HP Model 748 - VME Workstation User manual

Service Handbook
Model 748
HP Part No. A4511-90605
Edition E1199
Special Online Edition
Printed in U.S.A.

ii
Hewlett-Packard Co. 1997, 1999
Printing History
First Printing: February 1997
Latest Printing: November 1999
UNIX is a registered trademark of The Open Group.
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The information contained in this document is subject to change
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3000 Hanover St., Palo Alto, CA 94304.
10 9 8 7 6 5 4 3 2 1

Safety and Regulatory Statements
iii
Safety and Regulatory Statements
Safety
See the owner’s guide that came with your system for safety infor-
mation.
Regulatory Statements
Emissions Regulations
Federal Communications Commission (FCC) The Federal
Communications Commission of the U.S. government regulates
the radio frequency energy emanated by computing devices
through published regulations. These regulations specify the limits
of radio frequency emission to protect radio and television recep-
tion. All HP nodes and peripherals have been tested and comply
with these limits. The FCC regulations also require that computing
devices used in the U.S. display the agency’s label and that the
related documentation include the following statement:
NOTE: This equipment has been tested and found to comply with the limits
for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in
accordance with the instruction manual, may cause harmful
interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which
case the user will be required to correct the interference at his own
expense.
Canadian Department of Communications (CDC) This digi-
tal apparatus does not exceed the Class A limits for radio noise
emissions from digital apparatusas set out in theRadio Interference
Requirements of the Canadian Department of Communications.
Emissions Regulations Compliance Any third-party I/O device
installed in HP system(s) must be in accordance with the require-
ments set forth in the preceding Emissions Regulations statements.

Safety and Regulatory Statements
iv
In the event that a third-party noncompliant I/O device is installed,
the customer assumes all responsibility and liability arising there-
from.
Electrostatic Discharge (ESD) Precautions Electrostatic
charges can damage the integrated circuits on printed circuit
boards. To prevent such damage from occurring, observe the fol-
lowing precautions during board unpacking and installation:
• Stand on a static-free mat.
• Wear a static strap to ensure that any accumulated elec-
trostatic charge is discharged from your body to ground.
• Connect all equipment together, including the static-free
mat, static strap, routing nodes, and peripheral units.
• Keepuninstalledprintedcircuit boardsintheirprotective
antistatic bags.
• Handle printed circuit boards by their edges, once you
have removed them from their protective antistatic bags.

Contents
v
1 Product Information
Product Description 1-2
Rack Mounting Configurations 1-5
Memory 1-5
Mass Storage 1-5
System Graphics 1-6
System Board Graphics 1-6
GSC Mezzanine (Expansion Kit) Slot 1-6
PMC Expansion 1-6
Built-In Interfaces 1-6
Model 744 System Board Interfaces 1-7
Hardware Architecture 1-10
Operating Systems 1-10
HP-UX 1-10
Product Identification 1-12
Technical Information 1-13
Support 1-14
Hardware Support 1-15
Field Repair Philosophy 1-15
2 Environmental/Installation/PM
Overview 2-2
Environmental Specifications 2-3
Regulatory Requirements 2-4
Installation 2-5

Contents
vi
Preventive Maintenance 2-6
3 Configuration
Power Budgeting 3-2
Devices 3-2
Determining the Workstation’s Power Needs 3-3
4 Troubleshooting
Introduction to Troubleshooting 4-2
Diagnostic Philosophy 4-2
Analytic Troubleshooting 4-2
Diagnostic Overview 4-3
Diagnostic Documentation 4-3
Board Computer Troubleshooting 4-4
5 Field Replaceable Units
Introduction 5-2
Tools Required 5-2
Safety Precautions 5-2
New Parts 5-3
Exchange Parts 5-3
Local Hewlett-Packard Sales & Service Office 5-4
Replaceable Parts 5-4
Mass Storage Module Parts 5-5
EISA and PCI Module Parts 5-9
Chassis and Power Supply Parts 5-11

