HP Series 200 Technical manual

HP 9000 Series 200 Computers
Model
217
HP9817
Hardware SupportDocument
Flin- HEWLETT
.:~ PACKARD

HP 9817
Hardware Support Document
for HP 9000 Series 200 Computers
Manual Reorder No. 09817-90031
© Copyright 1985 Hewlett-Packard Company
This document contains proprietary information which is protected by copyright. All rights are reserved. No part
of this document may be
photocopied. reproduced or translated to another language without the prior written consent of Hewlett-Packard Company. The information
containea in this document is subject to change without notice.
Restricted Rights Legend
Use. duplication
or disclosure by the Government is subject to restrictions as set forth in paragraph (b)(3)(8) of the Rights in Technical Data
and Software clause in DAR 7-104.9(a).
Hewlett-Packard Company
3404 East Harmony Road. Fort Collins. Colorado 80525

Printing History
New editions of this manual will incorporate all material updated since the previous edition. Update
packages may be issued between editions and contain replacement and additional pages to be merged
into the manual
by the user. Each updated page will be indicated by a revision date at the bottom of
the page. A vertical bar
in the margin indicates the changes on each page. Note that pages which are
rearranged due
to changes on a previous page are not considered revised.
The manual printing date and
part number indicate its current edition. The printing date changes when
a new edition
is printed. (Minor corrections and updates which are incorporated at reprint do not
cause the date to change.) The manual part number changes when extensive technical changes are
incorporated.
October 1985 ...Edition 1. Replaced part number 09817-90030. Merged September 1984 update.
NOTICE
The information contained in this document is subject to change without notice.
HEWLETT-PACKARD MAKES NO WARRANTY OF ANY KIND WITH REGARD TO THIS MANUAL, INCLUDING, BUT NOT
LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Hewlett-
Packard shall not be liable for errors contained herein or direct, indirect, special, incidental or consequential damages in
connection with the furnishing, performance, or use of this material.
WARRANTY
A copy of the specific warranty terms applicable to your Hewlett-Packard product and replacement parts can be obtained from
your local Sales and Service Office.
ii

Table of Contents
Chapter 1: Product Description
Introduction . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.. 1
Product Information ............................................................. 2
Processor, . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 2
Clock and Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 2
Beepers .. , ................................................................. 2
Features
., . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 3
Physical. . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 3
Power Requirernents ......................................................... 3
Product Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4
Custorner Service Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5
On··site Repair .............................................................. 5
Service Center Repair. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5
Customer Repair. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5
Backplane Power Limits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 7
User Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 9
BA~3IC ... " ............................................................... ' .. 9
Pascal .................................................................... 9
Service Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 9
Miscellaneous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 10
Chapter 2: Site Preparation and Requirements
Site Preparation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 11
Class B Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.. 11
Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.. 11
HUlnidity ................................................................. 11
Vibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 12
Shock (non-operating) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 12
Altitude. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 12
Transportation ............................................................. 12
Power Hequirements ........................................................... 13
Chapter 3: Installation and Configuration . .......................................... 15
Chapter 4: Preventive Maintenance
Cleaning. """" .. " .................................................... " ... ". . .. 17
Chapter
5: Functional Description
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.. 19
Processor Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 19
110 Connectorboard ........................................................... 21
Power ~3upply ................................................................. 21
iii

iv
Chapter 6: Removal and Replacement
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 25
Top Cover Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 29
Front Panel Removal. .......................................................... 31
Power Supply Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 32
Rear Panel Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 34
Processor Board Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 35
110 Connectorboard Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 36
Power Receptacle Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 38
Chapter 7: Adjustments ........................................................... 41
Chapter 8: Troubleshooting and Diagnostics
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 43
Initial Troubleshooting Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 44
Dead Unit Procedure ........................................................... 50
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 50
Troubleshooting a Dead Unit. ................................................ 51
Power Supply Voltage Check ................................................ 54
Live Unit Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 55
Turn-on Self-test .............................................................. 58
Self-test Sequence .......................................................... 59
Running the Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 60
Boot ROM Beeper Codes ................................................... 62
Processor Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.. 62
Processor Test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.. 62
Boot
ROM Memory Test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 63
Boot
ROM Test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 63
RAM Memory Tests. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 64
Top RAM Test ............................................................. 64
RAM Pattern Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 64
RAM Addressing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 64
Checking a 1M Byte RAM Card Address ....................................... 65
Checking a 256K Byte RAM Card Address. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 65
Locating a Defective RAM Block. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 66
Keyboard Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 67
Keyboard Test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 67
I/O Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 68
Chapter 9: Replacement Parts
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 69
Chapter 10: Reference
Boot ROM Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 75

