Digital Identification Solutions EDI secure XID580i User manual

KAS-T099-002
May 2006
SERVICE MANUAL
SUBLIMATION TYPE RETRANSFER PRINTER
EDI secure
XID580i
Digital Identification Solutions Group of Companies
Teckstrasse 52, D-73734 Esslingen Germany
Phone : [phone] - 0
Facsimile : [phone] - 550
Recording method : Sublimation type retransfer
Feed format :Automatic feed
Recording density :300 dpi
Expression gradation : 256 gradations for each
color
Printing time :Approx. 29 seconds (for
single-sided printing,
excluding data transfer
time)
Interface :USB2.0 (standard)
Operating environment conditions
Temperature: 15°C ~ 30°C
Humidity: 35% ~ 70%
(no condensation)
Storage environment conditions
Temperature: -15°C ~ 55°C
Humidity: 20% ~ 80%
Power supply :100 — 120 V AC/
220 — 240 VAC
(allowance±10%)
Current dissipation :7.0A (for 100V system)/
5.0A (for 200V system)
Mass :Standard 22.0kg
Excluding the built-in
magnetic encoder
CX21ICL Series (Large-type IC unit)
Power supply :Fed from the printer.
5V±5% DC, 12V±5% DC, 24V±5%
DC
Current dissipation :500mA, 300mA, 1A
Mass :3.5kg
Dimension (mm) :110(W) ×221(D) ×255(H)
Accessories :Joint plate ×1
Inter-unit cable ×1
CX21ICS Series (Small-type IC unit)
Power supply :Fed from the printer.
Mass :0.5kg
Dimension (mm) :50(W) ×152(D) ×115(H)
Accessories :Screw (with washer) ×3
Screw (without washer) ×2
Products sold separately
:Ink ribon, retransfer film : Cleaning card
1,000 frames/set 10 card /set
Model : CY-P340A Model : CX210-CC1
:Laminator Unit :
Model : ILU
:Card tray
When setting paper feeding feature on the right
Model: CF-3NTR
: Hand gloves M Size (U105-M)
L Size (U105-L)
Accessories :Power cable
For 120 V AC
x 1
Dark gray (North America)
For 220 to 240 V AC
x 1
(Europe)
Instruction manual
English
x 1
Card stacker
×1
Ink ribbon cassette
×1
Retransfer film cassette
×1
Jog lever (contained in the
card tray)
×1
SPECIFICATIONS
* The detached power cords and the Instruction
manual vary according to model and country of
purchase.