Contents
vii
VME Module 5-13
Model 743/744 VMEbus Board Computer Parts 5-14
Removing and Replacing Mass Storage Devices 5-15
Section Contents 5-15
Introduction 5-15
Preliminary Requirements 5-15
Removing Mass Storage Module 5-16
Procedure 5-16
Selecting Device Address 5-17
Procedure 5-17
CD-ROM 5-18
Floppy Disk Drive 5-20
DDS Tape Drive 5-21
Hard Disk Drive Address Selection 5-23
Device Locations in Tray 5-23
Mass Storage Device Removal 5-28
Procedure 5-28
Power & SCSI cables 5-28
Retaining screws 5-28
Device removal 5-28
EISA or PCI Module Removal 5-29
Preliminary Requirements 5-29
Procedure 5-29
EISA / PCI Converter Board and Backplane Removal 5-30
VME Module Removal 5-31
Preliminary Requirements 5-31
Procedure to remove VME Module 5-32
VME Backplane Removal 5-33
Power Supply and Chassis Parts Replacement 5-34

Contents
viii
Preliminary Requirements 5-34
Power Supply Removal 5-35
Power Switch Assembly 5-36
Power Distribution PCA 5-37
6 Diagrams
Functional Description of Model 748 Chassis 6-2
7 Reference Documentation
Service Documentation 7-2
System Installation and Getting Started
Documentation 7-4
8 ServiceNotes

Contents
ix
Figures
Model 748 Ruggedized Workstation 1-3
I/O Connector Panel 1-7
Serial Number Information 1-12
Model 744 Memory Slots 3-4
Model 748 Exploded View 5-4
SE Mass Storage Module Parts 5-5
FWD Mass Storage Module Parts 5-7
EISA and PCI Module Parts 5-9
Chassis and Power Supply Parts 5-11
VME Module Parts 5-13
Mass Storage Tray Removal 5-16
Early Model CD-ROM Disk Drive 5-18
Later Model CD-ROM Disk Drive 5-19
Floppy Disk Drive 5-20
DDS Tape Drive Address Selection 5-21
Later Model DDS Tape Drive Address Selection 5-22
Device Locations 1 of 4 5-23
Device Locations 2 of 4 5-24
Device Locations 3 of 4 5-25
Device Locations 4 of 4 5-26
FWD Device Locations 5-27
Mass Storage Device Removal 5-28
Tray Removal 5-29
EISA/PCI Converter Board and Backplane Removal 5-30
Magnified View of Power Switch Tabs 5-36
Removing Power Distribution PCA from the Wall 5-37
Center Wall Removal 5-38
Power Distribution PCA Removal from Chassis 5-39
Functional Block Diagram 6-2

Contents
x
Tables
Model 748 Ruggedized Workstation Features 1-4
Supported Monitors for Model 748 1-6
Supported PMC Graphics Upgrades 1-6
Supported AUI LAN Adapters and Devices 1-9
Supported 700/RX Family X-Terminals 1-9
HP-UX Operating Systems and Languages 1-11
Electrical Information 1-13
Physical Information 1-14
EISA, PCI, and VME Slot Power Availability 1-14
Environmental Information 2-3
Regulatory Information 2-4
Model 744/132L Memory Card Current Usage Work-
sheet 3-4
Model 744/165L Memory Card Current Usage Work-
sheet 3-5
Model 744 Current Requirements Worksheet 3-7
Model 743 Current Requirements Worksheet 3-8
Internal Device Current Requirements 3-9
Upper Power Supply Current Budgeting Worksheet 3-10
Lower Power Supply Current Budgeting Worksheet 3-11
Diagnostic Documentation 4-4
Model 748 SE Mass Storage Module Parts List 5-6
Model 748 FWD Mass Storage Module Parts List 5-8
Model 748 EISA and PCI Module Parts List 5-10
Model 748 Chassis and Power Supply Parts List 5-12
Model 748 VME Module Parts List 5-14
Default SCSI Addressing 5-17
Related Service Documentation 7-2
Diagnostic Documentation 7-3
System Installation and Getting Started Documentation
7-4