HGST Travelstar Z5K500.B Product manual

HGST Hard Disk Drive Technical Reference Manual
1
HGST Travelstar
™
Z5K500.B
HTS545 050B7E660
T
echnical
Reference
Manual

HGST Hard Disk Drive Technical Reference Manual
2
One MB is equal to one million bytes, one GB is equal to one billion bytes and one TB equals
1,000GB (one trillion bytes) when referring to storage capacity. Accessible capacity will vary from
the stated capacity due to formatting and partitioning of the drive, the computer’s operating system,
and other factors.
The following paragraph does not apply to any jurisdiction where such provisions are inconsistent
with local law: THIS PUBLICATION IS PROVIDED "AS IS" WITHOUT WARRANTY OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
This publication could include technical inaccuracies or typographical errors. Changes are
periodically made to the information herein; these changes will be incorporated in new editions of
the publication. There may be improvements or changes in any products or programs described in
this publication at any time. It is possible that this publication may contain reference to, or
information about, HGST products (machines and programs), programming, or services that are not
announced in your country. Such references or information must not be construed to mean that
Western Digital Corporation intends to announce such HGST products, programming, or services in
your country. Technical information about this product is available by contacting your local HGST
product representative or on the Internet at: support.hgst.com.
Western Digital Corporation may have patents or pending patent applications covering subject
matter in this document. The furnishing of this document does not give you any license to these
patents.
© 2016 Western Digital Corporation or its affiliates.
Travelstar, Data Lifeguard and the HGST logo are registered trademarks or trademarks of Western
Digital Corporation or its affiliates in the U.S. and/or other countries. Other trademarks are the
property of their respective owners.
References in this publication to HGST-branded products, programs, or services do not imply that
they will be made available in all countries. Product specifications provided are sample
specifications and do not constitute a warranty. Actual specifications for unique part numbers may
vary. Please visit the Support section of our website, support.hgst.com, for additional information on
product specifications. Pictures shown may vary from actual products.

HGST Hard Disk Drive Technical Reference Manual
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HGST Travelstar
™
Z5K500.B
Technical Reference Manual

