HP P Elite SFF 600 G9 Assembly instructions

Page 1
EL-MF877-00
Template Revision C
Last revalidation date 20-Dec-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Elite SFF 600 G9 Desktop PC/HSC-F002SF
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking
code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm 2
Batteries, excluding Li-Ion batteries. All types including standard alkaline, coin or button
style batteries 1
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin
cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[] screws
[X] snaps
[] adhesive
[] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height Lite-On 260W EPA92 PSU 1
External electrical cables and cords Power Cord 1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs

Page 2
EL-MF877-00
Template Revision C
Last revalidation date 20-Dec-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity
of items
included
in product
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Hexagon Screw Driver T-15
Crisscross Screw Driver PH1
Electric Iron QUICK 310
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Use T-15 screw driver to loose thumb screw and remove access panel.
2. Disconnect ODD power cable and ODD SATA cable from ODD.
3. Press the ODD’s latch on ODD cage
4. Remove the ODD from ODD cage
5. Remove Front Bezel from chassis
6. Disconnect HDD power cable and HDD SATA cable from HDD.
7. Remove the driver cage from Chassis
8. Use T-15 screwdriver to loose the screws of HDD and remove HDD from HDD cage
9. Disconnect all cables from MB
10. Remove the Fan duct from cooler
11. Disconnect Cooler Fan cable from MB
12. Use T-15 screw driver to loose the cooler screws and remove cooler from MB
13. Use T-15 screw driver to loose the screws and remove the fan
14. Separate the fan from CPU heat sink
15. Remove memory from the MB
16. Rotate the handle and open it up
17. Remove the CPU from the board
18. Remove SSD M.2 Card
19. Remove WLAN M.2 Card
20. Remove the battery from the system board
21. Use T-15 screw driver to loose the screws of MB from board
22. Remove MB from chassis
23. Remove speaker from Chassis
24. Use T-15 screw driver to loose the screws of PSU
25. Press the PSU’s latch on chassis

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EL-MF877-00
Template Revision C
Last revalidation date 20-Dec-2018
HPI instructions for this template are available at EL-MF877-01
26. Remove the PSU from chassis
27. Remove the screws covered
28. Remove PSU cover
29. Use PH1 screw driver to remove FG screw
30. Disconnect fan connector and inlet connector
31. Loose screws and remove PCB from case
32. Loose screws and remove PSU fan
33. Use QUICK 310 to remove Ele-Cap from PCBA
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Step1 Use T-15 screw driver to Loose thumb screw and
remove access panel. Step2 Disconnect ODD power cable and ODD SATA cable
from ODD.
Step3 Press the ODD’s latch on ODD cage Step4 Remove the ODD from ODD cage

Page 4
EL-MF877-00
Template Revision C
Last revalidation date 20-Dec-2018
HPI instructions for this template are available at EL-MF877-01
Step5 Remove Front Bezel from chassis Step6 Disconnect HDD power cable and HDD SATA cable
from HDD.
Step7 Remove the driver cage from Chassis Step8 Use T-15 screw driver to loose the screws of HDD and
remove HDD from HDD cage

Page 5
EL-MF877-00
Template Revision C
Last revalidation date 20-Dec-2018
HPI instructions for this template are available at EL-MF877-01
Step9 Disconnect all cables from MB Step10 Remove the Fan Duct from cooler
Step11 Disconnect Cooler Fan cable from MB Step12 Use T-15 screw driver to loose the cooler screws and
remove cooler from MB

Page 6
EL-MF877-00
Template Revision C
Last revalidation date 20-Dec-2018
HPI instructions for this template are available at EL-MF877-01
Step13 Use T-15 screwdriver to loose the screws and
remove the fan Step14 Separate the fan from CPU heat sink
Step15 Remove memory from the MB Step16 Rotate the handle and open it up

Page 7
EL-MF877-00
Template Revision C
Last revalidation date 20-Dec-2018
HPI instructions for this template are available at EL-MF877-01
Step17 Remove the CPU from the board Step18 Remove SSD M.2 Card
Step19 Remove WLAN M.2 Card Step20 Remove the battery from the system board
Step21 UseT-15 screwdriver to loose the screws of MB
from board Step22 Remove MB from chassis

Page 8
EL-MF877-00
Template Revision C
Last revalidation date 20-Dec-2018
HPI instructions for this template are available at EL-MF877-01
Step23 Remove speaker from Chassis Step24 Use T-15 screwdriver to loose the screws of PSU
Step25 Press the PSU’s latch on chassis Step26 Remove the PSU from chassis
Step27 Remove screws covered Step28 Remove PSU cover

Page 9
EL-MF877-00
Template Revision C
Last revalidation date 20-Dec-2018
HPI instructions for this template are available at EL-MF877-01
Step29 Use PH1 screw driver to remove FG screw Step30 Disconnect fan connector and inlet connector
Step31 Loose screws and remove PCB from case Step32 Loose screws and remove PSU fan
Step33 Heat the solder of the Ele-Cap of greater than
2.5cm in diameter or height and Remove it from PCBA