Hilscher Netrapid 90 Guide

Design guide

netRAPID 90

Chip Carrier

Hilscher Gesellschaft für Systemautomation mbH

www.hilscher.com

Table of contents 2/108

Table of contents

1 Introduction .............................................................................................................................. 5

1.1 About this document ........................................................................................................5

1.2 List of revisions ................................................................................................................5

1.3 References to documents ................................................................................................5

2 Product concept and overview............................................................................................... 6

2.1 Concept netRAPID 90......................................................................................................6

2.1.1 Companion solution: Preloaded communication module.................................. 6

2.1.2 Stand-alone solution: Programming platform like a netX chip .......................... 7

2.1.3 One design with different memory options........................................................ 8

2.2 Overview netX90 base technology...................................................................................9

2.2.1 Features netX90 ............................................................................................... 9

2.2.2 Internal structure of the netX90......................................................................... 9

2.2.3 Security concept netX90 and netX90 based products .................................... 10

2.2.4 Software concept netX90 and netX90 based products................................... 10

2.3 Overview netRAPID 90 ..................................................................................................12

2.3.1 Features netRAPID 90.................................................................................... 12

2.3.2 Requirements for design-in............................................................................. 12

2.3.3 Connections overview..................................................................................... 13

2.3.4 Benefits of netRAPID90 .................................................................................. 14

2.4 netRAPID 90 variants.....................................................................................................15

2.4.1 Overview netRAPID 90 products .................................................................... 15

2.4.2 Memory options .............................................................................................. 15

2.4.3 Preloaded vs. open platform ........................................................................... 16

2.5 Solutions for typical applications ....................................................................................17

2.5.1 Companion solution providing a fixed layout .................................................. 17

2.5.2 Stand-alone solution providing a flexible layout.............................................. 17

3 Mechanics............................................................................................................................... 18

3.1 Dimension ......................................................................................................................18

3.2 Design guidelines for the host system ...........................................................................19

3.2.1 Footprint.......................................................................................................... 19

3.2.2 Thermal behavior and thermal pad ................................................................. 20

3.2.3 VIAs and signal fan out underneath the netRAPID device ............................. 20

3.3 Tempering, storage and soldering .................................................................................21

3.4 Matrix label.....................................................................................................................22

4 Electrical aspects common for both solutions ................................................................... 23

4.1 Location of pins ..............................................................................................................23

4.2 General signals ..............................................................................................................23

4.2.1 Supply voltage ................................................................................................ 23

4.2.2 Reset signals .................................................................................................. 24

4.2.3 Boot signal and boot options........................................................................... 25

4.3 Real-Time Ethernet interface .........................................................................................27

4.3.1 Interface description........................................................................................ 27

4.3.2 Design recommendations ............................................................................... 28

4.4 Diagnostic interfaces......................................................................................................31

4.4.1 Serial interface – UART .................................................................................. 31

4.4.2 JTAG Debugging interface.............................................................................. 32

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4.5 LED Signals ...................................................................................................................33

4.5.1 MultiLED concept............................................................................................ 33

4.5.2 LED overview.................................................................................................. 33

4.5.3 System LED (SYS LED) ................................................................................. 34

4.5.4 LEDs COM0 and COM1 ................................................................................. 35

4.5.5 Link/Activity LEDs ........................................................................................... 35

5 Electrical aspects for the companion solution ................................................................... 37

5.1 Pin assignment...............................................................................................................37

5.2 Block diagram for the companion solution .....................................................................40

5.3 Host interface .................................................................................................................41

5.3.1 Serial dual-port memory mode........................................................................ 41

5.3.2 Design recommendation ................................................................................. 42

5.4 Fieldbus interface...........................................................................................................43

5.4.1 PROFIBUS-DP ............................................................................................... 43

5.4.2 DeviceNet ....................................................................................................... 43

5.5 SYNC0/1 signals ............................................................................................................44

6 Electrical aspects for the stand-alone solution .................................................................. 46

6.1 Pin assignment...............................................................................................................46

6.2 Block diagram for the stand-alone solution ....................................................................50

6.3 General signals ..............................................................................................................51

6.3.1 Brown-out detection ........................................................................................ 51

6.4 MMIO signals .................................................................................................................51

6.5 ADCs..............................................................................................................................52

7 Evaluation Board ................................................................................................................... 55

7.1 Positions of elements - Evaluation board NRPEB H90-RE............................................55

7.2 Operating elements of the evaluation Board..................................................................57

7.2.1 Switches and buttons...................................................................................... 57

7.2.2 Jumper field X501 ........................................................................................... 63

7.3 Interfaces .......................................................................................................................64