HGST Hard Disk Drive Technical Reference Manual
4
TABLE OF CONTENTS
1. DESCRIPTION AND FEATURES........................................................................................ 8
1.1 General Descript ion ....................................................................................................... 8
1.2 Product Feat ures .......................................................................................................... 8
2. SPECIFICATIONS.................................................................................................................10
2.1 Performance Specif icat ions.... .... ........ ........ ........ .... ........ ........ ........ ........ .... ........ ........ ..... 10
2.2 Physical Specificat ions................................................................................................... 11
2.2.1 Physical Dimensions. ...................................................... .... .... .... .... .... .... .... .... .... . 12
2.3 Mechanical Specificat ions............................................................................................... 13
2.4 Electrical Specificat ions................................................................................................. 14
2.4.1 Current Requirements and Power Dissipation .... .. .. .. .. .... .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. 14
2.4.2 Input Volt age Requirements .................................................................................. 14
2.4.3 Ripple ........................................................................................................ 14
2.4.4 ESD............................................................................................ 14
2.5 Environmental Specifications........................................................................................... 15
2.5.1 Shock and Vibrat ion ............................................................................................ 15
2.5.2 Temperat ure and Humidit y .... .. .. .... .. .. ........ .. .... .. .. .... .. .. .... .. .. ........ .. .... .. .. .... .. .. .... .. . 16
2.5.3 Thermocouple Locat ion....................... .... .... .... .... .... .... .... .... .... ............................. 16
2.5.4 Cooling....................................................................................................... 17
2.5.5 Atmospheric Pressure .......................................................................................... 17
2.5.6 Electromagnetic Field/ Magnet ic Field Immunity .......................................................... 18
2.5.7 Operating Drive DC Magnetic Field Suscept ibilit y ......................................................... 18
2.5.8 Acoustics .................................................................................................... 18
2.5.9 RoHS (Rest rict ion of Hazardous Subst ances) . .. ... .. .... .... .. ... .. .... .... .. ... .. .... .... .. ... .. .... . 18
2.6 Reliabilit y Charact eristics............................................................................................... 19
2.7 Device Plug Connector Pin Definit ions ................................................................................ 19
2.8 Agency Approvals......................................................................................................... 20
2.9 Full Model Number Specification....................................................................................... 20
3. PRODUCT FEATURES........................................................................................................21
3.1 SATA 6 Gb/ s.................................................................................................... 22
3.2 Advanced Format (AF) ................................................................................................... 22
3.3 Perpendicular Magnetic Recording (PMR) ............................................................................. 22
3.4 Reduced Power Spinup (RPS)...................................................................................... 23
3.5 Syst em-on-Chip (SOC) . .. .... .... .... .... .... .... .. ... .. ... .. ... .. ... .. ... .. .... .... .... .... .... .. ... .. ... .. .. 23
3.6 S.M.A.R.T. Command Transport (SCT) ................................................................................ 24
3.6.1 Write Same.................................................................................................. 24
3.6.2 Temperat ure Report ing........................................................................................ 24
3.7 Reliabilit y Features Set .................................................................................................. 25
3.7.1 Dat a Lifeguard™................................................................................................. 25
3.7.2 Thermal Management .......................................................................................... 25
3.7.3 Internal Environmental Protect ion Syst em ................................................................. 26
3.7.4 Recoverable Errors ............................................................................................. 26
3.7.5 Unrecoverable Errors........................................................................................... 26
3.7.6 Self Test .......................................................................................................... 26
3.7.7 ATA Error Logging............................................................................................... 26
3.7.8 Defect Management ............................................................................................ 26
3.7.9 Automat ic Defect Ret irement ................................................................................ 27
3.7.10 Error Recovery Process.................................................................................... 27
3.8 Hot Plug Support .......................................................................................................... 27
3.9 Active LED St at us. ........................................................................................................ 28
3.10 Fluid Dynamic Bearings (FDB)...........................................................................................28
3.11 St aggered Spinup and Activit y Indication (SATA Power Pin 11) ................................................... 28
3.11.1 St aggered Spinup. .............................................................................................. 28
3.11.2 Activit y Indicat ion .............................................................................................. 28
3.12 CacheFlow™.......................................................................................................... 28
3.12.1 Write Cache................................................................................................. 29

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3.12.2 Read Cache ................................................................................................. 29
3.12.3 48-bit Logical Block Addressing (LBA) ....................................................................... 29
3.13 Power Management ...................................................................................................... 30
3.14 Self-Monitoring, Analysis, and Report ing Technology (S.M.A.R.T.) ............................................... 30
3.15 Securit y Mode........................................................................................................ 30
3.15.1 Mast er and User Passwords... .. .... .... .... .. ... .. .... .... .. ... .. .... .... .... .. ... .. .... .... .. ... .. .... .. 30
3.15.2 Security Levels. ................................................................................................. 30
4. AT COMMAND SET ............................................................................................................31
4.1 Host Interface Commands. .............................................................................................. 31
4.1.1 ATA-7/ ATA-8 Commands.................................................................................. 31
4.1.2 SATA Commands............................................................................................ 32
4.1.3 Obsolete Commands............................................................................................ 32
4.1.4 SCT Commands . .. .... .. .... .. .... .. .... .. .... .. .... .. .... .. .... .. .... .. .... .. .... .. .... .. .... .. .... .. 33
4.2 S.M.A.R.T. (B0h) .......................................................................................................... 33
4.2.1 Read Attribute Values Sub-Command........................................................................33
4.2.2 Support ed At tribut es........................................................................................... 35
4.2.3 Read Log Sector ................................................................................................. 36
4.3 Identify Device (ECh).....................................................................................................37
4.4 Set Features (EFh)................................................................................................... 47
5. INSTALLATION AND SETUP PROCEDURES..............................................................48
5.1 Unpacking. ............................................................................................................ 48
5.1.1 Handling Precaut ions........................................................................................... 48
5.1.2 Inspection of Shipping Container ............................................................................. 49
5.1.3 Removal From Shipping Cont ainer ........................................................................... 49
5.1.4 Removal From Stat ic Shielding Bag .......................................................................... 49
5.1.5 Moving Precaut ions............................................................................................. 49
5.2 Bare Drive Handling External Force....................................................................................50
5.3 Mounting Rest rict ions .................................................................................................... 50
5.3.1 Orientation....................................................................................................... 50
5.3.2 Screw Type and Screw Length Limit ations..................................................................50
5.3.3 Grounding ................................................................................................... 51
5.4 Jumper Set tings........................................................................................................... 52
6. MAINTENANCE....................................................................................................................53
7. GLOSSARY .............................................................................................................................54

