Fuji Electric EconoPIM M711 User manual

© Fuji Electric Co., Ltd. All rights reserved.MT6M14904MT6M14904b
Fuji Industrial IGBT Module
Solder pin type
EconoPIMTM (M711, M712, M719, M720)
EconoPACKTM (M633, M636, M668, M669, M1203)
Mounting instructions
Oct. 2022
EconoPIMTM and EconoPACKTM are registered trademark of Infineon Technologies AG, Germany.

MT6M14904b © Fuji Electric Co., Ltd. All rights reserved.
CONTENTS
1
2. Related Types 3
3-
1.
Surface conditions of heat sink
5
3-
2.
Application of thermal grease
6
3-
3.
Screw
tightening to heat sink 7
3. Mounting to heat sink 5
1. Scope of application 2
4. Mounting the module to printed circuit board 8
4-
1.
Soldering to printed circuit board
8
4-
2.
Screw tightening to printed circuit board
9
5. Warning 11
6. Storage and transportation notes 12

MT6M14904b
1. Scope of Application
© Fuji Electric Co., Ltd. All rights reserved.
This document provides information how to mount and use the solder pin type EconoPIMTM and
EconoPACKTM products of Fuji Electric.
Please refer to chapter 2 for identifiying the related module types.
When handling the products, please follow beside the descriptions within this document, additionally
the Warning and Caution of the delivery specifications of the related products.
EconoPIMTM and EconoPACKTM are registered trademark of Infineon Technologies AG, Germany.
2

MT6M14904b
2. Related types
© Fuji Electric Co., Ltd. All rights reserved.
Table 1 EconoPIMTM (PIM with built-in converter circuit and brake circuit)
The mounting instruction applies to the following module types:
650V (X series) 600 V (V series) 1200V (X series) 1200V (V series)
M711
(Type A) 25A 7MBR25VA-120-50
35A 7MBR35VA-120-50
50A 7MBR50VA-060-50
M712
(Type B) 35A 7MBR35VB-120-50
50A 7MBR50VB-120-50
75A 7MBR75VB-060-50 7MBR75VB-120-50
100A 7MBR100VB-060-50
M719
(M type) 25A 7MBR25VM-120-50
35A 7MBR35XMA120-50 7MBR35VM-120-50
50A 7MBR50XMA065-50 7MBR50XMA120-50 7MBR50VM-120-50
75A 7MBR75XMA065-50 7MBR75XME120-50
M720
(N type) 50A 7MBR50VN-120-50
75A 7MBR75XNA065-50 7MBR75XNA120-50 7MBR75VN-120-50
100A 7MBR100XNA065-50 7MBR100XNA120-50 7MBR100VN-120-50
150A 7MBR150XNA065-50 7MBR150XNE120-50 7MBR150VN-120-50
M719
(P type) 25A 7MBR25VP-120-50
35A 7MBR35XPA120-50 7MBR35VP-120-50
50A 7MBR50XPA065-50 7MBR50VP-060-50 7MBR50XPA120-50
7MBR50XPE120-50 7MBR50VP-120-50
75A 7MBR75XPA065-50 7MBR75VP-060-50 7MBR75XPE120-50
100A 7MBR100XPE065-50 7MBR100VP-060-50
M720
(R type) 50A 7MBR50VR-120-50
75A 7MBR75XRA120-50
7MBR75XRE120-50 7MBR75VR-120-50
100A 7MBR100XRA065-50 7MBR100VR-060-50 7MBR100XRA120-50
7MBR100XRE120-50 7MBR100VR-120-50
150A 7MBR150XRA065-50
7MBR150XRE065-50 7MBR150VR-060-50 7MBR150XRE120-50 7MBR150VR-120-50
EconoPIMTM and EconoPACKTM are registered trademark of Infineon Technologies AG, Germany.
3

MT6M14904b © Fuji Electric Co., Ltd. All rights reserved.
650V (X series) 600 V (V series) 1200V (X series) 1200V (V series)
M636(V)
M669(X) 50A 6MBI50VA-060-50 6MBI50VA-120-50
75A 6MBI75VA-060-50 6MBI75VA-120-50
100A 6MBI100VA-060-50 6MBI100XAE120-50 6MBI100VA-120-50
M633(V)
M668(X) 100A 6MBI100XBA120-50 6MBI100VB-120-50
150A 6MBI150VB-060-50 6MBI150XBA120-50 6MBI150VB-120-50
180A 6MBI180VB-120-50
6MBI180VB-120-55
200A 6MBI200XBA120-50
6MBI200XBE120-50
6MBI250XRBE120-50
Table 2 EconoPACKTM (6-in-1)
EconoPIMTM and EconoPACKTM are registered trademark of Infineon Technologies AG, Germany.
650V (X series) 600 V (V series) 1200V (X series) 1200V (V series)
M1203 50A 12MBI50VN-120-50
75A 12MBI75VN-120-50
100A 12MBI100VN-120-50
Table 3 EconoPACKTM (12-in-1)
4

