HP ProLiant DL585 G7 Assembly instructions

Product End-of-Life Disassembly Instructions
Marketing Name /
Model
[List multiple models if
applicable.]
Product Category
HP ProLiant DL585 G7 Server
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities.
It provides the basic instructions for the
disassembly of HP products to remove components
and materials requiring selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective
treatment in the right column, as applicable.
Item Description Notes
Quantity
of items
included
in
product
Printed Circuit Boards (PCB) or
Printed Circuit Assemblies (PCA)
With a surface greater than 10 sq
cm
6
Batteries All types including standard
alkaline and lithium coin or button
style batteries
2
Mercury-containing components For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
0
Liquid Crystal Displays (LCD) with a
surface greater than 100 sq cm
Includes background illuminated
displays with gas discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers
(Containing PCB / PCT)
0
Electrolytic Capacitors /
Condensers measuring greater than
2.5 cm in diameter or height
Depending on Power Supply model
number
2

External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated
Flame Retardants
0
Components and parts containing
toner and ink, including liquids,
semi-liquids (gel/paste) and toner
Include the cartridges, print heads,
tubes, vent chambers, and service
stations.
0
Components and waste containing
asbestos
0
Components, parts and materials
containing refractory ceramic fibers
0
Components, parts and materials
containing radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product
to a point where components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if applicable)
Torx screw driver T15
Flat head screw driver Medium
Philips Driver # 2
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and
materials requiring selective treatment:
1. System Board Battery - Remove the top cover and locate the battery on the
system board. Use a medium flat head screwdriver or fingers to remove the
battery and dispose of properly
2. BBWC Battery –
With a medium flat head screw driver remove the BBWC battery and
dispose of properly.
3. Capacitors=>2.5CM - Remove the power supply from the system using a T-15 driver.
With #2 Philips screw driver, remove the screws securing the top cover, then locate
the capacitors and pry from the PCB with a medium flat head screw driver and di
pose
of properly.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration
below to identify the items contained in the product that require selective treatment (with
descriptions and arrows identifying locations).
Attachment 1 – System Battery Location

Attachment 2- Location of BBWC Battery
Attachment 3,4,5- Capacitor location by model number of supply
Attachment 1
Attachment 2

Attachment 3
Attachment 4

Attachment 5