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L IST OF F IGURES
Figure 2-1 Mount ing Dimensions......................................................................................13
Figure 2-2 Drive Base Casting Thermocouple Locat ion . ... ..... ..... ... ..... ... ..... ..... ... ..... ... ..... ..... ... 16
Figure 2-3 Forced Airflow Direction ................................................................................ 17
Figure 2-4 Operating Drive DC magnetic Field Susceptibilit y................................................... 18
Figure 2-5 Standard Factory Connectors........................................................................... 19
Figure 3-1 RPSSpinup Profile................................................................................... 23
Figure 5-1 Drive Handling Precautions ............................................................................. 48
Figure 5-2 Hard Drive Removal From St at ic Shielding Bag ..... ........ ... ... ........ ... ........ ... ........ ... .. 49
Figure 5-3 Grounding Diagram....................................................................................... 51
Figure 5-4 Jumper Settings .......................................................................................... 52

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LIST OF TABLES
Table 2-1 Shock and Vibration........................................................................................15
Table 2-2 Device Pin Connect or Pin Definitions ................................................................... 19
Table 2-3 Full Model Number Descript ion .......................................................................... 20
Table 4-1 ATA-7/ ATA-8 Command Opcodes........................................................................ 31
Table 4-2 Opt ional Subcommands ................................................................................... 32
Table 4-3 Obsolete Command Opcodes....................................................................... 32
Table 4-4 SCT Action Codes .................................................................................... 33
Table 4-5 Definit ions for t he 512 Bytes. ............................................................................33
Table 4-6 Log Address Definit ion.....................................................................................36
Table 4-7 Identify Device Command.................................................................................37

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1.0 DESCRIPTION AND FEATURES
1.1 General Description
HGST Travelstar drives offer fast performance and low power consumption, making them ideal for
notebooks and other portable devices.

1.2 Product Features
 Serial ATA (SATA) — Serial ATA (SATA) is the next generation bus interface for
2.5-inch hard drives. It is designed to replace Parallel ATA, and has many advantages including
increased transfer rate, improved signal integrity, enhanced data protection, and hot plug support.
 Advanced Format (AF) — Technology adopted by HGST and other drive manufacturers to
increase media format efficiencies, thus enabling larger drive capacities.
 Perpendicular Magnetic Recording (PMR) — With PMR technology the magnetization of each
data bit is aligned vertically to the spinning disk, rather than longitudinally as has been the case in
hard drive technology for decades. This enables more data on a given disk than is possible with
conventional longitudinal recording, and provides a platform for future expansion of hard drive
densities.
 Reduced Power Spinup (RPS) — This optimized start up feature specifically designed for the
external hard drive and Consumer Electronics (CE) market. Specific focus for RPS is to minimize
the duration and magnitude of the peak power consumption from the hard drive.
 System-on-Chip - The System-on-Chip (SOC) is the foundation for HGST's next generation
electronics and firmware architecture. The native SATA SOC lowers component count by
integrating a hard disk controller, high performance processor, high speed execution SRAM, and
read channel in a 128-pin package.
 S.M.A.R.T. Command Transport (SCT) — The SCT Command Transport feature set provides a
method for a host to send commands and data to a device and for a device to send data and status to
a host using log pages.
 Reliability Features Set-Data Lifeguard™ — Representing HGST's ongoing commitment to data
protection, Data Lifeguard includes features that enhance the drive’s ability to prevent data loss.
Data Lifeguard data protection utilities include thermal management, an environmental
protection system, and embedded error detection and repair features that automatically detect,
isolate, and repair problem areas that may develop over the extended use of the hard drive. With
these enhanced data reliability features, the drive can perform more accurate monitoring, error
repair, and deliver exceptional data security.
 Hot Plug Support — SATA supports hot plugging (also known as “hot swapping”), the ability to
swap out a failed hard drive without having to power down the system or reboot. This capability
contributes to both data availability and serviceability without any associated downtime, making it
a critical feature for extending SATA into enterprise applications.
 Active LED Status — These drives support external LED requirements. It provides an activity
LED output which is ON during command execution and OFF otherwise.
 Fluid Dynamic Bearings (FDB) — Bearing design that incorporates a layer of high-viscosity
lubricant instead of ball bearings in the hard drive spindle motor. As an alternative to conventional
ball bearing technology, FDB designs provide increased non-operational shock resistance, speed
control, and improved acoustics.
 Staggered Spin-Up — Native SATA feature that allows the system to control whether the drive
will spin up immediately or wait until the interface is fully ready.