IMPORTANT SAFETY PRECAUTIONS
INSTRUCTIONS
MODEL NAME ................................................................................. 1
1. Detailed specifications .................................................................... 1
HOW TO CONNECT SEPARATELY SOLD PARTS .................. 2
1. Connecting the Small IC Unit .......................................................... 2
2. Connection of the Magnetic/Contact-type IC Encoder .................... 3
3. Connecting card tray ....................................................................... 4
BLOCK DIAGRAM .......................................................................... 5
1. OVERALL BLOCK DIAGRAM ......................................................... 5
2. BLOCK DIAGRAM OF PRIMARY SIDE OF POWERUNIT ............. 6
3. INTERLOCK SW BLOCK DIAGRAM .............................................. 7
4. BLOCK DIAGRAM OF THE FPGA CIRCUMFERENCE
ON A CPU BOARD ................................................................... 8
WIRING DIAGRAM ....................................................................... 9
Main Parts Layout .......................................................................... 10
1. Sensor-related ............................................................................... 10
2. Related to Thermal Head and Rollers ........................................... 10
3. Motor-related ................................................................................. 11
4. Solenoid-RELATED ....................................................................... 11
5. Switch-related ............................................................................... 12
6. Related to Circuit Boards, Power Supply Unit, and Fans .............. 12
7. RF-ID ............................................................................................. 14
REMOVAL AND EXCHANGE OF THE MAIN PARTS ............ 15
1. CHECKING AT THE TIME OF SERVICING .................................. 15
1.1 REMOVE THE TOP COVER AND THE REAR PANEL. .......... 15
1.2 REMOVE THE MG CIRCUIT BOARD. .................................... 15
1.3 SWING DOWN THE POWER SUPPLY UNIT. ........................ 16
2. REMOVAL AND EXCHANGE OF THE MAIN PARTS ................... 16
2.1 REMOVAL OF THE HEAT ROLLER ....................................... 16
2.1.1 Removal of the Bend Remedy Roller ............................... 16
2.1.2 Removal of the Heat Roller .............................................. 16
2.2 REMOVAL OF THE CAM MOTOR .......................................... 17
2.2.1 Installation of the Cam Motor ........................................... 18
2.3 REMOVAL OF THE RETRANSFER FILM SUPPLY
MOTOR ............................................................................ 18
2.3.1 Installation of the Retransfer Film Supply Motor ............... 19
2.4 REMOVAL OF THE RETRANSFER FILM TAKE UP
FILM WINDING MOTOR .................................................. 20
2.5 REMOVAL OF THE CARD FEED MOTOR ............................. 20
2.5.1 Installation of the Card Feed Motor .................................. 20
2.6 REMOVAL OF THE INK SUPPLY MOTOR AND
THE INK TAKE-UP MOTOR ............................................. 21
2.7 REMOVAL OF THE TURNOVER MOTOR AND
THE TURNOVER CARD FEED MOTOR .......................... 21
2.8 REMOVAL OF THE CARD PICKUP MOTOR ......................... 21
2.9 REMOVAL OF THE FRONT PANEL ....................................... 21
2.10 REMOVAL OF THE PLATEN SOLENOID ............................ 22
2.10.1 Installation of the Platen Solenoid.................................. 22
2.11 REMOVAL OF THE POWER SUPPLY UNIT ........................ 22
2.12 REMOVAL OF SENSORS AND SWITCHES ....................... 23
2.12.1 Removal of the Cam Sensor .......................................... 23
2.12.2 Removal of the Card Outlet Sensor ............................... 23
2.12.3 Removal of the Ink Encoder Circuit Board ..................... 23
2.12.4 Removal of the External Unit Power Circuit Board ........ 23
2.12.5 Removal of the Turnover Initial Position sensor ............. 24
2.12.6 Removal of the Card Near-empty Sensor ...................... 24
2.12.7 Removal of the No Card Sensor .................................... 24
2.12.8 Removal of the Retransfer roller/
Remedial Roller Sensor ....................................... 24
2.12.9 Removal of the Retransfer Film Mark/Ink Start Position
Sensor Circuit Board and the Card Edge Sensor ... 25
2.12.10 Removal of the C.L. Interlock Circuit Board and
the Card Supply Sensor ....................................... 25
2.12.11 Removal of the Door Interlock Circuit Board .............. 26
2.12.12 Removal of the Cassette Interlock Circuit Board ....... 26
2.12.13 Removal of the Card Tray Interlock Circuit Board ...... 27
2.12.14 Removal of the Turnover Card Sensor
Circuit Board ........................................................ 27
2.13 REMOVAL OF THE TURNOVER UNIT ................................ 27
2.14 FAN REMOVAL .................................................................... 28
2.14.1 Removal of the Thermal Head Cooling Fan ................... 28
2.14.2 Removal of the Suction Fan ........................................... 28
2.14.3 Removal of the Card Cooling Fan .................................. 28
2.14.4 Removal of the Ventilation Fan ....................................... 29
2.15 ROLLER REMOVAL ............................................................. 30
2.15.1 Feed Roller Removal ..................................................... 30
2.15.2 Platen Roller Assy Removal .......................................... 31
2.16 CIRCUIT BOARD REMOVAL ............................................... 32
2.16.1 Removal of the Main Circuit Board ................................ 32
2.17 Thermal Head Exchange Method ......................................... 33
USE OF SERVICE MODE ........................................................... 35
1. Entry into Service Mode ................................................................ 35
2. Explanation of the Various Modes ................................................. 37
2.1 Download ................................................................................ 37
2.2 Maintenance ........................................................................... 37
2.2.1 Offset Prt Y Setting ........................................................... 37
2.2.2 Offset Prt X Setting ........................................................... 37
2.2.3 Offset Trf X Setting ........................................................... 38
2.2.4 Card Stop Position Setting (Offset Card X) ...................... 38
2.2.5 Default LUT Setting .......................................................... 38
2.2.6 Device Type Setting .......................................................... 38
2.2.7 Card Fan Setting .............................................................. 38
2.2.8 TUR Response Setting ..................................................... 38
2.2.9 Compatible Mode Setting ................................................. 38
2.2.10 Setting of the ink sensor level ........................................ 38
2.3 Off-line Test ............................................................................. 39
2.3.1 Pattern setting .................................................................. 39
2.3.2 Printing Side ..................................................................... 40
CONTENTS

