HP EliteDesk 705 G1 Installation instructions

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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 705 G1 DM Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requirin
g
Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm Yes 2
Batteries All types including standard alkaline and lithium coin
or button style batteries Yes 1
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height Chicony Power - A120A01CH 1
External electrical cables and cords Chicony Power - A120A01CH 1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent

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including liquids, semi-liquids (gel/paste) and toner chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
#1 Micro shear 170II
#2 Torx Screwdriver T-15
#3 Slotted Screwdriver 2
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Disconnect the AC adapter cable.(see Figure 1 below)
2. Remove the access panel.(see Figure 2-3 below)
3. Remove the front bezel.(see Figure 4-5 below)
4. Remove HDD and HDD cable.(see Figure 6-9 below)
5. Remove HDD cage and Hood sense cable.(see Figure 10-12 below)
6. Remove Memorys.(see Figure 13-14 below)
7. Remove CPU HeatSink.(see Figure 15-16 below)
8. Remove system fan.(see Figure 17-19 below)
9. Remove PCIE cards.(see Figure 20-24 below)
10.Remove speaker,CPU and battery.(see Figure 25-31 below)
11. Remove MB.(see Figure 32-33 below)
12. Remove antenna cover and antenna cables.(see Figure 34-38 below)
13. The tool used for detaching external adapter is showing in figure 39.
14. Cut the join corner of external cover using Micro shear(Tool #1).(see Figure 40~41 below)
15. Separated the plastic covers.(see Figure 42)
16. Cut out the shielding soldered points using Micro shear(Tool #1), separated the shielding.(see Figure 43)
17. Remove a biggest E-cap using Micro shear(Tool #1).(see Figure 44)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Figure1 Disconnect the AC adapter cable. Figure2 Remove the thumb screw.
Figure3 Remove the Access Panel. Figure4 Loose the anchor point of front bezel.
Figure5 Remove the Front Bezel. Figure6 Disconnect HDD SATA cable.

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Figure7 Disconnect HDD Power cable. Figure8 Loose the HDD latch and remove HDD.
Figure9 Disconnect the cable from the HDD. Figure10 Loose the screw from HDD cage.
Figure11 Disconnect the hood sense cable. Figure12 Take out the HDD cage and remove hood
sense cable.

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Figure13 Loose the fixed feature of memory. Figure14 Remove the Memory from the board.
Figure15 Loose the screw of CPU HeatSink. Figure16 Remove the CPU HeatSink.
Figure17 Disconnect the system fan cable. Figure18 Loose the screws of system fan cable.

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Figure19 Remove the system fan. Figure20 Disconnect the antenna cable.
Figure21 Loose the WLAN card screw. Figure22 Remove the WLAN card.
Figure23 Loose SSD card screw. Figure24 Remove the SSD card.

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Figure25 Disconnect the speaker cable. Figure26 Remove the plastic screw.
Figure27 Remove the Speaker. Figure28 Rotate the handle and open it up.
Figure29 Remove the CPU from the board. Figure30 Pull the battery towards the chassis wall.

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Figure31 Remove the battery from the system board. Figure32 Loose MB screw.
Figure33 Remove the MB. Figure34 Loose the antenna cover hook.
Figure35 Remove the antenna cover. Figure36 Loose the antenna cable tape.

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Figure37 Loose the antenna hook. Figure38 Remove the antenna.
Figure39 Using tools for reference.
Figure40 Cut the join corner of external cover using
Tool#1 .(Use Chicony EPS as an example)
Figure41 Continued to cut the other corners of
external cover.
Figure42 Separated the plastic cover.

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Figure43 Cut out the shielding soldered points using
Tool#1, Separated the shielding. Figure44 Remove a biggest E-cap using Tool#1.