HP Compaq Presario V5000 Series Assembly instructions

HP-00007-01, Appendix 3 13-Oct-2004
HP Restricted
Page 1
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model Description
Compaq Presario V5000 Series Notebook PC Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description Notes Quantity of
items included
in product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA) With a surface greater than 10 square cm 3
Batteries All types including standard
alkaline and lithium coin or button
style batteries
2
Mercury containing components For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
1
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm Includes background illuminated displays with gas discharge lamps 1
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing
PCB / PCT)
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame
Retardants Declaration limited to case plastics only. 0
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
0
Components and waste containing
asbestos 0
Components, parts and materials 0

HP-00007-01, Appendix 3 13-Oct-2004
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containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Screwdriver Type-Phillip #1
Screwdriver Type-Phillip #0
C nnmm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1 Remove 6 cell battery
2 Remove one capture screws on RAM door and release the RAM door
3 Remove the Mini-PCI card
4 Remove RTC coin cell battery on MB for selective treatment
5 Remove one M2.5*4L screw on RAM door housing
6 Remove the ODD module
7 Remove two capture screws on HDD door and release HDD door
8 Remove the HDD module
9 Remove two M2*4L screws on battery housing which be indicated by triangle mark on
logic lower
10 Remove the strip cover
11 Remove four M2.5*4L screws on the front side of keyboard.
12 Remove the keyboard module
13 Remove four M2.5*8L screws on hinge cap.
14 Release the connector of LCD wire set.
15 Remove two M2.5*12L screws on logic low near hinge side.
16 Remove the LCD module.
17 Remove two M2.5*12L screws on logic up within Keyboard area.
18 Remove three M2.5*4L screws on logic low within Battery housing.
19 Remove two M2.5*4L and one M2.5*12L screws on logic low within HDD module housing
20 Remove two M2.5*12L screws on logic low within RAM module housing
21 Remove eight M2.5*12L screws on logic low.

HP-00007-01, Appendix 3 13-Oct-2004
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22 Remove logic lower.
23 Remove two M2.5*4L screws on audio board.
24 Remove the audio board
25 Remove one M2.5*4L screw on speaker box.
26 Remove one M2.5*4L screw on M/B
27 Pull out the audio board wire /DC-IN wire
28 Remove two M2*3L screws on Bluetooth module.
29 Remove Bluetooth module and pull out B/T module wire
30 Pull out the RJ-11 jack from hinge saddle.
31 Release the adhesive on T/P support bracket above speaker wire.
32 Remove M/B from logic up
33 Release the wire connector of fan module
34 Remove one M2*3L screw on hinge saddle
35 Remove two M2.5*5L screws on hinge saddle around CRT connector
36 Remove two I-HEAD screws around CABLE-DOCKING connector
37 Remove hinge saddle from M/B
38 Disassemble LCD module and remove mercury bulb for selective treatment
3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below: