HP 2509m Assembly instructions

EL-MF877-00 Page 1
Template Revision A
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP 2509m Flat Panel Monitor
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
4
{Backlight
Assembly (I
type)
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
27
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
1
External electrical cables and cords
4
Gas Discharge Lamps
4
Plastics containing Brominated Flame Retardants
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0

EL-MF877-00 Page 2
Template Revision A
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1: Bushing Screwdriver
(HEX5.5MM)
Description #2: Crossing Screwdriver
2#
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Lay the monitor on the desk, remove the VESA mounting cover with hand.
2. Unlock the 4 screws which they fix the VESA mounting by 2# screwdriver.
3. Unlock the 4 screws which they fix the stand by 2# screwdriver.
4. Remove the front bezel with hand from product
5. Remove the backcover with hand from Product.
6. Seprate the Keypad and backcover with hand
7. Unlock the 2 screws which they fix the chassis and panel, and then pull the LVDS out .
8. Unlock 2 screws for DVI port, D-SUB port, Power port, and 7 screws which they fix between chassis and PCA
boards, power board and IF board. Pull the wires out.
9. Unlock the 2 screws which they fix between the bottom-side and the base, and then unlock the 12 screws which they
fix between the base and base-cover.
10. Remove the arm-rear and then unlock the 4 screws which they fix between the arm-front and the rion.
11. To see the detail process are as attached files including assemble panel.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. System disassembly methods :
2. Panel disassembly methods:

PhotoToolAction
Whole
set
assem
bly
N/A

PhotoToolAction
Remov
e the
VESA
cover
coin

PhotoToolAction
Remov
e the 4
screws
#2
Crossi
ng
Screw
Driver

PhotoToolAction
#2
Crossi
ng
Screw
Driver
Remov
e the 4
screws

PhotoToolAction
Remov
e the
bezel hand

PhotoToolAction
Remov
e the
HP
LOGO
Sharp
object

PhotoToolAction
Separa
te the
bucket
assem
bly &
panel
assem
bly
Pull
out the
keypad
cable
hand

PhotoToolAction
Remov
e the
SUB-
bezel
from
the
bucket
assem
bly
Take
out the
KEYP
AD BD
from
the
bucket
assem
bly
hand

PhotoToolAction
Remov
e the
mid
cover
from
the
bucket
assem
bly
Remov
e the
OSD &
power
button
from
the mid
cover
Hand
and a
sharp
object

PhotoToolAction
Remov
e 6
screws
which
fix the
2
speake
rs
#2
Crossi
ng
Screw
Driver

PhotoToolAction
Remov
e 5
screws
which
fix
metal
shield
Pull
out the
metal
shield
from
the
chassi
s
#2
Crossi
ng
Screw
Driver
Hand

PhotoToolAction
Remov
e 4
screws
which
lock
the
chassi
s &
panel
Pull
out the
light
cable
from
the PI
BD
#2
Crossi
ng
Screw
Driver
Hand

PhotoToolAction
Remov
e 2
screws
which
lock
the AC
socket
Pull
out the
LVDS
cable
Remov
e the 4
screws
which
DVI &
VGA
connec
tor
#2
Crossi
ng
Screw
Driver
hand

PhotoToolAction
Remov
e 7
screws
which
lock
the
PI/IF
BD
#2
Crossi
ng
Screw
Driver

PhotoToolAction
N/A N/A
VIEW

PhotoToolAction
Pull
out the
cables
from
the
hooks
Take
out the
PCBA
S
Hand

PhotoToolAction
Stand
assem
bly N/A

PhotoToolAction
Unlock
six
screws
which
fix the
Base
#2
Crossi
ng
Screw
Driver