v
Chapter 11: Product History
IntrodLlction . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 77
Chapter 12: Diagrams
Figure 12-1. Block Diagram ....... - .............................................. 79
Figure 12-2. Power Distribution Diagram
.......................................... 80
Figure 12-3. Initial Troubleshooting Flowchart ...................................... 81
Figure 12-4. Dead Unit Troubleshooting Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.. 82
Figure 12-5. Live Unit Troubleshooting Flowchart .................................. 83
Figure 12-6. Computer Assembly Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 85

vi

Product Description Chapter
1
Introduction
This manual contains all the servicing information for the HP Series 9000 Model 217 computer.
The Model 217 computer is referred to interchangeably by its product number, by HP 9817, or by
the term
"computer". All three forms refer to the Model 217.
Hewlett-Pi:lckard supports repairing HP 9817 computers to the assembly level only, that is, isolating
the
problem to an assembly such as the processor board. Then the defective assembly is exchanged
for a new or rebuilt assembly.
Also included in this
chapter is service support information and a list of the documentation available
for
HP 981 7 computers.
Additional information
in this manual includes:
• Site Preparation
• Installation and Configuration
• Preventive Maintenance
• Functional Description
• Troubleshooting and Diagnostics
• Adjustments
• Removal and Replacement
• Replacement Parts
• Reference Material
• Product History
1

2 Product Description
Product Information
The HP 9000 Model 217 computer is a small, modular, MC68010-based computer. Modular refers
to the fact that
it is composed of a group of "modules", such as the keyboard, the display or the
central processing unit.
The MC68010 is fully object code-compatible with the MC68000, but has
the
added features of virtual memory support and enhanced execution timing.
It has these specifications:
Processor
Type:
Clock frequency:
Internal architecture:
Address range:
Data bus:
Instruction types:
Major
data types:
Addressing modes:
Interrupt levels:
Clock and Timers
Real-time clock
Resolution:
Accuracy:
Power-on default:
Timers
Delay interrupt:
Cycled interrupt:
Match interrupt:
Beepers
Range (nominal):
Duration:
Motorola
68010
8 MHz
32-bit data
and address registers
16M bytes
16-bit asynchronous
57
5
14
6 maskable and 1 non-maskable
10 msec
50 ppm (4.3 sec/day)
Midnight,
January 1
10 msecs to 1.94 days in 10 msec increments
10 msecs to 1.94 days in 10 msec increments
Match
on time of day, 0.00 to 84600.00 seconds (23.5 hours)
81.375 Hz to 5208 Hz
.01 to 2.55 sec
Beeper hardware supports three tone generators with attenuators and white noise source.

Product Description 3
Features
• HP stc:mdard industrial package
• Six accessory card slots (three for external interface cards)
• Pascal 3.0 and BA.SIC 3.0 language systems
• Supports external 14-inch medium-resolution, monochrome display (35721A/B/C)
• HP-HIL keyboard support (46020A)
Physical
Height:
Width:
Depth:
Net weight:
Shipping weight:
130 mm (5.12 inches)
325 mm (12.80 inches)
285 mm (11.22 inches)
6
kg (13.2 pounds)
9.5 kg (20.9 pounds)
Power Requirements
Operating voltage:
Operating frequency:
Power consumption:
Accessory slot power:
90 to 125 Vac, 198 to 250 Vac switch-selectable
48 to 66 Hz
130 W (maximum)
41.25 W@ +5 V
18.70 W @ + 12 V
6.00 W C~ -12 V
The accessory slot + 5 V lines are fuse-limited to 25 W for each pair of slots.