2.3.3 Times ................................................................................ 40
2.3.4 Test Select ........................................................................ 40
2.4 Diag. Test ................................................................................ 40
2.4.1 Sensor .............................................................................. 40
2.4.2 Actuator ............................................................................ 40
2.4.3 Memory ............................................................................ 41
2.4.4 SIO ................................................................................... 41
2.4.5 Display .............................................................................. 41
2.4.6 Back Color ........................................................................ 41
2.4.7 Buzzer .............................................................................. 41
2.4.8 Registers .......................................................................... 41
2.5 Information .............................................................................. 41
2.6 Parameter Push and Pop ........................................................ 41
OPERATION OF THE MECHANISM ......................................... 42
1. Single-side Printing ....................................................................... 42
2. Double-side Printing ...................................................................... 42
3. Initial Operation ............................................................................. 42
4. Card Supply and Card Feed .......................................................... 43
5. Printing Operation ......................................................................... 45
6. Retransfer Operation ..................................................................... 47
7. Operation in Case of Peeling with Return in Direction Towards
the Turnover Unit ..................................................................... 49
8. Operation of the Turnover Unit ...................................................... 50
9. Others ........................................................................................... 51
9.1 Position Relation with Ink Ribbon and Retransfer Film ........... 51
9.2 Ink Ribbon and Retransfer Film End Treatment ...................... 51
TROUBLESHOOTING .................................................................. 52
1. LCD Error Code Correspondence ................................................. 52
2. Printing Defects and Countermeasures ........................................ 57
3. Power Supply Check ..................................................................... 61
MAINTENANCE INSPECTIONS ................................................ 62
1. Cleaning ........................................................................................ 62
2. Lubrication ..................................................................................... 62
3. Maintenance Inspections for Main Parts and
Execution Standard ................................................................. 62
4. Periodic Inspection Items .............................................................. 63
5. Trouble Diagnosis Sheet ............................................................... 64
ADJUSTMENT ............................................................................... 65
1. Layout of the adjustment elements ............................................... 65
2. Adjustment .................................................................................... 65
3. Caution Items for the Time of Exchange of
the CPU Circuit Board ............................................................ 65
MG ENCODING UNIT .................................................................. 66
1. MG Encoding Specifications ......................................................... 66
1.1 Magnetic Encoder Specifications ............................................ 66
1.2 General Equipment Specifications .......................................... 66
2. Block Diagram ............................................................................... 67
2.1 MG Unit Block Diagram .......................................................... 67
2.2 Connection Diagram ............................................................... 68
3. MG Encoding Unit Exchange Method ........................................... 69
3.1 Repair Classification ............................................................... 69
3.2 Exchange Method ................................................................... 69
3.3 DIP Switch Specifications ....................................................... 71
3.4 MG-related Error Messages ................................................... 72
LARGE IC UNIT .................................................................... 73
1. Removal of Each Part ................................................................... 73
1.1 Removal of the Top Cover ....................................................... 73
1.2 Removal of the Front Panel .................................................... 73
1.3 Removal of the Mechanical Unit ............................................. 73
1.4 Removal of the IC Main Circuit Board ..................................... 73
1.5 Others ..................................................................................... 73
2. Block Diagram ............................................................................... 74
3. DIP Switch Specifications ............................................................. 75
3.1 Specifications .......................................................................... 75
3.2 IC Card Stop Position Adjustment .......................................... 75
4. Error Messages ............................................................................. 76
5. Specifications of Connector on the IC Main Board ....................... 77
EXPLODED VIEW AND ASSEMBLY LISTS ............................ 78
HOPPER ASSEMBLY1/2 — 2/2 ................................................... 79
FRAME ASSEMBLY1/7 — 7/7 ..................................................... 81
PLATEN ASSEMBLY1/1 ............................................................... 88
PICK UP MOTOR ASSEMBLY1/1 ................................................ 89
FEED MOTOR ASSEMBLY1/1 ..................................................... 90
MEDIA W MOTOR ASSEMBLY1/1 ............................................... 91
MEDIA S MOTOR ASSEMBLY1/2 — 2/2 ..................................... 92
INK S&W MOTOR ASSEMBLY1/1 ............................................... 94
HEATER CAM MTR ASSEMBLY1/1 ............................................. 95
TURN MOTOR ASSEMBLY1/1 ..................................................... 96
TURN UNIT ASSEMBLY1/1 ......................................................... 97
MECHANISM ASSEMBLY1/12 — 12/12 ...................................... 98
FRONT PANEL ASSEMBLY1/2 — 2/2 ....................................... 109
PR COMMON ASSEMBLY1/4 — 4/4 ......................................... 111
FINAL ASSEMBLY1/14 — 14/14 ................................................ 115

