Diamond Systems CME-Atom User manual

init
CME-Atom
COM Express 1.0 Computer-On-Module based on Intel®Atom Z530P/Z510PT CPU
Copyright 2010
FOR TECHNICAL SUPPORT Diamond Systems Corporation
PLEASE CONTACT: 1255 Terra Bella Ave.
Mountain View, CA 94043 USA
[e-mail] Tel [phone]
Fax [phone]
www.diamondsystems.com
Revision
Date
Comment
1.0
02/08/10
Release candidate 1
1.1
03/02/10
Corrections to product model names and specs
1.2
05/24/10
Addition of subsystem detail to block diagram

CME-Atom User Manual 1.2 www.diamondsystems.com Page 2
CONTENTS
IMPORTANT SAFE-HANDLING INFORMATION......................................................................................................3
1. INTRODUCTION.................................................................................................................................................4
1.1 Features.........................................................................................................................................................4
2. FUNCTIONAL OVERVIEW.................................................................................................................................6
2.1 Block Diagram ...............................................................................................................................................6
2.2 Board Dimensions, Mounting Holes, and Connectors...................................................................................7
2.3 Bus and Interface Connector Summary........................................................................................................9
2.4 COM Express Bus Connectors......................................................................................................................9
3. GETTING STARTED........................................................................................................................................ 10
3.1 COM Express Development Kits................................................................................................................ 11
3.2 Preparing the Hardware ............................................................................................................................. 11
3.3 Booting the System .................................................................................................................................... 12
3.4 BIOS Setup Utility....................................................................................................................................... 12
3.4.1 Main Setup Menu............................................................................................................................... 12
3.4.2 Advanced Setup Menu....................................................................................................................... 12
3.4.3 PCI/PnP Settings Menu..................................................................................................................... 13
3.4.4 Boot Settings Menu............................................................................................................................ 13
3.4.5 Security Settings Menu...................................................................................................................... 13
3.4.6 Chipset Settings Menu....................................................................................................................... 13
3.4.7 Exit..................................................................................................................................................... 14
3.5 Operating System Drivers .......................................................................................................................... 14
3.6 BIOS Beep Sounds List.............................................................................................................................. 14
4. INTERFACE CONNECTOR DETAILS............................................................................................................. 15
4.1 COM Express AB Connector...................................................................................................................... 16
4.1.1 USB signals ....................................................................................................................................... 18
4.1.2 Gigabit Ethernet (LAN)....................................................................................................................... 18
4.1.3 AC97 Audio/High Definition Audio..................................................................................................... 18
4.1.4 PCI Express....................................................................................................................................... 19
4.1.5 SATA.................................................................................................................................................. 19
4.1.6 General Purpose Inputs and Outputs (GPIO).................................................................................... 19
4.1.7 Power and System Management....................................................................................................... 20
4.1.8 LVDS Flat Panel ................................................................................................................................ 21
4.1.9 LPC Interface..................................................................................................................................... 21
4.1.10 Analog VGA (CRT) ............................................................................................................................ 22
4.1.11 TV Out................................................................................................................................................ 22
4.1.12 Miscellaneous Signals ....................................................................................................................... 23
4.2 COM Express CD Connector ..................................................................................................................... 24
4.2.1 IDE..................................................................................................................................................... 26
4.2.2 PCI Bus Interface............................................................................................................................... 27
5. APPENDIX: SYSTEM RESOURCES REFERENCE....................................................................................... 28
5.1 BIOS Memory Mapping .............................................................................................................................. 28
5.2 I/O Port Address Map................................................................................................................................. 28
5.3 Interrupt Request (IRQ) Lines .................................................................................................................... 29
5.4 BIOS Beep Codes ...................................................................................................................................... 30
5.4.1 Boot Block Beep Codes..................................................................................................................... 30
5.4.2 Post BIOS Beep Codes ..................................................................................................................... 30
5.4.3 Troubleshooting Post BIOS Beep Codes .......................................................................................... 31
5.4.4 Bootblock Initialization Code Checkpoints......................................................................................... 32
5.4.5 Bootclock Recovery Code Checkpoints............................................................................................. 33
5.4.6 POST Code Checkpoints................................................................................................................... 34
5.4.7 DIM Code Checkpoints...................................................................................................................... 37
5.4.8 ACPI Runtime Checkpoints ............................................................................................................... 38