4 Product Description
Product Configuration
The Model 217 is available in two configurations, the modular computer only (9817A) or a
complete hardware system (9817H).
Product
Number
9817A
9817H
Description
Model
217 Computer
.~ Built-in HP-IB interface with 2 m cable
.~ Built-in RS-232 interface (order cable separately)
i' 6 accessory slots for interfaces, language systems and memory
.~ Built-in HP-HIL interface
Model
217 Computer
.~ Built-in HP-IB interface with 2 m cable
.~ Built-in RS-232 interface (order cable separately)
* 6 accessory slots for interfaces, language systems and memory
* Built-in HP-HIL interface
512K bytes of RAM memory (two 98256A cards)
46020A keyboard
35721A, B
or C 14·inch monochrome monitor
98204B video interface
35722A tilt and swivel unit
Option 001: 1M byte
RAM memory (one 98257A substituted for two 98256A cards)

Product Description 5
Customer Service Support
Hewlett-Packard provides service support in three ways: on-site repair, service center repair and
customer repair.
On-site Repair
For on-site repair, an HP Customer Engineer goes to the customer's site and troubleshoots and
repairs the computer at the assembly level. The defective assembly is then exchanged for a new or
reconditioned assembly. This is the fastest way to get the computer up and running. Consult your
HP Sales and Service office for turnaround times.
Service Center Repair
For service center repair, the customer returns the defective computer to an HP Field Repair
Center. An
HP Service Technician repairs the computer and returns it to the customerl. Table 1-1
contains a list of the Field Repair Centers. Consult your HP Sales and Service office for turnaround
times.
Customer Repair
Customers have the option of repairing their own computers. Contact your nearest HP Sales/
Service office for information concerning
recommended spare assemblies and training.
INTERCONTINENTAL
ARGENTINA
BUENOS AIRES
Hewlett-Packard Argentina S. A.
Avda
Santa Fe 2035
Martlne/, 1h40
Phone [phone]
AUSTRALIA
New South Wales
SYDNEY
Hewlett·Packard Australia Ltd.
17-23 1;1 LIVl'ra Ruad
North Rvdl', New South Wales 211.1
Phone: 02 IHH7-lhl 1
Victoria
MELBOURNE
Hewlett-Packard Australia Ltd.
., 1-41 Joseph Street
Blackburn, Victoria 3130
I'honL':
0.1 IH90-h35 I
BRAZIL
SAO PAULO
Hewlett-Packard Brasil I.e.C
AlalT1l'dd Rio Negro 750
Alphaville
HarUl'ri, SP-0h400
Phone 011!421-1311
HONG KONG
HONG KONG
Hewlett-Packard Hong Kong Ltd.
5 Floor
Sun Ilung Kai Centre
30 HMbour Road
Wanchai,
Phone: 5/H32-3211
JAPAN
Kanagawa
SAGAMIHARA
Yokogawa Hewlett-Packard
1-27-15 'tabe
Sagarnihara, Kanagawa 229
Phone: [phone]
Osaka-Shi
OSAKA
Yokogawa-Hewlett-Packard Ltd.
Chuo Bldg. NishinakaJirna
5-4-20, Yodogawa-ku
Osaka, Osaka-Shi 532
Phone: h 1304-h021
Suginami-ku
TOKYO
Yokogawa-Hewlett-Packard Ltd.
3-29-21
Takaido-Higashi
Tokyo, Suginarni-ku IhH
Phone: 31331 -h 1 11
MEXICO
MEXICO CITY
Hewlett-Packard Mexicana SACV
Avenida Periferico Sur h50l
Col.
Tepepan, Xochirnilco
Mexico City, DFlh020
Phone: 905/67h-4600
SINGAPORE
SINGAPORE
Hewlett-Packard Singapore Ltd.
6th Floor, Inchcape House
450-452 Alexandra Road
Singapore, 0511
Phone: 5/h31-7HH
TAIWAN
TAIPEI
Hewlett-Packard Far East Ltd.
Bank Tower, 5th Floor
205 Tun Hwa North Road
Taipei,
Phone: [phone]
VENEZUELA
CARACAS
Hewlett-Packard Venezuela CA.
Edificio Segre 2Y3
3a Transversal Los Ruices Nort
Caracas, 1071
Phone: [phone]
Figure 1-1. Field Repair Centers

