HP EliteDesk 705 G2 Desktop Mini Assembly instructions
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 705 G2 SFF Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Main Board
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries RTC
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
AC power cord
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel
2. Remove all add-on cards
3. Remove all cables from main board and devices
4. Remove front bezel and hood lock
5. Remove SD card reader and ODD
6. Remove all equipped HDD
7. Remove PSU
8. Remove M/B
9. Remove 95W / 65W heat sink from M/B
10. Remove DDR and battery from M/B
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
1. Remove access panel
1.
Lift the latch to
release access
panel of SFF
chassis as photo1
shown
2.
Rotate the driver
cage up to vertical
position and release
the retainer bracket
as photo2 shown
Photo1
Photo2
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3. Remove all cables from main board and devices
1
Release all the
cables have been
connected between
M/B and devices
(See Photo6)
1) Power cable (6 pin)
2) Heat sink cable
3) 12v PWR cable (4pin)
4) Audio cable
5) Front USBx2 & card
reader
6) HDD SATA & PWR
7) ODD SATA & PWR
8) Add on card cabl
9) Hood lock cable
Photo6
EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
4. Remove front bezel and hood lock
1
Lift up 3 latches
then remove front
bezel
(See Photo7,8)
2
Release tamper
proof screw then
release the cable
from M/B
(6-32 x .187”
Security Head)
(See Photo9,10,11)
Photo7
Photo8
Photo9
Photo10
Photo11
EL-MF877-00 Page 7
Template Revision B
PSG instructions for this template are available at EL-MF877-01
5. Remove SD card reader and ODD
1
Release 1 screw
from card reader
(6-32 x 0.187”)
(See Photo12)
2
Remove card reader
module from chassis
(See Photo13,14)
3
Release the latch
from ODD cage then
pull ODD out of
cage; direction as
photo16 shown
(See Photo15,16)
Remove the plastic
latch from ODD as
photo17 shown
(See Photo17)
Photo12
Photo13
Photo14
Photo15
Photo16
Photo17
EL-MF877-00 Page 8
Template Revision B
PSG instructions for this template are available at EL-MF877-01
6. Remove all equipped HDD
1
Lift HDD latch then
press HDD to the
right for escaping
from cage
(See Photo18)
2
Remove HDD
towards up right
direction as 1st HDD
releasing
(See Photo19)
3
Lift HDD latch (Red
one) up then press
HDD to the right for
escaping from cage
(See Photo20)
Remove HDD
towards the direction
as shown as 2nd
HDD releasing
(See Photo21)
Photo18
Photo19
Photo20
Photo21
EL-MF877-00 Page 16
Template Revision B
PSG instructions for this template are available at EL-MF877-01
9. Remove 95W / 65W heat sink from M/B
1
Release 4 screws by
order 4 to 1 to free
95W heat sink from
chassis
(See Photo36)
2
Release 4 screws by
order 4 to 1 to free
65W heat sink from
chassis
(See Photo37)
Photo36
Photo37
1
2
3
4
EL-MF877-00 Page 17
Template Revision B
PSG instructions for this template are available at EL-MF877-01
10. Remove DDR and battery from M/B
1
Release DDR by
flipping latches
outwards as
direction shown
(See Photo38)
2
Remove battery
from M/B by
detaching the clip
outwards as
direction shown
(See Photo39)
Photo38
Photo39
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