CME-Atom User Manual 1.2 www.diamondsystems.com Page 3
IMPORTANT SAFE-HANDLING INFORMATION
WARNING: ESD-Sensitive Electronic Equipment!
Observe ESD-safe handling procedures when working with this product.
Always use this product in a properly grounded work area and wear
appropriate ESD-preventive clothing and/or accessories.
Always store this product in ESD-protective packaging when not in use.
Safe Handling Precautions
The CME-Atom contains numerous I/O connectors that connect to sensitive electronic components. This creates
many opportunities for accidental damage during handling, installation and connection to other equipment. The
list here describes common causes of failure found on boards returned to Diamond Systems for repair. This
information is provided as a source of advice to help you prevent damaging your Diamond (or any vendor‟s)
embedded computer boards.
ESD damage –This type of damage is almost impossible to detect, because there is no visual sign of failure or
damage. The symptom is that the board simply stops working, because some component becomes defective.
Usually the failure can be identified and the chip can be replaced. To prevent ESD damage, always follow proper
ESD-prevention practices when handling computer boards.
Damage during handling or storage –On some boards we have noticed physical damage from mishandling. A
common observation is that a screwdriver slipped while installing the board, causing a gouge in the PCB surface
and cutting signal traces or damaging components.
Another common observation is damaged board corners, indicating the board was dropped. This may or may not
cause damage to the circuitry, depending on what is near the corner. Most of our boards are designed with at
least 25 mils clearance between the board edge and any component pad, and ground / power planes are at least
20 mils from the edge to avoid possible shorting from this type of damage. However these design rules are not
sufficient to prevent damage in all situations.
A third cause of failure is when a metal screwdriver tip slips, or a screw drops onto the board while it is powered
on, causing a short between a power pin and a signal pin on a component. This can cause overvoltage / power
supply problems described below. To avoid this type of failure, only perform assembly operations when the
system is powered off.
Sometimes boards are stored in racks with slots that grip the edge of the board. This is a common practice for
board manufacturers. However our boards are generally very dense, and if the board has components very close
to the board edge, they can be damaged or even knocked off the board when the board tilts back in the rack.
Diamond recommends that all our boards be stored only in individual ESD-safe packaging. If multiple boards are
stored together, they should be contained in bins with dividers between boards. Do not pile boards on top of each
other or cram too many boards into a small location. This can cause damage to connector pins or fragile
components.
Power supply wired backwards –Our power supplies and boards are not designed to withstand a reverse
power supply connection. This will destroy each IC that is connected to the power supply. In this case the board
will most likely will be unrepairable and must be replaced. A chip destroyed by reverse power or by excessive
power will often have a visible hole on the top or show some deformation on the top surface due to vaporization
inside the package. Check twice before applying power!

CME-Atom User Manual 1.2 www.diamondsystems.com Page 4
1. INTRODUCTION
The CME-Atom is a highly integrated computer-on-module (COM) based on the low power, high performance
Intel® Atom processor clocked at up to 1.6GHz. The module is equipped with up to 2GB of soldered-on DDR2
SDRAM and provides interfaces for high-resolution CRTs and LVDS-interfaced LCDs, gigabit Ethernet, SATA
drives, USB peripherals, and audio. Additionally, the CME-Atom offers a high degree of system expansion
flexibility via the presence of both PCI Express and PCI buses on its COM Express 1.0 compliant baseboard
interface connectors.
1.1 Features
Processor:
oCME-Z530: 1.6GHz Intel Atom Z530P CPU; 400MHz FSB; 1MB L2 cache
oCME-Z510: 1.1GHz Intel Atom Z510PT CPU; 400MHz FSB; 1MB L2 cache
Chipset: Intel Poulsbo US15WPT
Soldered-on RAM:
oCME-Z530: 2GB DDR2 533MHz SDRAM
oCME-Z510: 1GB DDR2 533MHz SDRAM
Graphics:
oBased on integrated Intel Graphics Media Accelerator 500
oProvides two display interfaces:
VGA RGB at up to 2048 x 1536 resolution
Single-channel 24-bit LVDS
Audio:
oAC‟97 link
oMic in, line in/out signals
USB interfaces: 8 USB 2.0 ports
Networking: 10/100/1000 Mbps Ethernet (Intel 82574IT controller)
Mass storage interface:
oSATA port supports one device (Primary Master); 150MB/s max. data rate
oUSB mass storage devices supported in BIOS and OSes
Keyboard/mouse: USB keyboard/mouse devices supported in BIOS and OS
Other:
oPC speaker interface
oWatchdog timer with 1-255 levels, reset
o8-bit programmable digital I/O port
oI2C, SMBus serial buses
Three system expansion buses:
oPCI Express: 6 PCIe x1 lanes
oPCI Bus: 4 32-bit PCI bus masters
oLPC bus

