DFI TGU171 User manual

TGU171/TGU173
Mini-ITX Industrial Motherboard
User’s Manual ©March 06, 2023 DFI Inc.

2User's Manual | TGU171/TGU173
Copyright
This publication contains information that is protected by copyright. No part of it may be
reproduced in any form or by any means or used to make any transformation/adaptation
without the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes
no representations or warranties with respect to the contents or use of this manual and
specifically disclaims any express or implied warranties of merchantability or fitness for any
particular purpose. The user will assume the entire risk of the use or the results of the use of
this document. Further, the manufacturer reserves the right to revise this publication and make
changes to its contents at any time, without obligation to notify any person or entity of such
revisions or changes.
Changes after the publication’s first release will be based on the product’s revision. The website
will always provide the most updated information.
© 2023. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable
protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur
in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.

3User's Manual | TGU171/TGU173
Table of Contents
Chapter 1 - Introduction................................................................................................................6
Specifications.........................................................................................................................6
Block Diagram ........................................................................................................................8
Dimension...............................................................................................................................8
Chapter 2 - Hardware Installation................................................................................................9
Board Layout...........................................................................................................................9
Installing the Heat Sink........................................................................................................10
Jumper Settings...................................................................................................................11
Clear CMOS (JP1)..........................................................................................................11
COM 4 RS232 Power (JP3) ..........................................................................................11
COM 3 RS232 Power (JP2) ..........................................................................................11
SATA Selection (JP8)....................................................................................................12
eDP Inverter Power (DPJP1)........................................................................................12
Panel Inverter Power (DPJP2)......................................................................................12
Panel Power Jumper (DPJP3) .....................................................................................13
Panel Backlight Selection (DPJP4) ..............................................................................13
PIN Assignment....................................................................................................................14
CASEOPEN-....................................................................................................................14
SMBus ............................................................................................................................14
Digital I/O Power ...........................................................................................................15
Digital I/O.......................................................................................................................15
COM 1 & COM 2 ............................................................................................................16
COM 3 & COM 4 ............................................................................................................16
USB 5/6..........................................................................................................................17
USB 7/8..........................................................................................................................17
SATA0/1 HDD Power.....................................................................................................18
Front Audio.....................................................................................................................18
LCD/Inverter Power.......................................................................................................19
LVDS ...............................................................................................................................20
eDP .................................................................................................................................21
Expansion Slots....................................................................................................................22
PCI Express x4 Slot.......................................................................................................22
Install PCI Express cards such as network cards or other expansion cards...........22
Expansion Slots....................................................................................................................23
Installing the M.2 Module.............................................................................................23
Installing the SO-DIMM Module ...................................................................................24
Chapter 3 - BIOS Settings...........................................................................................................25
Overview ...............................................................................................................................25
Updating the BIOS................................................................................................................25
Main.......................................................................................................................................26
Advanced .............................................................................................................................26
CPU Configuration.........................................................................................................27
Power & Performance...................................................................................................27
Power & Performance ►CPU- Power Management Control ..............................28
Power & Performance ►GT- Power Management Control.................................28
PCH-FW Configuration..................................................................................................29
Trusted Computing........................................................................................................29
PTN3460 Configuration ................................................................................................30
NCT6126D Super IO Configuration..............................................................................30
NCT6126D HW Monitor ................................................................................................31
NCT6126D HW Monitor ►Smart FAN Function .................................................31
Serial Port Console Redirection ...................................................................................32
Serial Port Console Redirection ►Console Redirection Settings........................32
ACPI Settings.................................................................................................................33
USB Configuration ........................................................................................................34
Network Stack Configuration........................................................................................35
USB Power Control........................................................................................................36
Tls Auth Configuration..................................................................................................36
Chipset..................................................................................................................................37
System Agent (SA) Configuration................................................................................37
System Agent (SA) Configuration►Graphics Configuration................................38
PCH-IO Configuration....................................................................................................38
PCH-IO Configuration►PCI Express Configuration.............................................39
PCH-IO Configuration►SATA And RST Configuration.........................................39
PCH-IO Configuration►HD Audio Configuration.................................................40
Security .................................................................................................................................41
Secure Boot....................................................................................................................41
Boot.......................................................................................................................................42
Save & Exit............................................................................................................................42