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 CacheFlow™ —This unique, multi-generation caching algorithm evaluates the way data is
read
from and written to the drive and adapts “on-the-fly” to the optimum read and write
caching methods. CacheFlow minimizes disk seek operations and overheads due to
rotational latency. CacheFlow supports sequential and random write cache. With write
cache and other CacheFlow features, the user can cache both read and write data. The cache
can hold multiple writes and col- lectively write them to the hard drive.
 48-bit Logical Block Addressing (LBA) — The drives support both 48-bit and 28-bit LBA
and CHS-based addressing. LBA is included in advanced BIOS and operating system device
drivers and ensures high capacity disk integration.
 Power Management — The drives support the ATA and Serial ATA power management
command set, allowing the host to reduce the power consumption of the drive by issuing a
variety of power management commands.
 Automatic Defect Retirement — If the drive detects a defective sector while reading, writing,
or performing offline data collection, it automatically relocates the sector without end- user
intervention.
 Self-Monitoring, Analysis, and Reporting Technology (S.M.A.R.T.) — S.M.A.R.T. enables
a drive’s internal status to be monitored through diagnostic commands at the host level and
during offline activities. S.M.A.R.T. devices employ data analysis algorithms that are used to
predict the likelihood of some near-term degradation or fault conditions. When used with a
S.M.A.R.T. application, the drive can alert the host system of a negative reliability status
condition. The host system can then warn the user of the impending risk of data loss and
recommend an appropriate action.
 ATA Security — The drives support the ATA Security Mode Feature set. The ATA
Security Mode feature set allows the user to create a device lock password that prevents
unauthorized hard disk access even if the drive is removed from the host computer. The
correct password must be supplied to the hard drive in order to access user data. Both the
User and Master Password features are supported, along with the High and Maximum
security modes. The Master Password Revision code is also supported.

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
2.0 SPECIFICATIONS
2.1 Performance Specifications
Average Seek1
- Read
- Writ e
11.0 ms average
12.0 ms average
Track-t o-TrackSeek1 1.2 msaverage
Full St roke Seek 21 ms average
IndexPulsePeriod 11.1 ms (nominal)
Average Latency 5.5 ms
Rot at ional Speed 5400 RPM
Dat a Transfer Rate (maximum)
2
- Buffer t oHost
-
Host t o/ fromdrive
6 Gb/ s
147MB/ saverage
Buffer Size 16MB
Error Rat e - Unrecoverable <1 in 10
14
bit sread
Spindle St art Time
- From Power-on t o Drive Ready 3
- From Power-on t o Rotational Speed 4
2.8saverage
2.0saverage
Spindle St op Time 8s average
Load/ UnloadCycles5 600,000
1
Duringcont inuousSeek, Read, or Writ ecommands, analgorit hmint hecodewil l addlat encyasrequiredt okeep
t he
VCM mot or f rom overheat ing. Seek perf ormance wi ll be i mpact ed under t his condit i on.
2
Asused for st orage capacit y, onemegabyt e(MB)
= onemil li on byt es, one gigabyt e (GB) = onebil li on byt es, and one
t erabyt e (TB) = one t ril lion byt es. Tot al accessi ble capacit y varies depending on operat ing envir onment . As
usedf or
buf fer or cache, onemegabyte(MB)
= 1, 048, 576byt es. Asused f or t r ansf er rat eor i nt erf ace, megabyt e per second
(MB/ s)
= one mill ion byt esper second, and gigabit per second (Gb/ s) = one bil lion bit sper second. Ef f ect i ve
maximum SATA6Gb/ st ransf er r at ecal cul at edaccordingt ot heSerial ATAspecif icat ionpublishedby
t he SATA-IO
organizat ion asof t he dat e of t his specif icat ion sheet . Visit www. sat a-io.org f or det ai ls.
3
Def inedast het i mef rompower-ont ot heset t ingof DriveReadyand SeekComplet eincl udingcalibrat ion.
4
Def ined as t he t i me f rom power-on t o when t he f ull spindle rot at i onal speed is reached.
5
Cont rolled unload at ambient condit ion.