Important Safety Precautions
Prior to shipment from the factory, VDS products are strictly inspected to conform with the recognized product safety and electrical codes of the
countries in which they are to be sold. However, in order to maintain such compliance, it is equally important to implement the following precautions
when a set is being serviced.
Fig.1
1. Locations requiring special caution are denoted by labels and in-
scriptions on the cabinet, chassis and certain parts of the product.
When performing service, be sure to read and comply with these
and other cautionary notices appearing in the operation and serv-
ice manuals.
2. Parts identified by the !symbol and shaded ( ) parts are
critical for safety.
Replace only with specified part numbers.
Note: Parts in this category also include those specified to com-
ply with X-ray emission standards for products using
cathode ray tubes and those specified for compliance
with various regulations regarding spurious radiation
emission.
3. Fuse replacement caution notice.
Caution for continued protection against fire hazard.
Replace only with same type and rated fuse(s) as specified.
4. Use specified internal wiring. Note especially:
1) Wires covered with PVC tubing
2) Double insulated wires
3) High voltage leads
5. Use specified insulating materials for hazardous live parts. Note
especially:
1) Insulation Tape 3) Spacers 5) Barrier
2) PVC tubing 4) Insulation sheets for transistors
6. When replacing AC primary side components (transformers, power
cords, noise blocking capacitors, etc.) wrap ends of wires securely
about the terminals before soldering.
Power cord
Fig.2
10. Also check areas surrounding repaired locations.
11. Products using cathode ray tubes (CRTs)
In regard to such products, the cathode ray tubes themselves, the
high voltage circuits, and related circuits are specified for compli-
ance with recognized codes pertaining to X-ray emission.
Consequently, when servicing these products, replace the cath-
ode ray tubes and other parts with only the specified parts. Under
no circumstances attempt to modify these circuits.
Unauthorized modification can increase the high voltage value and
cause X-ray emission from the cathode ray tube.
12. Crimp type wire connector
In such cases as when replacing the power transformer in sets
where the connections between the power cord and power trans-
former primary lead wires are performed using crimp type connec-
tors, if replacing the connectors is unavoidable, in order to prevent
safety hazards, perform carefully and precisely according to the
following steps.
1) Connector part number : E03830-001
2) Required tool : Connector crimping tool of the proper type which
will not damage insulated parts.
3) Replacement procedure
(1) Remove the old connector by cutting the wires at a point
close to the connector.
Important : Do not reuse a connector (discard it).
Fig.7
cut close to connector
Fig.3
(2) Strip about 15 mm of the insulation from the ends of the
wires. If the wires are stranded, twist the strands to avoid
frayed conductors.
15 mm
Fig.4
(3) Align the lengths of the wires to be connected. Insert the
wires fully into the connector.
Connector
Metal sleeve
Fig.5
(4) As shown in Fig.6, use the crimping tool to crimp the metal
sleeve at the center position. Be sure to crimp fully to the
complete closure of the tool.
I
•Precautions during Servicing
7. Observe that wires do not contact heat producing parts (heatsinks,
oxide metal film resistors, fusible resistors, etc.)
8. Check that replaced wires do not contact sharp edged or pointed
parts.
9. When a power cord has been replaced, check that 10-15 kg of
force in any direction will not loosen it.
1.25
2.0
5.5
Crimping tool
Fig.6
(5) Check the four points noted in Fig.7.
Not easily pulled free Crimped at approx. center
of metal sleeve
Conductors extended
Wire insulation recessed
more than 4 mm
S40888-01

