HP Compaq dx2810 Microtower Assembly instructions

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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
Name / Model #1: HP Compaq dx2810 Microtower PC
Name / Model #2
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2 (1 sys bd,
1 P/S)
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
2 (P/S
board)
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances

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1.3 Markings for plastic parts greater than 25 grams
Plastic Part Name
Plastic Part
Description
Weight
(grams)
ISO 11469:2000 Plastic
Part Mark
Optional: Photo
Main Bezel
Main front bezel
piece
150
>ABS<
Bezel Frame
Front bezel frame
194
>ABS<
System Fan Frame
Fan Frame
47
>PBT-GF30-FR(17)<
CPU Heatsink Fan
Frame
Fan Frame
35
>PBT-GF30-FR(17)<
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Phillips screwdriver
Description #2 Dikes
Description #3 Torx screwdriver
T-15
Description #4 Flat head screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. To remove the access panel (see Figure 1):
a. Loosen the captive thumbscrew (1) that secures the access panel to the computer chassis.
b. Slide the access panel back (2) about 1.3 cm (1/2 inch), then lift it off the unit.
2. Press outward on the three latches on the right side of the bezel (1), then rotate the right side of the bezel off the
chassis (2) followed by the left side (see Figure 2).
3. Remove or cut all expansion cards, cables, and any other devices from the system board.
4. To remove the heatsink from the system board (see Figure 3):
a. Loosen the four captive screws that secure the heatsink to the system board.
b. Lift the heatsink from atop the processor and set it aside.
5. To remove the system board (see Figure 4):
a. Remove the 8 screws that secure the system board to the chassis.
b. Lift the system board and slide it toward the front of the chassis and up to remove it.
NOTE: System board appearance may vary.
6. To remove the power supply:
a. Remove the four Phillips screws that secure the power supply to the chassis (see Figure 6).
b. Press the release latch on the chassis base, and then lift up the rear of the power supply to disengage it from the
chassis.
c. Slide the power supply toward the front of the computer, rotate toward the fan so the power supply clears the lip on
the top of the chassis, and then lift the power supply out of the chassis.
7. Disassemble and remove required power supply components:
a. Using a Phillips screwdriver, remove the screws that secure the cover to the power supply chassis.
b. Using dikes, cut the plastic clamp that secures the wires to the power supply cover.
NOTE: You do not need to remove the screws from the fan guard or the power connector.
c. Lift the cover off the power supply.
d. Using dikes, cut all cables connecting the PCA to the power supply.
f. Remove the screws that secure the power supply PCA to the chassis.
g. Remove the power supply PCA from the power supply chassis.
h. Cut or remove the capacitors as shown in Figure 7.
8. To remove the battery:
Locate the battery and battery holder on the system board. Depending on the type of battery holder on the system

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board, complete the following instructions to remove the battery.
TYPE 1 BATTERY HOLDER (see Figure 8):
Lift the battery out of the holder.
TYPE 2 BATTERY HOLDER (see Figure 9):
To release the battery from its holder, squeeze the metal clamp that extends above one edge of the battery. When the
battery pops up, lift it out.
TYPE 3 BATTERY HOLDER (see Figure 10):
Pull back on the clip that holds the battery in place, and then remove the battery.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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FIGURE 1: Removing the access panel
FIGURE 2: Remove the front bezel
FIGURE 3: Remove the heat sink

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FIGURE 4: System board screw locations
FIGURE 5: Power supply screw locations
FIGURE 6: Power supply release tab location

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FIGURE 7: Power supply capacitors to cut
FIGURE 8: Type 1 battery holder
FIGURE 9: Type 2 battery holder

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FIGURE 10: Type 3 battery holder

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