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2.2 Physical Specifications
Physical
Specifications
HTS545050B7E660
Capacity1
500,107MB
Interface SATA6 Gb/ s
Act uat or Type Rot ary Voice Coil
Number of Disks 1
Data Surf aces 2
Number of Heads 2
Physical byt esper Sector 4096
Host bytes per Sect or 512
User Sectors per Drive 976,773,168
Servo Type Embedded
Recording Met hod LDPCTarget
1 As used f or st orage capacit y, one megabyt e (MB)
= one mil lion byt es, one gigabyt e (GB) = one bil lion
byt es, andonet erabyt e(TB) = onet rill ionbyt es. Tot al accessi blecapacit yvariesdependingon
operat ing environment . Asused f or buff er or cache, one megabyt e (MB)
= 1,048,576 byt es. Asused
f or t ransf er rat e or int erf ace, megabyt e per second (MB/ s) = one mill ion byt es per second, and gigabit
per second (Gb/ s) = one bil l ion bi t sper second. Ef f ect i ve maximum SATA6 Gb/ st r ansf er rat e
calculat ed accordingt o t heSerial ATAspeci ficat ion publi shed byt he SATA-IOorganizat ionasof t he
dat eof t hisspecif icat i on sheet .

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2.2.1 Physical Dimensions
English Metric
Dimension Tolerance Dimension Tolerance
Height 0.27 inches ±0.01 inch 6.8mm ±0.20 mm
Lengt h 3.94 inches ±0.01 inch 100.20 mm ±0.25 mm
Widt h 2.75 inches ±0.01 inch 69.85 mm ±0.25 mm
Weight (t ypical) 0.20 lb — 92 gm —

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1 >.040@
2.3 Mechanical Specifications
Figure 2-1 shows the mounting dimensions and locations of the screw holes for the drive.

Fi gure 2-1. Mount ing Dimensions
0.5 >.020@
6
; 9 :
0.5 >.020@
6
; 9 :

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2.4 Electrical Specifications
2.4.1 Current Requirements and Power Dissipation
Operating Mode Current1Power1
5 VDC
Spinup (max) 1A 5W
Read/ Writ e (average) 289mA 1.4W
Seek (average) 328mA 1.6W
POWER MANAGEMENT COMMANDS
Operating Mode Current1Power1
5 VDC
Idle (E1H)(average) 110mA 0.55W
St andby (E0H)(average) 31 mA 0.16W
Sleep(E6H)(average) 31 mA 0.16W
1
Al l val uesaret ypical (25°Cand5Vinput ) except wherespecif iedasmaximum.
2.4.2 Input Voltage Requirements
The input voltage requirement for these drives is +5.0V ± 5%.

2.4.3 Ripple
+ 5 VDC
Maximum
Frequency 100mV(peak-t o-peak)
10 KHz - 30 MHz
2.4.4 ESD
The ESD specification compliance is determined at room ambient conditions with nominal power
supply settings, unless otherwise specified.