6 Product Description
NORTH AMERICA
CANADA
Alberta
EDMONTON
Hewlett-Pack.ud Canada Ltd.
11620A 16Hth Street
Edmonton, Alberta T5M ,nY
Phone: -+03/-+52-3670
British Columbia
VANCOUVER
Hewlett-Packard Canada Ltd.
lO6YI Shellbrid~l' W.ly
Richmond, Brtllsh Columbia
V6X 2WH
Phol1l': 604/270-2277
Ontario
TORONTO WEST
Hewlett-Packard Canada Ltd.
6H77 Goreway Drive
Mississauga, Ontario 14V IMH
Phone: -+16/67H-Y430
UNITED STATES
California
LOS ANGELES WEST
Hewlett-Packard Company
5-+00 W, Rosecrans Blv'I.
Lawndall', California Y0260
Phone: 21J/M3-7500
SANTA CLARA
Hewlett-Packard Company
3003 Scott Boukvard
Santa Clara, California 951150
Phone: 40H/988-70()O
Colorado
DENVER
Hewlett-Packard Company
24 Inverness Place, Ea~t
Englewood, Colorado ~0112
Phone: [phone]
Georgia
ATLANTA
Hewlett-Packard Company
2000 South Park Place
Atlanta, C;eor~ia 3OJ3Y
Phone: -+04/Y5:->-1500
Illinois
CHICAGO WEST
Hewlett-Packard Company
'i2l)] Tolh'iew Drive
Rolling Meadows, Illinlli~ hO()OH
Phone 3122'i'i-YHOO
Maryland
WASHINGTON D.C.
Hewlett-Packard Company
2 Choke Cherry Road
Rockville, Maryland 20H50
Phone: 3111IY48-6370
Massachusetts
BOSTON
Hewlett-Packard Company
32 Hartwell Avenue
Lexinghln, Massachusetts ()2173
Phone: hI7/H61-H%0
Michigan
DETROIT
Hewlett-Packard Company
3%50 Orchard Hill Drive
Novi, Michigan 4H050
Phone: 31Ji349-Y200
New Jersey
PARAMUS
Hewlett-Packard Company
WI20 Cl'ntury Road
Paramu~, New jl'rsl'y 07652
Phone: 2111l265-5000
Pennsy I vania
PHILADELPHIA
Hewlett-Packard Company
Valley Forge Corporate Center
2750 Monroe Boulevard
Valley FI
1r,8e,
Pennsylvania IY4H2
Phone: 2 b/265-7000
Texas
DALLAS
Hewlett-Packard Company
930 East Campbl'll Road
Rlchard~on, Tex,ls 750HI
Phone: [phone]
Washington
SEATTLE
Hewlett-Packard Company
I'iHI5 S, I ,37th Street
Bellevue, Washington YHO()6
Phone 211hl643--+000
EUROPE AND
MIDDLE EAST
AUSTRIA
VIENNA
Hewlett-Packard GmbH
Lieblga~~e I
I'o~tfach 72
Vil'l1na, ,\-1222
Phone 222 3'iIh210
BELGIUM
BRUSSELS
Hewlett-Packard Belgium SA/NY
Boukvard de la Woluwe 100
Woluwedal lOll
Brussl'ls B-120{)
I'ho'~e: i 1762-320{)
DENMARK
COPENHAGEN
Hewlett-Packard A/S
Datavej 52
Birkerlled, DK-346ll
Phone: 2 IH l-hh-40
FINLAND
HELSINKI
Hewlett-Packard Oy
Revontulentie 7
Espoo, SF-02100
Phone: [phone]
JYVASKYLA
Hewlett-Packard Oy
Vainonkatu 9c
Jyvaskyla, SF-411100
Phone: 41 121h31H
OULU
Hewlet-Packard Oy
Kainuuntieic
Oulu, SF-YOI40
Phone: HI 1338785
FRANCE
ORSAY
Hewlett-Packard France
Les Ulis Avenue De TropiLJues
Z. Industridlc de Courtaboeuf
Les Ulis, F-YIY47
(,hol1l': h 19077825
GERMANY
BOEBLINGEN
Hewlett-Packard GmbH
Herrenberger Strasse I III
BI1l'blingen, D-7030
Phone: 7031hh7750
ITALY
MILANO
Hewlett-Packard Italiana S.p.A
Via C, Oi Vittorio Y
Cl'rnllsco Sui Navigl, 1-200h3
Phone 2 ;YOJhY 1
NETHERLANDS
AMSTELVEEN
Hewlett-Packard Nederland B. V.
Van Hellven Coedhartlaan 121
Amstdveen, NL-118IKK
Phon!': 20 i472()21
Figure 1-1. Field Repair Centers (Cont.)
NORWAY
OSLO
Hewlett-Packard Norge AJS
Ol'sterudall'n 18
Ol'steraas, N- 1]45
I'hone:2/17-11-80
SOUTH AFRICA
Transvaal
JOHANNESBURG
Hewlett-Packard South Africa
Private Bag
Wendywood
Sandton, Transvaal 2144
Phone: 1\ 1802-51\
SPAIN
MADRID
Hewlett-Packard Espanola S.A.
Costa Brava, 13-2
Mirasierra
Madrid, E-34
Phone: [phone]
SWEDEN
STOCKHOLM
Hewlett-Packard Sverige AB
SkalhoItsgatan 9, Kista
Box
19
Spanga, 5-16393
Phone: [phone]
SWITZERLAND
ZUERICH
Hewlett-Packard (schweiz) AG
allmend 2
Widen, CH-8Yh7
Phone: [phone]
UNITED KINGDOM
ENGLAND
MANCHESTER
Hewlett-Packard Ltd.
Trafalgar Ilouse
Navigation Road
Altrincham, England WAI4 INU
I'hone: hI IY28-6422
WINNERSH
Hewlett-Packard Ltd.
King Stred Lane
Winnersh
Wokingham, England RC II SAR
Phone: [phone]

