Fujitsu D2109 User manual

PRIMERGY
System Board D2109 and
SAS Controller D2107
for TX200 S3
Technical Manual
Susanne Däschlein
Fujitsu Siemens Computers GmbH München
81730 München
e-mail: email: [email protected]
Tel.: [phone]
Fax: (++49) 700 / 372 00000
D2109 (TX200 S3)
Sprachen: En
dition June 2006

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Copyright and Trademar s
Copyright © 2006 Fujitsu Siemens Computers GmbH.
All rights reserved.
Delivery subject to availability; right of technical modifications reserved.
All hardware and software names used are trademarks of their respective manufacturers.

D2109 (TX200 S3) Technical Manual
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Important notes . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Notes on safety . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 CE Certificate . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3 Environmental Protection . . . . . . . . . . . . . . . . . . . . 11
3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.2 Main memory . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3 PCI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.3.1 ISA bus resources . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3.2 PCI resources . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.4 Screen resolution . . . . . . . . . . . . . . . . . . . . . . . . 21
3.5 Temperature / system monitoring . . . . . . . . . . . . . . . . 22
3.6 LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.7 Interfaces and connectors . . . . . . . . . . . . . . . . . . . . 25
3.7.1 External ports . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.8 Settings with switches . . . . . . . . . . . . . . . . . . . . . . 28
4 SAS controller D2107 . . . . . . . . . . . . . . . . . . . . . 31
5 SCSI/IME configuration program . . . . . . . . . . . . . . . 33
6 Replacing the lithium battery . . . . . . . . . . . . . . . . . 43
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

D2109 (TX200 S3) Technical Manual 5
1Introduction
This technical manual describes the system board D2109, which can be
equipped with one or two Intel®processors.
Further information about drivers is provided in the readme files on the hard
disk, on the supplied "ServerStart" or "Update" CDs.
You will find further information in the BIOS description.
Notational conventions
The meanings of the symbols and fonts used in this manual are as follows:
italics indicates commands, menu items, file and path
names or software programs
fixed font indicate system output on the monitor
semi-bold fixed
font
indicates values to be entered through the keyboard
[Key symbol] indicates keys according to their representation on the
keyboard
If capital letters are to be entered explicitly, then the
Shift key is shown, e.g. [SHIFT] - [A] for A.
If two keys need to be pressed at the same time, then
this is shown by placing a hyphen between the two key
symbols.
“quotation marks” indicates names and terms that are being empha-
sized.
Êindicates an operation that to be performed
VCAUTION! indicates warnings, which, if ignored, will endanger
your health, destroy the system or lead to the loss of
data.
Iindicates additional information, notes and tips
Table 1: Notational conventions

D2109 (TX200 S3) Technical Manual 7
2 Important notes
In this chapter you will find essential information regarding safety when working
with your server.
VCAUTION!
With the system board installed you must open the system to access the
system board. How to access the system board of your system is
described in the appropriate service supplement.
When handling the system board, refer to the specific notes on safety in
the operating manual and/or service supplement for the respective
server.
2.1 Notes on safety
VCAUTION!
●The actions described in these instructions should only be performed
by authorized, qualified personnel. Equipment repairs should only be
performed by qualified staff. Any failure to observe the guidelines in
this manual, and any unauthorized openings and improper repairs
could expose the user to risks (electric shock, fire hazards) and could
also damage the equipment. Please note that any unauthorized
openings of the device will result in the invalidation of the warranty
and exclusion from all liability.
●Transport the device only in the antistatic original packaging or in
packaging that protects it from knocks and jolts.
●Only install expansions that are allowed for the system board. If you
install other expansions, you may damage the requirements and rules
governing safety and electromagnetic compatibility or your system.
Information on which system expansions are suitable can be
obtained from the customer service centre or your sales outlet.
●The warranty expires if the device is damaged during the installation
or replacement of system expansions.

8 Technical Manual D2109 (TX200 S3)
Notes on safety Important notes
V●Components can become very hot during operation. Ensure you do
not touch components when making extensions to the system board.
There is a danger of burns!.
●Transmisson lines to peripheral devices must be adequately shielded.
●To the LAN wiring the requirements apply in accordance with the
standards EN 50173 and EN 50174-1/2. As minimum requirement
the use of a protected LAN line of category 5 for 10/100 MBps
Ethernet, and/or of category 5e for Gigabit Ethernet is considered.
The requirements of the specification ISO/IEC 11801 are to be
considered.
●Never connect or disconnect data transmission lines during a storm
(lightning hazard).
Batteries
VCAUTION!
●Incorrect replacement of lithium battery may lead to a risk of
explosion. The batteries may only be replaced with identical batteries
or with a type recommended by the manufacturer.
It is essential to observe the instructions in chapter “Replacing the
lithium battery”.