MT6M14904b
3. Mounting to heat sink
© Fuji Electric Co., Ltd. All rights reserved.
3-1. Surface conditions of heat sink
Design the heat sink so that the following surface conditions are satisfied. If the roughness and
flatness do not satisfy the conditions, it may cause an increase in contact thermal resistance, or
insulation failure due to package cracking.
1. The surface roughness(Rz) of the heat sink should be 10μm or less.
2. The surface flatness of the heat sink should be 50μm or less in absolute value per 100mm,
taking the straight line connecting the center points of the two screw mounting holes as
reference. Here, "+" (plus) is defined when the heat sink has a convex shape, and "-" (minus) is
defined when the heat sink has a concave shape. If both shapes exist, the sum of the absolute
values of the maximum and minimum values should be 50μm or less.
* The flatness must satisfy the above value within the entire module mounting area including the
two screw clamps.
Fig.1 shows the definition of surface roughness and flatness of the heat sink.
Fig.1 Heat sink surface flatness and roughness
(Heat sink)
P=100mm pitch
+50μm
The surface flatness should be 50μm or less per 100mm, taking the straight line
connecting the center points of the two screw mounting holes as reference.
(a) In the case of convex shape
P=100mm pitch
-50μm
(b) In the case of concave shape
P=100mm pitch
(c) In the case of both shapes exist
50μm
(Heat sink)
(Heat sink)
Thermal grease
application surface
Thermal grease
application surface
Thermal grease
application surface The surface roughness
(Rz) should be 10μm or
less. Refer to ISO4287
for definition.
Rz
5

MT6M14904b © Fuji Electric Co., Ltd. All rights reserved.
3-2. Application of thermal grease
Thermal grease must be applied between the product mounting surface and the heat sink to ensure
heat dissipation from the product to the heat sink.
If the properties, amount, and application method of the thermal grease are not appropriate, it may
result in poor heat dissipation and lead to thermal failure. Make sure that the thermal grease is
spread over the entire base plate of the product. Also, please check the heat dissipation state of the
module. You can check the extent of spreading of thermal grease by removing the module after
mounting.
Table 4 shows the recommended thermal grease properties and thickness. Assuming that the
thickness is uniform, the required amount (weight) of thermal grease can be calculated from the
following formula.
We recommend using the stencil mask method to control the appropriate thermal grease thickness
(Fig.2). Recommended stencil mask pattern can be provided from a representative of our company or
one of our distributers.
In addition, depending on the type or application method of thermal grease, deterioration or dry out
of thermal grease may occur during high temperature operation or temperature cycle, which may
shorten the product lifetime. Pay attention to the selection and application method of the thermal
grease.
Unit Recommended value
Penetration (typ.) - >= 340
Thermal conductivity W/m・K>= 1
Thermal grease thickness μm 100 +/-30
Table 4 Recommended properties of thermal grease
Thermal grease
thickness (μm)
Thermal grease
weight (g) x 104Mounting surface area of module (cm2)
=Density of thermal
grease (g/cm3)
x x
Fig.2 Thermal grease application
Squeegee
(for applying thermal
grease)
Thermal grease
(apply to module’s
base plate)
Stencil mask
Stencil mask
fixing tool
6

MT6M14904b
2. Mounting on a heat sink
© Fuji Electric Co., Ltd. All rights reserved.
(a) Screw Tightening Torque and Screw Tightening Order (for M711,M719,M636,M669)
Screw tightening torque Order of screwing
Temporary tightening 0.5N・m(1) → (2)
Final tightening Vseries：2.5～3.5N・m
Xseries：2.5～6.0N・m(1) → (2)
(b) Screw Tightening Torque and Screw Tightening Order (for M712,M720,M633,M668,M1203)
Screw tightening torque Order of screwing
Temporary tightening 0.5N・m(1) → (2)→ (3)→ (4)
Final tightening Vseries：2.5～3.5N・m
Xseries：2.5～6.0N・m(1) → (2)→ (3)→ (4)
Fig. 3 Screw Tightening Torque and Screw Tightening Sequence
(1) (2)
(3)
(4)(1)
(2)
3-3. Screw tightening to heat sink
This section describes how to tighten the screws when mounting the module to heat sink.
1. Use M5 screws to fix the module to heat sink.
2. To fix the module with even force, first perform temporary tightening with 0.5N・m. Fig.3 shows
the tightening sequence.
3. Perform final tightening in the same sequence as temporary tightening. The final tightening
torque should be within the maximum ratings.
7

MT6M14904b
4-1. Soldering to printed circuit board
The recommended soldering conditions for mounting a printed circuit board (PCB) on the module are
shown below.
Terminal temperature: 245 ±5oC
Time: 5 ±0.5 sec
However, since the definition of the recommended soldering temperature is "terminal temperature", it is
different from the set temperature of the soldering machine. Set the soldering unit temperature to suit
the heat capacity of your PCB. Before soldering, make sure that the temperature of the resin part at the
base of the product terminal is 260°C or less.
4. Mounting the module to printed circuit board
© Fuji Electric Co., Ltd. All rights reserved. 8

MT6M14904b © Fuji Electric Co., Ltd. All rights reserved.
4-2. Screw tightening to printed circuit board
This section describes how to tighten the screws when mounting the module to the PCB.
1. Use M2.5 self-tapping screws to fix the module to the heat sink.
2. To secure the module with equal force, first perform temporary tightening with a torque of 1/3 of
the final tightening torque in the order shown in Fig. 4.
3. Next, perform the full tightening in the same order as the temporary tightening. Make sure that
the final tightening torque is within the range of 0.4 to 0.5 N・m.
(a) Screw Tightening Torque and Screw Tightening Order (for M711,M719,M636,M669)
Screw tightening torque Order of screwing
Temporary
tightening Make sure the screws go straight in (1) → (2)→ (3)→ (4)
Final tightening 0.4~0.5 N・m(1) → (2)→ (3)→ (4)
(b) Screw Tightening Torque and Screw Tightening Order (for M712,M720,M633,M668,M1203)
Screw tightening torque Order of screwing
Temporary
tightening Make sure the screws go straight in (1) → (2)→ (3)→ (4)
Final tightening 0.4~0.5 N・m(1) → (2)→ (3)→ (4)
Fig. 4 Screw Tightening Torque and Screw Tightening Sequence
(1)
(2)(3)
(4)
(1)
(2)(3)
(4)
9