HP 21-b All-in-One ENERGY STAR Assembly instructions

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: AIO computer
Marketing Name / Model
[List multiple models if applicable.]
Name / Model #1 HP 21-b All-in-One PC ENERGY STAR
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
MB*1, Memory*2 or 1, SSD*1
4
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button style
batteries RTC
1
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[X] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1/3.2.
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Includes background illuminated displays with gas
discharge lamps LCD
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
External electrical cables and cords
DC Cable for External Power Supply
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity of
items
included in
product
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
(Philips#1) screw driver 2±0.5 (kgf/cm)
(Philips#2) screw driver 4±0.5 (kgf/cm)
(Philips#2) screw driver 5±0.5 (kgf/cm)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Refer to 2-3 to disassemble Panel & system.
2. Refer to 4-5 to disassemble FAN & Heat sink.
3. Refer to 6-7 to disassemble DIMM & SSD.
4. Refer to 8 to disassemble power button board and Power button FFC.
5. Refer to 9-10 to disassemble Webcam.
6. Refer to 11 to disassemble Antenna and WIFI module.
7. Refer to 12-13 to disassemble HDD.
8. Refer to 14-16 to disassemble ODD.
9. Refer to 17 to disassemble Speaker.
10. Refer to 18 to disassemble M/B.
11. Refer to 19-20 to disassemble Hinge & M/B shielding.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations)
1. Place system & Stand. (Stand is assembled by user, not in Factory)

EL-MF877-00 Page 3
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
2. Remove 1 screw between Hinge & Front chin.
3. Disassemble Panel & System then remove LVDS & Backlight cable from M/B.
4. Remove 2 screws for FAN & FAN connector from M/B.

EL-MF877-00 Page 4
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
5. Release 4 screws to remove Heat sink.
6. Remove SSD by releasing 1 screw.
7. Release lock of DIMM on M/B, then remove DIMM.

EL-MF877-00 Page 5
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
8. Release 1 screw to remove power button board and remove FFC from M/B.
9. Release 2 screws to remove webcam, then remove webcam connector from M/B.
10. Remove Webcam cable & Shutter from Webcam assembly.

EL-MF877-00 Page 6
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
11. Release Antenna from WIFI module and release 1 screw to remove WIFI module.
12. Remove HDD cable and HDD (2 screws), and release 4 screw for removing HDD BKT.
13. Remove HDD cable & release 4 screws to remove HDD BKT from HDD.

EL-MF877-00 Page 7
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
14. Release 1 screw to remove ODD from MB shielding. And remove ODD rubber from ODD. Then remove ODD FFC from MB.
15. Then we can remove ODD assembly from system.
16. Remove ODD cable and ODD bezel from ODD module, and release 1 screw to remove ODD BKT.

EL-MF877-00 Page 8
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
17. Release 4 screws to remove speaker and mention the hook for release cable.
18. Release 7 screws to remove M/B from M/B shielding.

EL-MF877-00 Page 9
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
19. Release 8 screws to remove Hinge from M/B shielding.
20. Release 4 screws to remove M/B shielding from Back cover and we finish dis-assembly the unit.