HP ProDesk 485 G1 Installation instructions

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Product End-of-LifeDisassemblyInstructions
ProductCategory:
Personal Computers
MarketingName/ Model
[Listmultiplemodelsifapplicable.]
HP ProDesk485 G1Microtower BusinessPC
Purpose: Thedocumentisintendedforusebyend-of-liferecyclersortreatmentfacilities.Itprovidesthebasicinstructions
forthedisassemblyofHPproductstoremovecomponentsandmaterialsrequiring selectivetreatment,asdefinedbyEU
directive2002/96/EC,WasteElectricalandElectronicEquipment (WEEE).
1.0
ItemsRequiringSelective Treatment
1.1Itemslisted belowareclassified asrequiring selectivetreatment.
1.2Enterthe quantityofitemscontained withintheproduct whichrequireselectivetreatmentinthe right column,as
applicable.
ItemDescription Notes
Quantity
ofitems
included
inproduct
Printed Circuit Boards(PCB)orPrintedCircuit
Assemblies(PCA)
Withasurfacegreaterthan10 sq
cm
2
Batteries
Alltypesincluding standardalkaline and lithiumcoin
orbuttonstylebatteries
1
Mercury
-
containing components
Forexample, mercuryinlamps,displaybacklights,
scannerlamps,switches,batteries
LiquidCrystalDisplays(LCD)withasurfacegreater
than100sqcm
Includesbackground
illuminated displayswithgas
dischargelamps
CathodeRayTubes(CRT)
Capacito
rs/ condensers(ContainingPCB
/PCT)
ElectrolyticCapacitors/Condensersmeasuring
greaterthan2.5cmindiameterorheight
5
Externalelectricalcablesandcords
Powercord
1
GasDischarge Lamps
PlasticscontainingBrominatedFlameRetardants
weighing>25 grams(notincludingPCBsorPCAs
alreadylisted asaseparateitemabove)
Componentsandpartscontainingtonerandink,
includingliquids,semi-liquids(gel/paste)andtoner
Includethecartridges, printheads, tubes,vent
chambers,andservicestations.
Componentsandwastecontainingasbestos

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Components,partsandmaterialscontaining
refractoryceramicfibers
Components,partsandmaterialscontaining
radioactivesubstances
2.0ToolsRequired
Listthe typeandsizeofthetoolsthatwouldtypicallybe usedtodisassemblethe product toapointwherecomponents
andmaterialsrequiringselectivetreatmentcanbe removed.
ToolDescription
ToolSize(if
applicable)
Screwdriver
T
-
15
M
icroshear
YN
-
3
Screwdriver
PH1
Description #4
Description #5
3.0ProductDisassemblyProcess
3.1Listthe basicstepsthatshouldtypicallybefollowedtoremovecomponentsandmaterialsrequiring selectivetreatment:
1.Removeaccesspanel.(seeFigure1-3)
2.Removefront bezel.(see Figure4)
3.Disconnect coolercablethenremovethe coolerfromboard. (seeFigure5-7)
4.Disconnect 24 pinpowercable SATA cable SATA powercable CPUpowercable. (seeFigure8-11)
5.RemovetheODD andHDD fromchassis(seeFigure12-16)
6.Disconnect theMCR cablefromboardthen removetheMCR. (seeFigure17-19)
7.Disconnect systemfan cablethen removethe systemfanfromchassis(seeFigure20-22)
8.Disconnect FIOcablesand openthecableclip.(seeFigure23-24)
9.RemovetheFIOmodulefromchassis. (see Figure25-26)
10.DisconnectPWRcablethen removeit fromchassis.(seeFigure27-28)
11.Disconnectspeakercablethenremoveitfromchassis.(seeFigure29-31)
12.RemovetheMemoryfromchassis.(seeFigure32)
13.Removethebatteryfromtheboard.(seeFigure33)
14.RemoveMotherboardfromchassis. (see Figure34-36)
15.RemovetheI/Oshielding fromchassis.(seeFigure37)
16.RemovethePSUfromchassis.(seeFigure38&39)
17.RemovethePSUchassisand removethe PSUboard.. (seeFigure40-43)
18.RemovetheElectrolyticCapacitorsfromPSUboard. (seeFigure44-50)
3.2OptionalGraphic.Ifthe disassemblyprocessiscomplex, insertagraphicillustrationbelowtoidentifythe items
contained intheproduct that requireselectivetreatment(withdescriptionsandarrowsidentifying locations).

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Figure1Loose
thetwoscrews
fromaccesspanel
Figure2
Slidetheaccesspanelback
Figure3R
otatethe topofthe panel
away
toremoveit
Figure4Pullthe 3hooksandr
otate
toremovethe front
bezel

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Figure5DisconnectthecoolercablefromMB
Figure6Loose4screwsfromcoolerandremoveit
Figure7Removethe coolerfromboard Figure8DisconnecttheSATAcablesformboard

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Figure9DisconnecttheCPUpowercablefromboard Figure10 Disconnect the 24pinpowercablefromMB
Figure1
1
Disconnect
theSATA andpowercablesfrom
ODD
Figure12 LoosetheODDscrews

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Figure13Removethe ODDfromchassis
Figure14
Disconnect
the SATA and powercablesfrom
HDD
Figure15LoosetheHDD screws Figure16 RemovetheHDDformchassis

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Figure17Disconnect theMCRcablefromMB Figure18 LoosetheMCRscrews
Figure19Removethe MCRfromchassis Figure20 Disconnect systemfancablefromboard

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Figure21Loose2screwsfromsystemfan Figure22 Removethesystemfanfromchassis
Figure23
Disconnect
FIOcable
include
USB 3.0, USB
2.0, Audio
Figure24 Open the cableclip

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Figure25Loosethescrewofthe FIOcable Figure26 RemovetheFIOcablefromchassis
Figure27Disconnect PWRcablefromMB Figure28 RemovethePWRcable

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Figure29Disconnect speakercablefromboard Figure30 Loosethescrewof speaker
Figure31Removethe speakerformchassis
Figure
32
Push
the hooks
onbothsides
andthen
pick up
thememory

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Figure33Removethe batteryfromtheMB Figure34 Loosethe6screwsfromMB
Figure35Loosethe8screwsfromMB and removeit Figure36 RemoveMBfromchassis

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Figure37
Pushthe
I/O
shieldingtotheinside ofthe
chassisandremoveit
Figure38 Loose4screwsofPSUand removeit
Figure39Pullup thePSUandremoveit Figure40 Loose4screwsfromPSUcage andremoveit

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Figure41Cutthecabletie Figure42DisconnectthefancablefromPSU
Figure
43
Loose4screwsfromthe PSUPCA andremove
it
Figure
44
Heatthe solderofElectrolyticCapacitors
greaterthan 2.5cmindiameterorheightandremoveit

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Figure
49
Heat the solderofElectrolyticCapacitorsgreater
than 2.5cmindiameterorheightandremoveit(Gamay
300WE*6PSU-Bestec)
Figure
50
Heatthe solderofElectrolyticCapacitors
greaterthan 2.5cmindiameterorheightandremove
it(Gamay300WE*6PSU- Acbel))