
D7.8.6/1112-0815/E 1/18
Date of last update: Aug-15
Application Engineering Europe
CORESENSE™ DIAGNOSTICS FOR COPELAND™ STREAM COMPRESSORS
MODBUS® SPECIFICATION
CoreSense™Diagnostics for Copeland™Stream Compressors Modbus® Specification..........................................1
1Introduction......................................................................................................................................................3
1.1 Abbreviations...........................................................................................................................................3
1.1 Intent........................................................................................................................................................3
1.2 Scope.......................................................................................................................................................3
1.3 References ..............................................................................................................................................3
2General description..........................................................................................................................................3
3Modbus type identification ...............................................................................................................................4
3.1 Modbus with 10 DIP-switch .....................................................................................................................4
3.2 Modbus with 12 DIP-switch –New version .............................................................................................5
3.3 DIP-Switch functions ...............................................................................................................................5
4Physical layer...................................................................................................................................................6
4.1 Topology..................................................................................................................................................6
4.1.1 Wire used..................................................................................................................................................6
4.1.2 Bus bias ....................................................................................................................................................6
4.1.3 Termination...............................................................................................................................................6
4.2 Data signalling rates................................................................................................................................6
4.2.1 Baud rate selection ...................................................................................................................................6
4.2.2 Parity selection..........................................................................................................................................6
4.3 Labelling ..................................................................................................................................................7
4.4 Connectors ..............................................................................................................................................7
4.5 Wiring and connections ...........................................................................................................................7
5Data Link layer.................................................................................................................................................8
5.1 Node address ..........................................................................................................................................8
5.2 DIP-Switch settings .................................................................................................................................9
5.3 RTU Transmission mode.......................................................................................................................10
5.4 Response message timeout..................................................................................................................10
6Application layer.............................................................................................................................................10
6.1 Available functions.................................................................................................................................10
6.2 Data types..............................................................................................................................................10
6.3 Functions supported..............................................................................................................................10
6.3.1 Coil input status ......................................................................................................................................10