CME-Atom User Manual 1.2 www.diamondsystems.com Page 5
Power:
o+12VDC main power; +5VDC standby power
oPower requirement: 9W idle, 13W loaded (preliminary)
oReal-time clock backup: 2.0 to 3.6 VDC @ (tbd)
Operating environment:
oOperating temperature range:
CME-Z530: -40oC to +85oC
CME-Z510: -20oC to +71oC
o0 to 90% operating humidity (non-condensing)
Dimensions:
oCOM Express compliant form-factor
o4.9 x 3.7 inches (125 x 95 mm)
Weight: 2.8 oz (79 g)
Software:
oBIOS: AMI PnP flash BIOS
oOperating systems supported: Windows XP/Vista; Linux 2.6
Note: The COM Express specification is available from the PICMG organization
(http://www.picmg.org). The COM Express Tutorial and COM Express Design Guide are available
for download from the PICMG organization COM Express website located at:
http://www.picmg.org/v2internal/COMExpress.htm

CME-Atom User Manual 1.2 www.diamondsystems.com Page 6
2. FUNCTIONAL OVERVIEW
2.1 Block Diagram
Figure 1 shows the CME-Atom functional blocks, buses, and peripheral interface signals.
Figure 1: Functional Block Diagram

CME-Atom User Manual 1.2 www.diamondsystems.com Page 7
2.2 Board Dimensions, Mounting Holes, and Connectors
The two diagrams below show the mechanical dimensions of the CME-Atom‟s board outline and five mounting
holes, as well as the position of all connectors on both the top and bottom sides of the board.
Figure 2: Board Layout –Top

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Figure 3: Board Layout –Bottom

CME-Atom User Manual 1.2 www.diamondsystems.com Page 9
2.3 Bus and Interface Connector Summary
The CME-Atom has two 2x110-pin interface connectors, as listed in the tables below which are defined in
accordance with the PICMG COM Express Specification. Signal functions relating to all of the module‟s interface
connectors are discussed in greater detail in Section 4 of this document.
2.4 COM Express Bus Connectors
Connector
Location
Pins
Function
COMX AB
Bottom
2x110
USB, GigE, PCI Express, AC97 (audio), SATA, LVDS,
LPC, VGA (CRT), LAN, TV Out, power and ground
interfaces, and system and power management.
COMX CD
Bottom
2x110
32-bit PCI bus and power and ground signals.

CME-Atom User Manual 1.2 www.diamondsystems.com Page 10
Important Safe-Handling Information
WARNING: ESD-Sensitive Electronic Equipment!
Observe ESD-safe handling procedures when working
with this product.
Always use this product in a properly grounded work area
and wear appropriate ESD-preventive clothing and/or
accessories.
Always store this product in ESD-protective packaging
when not in use.
Please refer to page 3 of this manual (“Important Safe-Handling Information”) for further
details.
3. GETTING STARTED
This section of the CME-Atom User Manual covers basic hardware setup, power connection, system boot-up, and
initial software configuration. First-time CME-Atom users normally receive the product in conjunction with one of
Diamond‟s Development Kits, which provide everything needed to ensure rapid application development.