D2109 (TX200 S3) Technical Manual 9
Important notes Notes on safety
Modules with electrostatic-sensitive components
Systems and components that might be damaged by electrostatic discharge
(ESD) are marked with the following label:
Figure 1: ESD label
When you handle components fitted with ESDs, you must observe the following
points under all circumstances:
●You must always discharge yourself of static charges (e.g. by touching a
grounded object) before working.
●The equipment and tools you use must be free of static charges.
●Remove the power plug from the power socket before inserting or removing
boards containing ESDs.
●Always hold boards with ESDs by their edges.
●Never touch pins or conductors on boards fitted with ESDs.
●Use a grounding cable designed for this purpose to connect yourself to the
system unit as you install/deinstall the board.
●Place all components on a static-safe base.
IYou will find a detailed description for handling ESD components in the
relevant European or international standards (EN 61340-5-1,
ANSI/ESD S20.20).

10 TechnicalManual D2109 (TX200 S3)
CE Certificate Important notes
Notes about boards
●During installation/deinstallation of the system board, observe the specific
instructions described in the service manual for the server.
●Remove the plug from the mains outlet so that system and system board are
totally disconnected from the mains voltage.
●To prevent damage to the system board, the components and conductors on
it, please take great care when you insert or remove boards. Take great care
to ensure that extension boards are slotted in straight, without damaging
components or conductors on the system board, or any other components,
for example EMI spring contacts
●Be careful with the locking mechanisms (catches, centring pins etc.) when
you replace the system board or components on it, for example memory
modules or processors.
●Never use sharp objects (screwdrivers) for leverage.
2.2 CE Certificate
The shipped version of this board complies with the requirements
of the EEC directive 89/336/EEC "Electromagnetic compatibility".
Compliance was tested in a typical PRIMERGY configuration.

D2109 (TX200 S3) Technical Manual 11
Important notes Environmental Protection
2.3 Environmental Protection
Environmentally friendly product design and development
This product has been designed in accordance with standards for ”environmen-
tally friendly product design and development“. This means that the designers
have taken into account important criteria such as durability, selection of
materials and coding, emissions, packaging, the ease with which the product
can be dismantled and the extent to which it can be recycled.
This saves resources and thus reduces the harm done to the environment.
Notes on saving energy
Devices that do not have to be on permanently should not be switched on until
they need to be used and should be switched off during long breaks and on
completion of work.
Notes on packaging
Please do not throw away the packaging. We recommend that you do not throw
away the original packaging in case you need it later for transporting.
Notes on dealing with consumables
Please dispose batteries in accordance with local government regulations.
Do not throw batteries and accumulators into the household waste. They must
be disposed of in accordance with local regulations concerning special waste.
All batteries containing pollutants are marked with a symbol (a crossed-out
rubbish bin on wheels). In addition, the marking is provided with the chemical
symbol of the heavy metal decisive for the classification as a pollutant:
Cd Cadmium
Hg Mercury
Pb Lead
Notes on labeling plastic housing parts
Please avoid attaching your own labels to plastic housing parts wherever
possible, since this makes it difficult to recycle them.

12 TechnicalManual D2109 (TX200 S3)
Environmental Protection Important notes
Returning, recycling and disposal
For details on returning and reuse of devices and consumables within Europe,
refer to the “Returning used devices” manual, or contact your Fujitsu Siemens
Computers branch office/subsidiary or our recycling centre in Paderborn:
Fujitsu Siemens Computers
Recycling Center
D-33106 Paderborn
Tel. [phone]
Fax [phone]
The device may not be disposed of with household rubbish. This
appliance is labelled in accordance with European Directive
2002/96/EC concerning used electrical and electronic appliances
(waste electrical and electronic equipment - WEEE).
The guideline determines the framework for the return and recycling
of used appliances as applicable throughout the EU. To return your
used device, please use the return and collection systems available
to you. You will find further information on this at www.fujitsu-
siemens.com/recycling.