Product Description 7
Backplane Power Limits
The limits for the backplane power available to accessories is not to be exceeded by the installed
accessories. To help determine the power requirements of a particular set of accessories, the
following power requirements for accessories are listed.
CAUTION
IF THE POWER REQUIRED FOR ACCESSORIES EXCEEDS THE
POWER AVAILABLE AT THE COMPUTER BACKPLANE, DAMAC;E
TO THE COMPUTER'S POWER SUPPLY AND/OR THE ACCES-
SORY WILL OCCUR. HEWLETT-PACKARD DOES NOT SUPPORT
ACCESSORY CONFIGURATIONS REQUIRING MORE POWER
THAN IS RECOMMENDED AT THE COMPUTER BACKPLANE.
To detern1ine the sUitability of a given set of accessories for your computer, follow these instruc-
tions:
1. Calculate the accessory power required for each supply voltage and the total power required
for the accessory using the information in Table 1-2. Enter these values in the "Total Power
Required" block in Table I-I.
2. If the total pOWE~r required is greater than 56.26 W, or the power drawn at any given voltage
exceeds the value for that level, you must:
a. Change the type/number of accessories,
b. Add an HP 9888A Expander, or
3. Recalculate the power required versus power available.
Table 1-1. Power Requirements Calculation Table
accessory 1
accessory 2
accessory 3
accessorY 4
accessory 5
accessory 6
Total power required
Power Supply Voltage
+5 +12 -12
HP 9817 power available 48.5 W
9.12W 5.04W
Backplane
Maximum
56.26 W

8 Product Description
Table 1-2. Typical Power Requirements for Series 200 Accessories
Power Requirements
Product Description +5
+12
-12
Total
HP 9888A
Bus Expander 5.0 5.0
HP 13264A Data
link Pod 0.2 1.9 0.3 2.4
HP 13265A Modem 0.5 0.5 0.5 1.5
HP 13266A Current Loop Pod 1.0 1.0 1.0 3.0
HP 98028A
Res. Mgmt. MUX 2.2 6.4 8.6
HP 98204B Video wlo Graph. 7.5 7.5
HP 98204B Video w/Graphics 15.0 15.0
HP 98253A EPROM Prog. 5.7 5.7
HP 98254A 64K byte RAM 3.0 3.0
HP 98255A EPROM Card 2.8 2.8
HP 98256A 256K byte RAM
4.1
4.1
HP 98257A 1M byte RAM 6.0 6.0
HP 98259A 128K byte Bubble 2.4 2.9 5.3
HP 98601A BASIC 2.0 ROM 2.4 2.4
HP 98601A BASIC 1.0 ROM 2.3 2.3
HP 98602A BASIC 2.1 ROM 3.6 3.6
HP 98604A
HPL 2.0 ROM 1.5 1.5
HP 98620A DMA Controller 6.0 6.0
HP 98621A BASIC 1.0 Opt. 1 2.3 2.3
HP 98622A GPIO Interface 3.8 3.8
HP 98623A BCD Interface 2.5 2.5
HP 98624A HP-IB Interface 2.4 2.4
HP 98625A
Disc Interface 3.0
0.1
3.1
HP 98626A RS-232 Interface 2.0 0.6 0.6 3.2
HP 98627A Color Interface 5.5 5.5
HP 98628A Datacomm Interf. 3.6 0.5 0.7 4.8
HP 98629A Resource Mgmt. wlo 98028A 3.7 0.5 0.5 4.7
HP 98629A Resource Mgmt. w/98028A 5.9 6.9 0.5 13.3
HP 98630A Breadboard Card 1.3 1.3
HP 98635A Floating-Point 4.2 4.2
HP 98640A A-D Card 1.0 0.7 0.6 2.3
HP 98644A Serial Load Card 2.0 0.3 0.02 2.3
HP 98691A Progr. Datacomm 6.4 2.0 1.3 9.7