CME-Atom User Manual 1.2 www.diamondsystems.com Page 11
3.1 COM Express Development Kits
To facilitate evaluation and development, Diamond‟s COM Express are normally supplied in conjunction with one
of Diamond‟s COM Express development kits (pictured below). This approach increases project efficiency and
reduces risks by providing a known good environment for rapid application development.
ATX form-factor COM Express Development Kit
The baseboards in Diamond‟s COM Express development kits provide standardized I/O connectors, for quick and
easy access to nearly all system interfaces. They also feature a variety of expansion slots and sockets, for flexible
system expansion. The kits –which include both generic models and application-oriented baseboards in various
form-factors –also generally extend the COM Express module‟s functionality by adding Ethernet and serial ports,
solid-state media sockets, and more. Additionally, the kits typically include an comprehensive set of interface
cables, drivers for Linux and Windows operation, and full documentation.
3.2 Preparing the Hardware
If it is not already installed on the baseboard, carefully plug the CME-Atom into the baseboard‟s COM Express
bus connectors. Place the heatsink or heat-spreader supplied with the CME-Atom on top of the module, carefully
positioning it so that its mounting holes line up with those of the module. Then, affix the module and heatsink to
the baseboard using the provided hardware.
Connect a USB keyboard, USB mouse, monitor, and mass storage devices to the appropriate connectors on the
baseboard. Refer to the baseboard‟s User Manual for peripheral compatibility and interface cabling
considerations.

CME-Atom User Manual 1.2 www.diamondsystems.com Page 12
3.3 Booting the System
Power-up the display, then power-up the system power supply.
The CME-Atom module should begin its boot-up sequence immediately, as evidenced by BIOS messages on the
connected display. You can use the BIOS Setup utility and install an operating system on the boot drive just as
you would on a normal desktop PC.
3.4 BIOS Setup Utility
The BIOS Setup utility program is used for specifying the system configurations and settings. The BIOS ROM of
the system stores the Setup utility. When you turn on the computer, the BIOS is immediately activated. The
following menus/options are available:
Main Setup Menu
Advanced Setup Menu
PCI/PnP Setup Menu
Boot Setup Menu
Security Setup Menu
Chipset Setup Menu
Exit
Use the left/right arrow keys to highlight a particular configuration screen from the top menu bar, or use the down
arrow key to access and configure the information in the menus which are described below.
3.4.1 Main Setup Menu
This menu allows you to select configuration options for the following:
System Time
System Date
3.4.2 Advanced Setup Menu
This menu allows you to select configuration options for the following:
CPU Configuration –Settings for Hardware Prefetcher, Adjacent Cache Line Prefetch, Cache L1 & L2,
Max CPUID Value Limit, Vanderpool Technology, Core Multi-Processing, and Intel® SpeedStep™ Tech.
Mass Storage Configuration –Settings for hard drives (Primary/Secondary, Master/Slave).
Floppy Configuration –Settings for the type of floppy drive installed on the system.
Super IO Configuration –Settings for Onboard Floppy Controller, Serial Port1 / Port2 Address, Serial
Port2 Mode, Parallel Port Address, Parallel Port Mode, Parallel Port IRQ, Restore on AC Power Loss by
IO.
Hardware Health Configuration –Settings for System/ CPU Temperature 1, CPU / System Fan Speed,
Vcore (CPU voltage), +5.0V / +3.3V / +12.0V / 5Vsb / VBAT (standby and battery voltage).
ACPI Configuration –Settings for Suspend mode.
AHCI Configuration –Settings for AHCI Ports.
APM Configuration –Settings for Power Management/APM, Video Power Down Mode, Hard Diks Power
Down Mode, Suspend Time Out, Keyboard & PS/2 Mouse, Power Button Mode, Advanced Resume
Event Controls.

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MPS Configuration –Settings for MPS Revision (multi-processor version control).
USB Configuration –Settings for Legacy USB Support, USB 2.0 Controller Mode, BIOS EHCI Hand-Off,
USB Mass Storage Reset Delay, Emulation Type (floppy/hard drive).
Remote Access Configuration –Settings for Remote Access, Serial port number, Base Address IRQ.
3.4.3 PCI/PnP Settings Menu
This menu allows you to select configuration options for the following:
Clear NVRAM
Plug & Play O/S
PCI Latency Timer
Allocate IRQ to PCI VGA
IRQ3 - IRQ15
DMA Channel 0 - DMA Channel 7
Reserved Memory Size
3.4.4 Boot Settings Menu
This menu allows you to select configuration options for the following:
Boot Device Priority
Hard Disk Drives
Removable Drives
Quick Boot
Bootup Num-Lock
LAN Boot Function
3.4.5 Security Settings Menu
This menu allows you to select configuration options for the following:
Supervisor Password & User Password
Boot Sector Virus Protection
3.4.6 Chipset Settings Menu
This menu allows you to select configuration options for the following:
North Bridge Chipset Configuration –Settings for Boots Graphic Adapter Priority, Internal Graphic Mode
Select, Video Function Configuration, DVMT Mode and Memory, Boot Display (CRT, LVDS), Flat Panel
Type, TV Standard, Spread Spectrum Clock.