4User's Manual | TGU171/TGU173
About this Manual
This manual can be downloaded from the website.
The manual is subject to change and update without notice, and may be based on editions
that do not resemble your actual products. Please visit our website or contact our sales
representatives for the latest editions.
Warranty
1. Warranty does not cover damages or failures that arise from misuse of the product,
inability to use the product, unauthorized replacement or alteration of components and
product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper
installation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any
circumstances, attempt to perform service, adjustments or repairs on the product,
whether in or out of warranty. It must be returned to the purchase point, factory or
authorized service agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequential damages to
the product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in
handling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you
are ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components,
contacts or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or
connectors by their ends.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other
components. Perform the upgrade instruction procedures described at an ESD
workstation only. If such a station is not available, you can provide some ESD
protection by wearing an antistatic wrist strap and attaching it to a metal part
of the system chassis. If a wrist strap is unavailable, establish and maintain
contact with the system chassis throughout any procedures requiring ESD
protection.
Safety Measures
• To avoid damage to the system, use the correct AC input voltage range.
• To reduce the risk of electric shock, unplug the power cord before removing the
system chassis cover for installation or servicing. After installation or servicing, cover
the system chassis before plugging the power cord.

5User's Manual | TGU171/TGU173
About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• 1 TGU171/TGU173 motherboard
• 1 COM port cable (Length: 250mm, 1 x COM ports)
• 1 Serial ATA data with power cable (Length: 300mm)
• 1 Heat sink
Note: The items are subject to change in the developing stage.
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
When installing the system board in a new system, you will need at least the following internal
components.
• Power adapter
External system peripherals may also be required for navigation and display, including at least a
keyboard, a mouse and a video display monitor.

6
Chapter 1
INTRODUCTION
User's Manual | TGU171/TGU173
X Specifications
SYSTEM
Processor 11th Generation Intel®Core™ Processors
Intel®Core™ i7-1185GRE, Quad Core, 12M Cache, 1.8GHz (4.4GHz), 15W
Intel®Core™ i5-1145GRE, Quad Core, 8M Cache, 1.5GHz (4.1GHz), 15W
Intel®Core™ i3-1115GRE, Dual Core, 6M Cache, 2.2GHz (3.9GHz), 15W
Intel®Celeron®6305E, Dual Core, 4M Cache, 1.8GHz (1.8GHz), 15W
Memory 2 x 260-pin SO-DIMM up to 64GB (32GB per slot)
Dual channel DDR4 up to 3200MHz (Support in-band ECC)
BIOS AMI SPI 256Mbit
GRAPHICS
Controller Intel®Iris®Xe Graphics for i7/i5 Processors
Intel®UHD Graphics for i3/Celeron Processors
Feature OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: WMV9, AVC/H264, JPEG/MJPEG, HEVC/H265, VP9, AV1
HW Encode: AVC/H264, JPEG, HEVC/H265, VP9
Display 1 x LVDS (Resolution up to 1920x1200 @60Hz)
1 x eDP (Resolution up to 3840x2160 @60Hz)
1 x DP++ (Resolution up to 3840x2160 @60Hz)
1 x HDMI (Resolution up to 3840x2160 @60Hz)
1 x USB Type C (Resolution up to 3840x2160 @60Hz. Support USB3.1 Gen2, 15W power delivery and DP Alt mode)
Quad Displays LVDS + eDP + DP++ + HDMI + USB Type C
EXPANSION
Interface 1 x PCIe x4 (PCIe Gen 3 x4)
1 x M.2 2242/2280 M Key (PCIe Gen4 x4) (Support NVMe and Intel®Optane memory) (Support DFI proprietary expansion module)
1 x M.2 2242/3042/3052 B Key (PCIe Gen3 x1/SATA/USB 3.1 Gen1) (Support 4G/5G and storage module) (Opt.: PCIe Gen3 x2)
1 x M.2 2230 E Key (USB2.0) (Support Intel®CNVi module only and Intel®vPro)
1 x Nano-SIM Socket (Connect to M.2 Key B for 4G/5G module)
**Note: Intel CNVi module Support List: AX201 & AC-9560
AUDIO Audio Codec Realtek ALC888
ETHERNET Controller 2 x Intel®I211AT/I210IT PCIe (10/100/1000Mbps)
1 x Intel®I225LM/I225IT PCIe (10/100/1000Mbps/2.5Gbps)
REAR I/O
Ethernet 2 x GbE (RJ-45)
1 x 2.5GbE (RJ-45)
USB 4 x USB 3.1 Gen2 (Type-A)
1 x USB Type-C (Support USB 3.1 Gen2, 15W power delivery and DP Alt mode)
Display 1 x DP++
1 x HDMI
Chapter 1 - Introduction

