HP ProLiant SL250s Gen8 User manual

HP ProLiant SL250s Gen8 Server
User Guide
Abstract
This document provides detailed instructions to configure and use the HP ProLiant SL250s Gen8 Server.
Part Number: 666298-002
September 2012
Edition: 2

© Copyright 2012 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall
not be liable for technical or editorial errors or omissions contained herein.
Confidential computer software. Valid license from HP required for possession, use or copying. Consistent with FAR 12.211 and 12.212,
Commercial Computer Software, Computer Software Documentation, and Technical Data for Commercial Items are licensed to the U.S. Government
under vendor’s standard commercial license.
Microsoft® and Windows® are U.S. registered trademarks of Microsoft Corporation. Bluetooth® is a trademark owned by its proprietor and used
by Hewlett-Packard Company under license.

Contents 3
Contents
Component identification............................................................................................................... 6
Front panel components ............................................................................................................................. 6
Front panel LEDs and buttons ...................................................................................................................... 7
Rear panel components.............................................................................................................................. 8
Rear panel LEDs and buttons....................................................................................................................... 8
System board components.......................................................................................................................... 9
DIMM slot locations ....................................................................................................................... 10
System maintenance switch............................................................................................................. 11
NMI header.................................................................................................................................. 12
Device numbers ...................................................................................................................................... 12
Drive LED definitions................................................................................................................................ 13
Operations................................................................................................................................. 15
Power up the server................................................................................................................................. 15
Power down the node.............................................................................................................................. 15
Remove the server from the chassis ............................................................................................................ 15
Remove the processor air baffle ................................................................................................................ 16
Setup......................................................................................................................................... 17
Optional installation services .................................................................................................................... 17
Rack planning resources........................................................................................................................... 17
Optimum environment.............................................................................................................................. 17
Space and airflow requirements ...................................................................................................... 18
Temperature requirements............................................................................................................... 18
Power requirements ....................................................................................................................... 19
Electrical grounding requirements .................................................................................................... 19
Rack warnings ........................................................................................................................................ 19
Contents of the server shipping carton........................................................................................................ 20
Installing the chassis ................................................................................................................................ 20
Installing options ..................................................................................................................................... 20
Installing components............................................................................................................................... 21
Installing the server into the chassis............................................................................................................ 21
Powering up the chassis ........................................................................................................................... 23
Configuring the chassis ............................................................................................................................ 23
Powering on and selecting boot options ..................................................................................................... 23
Installing the system software .................................................................................................................... 23
Registering the server............................................................................................................................... 23
Hardware options installation....................................................................................................... 24
Introduction ............................................................................................................................................ 24
Processor option...................................................................................................................................... 24
Memory options...................................................................................................................................... 28
HP SmartMemory .......................................................................................................................... 28
Memory subsystem architecture ....................................................................................................... 29
Single-, dual-, and quad-rank DIMMs ............................................................................................... 29
DIMM identification ....................................................................................................................... 30
Memory configurations................................................................................................................... 30

Contents 4
General DIMM slot population guidelines......................................................................................... 32
Installing a DIMM.......................................................................................................................... 33
Drive guidelines ...................................................................................................................................... 34
Removing the hard drive blank........................................................................................................ 34
Installing a hot-plug SAS drive......................................................................................................... 34
Installing SFF quick-release drive cages ............................................................................................ 35
Installing a quick-release drive......................................................................................................... 40
Controller options.................................................................................................................................... 41
Installing the cache module............................................................................................................. 42
Installing the FBWC capacitor pack ................................................................................................. 43
Mini-SAS cable to a controller card.................................................................................................. 45
Expansion board options.......................................................................................................................... 50
Installing an expansion board ......................................................................................................... 50
Installing a PCI riser board assembly................................................................................................ 51
Installing a FlexibleLOM riser assembly ............................................................................................ 52
Redundant hot-plug power supply option.................................................................................................... 53
Connecting the SUV cable........................................................................................................................ 55
HP Trusted Platform Module option ............................................................................................................ 56
Installing the Trusted Platform Module board ..................................................................................... 56
Retaining the recovery key/password .............................................................................................. 58
Enabling the Trusted Platform Module............................................................................................... 58
Cabling ..................................................................................................................................... 59
Cabling overview.................................................................................................................................... 59
FBWC capacitor pack cabling.................................................................................................................. 59
Front GPU cabling................................................................................................................................... 60
Software and configuration utilities ............................................................................................... 62
Server mode........................................................................................................................................... 62
Server QuickSpecs .................................................................................................................................. 62
HP iLO Management Engine..................................................................................................................... 62
HP iLO ......................................................................................................................................... 62
Intelligent Provisioning.................................................................................................................... 64
Scripting Toolkit ............................................................................................................................ 65
HP Service Pack for ProLiant ..................................................................................................................... 65
HP Smart Update Manager............................................................................................................. 66
HP ROM-Based Setup Utility ..................................................................................................................... 66
Using RBSU .................................................................................................................................. 67
Auto-configuration process.............................................................................................................. 67
Boot options ................................................................................................................................. 67
Configuring AMP modes ................................................................................................................ 68
Re-entering the server serial number and product ID ........................................................................... 68
Utilities and features ................................................................................................................................ 69
Array Configuration Utility.............................................................................................................. 69
Option ROM Configuration for Arrays ............................................................................................. 70
ROMPaq utility.............................................................................................................................. 70
Automatic Server Recovery ............................................................................................................. 70
USB support.................................................................................................................................. 70
Redundant ROM support ................................................................................................................ 71
Keeping the system current ....................................................................................................................... 71
Drivers ......................................................................................................................................... 71
Software and firmware................................................................................................................... 72
Version control.............................................................................................................................. 72
HP Operating Systems and Virtualization Software Support for ProLiant Servers..................................... 72

