HP Z2 SFF G5 Assembly instructions

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Z2 SFF G5 Workstation
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button style
batteries
1
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[X] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
Acbel 260W EPA92 PSU
1
External electrical cables and cords
Power Cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity of
items
included in
product
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Hexagon Screw Driver
T-15
Crisscross Screw Driver
PH1
Electric Iron
QUICK 310
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Open access panel
2. Remove Front Bezel from chassis
3 Press the Graphic card’s latch
4 Unplug Graphic card
5. Loose the screws of HDD and remove HDD from HDD cage
6. Disconnect HDD power cable and HDD SATA cable from HDD
7. Disconnect all cables from MB
8. Remove the driver cage from Chassis
9. Disconnect system fan cable from MB
10. Disconnect cooler fan cable from MB
11. Remove the Fan duct from cooler
12. Use T-15 screwdriver to loose the screws and remove cooler
13. Use PH1 screwdriver to loose the screws and remove the fan
14. Separate the fan from cooler
15. Remove memory from MB
16. Rotate the handle and open it up
17. Remove the CPU from the board
18. Remove the battery from the system board
19. Remove speaker from Chassis
20. Remove WLAN M.2 Card
21. Use T-15 screwdriver remove the screws on the PSU Chassis
22. Disconnect the PSU cable from the MB
23. Use T-15 screwdriver to loose the screws of MB from board
24. Remove MB from chassis
25. Press the PSU’s latch on chassis
26. Remove the PSU from chassis
27. Use PH1 screwdriver to remove screw for the PSU
28. Remove cover

EL-MF877-00 Page 3
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
29. Use PH1 screwdriver to remove FG screw
30. Disconnect fan connector and inlet connector
31. Use PH1 screw driver to remove PCB1 screw
32. Use PH1 screwdriver to remove AC inlet & Fan screw
33. Heat the solder of the Electrolytic Capacitors of greater than 2.5cm in diameter or height and Remove it
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).
Step1 Open access panel
Step2 Remove front bezel from chassis
Step 3 Press the Graphic card’s latch
Step 4 Unplug Graphic card
Step 5
Loose the screws of HDD and remove HDD from HDD
cage
Step 6
Disconnect HDD power cable and HDD SATA cable
from HDD

EL-MF877-00 Page 4
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
.
Step7 Disconnect all cables from MB
Step8Remove the driver cage from Chassis

EL-MF877-00 Page 5
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step 9 Disconnect system fan cable from MB
Step 10 Disconnect cooler fan cable from MB
Step 11 Remove the Fan duct from cooler
Step 12 Use T-15 screwdriver to loose the screws and remove
cooler

EL-MF877-00 Page 6
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step 13 Use PH1 screwdriver to loose the screws and remove
the fan
Step 14 Separate the fan from cooler
Step 15
Remove memory from MB
Step 16
Rotate the handle and open it up

EL-MF877-00 Page 7
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step 17 Remove the CPU from the board
Step 18 Remove the battery from the system board
Step 19 Remove speaker from Chassis
Step 20 Remove WLAN M.2 Card

EL-MF877-00 Page 8
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step 21 Use T-15 screwdriver remove the screws on the PSU
Chassis
Step 22 Disconnect the PSU cable from the MB
Step 23 Use T-15 screwdriver to loose the screws of MB from
board
Step 24 Remove MB from chassis

EL-MF877-00 Page 9
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step 25 Press the PSU’s latch on chassis
Step 26 Remove the PSU from chassis
Step 27
Use PH1 screwdriver to remove screw for the PSU
Step 28
Remove cover

EL-MF877-00 Page 10
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step 29 Use PH1 screwdriver to remove FG screw
Step 30 Disconnect fan connector and inlet connector
Step 31 Use PH1 screw driver to remove PCB1 screw
Step 32 Use PH1 screwdriver to remove AC inlet & Fan screw
Step 33
Heat the solder of the Electrolytic Capacitors of greater
than 2.5cm in diameter or height and Remove it