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South Bridge Chipset Configuration –Settings for USB Function (active ports), USB 2.0 Controller, HDA
Controller, SLP_S4# Min. Assertion Width, Onboard LAN1.
3.4.7 Exit
This selection saves changes and exits the BIOS Setup Utility.
3.5 Operating System Drivers
Drivers for Windows XP and Linux 2.6, if required, are included on the Software and Documentation CD that is
provided along with the CME-Atom or in its Development Kit. To locate the CME-Atom module‟s software drivers
on the CD, view the index.html file in the CD‟s root directory, locate “Computer-on-Modules,” and then click on
“CME-Atom.” This software is also available for download from Diamond‟s website.
3.6 BIOS Beep Sounds List
Post BIOS Beep Codes
Number of Beeps
Description
1
Memory refresh timer error.
2
Parity error in base memory (first 64KB block)
3
Base memory read/write test error
4
Motherboard timer not operational
5
Processor error
6
8042 Gate A20 test error (cannot switch to protected mode)
7
General exception error (processor exception interrupt error)
8
Display memory error (system video adapter)
9
AMIBIOS ROM checksum error
10
CMOS shutdown register read/write error
More BIOS information is included in the Appendix.

CME-Atom User Manual 1.2 www.diamondsystems.com Page 15
4. INTERFACE CONNECTOR DETAILS
This section describes the functions available on the COM Express AB and CD interface connectors.
Note: The COM Express specification is available from the PICMG organization
(http://www.picmg.org). The COM Express Tutorial and COM Express Design Guide are available
for download from the PICMG organization COM Express website located at:
http://www.picmg.org/v2internal/COMExpress.htm.

CME-Atom User Manual 1.2 www.diamondsystems.com Page 16
4.1 COM Express AB Connector
The 2x110-pin, high-density COM Express AB connector implements the board‟s USB, PCI Express, SATA,
LVDS, LPC, AC97 (audio), VGA (CRT), LAN, power and ground interfaces, and system and power management,
as indicated in the table below. Further information regarding each of these signal groups follows the table. (Note:
Pins designated “NC” should be left unconnected.)
GND
B1
A1
GND
USB7-
B36
A36
USB6-
GBE0_ACT#
B2
A2
GBE0_MDI3-
USB7+
B37
A37
USB6+
LPC_FRAME#
B3
A3
GBE0_MDI3+
USB_4_5_OC#
B38
A38
USB_6_7_OC#
LPC_AD0
B4
A4
GBE0_LINK100#
USB5-
B39
A39
USB4-
LPC_AD1
B5
A5
GBE0_LINK1000#
USB5+
B40
A40
USB4+
LPC_AD2
B6
A6
GBE0_MDI2-
GND
B41
A41
GND
LPC_AD3
B7
A7
GBE0_MDI2+
USB3-
B42
A42
USB2-
LPC_DRQ0#
B8
A8
NC
USB3+
B43
A43
USB2+
LPC_DRQ1#
B9
A9
GBE0_MDI1-
USB_0_1_OC#
B44
A44
USB_2_3_OC#
LPC_CLK
B10
A10
GBE0_MDI1+
USB1-
B45
A45
USB0-
GND
B11
A11
GND
USB1+
B46
A46
USB0+
PWRBTN#
B12
A12
GBE0_MDI0-
EXCD1_PERST#
B47
A47
VCC_RTC
SMB_CK
B13
A13
GBE0_MDI0+
EXCD1_CPPE#
B48
A48
EXCD0_PERST#
SMB_DAT
B14
A14
GBE0_CTREF
SYS_RESET#
B49
A49
EXCD0_CPPE#
SMB_ALERT#
B15
A15
SUS_S3#
CB_RESET#
B50
A50
LPC_SERIRQ
NC
B16
A16
SATA0_TX+
GND
B51
A51
GND
NC
B17
A17
SATA0_TX-
NC
B52
A52
NC
SUS_STAT#
B18
A18
SUS_S4#
NC
B53
A53
NC
NC
B19
A19
SATA0_RX+
GPO1
B54
A54
GPI0
NC
B20
A20
SATA0_RX-
NC
B55
A55
NC
GND
B21
A21
GND
NC
B56
A56
NC
NC
B22
A22
SATA2_TX+
GPO2
B57
A57
GND
NC
B23
A23
SATA2_TX-
NC
B58
A58
NC
PWR_OK
B24
A24
SUS_S5#
NC
B59
A59
NC
NC
B25
A25
SATA2_RX+
GND
B60
A60
GND
NC
B26
A26
SATA2_RX-
PCIE_RX2+
B61
A61
PCIE_TX2+
WDT
B27
A27
BATLOW#
PCIE_RX2-
B62
A62
PCIE_TX2-
AC_SDIN2
B28
A28
ATA_ACT#
GPO3
B63
A63
GPI1
AC_SDIN1
B29
A29
AC_SYNC
PCIE_RX1+
B64
A64
PCIE_TX1+
AC_SDIN0
B30
A30
AC_RST#
PCIE_RX1-
B65
A65
PCIE_TX1-
GND
B31
A31
GND
WAKE0#
B66
A66
GND
SPKR
B32
A32
AC_BITCLK
WAKE1#
B67
A67
GPI2
I2C_CK
B33
A33
AC_SDOUT
PCIE_RX0+
B68
A68
PCIE_TX0+
I2C_DAT
B34
A34
BIOS_DISABLE#
PCIE_RX0-
B69
A69
PCIE_TX0-
THRM#
B35
A35
THRMTRIP#
GND
B70
A70
GND

