Hewlett Packard Enterprise 3PAR StoreServ 8 0A Series Assembly instructions

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HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Storage Enclosures
Marketing Name / Model
[List multiple models if applicable.]
HPE 3PAR StoreServ 8xx0A
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
24
Batteries
All types including standard alkaline and lithium
coin or button style batteries
4
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
18
External electrical cables and cords
PVC insulation
4
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
6 Heat sink clips; 11 connector housings; 7 misc
structural parts
46
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0

MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
Item Description Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx Driver
T6/T10/T15
Philips Driver
#0, #1, #2
Diagonal cutter
Medium size
Pry Bar
Small
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove unit from System rack by removing Torx T15 mounting screws
2. Pull release handles on Drives sleds to remove Hard drives / SSD modules; separate plastics and hard drives from
frame using phillps screw driver.
3. Pull release handle on Node(s) to remove from Drive bay. Remove heat pipe and/or heat sinks using T10 Torx driver;
Remove PCBA from Frame.
4. Remove coin cell battery from node board.
5. Remove Power Cooling Modules by depressing on the latch, the unit will slide out of the drive bay. Remove Lithium
Ion battery pack.(see step 6) Uses Phillips #1 to remove screws on the enclosure, remove PCBAs from housing,
remove electrolytic capacitors 1 4cm high; 10, 2.4 cm 10, 1cm.
6. Remove cover of lithium ion battery pack, using phillips #1, remove battery pack from enclosure; do not short batteries!
Carefully remove Lithium ion batteries by severing the metal tabs with a diagonal cutter.
7. Using phillips #1 Screw driver remove plastic sections from the drive bay; Then remove the mid-plane PCBA; this
board has several 1cm electrolytic capacitors.
8.
9. Node Steps:
10. 2. Remove top cover from array node.
11. 3. Remove DIMM's, and BOOT drive from node assembly.
12. 4. Use pry bar to remove capacitors.
13. 5. Remove coin battery from motherboard.
14. 6. Remove torx screws
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3
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Attachment 1 - Removing Midplane PCA from drive chassis
Attachment 1 – removing midplane PCA from drive chassis.
Attachment 2—removing battery pack from Power Cooling Module.
Attachment 3—removing electrolytic caps from Power Cooling Module.
Attachment 4—removing coin cell from Node PCA.

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Attachment 2 -Removing battery from Power Cooling Module
Remove the battery pack PCA from the enclosure
Carefully Remove the lithium Ion batteries avoid shorting terminals

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Attachment 3 - Removing Electrolytic Capacitors from Power Cooling Module

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Attachment 4 - Removing coin cell, capacitors and screws from the motherboard.

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Chassis level Disassembly:

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Template Revision A
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