D2109 (TX200 S3) Technical Manual 13
3 Features
3.1 Overview
Processors
– 1 or 2 x Intel®Xeon™ dual core processors
– 2 processor sockets LGA771 for Intel®Xeon™ processor
– 2x2 or 4 MB second level cache (on-die unified, 64 byte cache-line size)
– 24 KB L1 cache (on-die, data)
– 16 KB L1 cache (on-die, instruction)
– 2x VRM 11.0 onboard (EVRD)
Main memory
– 6 slots for main memory FBD533/PC2-4200F or FDB533/PC2-5300F Fully
Buffered DIMM memory modules with 512 MB, 1 Gbyte, 2 Gbyte and
4 Gbyte
– maximum 16 Gbyte of memory
– minimum 1 Gbyte (2 memory modules)
– maximum 16 Gbyte/s bandwidth
– supports 2 way interleaved memory subsystems (2 identical memory
modules have to installed at the same time)
– ECC multiple bit error detection and single bit error correction
– memory scrubbing function
– Single Device Data Correction (SDDC) function (Chipkill™)
– Hot-spare memory support
Chips on the system board
– Intel®BlackfordVS Chipset
– Single-channel Gigabit LAN controller (PHY Intel 82564EB Mono Gilgal)
– Service LAN controller (10/100 PHY Broadcom AC201KMLG)
– Integrated VGA controller with PCI 32 Bit/33 MHz
– Super I/O controller (SMSC DME1737)
– Flash EPROM for:
–SCSI-BIOS
–BIOS
–LAN
– server management (SM)
– server management with iRMC (FSC System)

14 TechnicalManual D2109 (TX200 S3)
Overview Features
– thermal and system management controller (ADT7462)
Internal connectors
– floppy disk connector (34 pin)
– 1 IDE primary
–2SerialATA
– SCSI activity connector (HD LED)
– main power connector (12V, -12V, 5V, 3.3V and 5V auxiliary)
– 1 dual 12V power connector
– 1 mono 12V power connector
– PC98 connector
– front panel
– dual USB type C (for USB port on front side)
– 2 USB connectors
– 2 connectors for system fans
– 1 connector for CPU fans
– IPMB connector (RSB data)
– KVM power connector
– intrusion connector
– 1 RAID key
– 1 connector for 2 additonal redundant system fans (optional)
External connectors
– 2 serial ports (COM1, COM2)
– 1 parallel port (optional)
– 2 PS/2 interfaces for keyboard and mouse
– 2 USB 2.0 ports with 480 Mbits/s (rear side)
– 1 VGA port
– 2 RJ45 LAN ports
PCI slots
– 2 x PCI-X (64 bit / 100/133 MHz IOOPTM)
– 1 x PCI-Express (2 Gbyte/s bandwidth)
– 1 x PCI-Express (4 Gbyte/s bandwidth)
– 1 x PCI 2.3 (32 bit / 33 MHz)
– 1 x PCI-X only for SAS controller D2107

D2109 (TX200 S3) Technical Manual 15
Features Overview
BIOS features
– Phoenix System-BIOS V 4.06
– Rompilot
– SMBIOS 2.31 (DMI)
– MultiProcessor Specification 1.4
– Server Hardware Design Guide 3.0
– WfM 2.0
–IPMI1.5
– ACPI 2.0 support
– USB keyboard/mouse
– boot possible from:
– 120 MB floppy disk drive
– CD-ROM/DVD
– Festplatte
–LAN
– console redirection support
– OEM logo
– CPU, memory disable
– hotspare memory support
Environmental protection
battery in holder
Form factor
302 x 415 mm

16 TechnicalManual D2109 (TX200 S3)
Main memory Features
3.2 Main memory
The system board supports up to 16 Gbyte main memory. 6 slots (3 memory
banks with 2 modules) are available for the main memory. Each memory bank
can be populated with two 512 Mbyte, 1 Gbyte, 2 Gbyte or 4 Gbyte
FBD533/PC2-4200F or FDB667/PC2-5300F fully buffered DIMM memory
modules.
A memory bank can be configured as hot spare bank (optional).
As in the basic configuration memory bank 1 is populated with 1 Gbyte, 2 Gbyte,
4 Gbyte or 8 Gbyte memory modules, the memory extensions can be
performed up to two times for memory bank 2 and 3.
ECC with memory scrubbing and with the Single Device Data Correction
(SDDC) function is supported.
Module population
Figure 2: Main memory
– The memory modules have to be based on x4 or x8 organised single or dual
ranked FBD533/PC2-4200F or FDB667/PC2-5300 fully buffered DIMM
modules and must be populated in pairs. It is only allowed you use memory
modules released by Fujitsu Siemens Computers.
– Each pair must consist of identical memory modules (2 way interleaved
mode).
– The module capacity between pairs can differ: pair 1A/1B can be populated
with two 512 Mbyte modules and pair 2A/2B with two 1 Gbyte modules.
DIMM-3B
DIMM-2B
DIMM-1B
DIMM-3A
DIMM-2A
DIMM-1A