•Safety Check after Servicing
Examine the area surrounding the repaired location for damage or deterioration. Observe that screws, parts and wires have been returned
to original positions, Afterwards, perform the following tests and confirm the specified values in order to verify compliance with safety
standards.
1. Insulation resistance test
Confirm the specified insulation resistance or greater between power cord plug prongs and exter-
nally exposed parts of the set (RF terminals, antenna terminals, video and audio input and output
terminals, microphone jacks, earphone jacks, etc.). See table 1 below.
2. Dielectric strength test
Confirm specified dielectric strength or greater between power cord plug prongs and exposed acces-
sible parts of the set (RF terminals, antenna terminals, video and audio input and output terminals,
microphone jacks, earphone jacks, etc.). See table 1 below.
3. Clearance distance
When replacing primary circuit components, confirm specified clearance distance (d), (d’) be-
tween soldered terminals, and between terminals and surrounding metallic parts. See table 1
below.
4. Leakage current test
Confirm specified or lower leakage current between earth ground/power cord plug prongs and
externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks, etc.).
Measuring Method : (Power ON)
Insert load Z between earth ground/power cord plug prongs and externally exposed accessible
parts. Use an AC voltmeter to measure across both terminals of load Z. See figure 9 and following
table 2.
5. Grounding (Class 1 model only)
Confirm specified or lower grounding impedance between earth pin in AC inlet and externally exposed accessible parts (Video in, Video out,
Audio in, Audio out or Fixing screw etc.).
Measuring Method:
Connect milli ohm meter between earth pin in AC inlet and exposed accessible parts. See figure 10 and grounding specifications.
Fig. 10
Fig. 9
Fig. 8
Table 1 Specifications for each region
Table 2 Leakage current specifications for each region
Note: These tables are unofficial and for reference only. Be sure to confirm the precise values for your particular country and locality.
II
S40888-01
ab
c
V
A
Externally
exposed
accessible part
Z
Clearance Distance (d), (d')
d, d' 3 mm
d, d' 4 mm
d, d' 3.2 mm
1 MΩR 12 MΩ/500 V DC
Dielectric Strength
AC 1 kV 1 minute
AC 1.5 kV 1 miute
AC 1 kV 1 minute
AC Line Voltage
100 V
100 to 240 V
110 to 130 V
110 to 130 V
200 to 240 V
Japan
USA & Canada
Europe & Australia R 10 MΩ/500 V DC
Region
Insulation Resistance (R)
R 1 MΩ/500 V DC
≤
≤
≥≥
≤
≤
≤
≤
≤
≤
AC 3 kV 1 minute
(Class 2)
AC 1.5 kV 1 minute
(Class 1)
d 4 mm
d' 8 mm (Power cord)
d' 6 mm (Primary wire)

1
The letters and numbers following the model name are used to differentiate between destinations and specifications.
Model name: XID580i - #
MODEL NAME
1. Detailed specifications
# Portion – Internal option
Nil ......... No option (Standard model)
B........... Equipped with ISO magnetic encorder / IC contact

2
HOW TO CONNECT SEPARATELY SOLD PARTS
1. Connecting the Small-type IC Unit
1. Remove the cover on the side of the printer.
Remove the screw, and then raise the cover to remove it.
Pass the cable through the notch.
Screw with washer
(provided)
Screw
(provided)
2. Connect the connector.
Please note that the connector has directionality.
3. Install the unit with three screws.
Install the screws so that the cable of the connector
is not caught.
4. Install the cover with two screws.

3
2. Connection of the Magnetic/Contact-type IC Encoder
When the separately sold magnetic/contact-type IC encoder is to be connected to a standard printer, connect it accord-
ing to the following procedure.
For details in regard to the removal method for each part, refer to “Removal and exchange of the Main Parts”.
1) Remove the top cover.
2) Swing down the power supply.
3) Remove the front panel.
4) Install the magnetic unit. Fix with three black screws 8at the front and four black screws 8at the rear.
5) Install the bracket fixing the MG circuit board with four screws 6.
Pass the wires of
power switch.
Explanation drawing 1
CN12 11
KWR17110-001
9
x6
8
8
8
12
KWR18416-001
(TSA0141)
2
1
(TFA0023)
G.NO.004
6
J9
J10
14 KWS0767-002
KWS0768-001
J14
J10
J14
J10
15
13 KWS0744-001
J14
J10
CN3
Clamp
Explanation drawing 1
Clamp Clamp
Explanation
drawing 1
MG PWB SA
Explanation
drawing 2
6
6
6
J1
CLAMP
6
8
CLAMP
J7
J3
J5
J4
J8
3pin
CLAMP
Explanation
drawing 2
Make the cable routed
away from the rail

