HP 24 Assembly instructions

Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP 24 All-in-One PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
MotherBoard, SSD Card, VGA PCB, RAM
4
Batteries
All types including standard alkaline and lithium coin
or button style batteries RTC battery
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps LCD
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Power Cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.

Tool Description
Tool Size (if
applicable)
Screwdiver
TORX T8
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Removed Hinge Cap
2. Removed Base Stand
3. Removed Front Benzel
4. Remove LCD display
5. Removed HDD holder and HDD
6. Removed ODD
7. Removed Speaker
8. Removed Power PCB
9. Remove FAN
10. Removed Carmera module
11. Removed Heat Sink
12. Removed VGA PCB, Wirelan Card, SSD Card, RAM
13. Removed Motherboard,
14. Removed Hinge
15. Removed MB Holder
16. Removed Rear Cover
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Removed Hinge Cap
2. Removed Base Stand

EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3. Removed Front Bezel
4. Remove LCD display
5. Removed HDD Holder and HDD
6. Removed ODD

EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
7. Removed Speaker
8. Removed power PCB
9. Removed FAN
10. Removed Camera module

EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
11. Removed Heat sink
12. Removed VGA PCB, Wirelan Card, SSD Card, RAM
13. Removed Motherboard
14. Removed Hinge

EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
15. Removed MB Holder
16. Removed Rear Cover