D2109 (TX200 S3) Technical Manual 17
Features PCI bus
Following table shows the mandatory population order:
3.3 PCI bus
Figure 3: PCI slots
PCI slots
The following table shows an overview of the PCI slots:
module pair 1A/1B
(black)
module pair 2A/2B
(blue)
module pair 3A/3B
(blue)
populated empty empty
populated populated empty
populated populated populated
PCI slot 64bit/
32bit
Frequency
in MHz
Description
1 64 bit 100/133 64-bit PCI-X slots, 133 MHz only if one of the
three slots (1,2,or 10) is populated
2 64 bit 100/133
1
2
3
4
5
PCI X (only SAS controller D2107)
PCI X 64/133 IOOP
PCI X 64/133 IOOP (ZCR)
PCI e x
PCI e x4
PCI 32/33
10
slot 5
slot 4
slot 3
slot 2
slot 1
slot 10
TM
TM

18 TechnicalManual D2109 (TX200 S3)
PCI bus Features
IOOP™ (PCI bus speed optimisation)
The hardware of the system board optimizes the PCI bus speed of the slots 1,
2 and 10, depending on the slots’ population.
– the PCI bus speed is 133 MHz, if only one of the three slots (or no slot) is
populated.
– the PCI bus speed is 100 MHz for all other population variants for slot 1, 2
and 10.
Zero Channel RAID (with SAS controller D2107)
PCI slot 1 (blue sockel) is prepared for Zero Channel RAID (ZCR). ZCR means
that the SCSI controller is seen as SCSI RAID controller through the inserted
SAS controller D2107. The PCI bus then runs with 100 MHz.
3 PCI e x8 slot
4 PCI e x4 slot
5 32 bit 33 32 bit PCI slot
10 64 bit 100/133 PCI-X slot only for SAS controller D1207
PCI slot 64bit/
32bit
Frequency
in MHz
Description

D2109 (TX200 S3) Technical Manual 19
Features PCI bus
3.3.1 ISA bus resources
"IRQ" = interrupt assigned as shipped
"Address" = this address can be used for your particular device
"Address" = this DMA can be used for your particular device
Default settings are shown in bold print
Device IRQ Address DMA
Timer 0 040-043
Keyboard 1 060,064
Serial port COM2 3 3F8-3FF, 2F8-2FF, 3E8-
3EF, 2E8-2EF
Serial port COM1 4 3F8-3FF, 2FB-2FF, 3E8-
3EF, 2E8-2EF
free 5
Floppy disk drive controller 6 3F0-3F5, 3F7 2
Parallel interface LPT1 7 278-27B, 378-37B, 3BC-
3BF
1, 3
Real-time clock (RTC) 8 070-071
free 9, 10, 11
Mouse controller 12
Numeric processor 13 0F0-0FE
IDE controller (primary) 14 1F0-1F7, 3F6

20 TechnicalManual D2109 (TX200 S3)
PCI bus Features
3.3.2 PCI resources
PCI IRQ Line x - Assignment of the PCI interrupts
PCI IRQ Line x defines which ISA interrupts are used for the separate PCI slots.
If you select Auto in the BIOS setup, the interrupts are assigned automatically
and no further settings are required.
Multifunctional PCI boards or boards with an integrated PCI-to-PCI bridge can
use several PCI interrupts (INTA#, INTB#, INTC#, INTD#). Monofunctional PCI
boards (default) only use one PCI interrupt (INTA#) per PCI slot.
The PCI interrupts INTA#, INTB#, INTC# and INTD# are available for each PCI
slot.
The same interrupt can be assigned simultaneously to several PCI boards. You
should avoid this condition due to reduced performance.
If you use a setting other than Auto, the Plug&Play functionality of the system
BIOS for the corresponding PCI boards is deactivated.
Auto The PCI interrupts are assigned automatically in accordance with
the Plug&Play guidelines.
Disabled No ISA interrupt is assigned to the PCI interrupt.
3, 4, 5, 6, 7, 9, 10, 11, 12, 14, 15
The selected ISA interrupt is assigned to the PCI interrupt. You
may not select an ISA interrupt that is used by a component on
the system board (e.g. controller) or an ISA board.