4
3. Connecting card tray
Upon issuing the card using paper feeding feature on the right, as the NG cards transported to the printer will be ejected,
replace the standard hopper unit with an optional card tray.
Mount the card tray according to the following procedures:
1. Pull out the standard hopper unit diagonally upwards.
2. Insert the optional card tray diagonally downwards.
(Note: The cleaning roller should be left as it is.)
3. Enter the service mode of the printer main unit, select “Card Loading” under the maintenance items and switch from
“standard” to “Right Side”.
4. Settings other than this and operating procedures are dependent to the user system.
Note: If there are 10 cards accumulated continuously in the card tray, the printer will display “Card Tray Full”. Remove
the cards immediately.
5. Keep the removed hopper unit safely.

5
BLOCK DIAGRAM
1. OVERALL BLOCK DIAGRAM
THERMAL HEAD
HEAD
CONN
PWB
U1
EEPROM
32Kbit
HEAD BLOCK
MAIN PWB
FRONT PWB
POWER
SUPPLY
UNIT
U1
CPU
X1
XTAL
66.67MHz
U7
EEPROM
32Kbit
U2
SDRAM
64Mbit
U3
FLASH ROM
16Mbit
TR THERMISTOR
RR THERMISTOR
DRIVE PWB
NO CARD
CARD IN
CARD (MG POSITION) (PWB)
(OPTION(MGIC))
CARD (TURN) (PWB)
TURN POSITION
EDJE (PWB)
CARD OUT (PWB)
FILM MARK (PWB)
CAM POSITION
TR POSITION
RR POSITION
INK FG(PWB)
CARD NEAR EMPTY
INK FG
(MOTOR built-in)
FILMFG (MOTOR built-in)
SENSORS
U5
SDRAM
64Mbit
U5
FLASH ROM
16Mbit
SENSORS
THERMISTOR &
CONNECTOR (PWB)
EXTERNALUNIT
HEATER PROTECTOR PWB
USB
I/F
Q13
REGULATOR
(A+5V)
U8
REGULATOR
(3.3V)
Q11
REGULATOR
(1.5V)
U10
REGULATOR
(1.8 V)
DC-DC circuit
U11
FPGA
U12
SDRAM
64Mbit
U1
DAConverter
LCD module
(16columX2line)
SWX6
COLOR
LED
LEDX2
BUZZER
U17
USB
chip
X1
XTAL
48MHz
U7
STEP MOTOR DRIVER
Q2
Q3
TRANSISTOR
Q5
TRANSISTOR
Q6
TRANSISTOR
Q7
TRANSISTOR
U8
STEP MOTOR DRIVER
U11
STEP MOTOR DRIVER
U13
DC MOTOR DRIVER
U14
DC MOTOR DRIVER
U15
DC MOTOR DRIVER
SOLENOID (PLATEN ROLLER)
SOLENOID (IC CONTACT(OPTION))
FAN (THERMAL HEAD)
FAN (CARD)
FAN (PRINTER)
CARD MOTOR
FILM MOTOR
CAM MOTOR
FILM MOTOR
INK MOTOR
INK MOTOR
TURN MOTOR
CARD MOTOR (TURN)
CARD MOTOR (PICK UP )
U9
STEP MOTOR DRIVER
U10
STEP MOTOR DRIVER
U16
DC MOTOR DRIVER
EXTERNAL
UNIT
EXTERNAL
UNIT
MG/IC UNIT(OPTION)
RF-ID UNIT
U14~16
BUFFER
U32,U33
COMPARATOR
U22,36~U39
BUFFER
U2
Serial to Parallel
U19
INVERTER
CPU BUS
U13
ADConverter
U2
RESET IC
(5V)
CLEANING ROLLER INTERLOCK SW
DOOR INTERLOCK SW
CASSETTE INTERLOCK SW
CARD TRAY INTERLOCK SW
FAN (PRINTER)
U7
CLK
DRIVER
X2
XTAL
32MHz