7.3.1 Fieldbus interface (X300)................................................................................ 64

7.3.2 JTAG interface (X301) .................................................................................... 65

7.3.3 Extension interface (X302).............................................................................. 66

7.3.4 COM IO (X303) ............................................................................................... 67

7.3.5 Extension interface (X304).............................................................................. 68

7.3.6 SYNC0/1 signals (X305) ................................................................................. 69

7.3.7 SYNC0/1 signals (X306) ................................................................................. 70

7.3.8 Reset out signal (X307) .................................................................................. 71

7.3.9 UART interface (X308).................................................................................... 72

7.3.10 SQI interface (X309) ....................................................................................... 73

7.3.11 Ethernet interface (X400)................................................................................ 74

7.3.12 ADC reference voltage VREF-ADC (X500) .................................................... 75

7.3.13 SPM Interface (X600) ..................................................................................... 75

7.3.14 USB interface for SPM - NRPEB H90-RE (X700)........................................... 76

7.3.15 Power connector (X800) ................................................................................. 77

7.4 LEDs ..............................................................................................................................78

7.4.1 SYS LED (P300) ............................................................................................. 79

7.4.2 COM0 LED (P400).......................................................................................... 80

7.4.3 COM1 LED (P401).......................................................................................... 80

7.4.4 User LEDs (P500-P503) ................................................................................. 81

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7.4.5 Link/Activity0/1 (X400-C/D)............................................................................. 82

8 Accessories............................................................................................................................ 83

8.1 NXHX Fieldbus interface modules .................................................................................83

8.1.1 PROFINET-DP Interface Module NXHX-DP................................................... 84

8.1.2 CANopen Interface Module NXHX-CO ........................................................... 85

8.1.3 DeviceNet Interface Module NXHX-DN .......................................................... 85

8.1.4 CC-Link Interface Module NXHX-CC.............................................................. 86

8.2 NXHX RS232 interface modules....................................................................................87

8.2.1 RS232 interface module ................................................................................. 88

9 Schematics ............................................................................................................................. 89

9.1 NRPEB H90-RE - Front view .........................................................................................89

9.2 NRPEB H90-RE ETHERNET.........................................................................................90

9.3 NRPEB H90-RE FTDI ....................................................................................................91

9.4 NRPEB H90-RE IO ADC................................................................................................92

9.5 NRPEB H90-RE NETRAPID..........................................................................................93

9.6 NRPEB H90-RE POWER_SUPPLY ..............................................................................94

9.7 NRPEB H90-RE SWITCHING MATRIX.........................................................................95

9.8 NRPEB H90-RE SYSTEM .............................................................................................96

10 Bill of material ........................................................................................................................ 97

10.1 Overview ........................................................................................................................97

10.2 NRPEB H90-RE .............................................................................................................97

11 Appendix............................................................................................................................... 100

11.1 Legal notes...................................................................................................................100

Contacts................................................................................................................................ 108

netRAPID 90 | Design guide

Introduction 5/108

1 Introduction

1.1 About this document

This design guide describes the mechanical and electrical interfaces of

netRAPID 90. This document also includes the description of the netRAPID

90 Evaluation Board.

1.2 List of revisions

Rev Date Name Chapter Revision

1 2019-09-11 RGö/

CHu / HHe

All Created.

Table1: List of revisions

1.3 References to documents

This document refers to the following other documents:

Hilscher Gesellschaft für Systemautomation mbH: Getting Started Guide,

Serial Dual-Port Memory Interface with netX, Revision 4, English, 2015.

Hilscher Gesellschaft für Systemautomation mbH: Design-In Guide,

netX90, Revision 4, Document ID DOC180501DG04EN, English, 2018-19.

Hilscher Gesellschaft für Systemautomation mbH: Technical Data

Reference Guide, netX90, Revision 3, Document ID

DOC160609TRG03EN, English, 2017-19.

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2 Product concept and overview

2.1 Concept netRAPID 90

The architecture of the netRAPID 90 half-size chip carrier is based on the

netX 90 technology and provides a scalable platform for a wide range of

application scenarios.

You can use the netRAPID 90 as

·a companion solution with host interface (application is executed on

the host CPU)

·a stand-alone solution with a single chip (application is executed on

the APP CPU of netX 90)

On top netRAPID 90 is the perfect way for rapid prototyping of netX90 and

one can easily migrate to a real chip-design after a ramp-up phase.

2.1.1 Companion solution: Preloaded communication module

You can use netRAPID 90 as companion solution in the style of a

communication module to be connected with a host CPU.

In this scenario, netRAPID 90 comes preloaded with a communication

protocol and is ready to use. For this approach, no netX licence or support

agreement is required.

For the companion solution, no netX licence or support contracts are

required.

In the preloaded version, the pin assignment is fixed to certain functionality:

·Real-Time Ethernet or Fieldbus Slave

·SPI interface to the host CPU

·LEDs (COM0, COM1, Link/Activity 0/1)

·SYNC0/1

·UART Diagnosis

·+3.3V, GND

Note:

For more information, see section Companion solution providing a

fixed layout [}page17].