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LVDS_B0+
B71
A71
LVDS_A0+
VGA_GRN
B91
A91
RSVD
LVDS_B0-
B72
A72
LVDS_A0-
VGA_BLU
B92
A92
RSVD
LVDS_B1+
B73
A73
LVDS_A1+
VGA_HSYNC
B93
A93
GPO0
LVDS_B1-
B74
A74
LVDS_A1-
VGA_VSYNC
B94
A94
RSVD
LVDS_B2+
B75
A75
LVDS_A2+
VGA_I2C_CK
B95
A95
RSVD
LVDS_B2-
B76
A76
LVDS_A2-
VGA_I2C_DAT
B96
A96
GND
NC
B77
A77
LVDS_VDD_EN
TV_DAC_A
B97
A97
VCC_12V
NC
B78
A78
NC
TV_DAC_B
B98
A98
VCC_12V
LVDS_BKLT_EN
B79
A79
NC
TV_DAC_C
B99
A99
VCC_12V
GND
B80
A80
GND
GND
B100
A100
GND
LVDS_B_CK+
B81
A81
LVDS_A_CK+
VCC_12V
B101
A101
VCC_12V
LVDS_B_CK-
B82
A82
LVDS_A_CK-
VCC_12V
B102
A102
VCC_12V
CKLVDS_BKLT_CTRL
B83
A83
LVDS_I2C_CK
VCC_12V
B103
A103
VCC_12V
VCC_5V_SBY
B84
A84
LVDS_I2C_DAT
VCC_12V
B104
A104
VCC_12V
VCC_5V_SBY
B85
A85
GPI3
VCC_12V
B105
A105
VCC_12V
VCC_5V_SBY
B86
A86
KBD_RST#
VCC_12V
B106
A106
VCC_12V
VCC_5V_SBY
B87
A87
KBD_A20GATE
VCC_12V
B107
A107
VCC_12V
RSVD
B88
A88
PCIE0_CK_REF+
VCC_12V
B108
A108
VCC_12V
VGA_RED
B89
A89
PCIE0_CK_REF-
VCC_12V
B109
A109
VCC_12V
GND
B90
A90
GND
GND
B110
A110
GND