7
Chapter 1
INTRODUCTION
User's Manual | TGU171/TGU173
INTERNAL I/O
Serial 2 x RS-232/422/485 (2.0mm pitch)
2 x RS-232 (2.0mm pitch) (RS-232 w/ power)
USB 4 x USB 2.0 (2.0mm pitch)
Display 1 x LVDS
1 x eDP
Audio 1 x Front Audio (2.0mm pitch)
SATA 2 x SATA 3.0 (up to 6Gb/s) (RAID 0/1)
2 x SATA Power
DIO 1x8-bit DIO
1 x DIO Power
Cooling 1 x CPU fan
1 x System fan
WATCHDOG
TIMER Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds
SECURITY TPM fTPM (default) / dTPM (option)
POWER
Type TGU171: Single 12V +/-5% DC
TGU173: Wide Range 9~36V
Connector DC-in Jack
Right Angle Connector (4-pin) (available upon request)
Straightl Type Connector (4-pin) (available upon request)
Consumption Idle: TGU173-IE-1185GRE 15W: 12V@ 1.12A (13.44W)
Max: TGU173-IE-1185GRE 15W: 12V@ 6.26A (75.12W)
RTC Battery CR2032 Coin Cell
OS SUPPORT
Microsoft Windows 10 IoT Enterprise 64-bit
Linux Linux
ENVIRONMENT
Temperature Operating: -5 to 65°C / -20 to 70°C
Storage: -40 to 85°C
Humidity Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF TGU171-IE-1185GRE 414,291 hrs @ 25°C; 254,601 hrs @ 45°C; 166,963 hrs @ 60°; 124,264 hrs @ 70°C;
TGU173-IE-1185GRE 397,863 hrs @ 25°C; 244,099 hrs @ 45°C; 160,483 hrs @ 60°; 119,765 hrs @ 70°C;
Calculation model: Telcordia Issue 4 Environment: GB, GC – Ground Benign, Controlled
MECHANICAL
Dimensions 170mm (6.7") x 170mm (6.7")
Height Top Side: 16.5mm, Bottom Side: 3.5mm
CERTIFICATIONS Certifications CE, FCC, RoHS, UKCA

8
Chapter 1
INTRODUCTION
User's Manual | TGU171/TGU173
X Block Diagram X Dimension

9
Chapter 2
HARDWARE INSTALLATION
User's Manual | TGU171/TGU173
Chapter 2 - Hardware Installation
X Board Layout
13
14
15
16
17
18
19
20
LCD/Inverter Power
System FAN
Buzzer
Clear CMOS
Battery
Debug Card
CASEOPEN-
USB 7/8
21
22
23
24
USB 5/6
SATA Selection
SATA1 Power
SATA1
11
12
Panel Inverter Power
Panel Backlight Selection
1
2
3
4
5
6
7
8
9
10
CPU FAN
Front Panel
Digital I/O Power
Digital I/O
SMBus
eDP
Panel Power Jumper
LVDS
Innoage HDR1
eDP Inverter Power
37
38
39
40
USB Type-C
M.2-M
M.2-E
M.2-B
41
42
43
44
45
46
47
COM4 RS232 Power
COM4
COM3 RS232 Power
COM3
COM2
COM1
SIM slot
25
26
27
28
29
30
SATA0
SATA0 Power
Debug
Debug
DC-in
HDMI
31
32
33
34
35
36
DP++
LAN1
LAN2
2.5G LAN1
USB 1/2 (USB 3.1 Gen2)
USB 3/4 (USB 3.1 Gen2)
48
PCIe x4
49
Front Audio

10
Chapter 2
HARDWARE INSTALLATION
User's Manual | TGU171/TGU173
The CPU must be kept cool by using a heat sink, otherwise the CPU will overheat damaging both the CPU and system board.
1. Before you install the fan / heat sink, you must apply a thermal paste onto the top of the CPU. The thermal paste is usually supplied when you purchase the fan / heat sink assembly. Do not
spread the paste all over the surface. When you later place the heat sink on top of the CPU, the compound will disperse evenly.
Some heat sinks come with a patch of pre-applied thermal paste. Do not apply thermal paste if the fan / heat sink already has a patch of thermal paste on its underside. Peel the strip that
covers the paste before you place the fan / heat sink on top of the CPU.
2. Place the heat sink on top of the CPU. The 4 spring screws around the heat sink, which are used to secure the heat sink onto the system board, must match the 4 mounting holes around the
board.
3. Screw tight two of the spring screws at opposite corners into the mounting holes. And then proceed with the other two spring screws.
Mounting holes
Note:
Some components are optional and only available upon request.
Important:
Electrostatic discharge (ESD) can damage your board, processor,
disk drives, add-in boards, and other components. Perform
installation procedures at an ESD workstation only. If such a
station is not available, you can provide some ESD protection by
wearing an antistatic wrist strap and attaching it to a metal part
of the system chassis. If a wrist strap is unavailable, establish
and maintain contact with the system chassis throughout any
procedures requiring ESD protection.
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8 1
19
2
19
2
1 1
1 40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
X Installing the Heat Sink