Op- System Level Minimum
Direct cont act discharges 8 kV
Direct air discharges 15 kV
Indirect cont act discharges (VCP & HCP) 8 kV
Indirect air discharges (VCP & HCP) 15 kV
Non- Op Drive Level
Direct cont act discharges 8 kV
Direct air discharges 15 kV

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
2.5 Environmental Specifications
2.5.1 Shock and Vibration
Table 2-1. Shock and Vibrat ion
Shock
Operating(2 ms) 400G
Non-operating(2ms) 1000G
Not e: Half -sine wave, measured wit hout shock isolat ion and wit hout non-r ecoverable errors.
Vibration
Operating
1
0.063g2/ Hz, 5Hz-40Hz; 0.063g2/ Hz-0.0006g2/ Hz, 40Hz-500Hz
Non-operating
2
0.06984 g2/ Hz, 10-500 Hz
1 2.2 Grms, measured usingrandom writ e/ read rat io of 1:3 at bl ock size of 256
2
5.8 Grms
Drive Generated Vibration
Operating (average) 0.22 gm-mm
Rotational Shock Non-Operating
Amplit ude 50Krad/ sec2
Durat ion 2 ms
Operating Vibration
Drives are tested by applying a random or swept sinusoidal excitation in each linear axis, one axis at a
time. The drive incurs no physical damage and no hard errors while operating and subjected to
continuous vibration not exceeding the level listed in Table 2-1. Operating performance may degrade
during periods of exposure to continuous vibration.

Non- Operating Vibration
Note : This specification applies to handling and transportation of unmounted drives.
Drives are tested by applying a random or swept sinusoidal excitation in each linear axis, one axis at a
time. The drive incurs no physical damage when subjected to continuous vibration not exceeding the
level listed in Table 2-1.

Drive Generated Vibration
Drives are tested by supporting a single drive horizontally in a free-free state and measuring the side-to-
side vibration. Self vibration may not exceed the level listed in Table 2-1.

Rotational Shock Non- Operating
Drives are tested by applying a rotational force centered around the actuator pivot. The drive incurs no
physical damage when subjected to the rotational force specified in Table 2-1.

Packaged Shock and Vibration
The shipping packaging is designed to meet the National/International Safe Transit Association
(N/ISTA) standards for packaged products. The drive incurs no physical damage when subjected to the
N/ISTA standards.

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
2.5.2 Temperature and Humidity
Operation
Min-Max Base Cast ing Temperat ure
1
0C t o 60C (32°F to 140°F)
Humidit y 8-90% RH non-condensing
29.4  C (maximum wet bulb)
Thermal Gradient 20  C/ hour (maximum)
Humidity Gradient 20%/ hour (maximum)
Non- Operation
Non-operatingTemperature -40°C to 65°C (-40°F t o 149°F)
Humidit y 5-95% RH non-condensing
40C(maximumwet bulb)
Thermal Gradient 30  C/ hour (maximum)
Humidity Gradient 20%/ hour (maximum)
1
The syst em environment must all ow suf f icient air f low t o limit maximum base cast ing t emperat uresasdef ined in
Figure 2-2below.
2.5.3 Thermocouple Location
Component Location
Drive base cast ing #1, Figure 2-2
Figure 2-2. Drive Base Cast ingThermocouple Locat ion
6.35
.250
19.05
.750

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2.5.4 Cooling
If forced air cooling is required, the drive must be positioned to receive airflow from one or more fans
as indicated in Figure 2-3.

Fi gure 2-3. Forced Airf l ow Direct i on
2.5.5 AtmosphericPressure
Altitude
-1,000 feet t o 10,000 feet (-305m to 3,048m)
-1,000 feet t o 40,000 feet (-305m to 12,192m)

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2.5.6 Electromagnetic Field/ Magnetic Field Immunity
Test Level
Frequency Range
5 V/ m 100 Khz t o 200 MHz
5 Gauss DC t o . 200 MHz
1 Gauss .200 Mhz t o . 400 MHz
.005 Gauss .400 Mhz t o 20 MHz
2.5.7 Operating Drive DC Magnetic Field Susceptibility
Drive level operational magnetic DC field susceptibility:
 160 Gauss outside shaded area
 40 Gauss inside shaded area in all magnetic field directions

