HP EliteOne 800 G3 Installation instructions
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteOne 800 G3 Touch GPU All-in-One Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
MB*1, Memory*2, SSD*1
4
Batteries
All types including standard alkaline and lithium coin
or button style batteries RTC
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps LED
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
Power cord
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Star(Torx) screwdriver OD 3.3mm..
Cross(Philips) screwdriver OD 3.0mm
Cross(Philips) screwdriver OD 2.0mm
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Refer to 1~4 to disassemble rear cover and IO pocket
2. Refer to 5~6 to disassemble VESA bracket and Fan
3. Refer to 7~8 to disassemble Thermal module
4. Refer to 9~12 to disassemble HDD and ODD
5. Refer to 13~14 to disassemble Webcam module
6. Refer to 15~16 to disassemble WLAN card and SSD card
7. Refer to 17~18 to disassemble Power supply and Audio jack cable
8. Refer to 19 to disassemble IO shielding
9. Refer to 20~22 to disassemble Power button board and Finger print
10. Refer to 23~25 to disassemble MB and CPU and Memory
11. Refer to 26~27 to disassemble Thermal pad and Base pan
12. Refer to 28 to disassemble Speaker and Antenna
13. Refer to 29 to disassemble LVDS and Backlight cable and Touch cable
14. Refer to 30 to disassemble LCD
15.
16.
17.
18.
19.
20.
21.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
AIO system disassembly
1. Place the system
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
4. Remove IO pocket , release 2 screws on red circle location remove IO pocket
Tool: Star(Torx) screwdriver OD 3.3mm
5. Remove VESA bracket with Fan , release 5 screws on red circle location to remove VESA bracket with Fan
Tool: Star(Torx) screwdriver OD 3.3mm
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
6. Remove Fan from VESA bracket ,release 4 screws on red circle location remove Fan from VESA bracket
Tool: Star(Torx) screwdriver OD 3.3mm
7. Remove thermal module(GPU SKU) , release 8 screws on red circle location to remove thermal module
Tool: Star(Torx) screwdriver OD 3.3mm
EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
8. Remove HDD with HDD cage , release 1 screw on red circle location and remove the DC power cable from the
hook on red circle location to remove HDD with HDD cage
Tool: Star(Torx) screwdriver OD 3.3mm
EL-MF877-00 Page 7
Template Revision B
PSG instructions for this template are available at EL-MF877-01
9. Remove HDD from cage , slide HDD out from the cage then release 4 gromet to remove HDD from cage
Tool: Cross(Philips) screwdriver OD 3.0mm
10. Remove ODD , push the ODD latch on red circle location to slide out the ODD
EL-MF877-00 Page 9
Template Revision B
PSG instructions for this template are available at EL-MF877-01
12. Remove Webcam module box , release 3 screws on red circle to remove Fan dust then release 4 screws on
yellow screws and unplug webcam connector on yellow circle location from MB
Tool: Star(Torx) screwdriver OD 3.3mm
Cross(Philips) screwdriver OD 3.0mm
13. Remove Webcam and Dmic , release 3 screws to remove Webcam box cover then remove Webcam and Dmic
EL-MF877-00 Page 11
Template Revision B
PSG instructions for this template are available at EL-MF877-01
14. Remove WLAN card , release 1 screws on red circle on location and unplug the antenna on yellow circle location
to remove WLAN card
Tool: Cross(Philips) screwdriver OD 2.0mm
15. Remove SSD card , release 1 screw on red circle location to remove SSD card
Tool: Cross(Philips) screwdriver OD 2.0mm
EL-MF877-00 Page 17
Template Revision B
PSG instructions for this template are available at EL-MF877-01
21. Remove Finger print module (Touch SKU) , release 2 screws on red circle loction to remove Finger print module
Tool: Cross(Philips) screwdriver OD 2.0mm
22. Remove MB , remove LVDS on red circle location from MB then release 9 screws on yellow circle location to remove MB
Tool: Star(Torx) screwdriver OD 3.3mm
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