CME-Atom User Manual 1.2 www.diamondsystems.com Page 18
4.1.1 USB signals
These pins provide connections to the board‟s eight USB channels. For further information regarding the functions
of the USB signals listed above, refer to the USB 2.0 Specification, available from the USB Implementers Forum
(http://www.usb.org).
Signal Name
Signal Function
Direction
USB[0:7]+
USB[0:7]-
USB differential pairs, data channels 0 through 7.
I/O
USB_0_1_OC#
USB over-current sense, USB channels 0 and 1.
I
USB_2_3_OC#
USB over-current sense, USB channels 2 and 3.
I
USB_4_5_OC#
USB over-current sense, USB channels 4 and 5.
I
USB_6_7_OC#
USB over-current sense, USB channels 6 and 7.
I
4.1.2 Gigabit Ethernet (LAN)
These pins provide connections to the GigE (LAN) interface.
Signal Name
Signal Function
Direction
GBE0_MDI[0:3]+
GBE0_MDI[0:3]-
Gigabit Ethernet Controller 0: Media Dependent Interface
Differential Pairs 0,1,2,3.
I/O
GBE0_ACT#
Gigabit Ethernet Controller 0 activity indicator.
OD
GBE0_LINK#
Gigabit Ethernet Controller 0 link indicator.
OD
GBE0_LINK100#
Gigabit Ethernet Controller 0 100 Mbit / sec link indicator.
OD
GBE0_LINK1000#
Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator.
OD
GBE0_CTREF
Reference voltage for carrier board Ethernet channel 0
magnetics center tap.
REF
4.1.3 AC97 Audio/High Definition Audio
These pins provide connections to the high definition audio interface.
Signal Name
Signal Function
Direction
AC_RST#
Reset output to AC97 CODEC.
O
AC_SYNC
48kHz fixed-rate, sample-synchronization signal to the
CODEC(s).
O
AC_BITCLK
12.228 MHz serial data clock generated by the external
CODEC(s).
I/O
AC_SDOUT
Serial TDM data output to the CODEC.
O
AC_SDIN[0:2]
Serial TDM data inputs from up to 3 CODECs/
I

CME-Atom User Manual 1.2 www.diamondsystems.com Page 19
4.1.4 PCI Express
These pins provide connections to the PCI Express interface and card.
Signal Name
Signal Function
Direction
PCIE_TX[0:3]+
PCIE_TX[0:3]-
PCI Express Differential Transmit Pairs 0 through 3
O
PCIE_RX[0:3]+
PCIE_RX[0:3]-
PCI Express Differential Receive Pairs 0 through 3
I
PCIE_CLK_REF+/-
PCI Express Clock Reference.
I
EXCD_CPPE[0:1]
PCI Express Card.
I
EXCD_RST[0:1]#
PCI Express Card reset.
I
4.1.5 SATA
These pins carry the Serial ATA signals.
Signal Name
Signal Function
Direction
SATA0_TX+
SATA0_TX
Serial ATA or SAS Channel 0 transmit differential pair.
O
SATA0_RX+
SATA0_RX
Serial ATA or SAS Channel 0 receive differential pair.
I
SATA2_TX+
SATA2_TX
Serial ATA or SAS Channel 2 transmit differential pair.
O
SATA2_RX+
SATA2_RX
Serial ATA or SAS Channel 2 receive differential pair.
I
ATA_ACT#
ATA (parallel and serial) or SAS activity indicator.
O
4.1.6 General Purpose Inputs and Outputs (GPIO)
These pins carry four general purpose input lines and four general purpose outputs.
Signal Name
Signal Function
Direction
GPO[0:3]
General purpose output pins.
O
GPI[0:3]
General purpose input pins.
I

CME-Atom User Manual 1.2 www.diamondsystems.com Page 20
4.1.7 Power and System Management
These pins support various power management and control functions.
Signal Name
Signal Function
Direction
PWRBTN#
Power button to bring system out of S5 (soft off), active on
rising edge.
I
SYS_RESET#
Reset button input.
I
CB_RESET#
Reset output from module to carrier board.
O
PWR_OK
Power OK from main power supply.
I
SUS_STAT#
Indicates imminent suspend operation; used to notify LPC
devices.
O
SUS_S3#
Indicates system is in Suspend to RAM state.
O
SUS_S4#
Indicates system is in Suspend to Disk state.
O
SUS_S5#
Indicates system is in Soft Off state. Also known as
"PS_ON" and can be used to control an ATX power
supply.
O
WAKE0#
PCI Express wake up signal.
I
WAKE1#
General purpose wake up signal.
I
BATLOW#
Indicates that external battery is low.
I
THRM#
Input from off-module temp sensor indicating an over-temp
situation.
I
THERMTRIP#
Active low output indicating that the CPU has entered
thermal shutdown.
O
SMB_CK
System Management Bus bidirectional clock line.
I/O
SMB_DAT
System Management Bus bidirectional data line.
I/O
SMB_ALERT#
System Management Bus Alert..
I