User Documentation
BASIC Manual
Manual
Part Number
98613-10010
98613-87901
98613-10020
98613-10030
98613-90010
98613-90020
98613-90030
98613-90040
98613-90050
98613-90060
98613-90070
Pascal
Manual
Part NUinber
98615-87902
09826-90072
09826-90073
98615-90021
98615-90030
98615-90035
98615-90040
98615-9()050
Description
CSUB Preparation Manual
BASIC 3.0 Manual Kit contains one each of the following manuals:
Utilities library Manual
Loader
Utility Manual
BASIC 3.0 Programming Techniques
BASIC 3.0 Interfacing Techniques
BASIC 3.0 Graphics Techniques
BASIC 3.0 User's Guide
BASIC 3.0 Language Reference
Condensed Reference
Documentation Guide and Master Index
Description
Pascal 3.0 Manual Kit contains one each of the following manuals:
Pascal Textbook (Wiley)
MC68000 User's Manual
Pascal 3.0 Workstation System
Pascal 3.0 Procedure library
Pascal 3.0 Graphics Techniques
Pascal 3.0 User's Guide
HP Pascal Language Reference for Series 200 Computers
Service Documentation
Manual
Part Number Description
09817-90030
09817-90039
09817 +49A-90101
35 7~~ 1-90()04
HP 9817 Hardware Support Document
HP 9817 CE Handbook Section
Model 217 Self-Paced Hardware Training Guide
HP 35721A/B/C Service Manual
Product Description 9

10 Product Description
Miscellaneous
Manual
Part Number
98204~90001
98257-90000
98620-90001
98622-90000
98623-90000
98624-90000
98625-90000
98626-90000
98627 -90000
98628-90001
98630-90000
98635-90000
Description
HP 98204B Composite Video Card Installation Note
HP 98257 A RAM Card Installation Note
HP 98620A/B DMA Card Installation Note
GPIO Installation Manual
BCD Installation Note
HP-IB Installation Note
Disc Interface Installation Manual
RS-232 Installation Manual
Color Video Interface Installation Manual
HP 98628198691 Datacomm Installation Manual
HP 98630A Breadboard Installation Manual
HP 98635A Floating-Point Math Card Installation Note

Site Preparation and Requirements
Site Preparation
Site preparation requirements for the HP 9817 computer are:
Environmental Class B or higher: No site prep
needed
Othen.vise: Upgrade site to Class B
Class B Specifications
Chapter
2
Class B specifications are designed for commercial and industrial environments, that is, light or
medium industrial and commercial manufacturing facilities suitable for occupancy by operating
personnel
on a full-time basis without benefit of air conditioning or other protective measures.
This kind of environment
is expected to fall within the specifications in Table 2-1. Ifany parameter
falls outside the specification, steps must be taken to ensure that the computer is sUitably protected.
Temperature
Non-operating
Operating Survival
Operating
Humidity
Non-operating
Operating
Supersoak
Condensation
Vibration
Cycle Range
Amplitude (p-p)
SweeptimE~
Dwell at Resonances
Amplitude
at Resonances
5 to 10 Hz
10 to 25 Hz
25 to 55 Hz
Table 2-1. Class B Specifications
-40 to + 75°C
-20 to +65°C
oto +55°C
90% R.H. @ 65°C
oto 95% R.H. @ 40°C
24 Hours
Operates without damage and recovers within specified time limits
5 to
55 to 5 Hz
0.38mm
1 min./octave, 15 min. total
10 min. each resonance
3.17 mm
1.52 mm
.38mm
11

12 Site Preparation and Requirements
Table 2.1. Class B Specifications (cont.)
Shock (non-operating)
Magnitude
Duration
'Number of Shocks
Waveform
Bench Handling
Altitude
Non-operating
Operating
Transportation
30g
11 ms
18
Half-sine
102 mm Tilt Drop
15300 m
4600m
Drop Test (in shipping carton) 752 mm