HP ProDesk 400 G4 Installation instructions

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PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 400 G4 Microtower Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Acbel EPA85
3
External electrical cables and cords
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
Include the cartridges, print heads, tubes, vent

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including liquids, semi-liquids (gel/paste) and toner
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
T-15
Micro shear
170II
Screwdriver
PH1
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Loose the screw and remove access panel.(see Figure 1 below)
2. Disconnect ODD/HDD power cable and SATA cable from ODD/HDD.(see Figure 2- 5 below)
3. Remove the driver cage from chassis.(see Figure 6 below)
4. Remove ODD/HDD from driver cage.(see Figure 7-10 below)
5. Disconnect all cables from the MB.(see Figure 11-18 below)
6. Remove the heatsink from MB.(see Figure 19 below)
7. Separate the fan from CPU heatsink.（see Figure 20-21 below)
8. Remove the Memory card from the MB.(see Figure 22 below)
9. Remove the CPU from the MB.(see Figure 23-24 below)
10. Remove the battery from the MB .(see Figure 25 below)
11. Remove M/B from chassis.(see Figure 26-28 below)
12. Remove Speaker/system fan from chassis.(see Figure 29-30 below)
13. Remove PSU from chassis.(see Figure 31-33 below)
14. Separate PSU cover/fan and remove the Electrolytic Capacitors.(see Figure 34-41 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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PSG instructions for this template are available at EL-MF877-01
Figure 1 Loose thumb screw and remove access panel
Figure 2 Disconnect ODD power cable from ODD
Figure 3 Disconnect SATA cable from ODD
Figure 4 Disconnect HDD Power cable from HDD
Figure 5 Disconnect SATA cable from HDD
Figure 6 Remove the driver cage from chassis

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PSG instructions for this template are available at EL-MF877-01
Figure 7 Press the ODD’s latch on ODD cage
Figure 8 Remove the ODD from ODD cage
Figure 9 Use T-15 screwdriver to loose the screws of HDD
from cage
Figure 10 Remove the HDD from HDD cage
Figure 11 Disconnect SATA cable from the MB
Figure 12 Disconnect ODD/HDD PSU cables from the MB

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PSG instructions for this template are available at EL-MF877-01
Figure 13 Disconnect PSU P1 cable from the MB
Figure 14 Disconnect PSU P2 cable from the MB
Figure 15 Disconnect CPU P3 cable from the MB
Figure 16 Disconnect Speaker cable from the MB
Figure 17 Disconnect system fan cable from the MB
Figure 18 Disconnect heat sink fan cable from MB

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PSG instructions for this template are available at EL-MF877-01
Figure 19 Use T-15 screwdriver to loose the screws and
remove heat sink
Figure 20 Use PH1 screwdriver to loose the screws and
remove the fan
Figure 21 Separate the fan from CPU heat sink
Figure 22 Remove the Memory card from the board
Figure 23 Rotate the handle and open it up
Figure 24 Remove the CPU from the board

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Figure 25 Remove the battery from the system board
Figure 26 Use T-15 screwdriver to loose the screws of MB
from board
Figure 27 Remove front panel from chassis
Figure 28 Remove MB from chassis
Figure 29 Use T-15 screwdriver to loose the screws of
speaker and remove it
Figure 30 Use PH1 screwdriver to loose the screws of
system fan and remove it

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PSG instructions for this template are available at EL-MF877-01
Figure 31 Use micro shear 170II to cut the cable ties from
chassis front wall
Figure 32 Use T-15 screwdriver to loose the screws of PSU
Figure 33 Press the PSU’s latch on chassis
Figure 34 Remove the PSU from chassis
Figure 35 Use PH1 screwdriver to loose screws from top
of PSU
Figure 36 Use PH1 screwdriver to loose screws from bottom
of PSU

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Figure 37 Use PH1 screwdriver to loose screws of PSU fan
Figure 38 Open the PSU case
Figure 39 Use PH1 screwdriver to loose the screw of
PCBA cable
Figure 40 Use PH1 screwdriver to loose screws and remove
PCB from case
Figure 41 Remove caps from PCB