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2.1.2 Stand-alone solution: Programming platform like a netX chip

You can use netRAPID 90 in a stand-alone solution without any host. This

use case can be considered as nearly identical to the direct use of a netX

90 chip.

The pin assignment is flexible and can be adapted by the customer

according to his or her needs by using the tool netX Studio CDT.

For this approach, a netX license and support agreement as well as the

purchase of appropriate protocol stacks are required.

In this scenario, the netRAPID 90 is provided as a pure hardware-platform.

Note:

For more information, see section Stand-alone solution:

Programming platform like a netX chip [}page7].

To reduce production costs at the OEM, Hilscher optionally offers the

service to supply netRAPID 90 preloaded with customer specific content.

For further details about this service please contact the Hilscher sales

team.

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2.1.3 One design with different memory options

A netRAPID 90 is a scalable platform for various use cases, from pure

communication interface up to intelligent field device with integration

customer application. It is a single hardware design, which comes in

different memory options and subsequent different software functionality:

·netRAPID 90 with netX90-internal memory only (NRP H90-RE)

·netRAPID 90 with 8 MB SQI Flash and 8 MB SDRAM (NRP H90-RE

\F8D8)

Depending on the available memory size, the following communication

functionality can be applied:

Basic communication functionality for small footprints, low cost and function

optimized slave devices:

·Using netX90 internal memory only

·Channel 0: Real-Time Ethernet or Fieldbus Slave

·Channel 1: Network Services e.g. TCP socket or NDIS

·Basic WebServer

·Configuration via packets only

Full featured firmware with maximum functionality

·Using external SDRAM and SQI Flash memory

·Channel 0: Real-Time Ethernet or Fieldbus Slave

·Channel 1: Network Services e.g. TCP socket or NDIS

·Future option: Channel 2: IOT Communication (e.g. OPC UA Server,

MQTT Client)

·Basic WebServer + Custom web content

·Configuration via packets + Configuration Tool Communication Studio

·Future option: Security functions

Note:

For detailed functionality, please refer to the technical data of the

corresponding protocol stack within the Hilscher knowledgebase:

https://kb.hilscher.com/display/HILKB/Technologies

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2.2 Overview netX90 base technology

This section describes the netX90 base technology empowering the

netRAPID 90.

2.2.1 Features netX90

The netX 90 is a very powerful and versatile System-on-chip (SoC) for

communication in industrial networks. It offers:

·Smallest multi-protocol SoC with additional Cortex-M4 application

processor:

10 x 10 mm in a 144-pin BGA with 0.8 mm ball pitch

Its innovative architecture allows communication tasks and application

tasks to be executed on separated Cortex-M4 processors.

·Energy-efficient SoC with lowest power loss (<= 1 W).

·Support for all Industrial Ethernet, Fieldbus and IIoT standards providing

a huge amount of flexibility.

·Support for IEEE 1588 functionality

·Rich software ecosystem with state-of-the-art tools

·Common software interface

·Rich peripheral set for application designs

·Integrated security functions for secure field and cloud connectivity.

2.2.2 Internal structure of the netX90

The following figure shows a block diagram of the netX 90.

Figure1: Block diagram of netX90

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2.2.3 Security concept netX90 and netX90 based products

netX 90 offers integrated security functions required for secure field and

cloud functionality. This is achieved by the CryptoCore integrated within

netX 90 which accelerates the SSL/TLS protocols and supports the

following encryption algorithms:

Algorithm Supported key length

RSA 4096

ECC 512

AES 256

SHA 512

Table2: Supported encryption algorithms in netX 90

There is no TPM chip necessary.

2.2.4 Software concept netX90 and netX90 based products

Common software application interface

Figure2: Common software application interface

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The common software application interface of the netX 90 and the netX 90-

based products:

·Based on Hilscher’s Platform strategy

·Three separate COM channels to the application (cyclic and acyclic

data)

Channel Data transferred via channel

Channel 0 Real-Time Ethernet data(→ CIFX API)

Channel 1 TCP socket / Raw Ethernet interface

Channel 2 IIoT data(→ netPROXY API)

Table3: COM channels for cyclic and acyclic data to the application

·Uses same software application interface whether:

– from external host (→ Companion Solution)

– or internal host application (→ Stand-alone Solution)

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2.3 Overview netRAPID 90

2.3.1 Features netRAPID 90

netRAPID 90 offers the following features:

·Ultra-compact design for small field devices

·All major Real-Time Ethernet, Fieldbus and IIoT standards are

supported.

