
M-90
GPS Module series
HE PRO NAME IN GPS
HOLUX echnology, Inc.
No. 1-1, Innovation Rd. I, Science-Based Industrial Park, HsinChu City 300, aiwan R.O.C
EL: 886-3-6687000
F
AX:886-3-6
6871
1
1 E-m
ail:
[email protected].tw http:
www
.holux.com
.tw
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Index
1. Introduction.............................................................................................4
1.1 General introductions.................................................................4
1. Key Features................................................................................4
1.3 Applications.................................................................................4
Technical Description.............................................................................5
.1 Block Diagram .............................................................................5
. Pin Definition ...............................................................................5
.3 Specification................................................................................6
3. Mechanical Dimension ...........................................................................8
3.1 Mechanical Dimension................................................................8
4 Package ...................................................................................................9
4.1 Packing ........................................................................................9
4. Reference product photo..........................................................10
5 User Interface........................................................................................ 11
5.1 Protocol...................................................................................... 11
5. NMEA Protocol .......................................................................... 11
5.3 MTK NMEA Packet Format .......................................................12
6 Reference design..................................................................................13
6.1 Application circuit.....................................................................13
6. Reference PCB pattern .............................................................14
6.3 Recommendation reflow profile...............................................15