Figure2-4. Operat ingDriveDCmagnet icFieldSuscept ibilit y
2.5.8 Acoustics
TYPICAL SOUND POWER LEVEL1
Idle Mode (average dBA) 2
17
Seek Mode (average dBA) 3
22
1
Measured pe
r
ECMA-74/ ISO 7779.
2
No audible pure t ones.
3
Random seek at a rat e of 26 seeksper second.
2.5.9 RoHS (Restriction of Hazardous Substances)
HGST hard drive products manufactured and sold worldwide after June 8, 2011, meet or exceed
Restriction of Hazardous Substances (RoHS) compliance requirements as mandated by the RoHS
Directive 2011/65/EU. RoHS aims to protect human health and the environment by restricting the
use of certain hazardous substances in new equipment, and consists of restrictions on lead, mercury,
cadmium, and other substances.

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
2.6 Reliability Characteristics
Average Failure Rate (AFR) is calculated based upon a typical PC Client environment. Operation
outside the typical Client environment may increase the AFR.

Component Design Life 5 years
AFR <0.5%
Power on Hours(POH) 3120

2.7 Device Plug Connector Pin Definitions
The drive interfaces with the host I/O bus via the SATA interface connection, and receives power from
the SATA power connection, illustrated in Figure 2-5 below. Table 2-2 identifies the pin definitions of
the SATA connectors and the corresponding signal names and signal functions.

Figure 2-5. St andard Fact ory Connect ors
Table 2-2. Device Pin Connect or Pin Definit i ons
Signal segment
S1 Gnd 2nd mat e
S2 A+ Differential signal pair A from Phy
S3 A-
S4 Gnd 2nd mat e
S5 B- Di f f er ent i al si gnal pai r B f r om Phy
S6 B+
S7 Gnd 2nd mat e
Key and spacing separat e signal and power segments
Power segment
P1 Reserved Connected t o P2
P2 Reserved Connected t o P1
P3 Reserved Not Connect ed
P4 Gnd 1st mate, GROUND
P5 Gnd 2nd mate, GROUND
P6 Gnd 2nd mate, GROUND
P7
V
5
5Vpower, Precharge, 2nd mat e
P8
V
5
5V power
P9
V
5
2nd mate, 5Vpower
P10 Gnd 2nd mate, GROUND
P11 ACT- Act ivit y LED- (O. D.)/ St aggered Spin-up Disable Cont rol
P12 Gnd 1st mate, GROUND
P13 V12 12 V power, pre-charge, 2nd mat e, NOT CONNECTED
P14 V12
12 V power, NOT CONNECTED
P15
V
12
12 V power, NOT CONNECTED

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2.8 Agency Approvals
Travelstar Z5K500.B Regulatory Number (R/N): 800025
These drives meet the standards of the following regulatory agencies:
 Underwriters Laboratories: Bi-National UL Standard CAN/CSA-C22.2 No. 60950/UL 60950-
1. Standard for Safety of Information Technology Equipment, including Electrical Business
Equipment (File E101559).
 TUV NORD CERT GmbH: IEC-950 (EN60950) Standard for Safety of Information
Technology Equipment, including Electrical Business Equipment. EN60065. Standard of Safety
for Audio, Video, and Similar Electronic Apparatus.
 CE Compliance for Europe : Verified to comply with European Directive 2014/30/EU and
the CE marking for the certification appears on the hard disk drive.
 RCM Compliance for Australia: Verified to comply with AS/NZ3548 for RF Emissions as
required by the Australian Communications Authority.
 Korean RRL Mark : Registered as a Class-B product with the South Korean Ministry of
Information and Communication.
 Taiwan BSMI EMI Certification: Certified as a Class-B product with the Bureau of Standards
Metrology and Inspection (BSMI).
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2.9 Full Model Number Specification
Table 2-3 below provides a summary specification of the model number suffix for this product
platform.
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Table 2-3. Full Model Number Descript ion
Model Number Format Product Brand RPM Description
HTS545050B7E660 Travelstar Z5K500.B
5400 Travelst ar Z5K500.B 16MB SATA 6Gbps