB
This function allows you to use a USB keyboard or USB mouse to wake up a system from the
S3 (STR - Suspend To RAM) state.
RTC Timer
The RTC installed on the system board allows your system to automatically power-on on the
set date and time.
ACPI STR
The system board is designed to meet the ACPI (Advanced Configuration and Power Interface)
specification. ACPI has energy saving features that enables PCs to implement Power Manage-
ment and Plug-and-Play with operating systems that support OS Direct Power Management.
ACPI when enabled in the Power Management Setup will allow you to use the Suspend to RAM
function.
With the Suspend to RAM function enabled, you can power-off the system at once by pressing
the power button or selecting “Standby” when you shut down Windows®without having to go
through the sometimes tiresome process of closing files, applications and operating system.
This is because the system is capable of storing all programs and data files during the entire
operating session into RAM (Random Access Memory) when it powers-off. The operating ses-
sion will resume exactly where you left off the next time you power-on the system.
Power Failure Recovery
When power returns after an AC power failure, you may choose to either power-on the system
manually or let the system power-on automatically.
USB
USB 3.1 Gen2 is capable of running at a maximum transmission speed of up to 10 Gbit/s (1.2
GB/s) and is faster than USB 3.1 Gen1 (5 Gbit/s, or 625 MB/s), USB 2.0 (480 Mbit/s, or 60
MB/s) and USB 1.1 (12Mb/s). USB 3.1 reduces the time required for data transmission, reduc-
es power consumption, and is backward compatible with USB 2.0. It is a marked improvement
in device transfer speeds between your computer and a wide range of simultaneously acces-
sible external Plug and Play peripherals.

www.d.com
CS170-Q370/C246/H310
Chapter 2 - Hardware Installation
9
DDR4_2 SODIMM
DDR4_1 SODIMM
DDR4_1 SODIMM
DDR4_2 SODIMM
Intel
C246/Q370/H310
M.2 2280
M Key
65
21
JP4
12
56
JP5
JP7
11
33
JP10
6
5
2
1
JP8
JP1
13
CPU Fan
LVDS
SATA1
(R2)
SATA0
ATX Power
LVDS
Inverter Power
1
1
39
2
8
1
1
1
Front Panel
81
DIO
14
DIO
Power
1 3
System
Fan
1
LPCLPC
2
8
SMI
10
2
USB7/8
(USB 2.0)
USB7/8
(USB 2.0)
+12V Power
1
2
9
Front Audio
LAN1LAN2
USB 3/4
(USB 3.1 Gen1)
USB 1/2
(USB 3.1 Gen2
/USB 3.1 Gen1)
DP1
USB 7/9
(USB 3.1 Gen1
/USB 2.0)
LAN1
COM1
COM2
VGA
DP2
Audio
2
1
Chassis
Intrusion
Chassis
Intrusion
Chassis
Intrusion
2
5
SM BUS
Battery
Battery
Buzzer
PCIe Gen3
x16
Realtek
ALC887
Chapter 2 - Hardware Installation
►Board Layout
►System Memory
Important:
Electrostatic discharge (ESD) can damage your board, pro-
cessor, disk drives, add-in boards, and other components.
Perform installation procedures at an ESD workstation
only. If such a station is not available, you can provide
some ESD protection by wearing an antistatic wrist strap
and attaching it to a metal part of the system chassis. If
a wrist strap is unavailable, establish and maintain contact
with the system chassis throughout any procedures requir-
ing ESD protection.
Important:
When the Standby Power LED lit red, it indicates that
there is power on the system board. Power-off the PC
then unplug the power cord prior to installing any devices.
Failure to do so will cause severe damage to the mother-
board and components.
Note:
A M.2 E Key 2230 socket with standoff is available at the bottom side of this board.
DDR4_1 SODIMM
DDR4_2 SODIMM
Intel
C246/Q370/H310
M.2 2280
M Key
M.2 2230
E Key
Bottom Side
65
21
JP4
12
56
JP5
JP7
11
33
JP10
6
5
2
1
JP8
JP1
13
CPU Fan
LVDS
SATA1
(R2)
SATA0
ATX Power
LVDS
Inverter Power
1
1
39
2
8
1
1
1
Front Panel
81
DIO
1
4
DIO
Power
1 3
System
Fan
1
LPCLPC
2
8
SMI
10
2
USB7/8
(USB 2.0)
USB7/8
(USB 2.0)
+12V Power
1
2
9
Front Audio
LAN1LAN2
USB 3/4
(USB 3.1 Gen1)
USB 1/2
(USB 3.1 Gen2
/USB 3.1 Gen1)
DP1
USB 7/9
(USB 3.1 Gen1
/USB 2.0)
LAN1
COM1
COM2
VGA
DP2
Audio
2
1
Chassis
Intrusion
Chassis
Intrusion
Chassis
Intrusion
2
5
SM BUS
BatteryBattery
Buzzer
PCIe Gen3
x16
Realtek
ALC887
M.2 2230
E Key
Bottom Side

www.d.com
CS170-Q370/C246/H310
Chapter 2 - Hardware Installation
10
Installing the SODIMM Module
Before installing the memory module, please make sure that the following safety cautions are
well-attended.
1. Make sure the PC and all other peripheral devices connected to it has been powered
down.
2. Disconnect all power cords and cables.
3. Locate the SO-DIMM socket on the system board
4. Make sure the notch on memory card is aligned to the key on the socket.
Notch
Retention Notch
Key
Socket Top View
DDR4 SO-DIMM
Retention Clip
45°
Step 1
Step 2
Step 3
Features
• Two 260-pin SODIMM up to 32GB
• Dual Channel DDR4 2133/2400/2666MHz
• ECC memory supported by CS170-C246
The system board supports the following memory interface.
Single Channel (SC)
Data will be accessed in chunks of 64 bits from the memory channels.
Dual Channel (DC)
Data will be accessed in chunks of 128 bits from the memory channels. Dual channel provides
better system performance because it doubles the data transfer rate.
Single Channel DIMMs are on the same channel. DIMMs in a channel can be identi-
cal or completely different. However, we highly recommend using
identical DIMMs. Not all slots need to be populated.
Dual Channel DIMMs of the same memory configuration are on different channels.
►System Memory
►System Memory