6
2. BLOCK DIAGRAM OF PRIMARY SIDE OF POWERUNIT
THERMOSTAT
HEATROLLER
(REMEDIAL)
t˚
THERMISTOR
(to DRIVE PWB)
THERMOSTAT
HEATROLLER
(RETRANSFER)
t˚
THERMISTOR
(to DRIVE PWB)
POWER
SUPPLY
UNIT
N(AC IN)
L(AC IN)
SSR2N
SSR2L
SSR1N
SSR1L
CN3
VTH
CN1
5V
12V
CN2
24V
CN8
24V_RC
CN4
CONTROL
SIGNAL
N(AC OUT)
L(AC OUT)
(to ANALOG POWER PWB)
FAIL SIGNAL
(to DRIVE PWB)
HEATER PROTECTOR PWB
POWER
SWITCH
CN1
CN2
AC
VOLTAGE
DETECT
PHOTO
COUPLER
ABNORMAL
CURRENT
DETECT
PHOTO
COUPLER
Primary
Secondary
SSR1L
SSR2L
ON/OFF
CN5
SSR
CN7
CN6
SSR

7
3. INTERLOCK SW BLOCK DIAGRAM
24V
U9
TURN MOTOR DRIVER
U10
CARD MOTOR DRIVER
U16
PICK UP MOTOR DRIVER
Cleaning roller SW (PWB)
Card Tray SW (PWB)
24V_RC
POWER
SUPPLY
UNIT
DRIVE PWB
Cassette SW (PWB)
Door SW (PWB)
J16
J18
J7
J6
CN8
Door SW (PWB) OPEN
and
Cassette SW (PWB) OPEN
24V OFF
Cleaning roller SW (PWB) OPEN
Card Tray SW (PWB) OPEN
Turn Motor STOP
Card Motor STOP
Pick up Motor STOP
Pick up Motor STOP
Specification of Interlock Switch
CN3
Vth
CN1
5V
12V
CN2
24V
CN4
24V_RC
Vth_RC
MAIN PWB

8
4. BLOCK DIAGRAM OF THE FPGA CIRCUMFERENCE ON A MAIN BOARD
TPH I/F BLOCK
Line Buffer Memory
x 2
Thermal Print Head
Print Data
Strobe
Lutch
SDRAM
4MWordx16bit
16bit
Data
Plane Memory
2MByte
Step Motor
Speed Up/Down
Table
(CPU generates
the table data.)
Heater control
Table(*2)
TPH Control
Table(*2)
(Strobe)
Tables for
Print Data
Correction(*2)
Work Memory
for PRINT BLOCK
(*1)(*2)These data are copied
from Flash Memory.
CPU I/F BLOCK
32bit CPU BUS
16bit
Data
CPU Flash
Memory
AD
CONVERTER
CONTROL
BLOCK
SDRAM I/F BLOCK
HEATER
CONTROL
BLOCK
(The Heaters
are controlled
by each
temperature.)
PRINT BLOCK
(Temperature
correction,
Outline emphasis,
LUT)
MOTOR
CONTROL
BLOCK
INTERNAL
CLOCK
GENERATOR
Microcode
Memory(*1)
512Word x 16bit
Data Processor
Sensor input
Motor
Solenoid
Control
Signals
Retransfer
Heater
Control Signal
Bend Remedial
Heater
Control Signal
Retransfer
Heater
Temperature
Bend Remedial
Heater
Temperature
TPH
Temperature
8
9
7
78
6
1
2
9
6
5
4
3
2
1
3
56
4
D/A
Interface
INK Sensor
LED Driver
*FPGA=
FieldPrgrambleGateArray