·Built-in security for secure connectivity to field and cloud

·Scalable platform for different use cases

·Preloaded and “ready to use”

·Energy-efficient for extended temperature range

2.3.2 Requirements for design-in

Take the following items into account during the design of your netRAPID

90-based device:

·netRAPID 90

·Magnetics / Transformer

·Connector

·LEDs

·Follow design rules for > 70°C

·SPI Host connection only

·+3.3V and GND

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2.3.3 Connections overview

The figure below illustrates all connections of the netRAPID 90 chip carrier

regardless of the mode they are intended for (companion solution or stand-

alone solution).

Figure3: Block diagram of NRP H90-RE and its interfaces

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For a similar figure showing only the pins relevant for the companion

solution, see section Block diagram for the companion

solution [}page40].

For a similar figure showing only the pins relevant for the strand-alone

solution, see section Block diagram for the stand-alone

solution [}page50].

2.3.4 Benefits of netRAPID90

Ready-to-use netX 90 design

·The fully tested netX 90 design ensures a fast time to market without

development risk

·EOL and part obsolescence handling by Hilscher

·RTE or FB interface in one design

Reduced design and production costs

·PCB complexity and costs are encapsulated. Baseboard can be done in

cost-effective 4 to 6 layer design

·Preloaded with COM Firmware and customer application to reduce

production effort at OEM

Modular and scalable platform

·Different memory options for different applications in a single baseboard

design

·Well prepared for security, TSN and other emerging technologies

·Simpler handling compared to a chip

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2.4 netRAPID 90 variants

2.4.1 Overview netRAPID 90 products

Overview

The following table lists all variants of netRAPID 90, the corresponding

evaluation board and the appropriate firmware:

Products Description Part number

NRPEB H90-RE Evaluation board equipped with soldered-in NRP H90-RE\F8D8 7600.320

NRP H90-RE\F8D8 (TRAY) 56 pieces of NRP H90-RE\F8D8 Chip Carriers (8 Mbyte SQI Flash

and 8 Mbyte SDRAM) preloaded in according variants with firmware

for EtherCAT (NRP H90-RE\F8D8/ECS), EtherNet/IP (NRP H90-RE

\F8D8/EIS) or PROFINET IO (NRP H90-RE\F8D8/PNS)

7690.102

NRP H90-RE (TRAY) 56 pieces of NRP H90-RE Chip Carriers (Internal flash and RAM

only) preloaded in according variants with firmware for EtherCAT

(NRP H90-RE /ECS), EtherNet/IP (NRP H90-RE /EIS) or

PROFINET IO (NRP H90-RE/PNS)

7690.100

NXHX-DP Fieldbus interface module for PROFIBUS-DP 7923.410

NXHX-CO Fieldbus interface module for CANopen 7923.500

NXHX-DN Fieldbus interface module for DeviceNet 7923.510

NXHX-CC Fieldbus interface module for CC-Link 7923.740

Firmware for Real-Time Ethernet (Slave)

NXLFW-ECS Loadable EtherCAT Slave Firmware 7428.120

NXLFW-EIS Loadable EtherNet/IP Adapter Firmware 7428.830

NXLFW-OMB Loadable Open Modbus/TCP Firmware planned

NXLFW-PLS Loadable POWERLINK Controlled Node Firmware planned

NXLFW-PNS Loadable PROFINET IO Device Firmware 7428.851

NXLFW-PNS-IOT Loadable PROFINET IO-Device Firmware and IoT planned

NXLFW-EIS-IOT Loadable Firmware EtherNet/IP Adapter and IoT planned

Firmware for Fieldbus (Slave)

NXLFW-DPS Loadable PROFIBUS-DP Slave Firmware planned

NXLFW-DNS Loadable DeviceNet Slave Firmware planned

Table4: Product overview netRAPID 90

2.4.2 Memory options

As described in section One design with different memory

options [}page8], there are two memory options for the netRAPID 90:

·The NRP H90-RE uses the internal memory of the netX 90 processor

(COM-CPU: 576 kB SRAM, 1024 kB Flash, APP-CPU: 64 kB SRAM,

512 kB Flash).

·The NRP H90-RE\F8D8 uses 8 MB external SQI Flash and 8 MB

external SDRAM additionally to the internal memory of the netX 90

processor.

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2.4.3 Preloaded vs. open platform

2.4.3.1 Evaluation

The evaluation board NRPEB H90-RE is sold in units of 1 piece for test and

development purposes (order no. 7600.320).

2.4.3.2 Preloaded variants of netRAPID 90 (Companion solution)

In the following product variants, netRAPID 90 is available preloaded with

communication protocol:

Packaging unit 1 tray 18 trays 45 trays

NRP H90-RE\PNS 56 pieces \F8D8 1008 pieces \F8D8 2520 pieces \F8D8

NRP H90-RE\EIS 56 pieces \F8D8 1008 pieces \F8D8 2520 pieces \F8D8

NRP H90-RE\ECS 56 pieces \F8D8 1008 pieces \F8D8 2520 pieces \F8D8

NRP H90-RE\DPS

(planned)