HP Z1 Assembly instructions

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Z1 Entr
y
TWR G6
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking
code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm 2
Batteries, excluding Li-Ion batteries. All types including standard alkaline, coin or button
style batteries 1
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin
cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[] screws
[X] snaps
[] adhesive
[] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height Delta 350W EPA92 PSU 1
External electrical cables and cords Power Cord 1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity
of items
included
in product
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Hexagon Screw Driver T-15
Crisscross Screw Driver PH1
Electric Iron QUICK 310
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Use T-15 screw driver to loose thumb screw and remove access panel.
2. Disconnect ODD power cable and ODD SATA cable from ODD.
3. Press the ODD’s latch on ODD cage
4. Remove the ODD from ODD cage
5. Remove Front Bezel from chassis
6. Disconnect HDD power cable and HDD SATA cable from HDD.
7. Remove the driver cage from Chassis
8. Use T-15 screw driver to loose the screws of HDD and remove HDD from HDD cage
9. Disconnect all cables from MB
10. Disconnect system fan cable from MB
11. Disconnect Cooler Fan cable from MB
12. Use T-15 screw driver to loose the cooler screws and remove cooler from MB
13. Use T-15 screw driver to loose the screws and remove the fan
14. Separate the fan from CPU heat sink
15. Remove memory from the MB
16. Rotate the handle and open it up
17. Remove the CPU from the board
18. Remove SSD M.2 Card
19. Remove WLAN M.2 Card
20. Remove the battery from the system board
21. Use T-15 screw driver to loose the screws of MB from board
22. Remove MB from chassis
23. Remove speaker from Chassis
24. Remove System fan

EL-MF877-00 Page 3
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
25. Remove Front Antenna cable
26. Remove Rear Antenna cable
27. Use T-15 screw driver to loose the screws of PSU
28. Press the PSU’s latch on chassis
29. Remove the PSU from chassis
30. Remove four screws covered
31. Remove the screw and open case
32. Use PH1 screw driver to remove FG screw
33. Disconnect fan connector and inlet connector
34. Loose screws and remove PCB from case
35. Loose screws and remove PSU fan
36. Use QUICK 310 to remove Ele-Cap from PCBA
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Step1 Use T-15 screwdriver to Loose thumb screw and
remove access panel
Step2 Disconnect ODD power cable and ODD SATA cable
from ODD
Step3 Press the ODD’s latch on ODD cage
Step4 Remove the ODD from ODD cage

EL-MF877-00 Page 4
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step5 Remove front bezel from chassis Step6 Disconnect HDD power cable and HDD SATA cable
from HDD.
Step7 Remove the driver cage from Chassis
Step8 Use T-15 screwdriver to loose the screws of HDD and
remove HDD from HDD cage

EL-MF877-00 Page 5
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step9 Disconnect all cables from MB
Step10 Disconnect system fan cable from MB
Step11 Disconnect Cooler Fan cable from MB Step12 Use T-15 screw driver to loose the screws of HDD and
remove HDD from HDD cage

EL-MF877-00 Page 6
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step13 Use T-15 screwdriver to loose the screws and
remove the fan
Step14 Separate the fan from CPU heat sink
Step15 Remove memory from the MB
Step16 Rotate the handle and open it up

EL-MF877-00 Page 7
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step17 Remove the CPU from the board
Step18 Remove SSD M.2 Card
Step19 Remove WLAN M.2 Card Step20 Remove the battery from the system board
Step21 Use T-15 screwdriver to loose the screws of MB
from board
Step22 Remove MB from chassis

EL-MF877-00 Page 8
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step23 Remove speaker from Chassis
Step24 Remove System fan
Step25 Remove Front Antenna cable
Step26 Remove Rear Antenna cable

EL-MF877-00 Page 9
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step27 Use T-15 screwdriver to loose the screws of PSU
Step28 Press the PSU’s latch on chassis
Step29 Remove the PSU from chassis
Step30 Remove screws covered
Step31 Remove PSU Cover
Step32 Use PH1 screw driver to remove FG screw

EL-MF877-00 Page 10
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step33 Disconnect fan connector and inlet connector
Step34 Loose screws and remove PCB from case
Step35 Loose fan screws and remove PSU fan
Step36 Heat the solder of the Ele-Cap of greater than 2.5cm in diameter or height and Remove it from PCBA