9
WIRING DIAGRAM
USB I/F
POWER SUPPLY
DRIVE PWB
Option1 I/FOption2 I/F Serial I/F
AC IN
DC5/12V
FRONT PWB
CTL1 VTH
HEAD PWB
MAIN PWB
CTL2ACAC
KWS0644-001
Step
Motor
Step
Motor
DC
Motor
CN8 CN9
Step
Motor
DC Motor
DC Motor
DC Motor
Step
Motor
OPTION
(MG/IC Block)
Step
Motor
S3
S1
S2
T2
F1
T1
Pick up motor Turn over motor
Turnover feed motor
Ink takeup motor
Ink supply motor
INK FG sensor
card supply sensor
Platen roller solenoid
Card edge sensor
HEATER
PROTECTOR
PWB
CN1 CN2
KWR16003-001
Turnover card sensor
Retranfer film mark sensor
No card sensor
Turnover initial position sensor
Card near empty sensor
Thermal Head cooling fan
Thermostat
Retransfer film Take up motor
Cam motor
Card feed motor
Retransfer film supply motor
Remedial Heat Roller Thermistor
Card outlet sencer
Retransfer Heat Roller Thermistor
Cam sensor Retransfer
Heatroller Positionning sensor
Card tray
interlock
Thermal Head
Cleanning roller interlock
Door interlock Cassette
interlock
Ink start position sensor
Cooling fan
AC AC
Cooling fan
POWER
SWITCH
Remedial
Heat roller
Retransfer
Heat roller
Thermostat
DC24V
DC5/12V/24V
Step
Motor
MG Feed Motor
IC CONTACT
Solenoid For
Head position1 Card position
210Encode
75Encode
IC FLAG
5V 12V
IC R/W
MG HEAD
IC
CONTACT
XID580i BLOCK DIAGRAM
Head position2
Head position3 Remedial
Heatroller Positionning sensor
Card Cooling Fan
J6 J7 J4
J8
J13
J12
J11
J24
J23 J10 J9 J15 J5 J21
J22 J2
J18
J16
J17
J14
RF-ID PWB
J9
J8 J11 J12 J16J14 J7 J6 J3
J4
J2
J1
CN1
CN2 CN3
to J13
J13 J15
J10
J9 J12
to
J16 to J9 to J12
to J8
to J13
to J13
to
J8 to J16 to J10
J1 to J11
CN1 CN1
CN3
to J15 CN3 CN301
CN1
CN201
CN4 CN5
CN6 CN7
to J8
CN2

10
Main Parts Layout
1. Sensors
2. Thermal Head and Rollers
Card edgesensor
(Circuit board)
Retransfer roller
sensor
Ink start position
sensor (circuit board)
Turnover card
sensor (circuit board)
Turnover initial position
sensor
Card supply sensor
No card
Ink FG sensor (encorder circuit board)
Retransfer film
mark sensor
(circuit board)
Card outlet
sensor
Bend remedial
roller sensor
Cam sensor Card near empty sensor
Platen roller
Bend remedial roller
Retransfer roller
Thermal head
Turnover unit
NG card
outlet roller
Card supply roller

11
3. Motors
4. Solenoid
Card pick up motor
Ink take-up
motor
Ink supply
Motor
Turn over
motor
Turn over
feed motor
Retransfer
film supply
motor
Retransfer
film take-up
motor
Cam motor
Card feed
motor
Platen Solenoid
Rear veiw

12
5. Switches
6. Circuit Boards, Power Supply Unit, and Fans
Door interlock
switch
Card tray
interlock switch
Cassette interlock
switch
Cleanning roller
interlock switch
MAIN PWB
Drive PWB
Power
supply unit
Heater protector
PWB
Front PWB

13
Ventilation fan
Thermal head
cooling fan
Ventilation fan
Card cooling fan

14
7. RF-ID
RF-ID unit

15
1. CHECKING AT THE TIME OF SERVICING
When confirming the symptoms, swing the power supply unit down as shown in the following figure and check the inside.
1.2 REMOVE THE MG CIRCUIT BOARD.
1) Remove the three screws A and the screw B.
2) After the power supply unit has been swung down,
use the screw B for provisional fixing, so that the
MG circuit board does not move.
1.1 REMOVE THE TOP COVER AND THE
REAR PANEL.
1) Remove the filters on both sides of the top cover.
Caution: If they are not removed, the filters will be
damaged when the top cover is moved.
2) Remove the seven screws A and pull the top cover
to the rear to remove it.
3) Remove the screw B and take off the rear panel.
Screw B
Screw A
REMOVAL AND EXCHANGE OF THE MAIN PARTS
Filter
ScrewA
ScrewB