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  9. HP ProDesk 405 G2 Assembly instructions

HP ProDesk 405 G2 Assembly instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 405 G2 MT Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
6
External electrical cables and cords
Power cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Cooler fan 84g,system fan 92g,PSU fan 63.5g
239.5g
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
T-15
Micro shear
YN-3
Screw driver
PH2
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel. (see Figure 1-2)
2. Remove front bezel. (see Figure 3)
3. Remove the HDD (see Figure 4-6)
4. Remove the Slim ODD (see Figure 7-8)
5. Unplug all cable conn. from PCA. (see Figure 9)
6. Remove the PCA(see Figure 10-11)
7. Remove the DIMM. (see Figure 12)
8. Disconnect cooler cable then remove the cooler from board. (see Figure13-14)
9. Remove the Battery. (see Figure 15)
10. Remove the FIO module from chassis. (see Figure 16-17)
11. Remove the SD card reader from chassis. (see Figure 18-19)
12. Remove the speaker from chassis. (see Figure 20-21)
13. Remove the PSU from chassis. (see Figure 22-23)
14. Remove the PSU chassis and remove the PSU board. (see Figure 24-34)
15. Remove the Electrolytic Capacitors from PSU board. (see Figure 35-41)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure1 Release Thumb screw on the access panel.
Figure2 Griping the tab at the end of access panel, pull
towards the rear and remove from unit.
Figure3 Pull 3 pcs bezel hooks and remove the front bezel
from chassis.
Figure4 Disconnect the SATA and power cables from
HDD
Figure5 Release the HDD screws
Figure6 Remove the HDD form chassis
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure7 Push the latch and release the Slim ODD.
Figure8 Remove the Slim ODD form chassis.
Figure9 Unplug all cable conn. from PCA.
Figure10 Release 6 pcs screws from PCA
Figure11 Remove PCA from chassis
Figure12 Push the hooks on both sides and then pick up
the memory
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure13 Unplug the cooler cable from PCA
Figure14 Release 4 screws from cooler and remove it
Figure15 Remove the battery from the PCA
Figure16 Release the screw of the FIO cable
Figure17 Push the plastic hook and rotation the FIO
module inside. Remove the FIO module from chassis
Figure18 Release the SD card reader screw
EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
EL-MF877-00 Page 7
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure19 Remove the SD Card reader from chassis
Figure20 Release two screws of speaker
Figure21 Remove the speaker form chassis
Figure22 Release 4 pcs screws of PSU and remove it
Figure23 Pull up the PSU and remove it
Figure24 Cut the cable tie
EL-MF877-00 Page 8
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure25 Remove screw for bottom
Figure26 Remove screw for top
Figure27 Remove FG screw
Figure28 Disconnect fan connector
Figure29 Cut the cable tie
Figure30 Remove LED
EL-MF877-00 Page 9
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure31 Remove plastic cover
Figure32 Remove PCB screw
Figure33 Remove AC inlet , select switch screw
Figure34 Cut output cable, AC inlet wire, LED wire
Figure35 Remove capacitors use solder iron
Figure36 Heat the solder of Electrolytic Capacitors
greater than 2.5cm in diameter or height and remove it.
(Crasto-S 180W E-Star-Acbel)
EL-MF877-00 Page 10
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure37 Heat the solder of Electrolytic Capacitors
greater than 2.5cm in diameter or height and remove it.
(C801 ,C951)(Crasto-S 180W E*6 PSU-Delta)
Figure38 Heat the solder of Electrolytic Capacitors
greater than 2.5cm in diameter or height and remove it.
(C801,C802,C951,C303) (Crasto-S 180W REG PSU-
Delta)
Figure39 Heat the solder of Electrolytic Capacitors
greater than 2.5cm in diameter or height and remove it.
( Crasto-S 180W APFC-Acbel)
Figure40 Heat the solder of Electrolytic Capacitors
greater than 2.5cm in diameter or height and remove it.
(Crasto-S 180W REG PSU-Chicony)
Figure41 Heat the solder of Electrolytic Capacitors
greater than 2.5cm in diameter or height and remove it.
(Crasto-S 180W APFC PSU-Chicony)

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