ISATA DoM User Manual
DMP Electronics Inc. III
Table of Contents
1 Product Overview............................................................................................................................. 1
1.1 Introduction of DMP ISATA........................................................................................................ 1
1.2 Product View and Models .............................................................................................................. 1
1.3 SATA Interface ................................................................................................................................ 1
2 Product Specifications...................................................................................................................... 2
2.1 Capacity and Device Parameters ................................................................................................... 2
2.2 Performance...................................................................................................................................... 2
2.3 Electrical Specifications .................................................................................................................. 3
2.3.1 Power Requirement ............................................................................................................. 3
2.3.2 Power Consumption............................................................................................................ 3
2.4 Environmental Specifications ........................................................................................................ 3
2.4.1 Temperature Rangers........................................................................................................... 3
2.4.2 Humidity................................................................................................................................ 3
2.4.3 Shock and Vibration ............................................................................................................ 4
2.4.4 Mean Time between Failures (MTBF).............................................................................. 4
2.5 CE and FCC Compatibility ............................................................................................................. 4
2.6 RoHS Compliance ............................................................................................................................ 4
2.7 Reliability........................................................................................................................................... 5
2.8 Transfer Mode.................................................................................................................................. 5
2.9 Pin Assignment ................................................................................................................................ 6
2.10 Mechanical Dimensions ................................................................................................................ 6
2.11 Assembly Weight............................................................................................................................ 6
2.12 Seek Time........................................................................................................................................ 7
2.13 Hot Plug .......................................................................................................................................... 7
2.14 NAND Flash Memory .................................................................................................................. 7
