HP 5900AF-48XG-4QSFP+ Assembly instructions

EL-MF877-00 Page 1
Template Revision B
Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP 5900AF-48XG-4QSFP+ Switch Chassis（JC772A）
HP 5900AF-48XG-4QSFP+ TAA Switch Chassis（JG554A）
HP FF 5900CP-48XG-4QSFP+ Switch Chassis (JG838A)
HP 5900CP-48XG-4QSFP+ 8Gb FC B-F Switch Chassis (E7W29A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
4
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0

EL-MF877-00 Page 2
Template Revision B
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
2#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws on mounting angle 1, and then remove mounting angle 1.
2. Unscrew the screws on mounting angle 2, and then remove mounting angle 2.
3. Unscrew the screws on fan-assembly 3, and then remove fan-assembly 3.
4. Remove the power 4.
5. Remove the filler panel 5.
6. Unscrew the screws on top cover 6, and remove top cover 6.
7. Unscrew the screws on front panel 7, and then remove front panel 7.
8. Unscrew the screws on PCB 9, and remove PCB 9.
9. Unscrew the screws on PCB 10, and remove PCB 10.
10. Unscrew the screws on shielding plate 11, and remove shielding plate 11.
11. Unscrew the screws on wind cover 12, and then remove wind cover 12.
12. Unscrew the screws on PCB 13, and remove PCB 13.
13. Remove all of the labels.
14. Unscrew the screws on 3-2, and then remove 3-2.
15. Unscrew the screws on 3-3, and then remove 3-3.
16. Unscrew the screws on fan 3-4, and then remove fan 3-4.
17. Unscrew the screws on pcb 3-5, and then remove 3-5.
18. Unscrew the screws on pulled handle 3-6, and then remove pulled handle 3-6.
19. Remove shielding finger 3-7.
20. Remove all of the labels.
21. Unscrew the screws on pulled handle 5-1, and then remove pulled handle 5-1.
22. Remove shielding finger 5-3.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3
Template Revision B
Figure 1 Remove mounting angle Figure 2 Rear of product
Figure 3 Treatments to the product Figure 4 Treatments to the product
Figure 5 Treatments to fan-assembly Figure 6 Treatments to filler panel

EL-MF877-00 Page 4
Template Revision B
3.3 Material of the facility built
Facility
Components
Material
Weight(g)
Weight
percentage
Selective treatment for
materials and components
Details
1
Fe
(135+46)*2
3.25%
Fe
recycling
2
Fe
38*2
0.68%
Fe
recycling
3
3-1
Fe
170
1.53%
Fe
recycling
3-2
Fe
21
0.19%
Fe
recycling
3-3
Fe
23
0.21%
Fe
recycling
3-4
PC
40*2
0.72%
Containing brominated flame
retardants
3-5
Complex
PWB
30
0.27%
The surface of PCB is greater
than 10 square centimeters;
3-6
Fe
24
0.22%
Fe
recycling
3-7
Be-Cu
4.3*8
0.31%
Cu
recycling
4
Fe
1050
9.44%
Fe
recycling
5
Fe
144
1.29%
Fe
recycling
6
Fe
2720
24.45%
Fe
recycling
7
Fe
320
2.88%
Fe
recycling
8
Fe
3920
35.24%
Fe
recycling
9
Complex
PWB
48
0.43%
The surface of PCB is greater
than 10 square centimeters;
10
Complex
PWB
103
0.93%
The surface of PCB is greater
than 10 square centimeters;
11
Fe
19
0.17%
Fe
recycling
12
Fe
57
0.51%
Fe
recycling
13
Complex
PWB
2360
21.22%
The surface of PCB is greater
than 10 square centimeters;
4. Revised record
Date
Version
Author
Modify content
2012.11.12
V0
LiuBaoquan
Initial version
2013.11.08
V1
LuanZhiming
Add the module JG838A、E7W29A