Contents 5
HP Technology Service Portfolio ...................................................................................................... 73
Change control and proactive notification ........................................................................................ 73
Troubleshooting.......................................................................................................................... 74
Troubleshooting resources ........................................................................................................................ 74
System battery............................................................................................................................ 75
Regulatory compliance notices ..................................................................................................... 76
Regulatory compliance identification numbers............................................................................................. 76
Federal Communications Commission notice............................................................................................... 76
FCC rating label............................................................................................................................ 76
FCC Notice, Class A Equipment...................................................................................................... 76
FCC Notice, Class B Equipment ...................................................................................................... 76
Declaration of conformity for products marked with the FCC logo, United States only....................................... 77
Modifications.......................................................................................................................................... 77
Cables................................................................................................................................................... 77
Canadian notice (Avis Canadien).............................................................................................................. 77
European Union regulatory notice ............................................................................................................. 78
Disposal of waste equipment by users in private households in the European Union......................................... 78
Japanese notice ...................................................................................................................................... 79
BSMI notice............................................................................................................................................ 79
Korean notice ......................................................................................................................................... 79
Chinese notice ........................................................................................................................................ 80
Vietnam compliance marking notice .......................................................................................................... 80
Ukraine notice ........................................................................................................................................ 80
Laser compliance .................................................................................................................................... 80
Battery replacement notice........................................................................................................................ 81
Taiwan battery recycling notice................................................................................................................. 81
Power cord statement for Japan................................................................................................................. 81
Acoustics statement for Germany (Geräuschemission) .................................................................................. 82
Electrostatic discharge................................................................................................................. 83
Preventing electrostatic discharge .............................................................................................................. 83
Grounding methods to prevent electrostatic discharge.................................................................................. 83
Specifications............................................................................................................................. 84
Environmental specifications ..................................................................................................................... 84
Server specifications ................................................................................................................................ 84
Hot-plug power supply calculations............................................................................................................ 84
Support and other resources ........................................................................................................ 85
Before you contact HP.............................................................................................................................. 85
HP contact information............................................................................................................................. 85
Customer Self Repair ............................................................................................................................... 85
Acronyms and abbreviations........................................................................................................ 93
Documentation feedback ............................................................................................................. 97
Index......................................................................................................................................... 98

Component identification 6
Component identification
Front panel components
Item Description
1 Hot-plug hard drive, Bay 1 HDD 1
2 Hot-plug hard drive, Bay 1 HDD 2
3 Option bay 1, PCI riser board
4 Hot-plug hard drive, Bay 1 HDD 3
5 Hot-plug hard drive, Bay 1 HDD 4
6 Option bay 1, FlexibleLOM riser
7 SUV port
8 Serial port
9 NIC 1 network port
10 NIC 2 network port
11 iLO 4 network port

Component identification 7
Front panel LEDs and buttons
Item Description Status
1 Power On/Standby button
and system power LED Green—System on Amber—System shut down, but power still applied.
Off—Power cord is not attached, or power supply has failed.
2 Health LED Green—Normal
Flashing amber—System degraded
Flashing red—System critical
3 UID LED button Blue—Activated
Flashing blue—System is being remotely managed.
Off—Deactivated
4 NIC 1/iLO 4 speed LED Green—LAN connection using a GbE link
Amber—LAN connection using a 10 Mbps/100 Mbps link
Off—No LAN connection exists.
5 NIC 1/iLO 4 activity LED Flashing green—Network data activity exists.
Off—No network data activity exists, or no network connection
exists.
6 NIC 2 speed LED Green—LAN connection using a GbE link
Amber—LAN connection using a 10 Mbps/100 Mbps link
Off—No LAN connection exists.
7 NIC 2 activity LED Flashing green—Network data activity exists.
Off—No network data activity exists, or no network connection
exists.
8 iLO 4 network activity LED Flashing green—Network data activity exists.
Off—No network data activity exists, or no network connection
exists.
9 iLO 4 network speed LED Green—LAN connection using a GbE link
Amber—LAN connection using a 10 Mbps/100 Mbps link
Off—No LAN connection exists.

Component identification 8
Rear panel components
The server has four power supplies, eight fans, and a single SLAPM interface located on the rear panel of the
chassis.
Item Description
1 SLAPM interface
2 Power supply 4
3 Power supply 3
4 Power supply 2
5
Power supply 1
Rear panel LEDs and buttons
Item Description Status
1 Fan 8/16 power LED Off—Normal
Amber—Fan has failed.
2 Fan 7/15 power LED Off—Normal
Amber—Fan has failed.
3 UID LED button Blue—Activated

Component identification 9
Item Description Status
Flashing blue—System is being remotely
managed.
Off—Deactivated
4 Fan 4/12 power LED Off—Normal
Amber—Fan has failed.
5 Fan 3/11 power LED Off—Normal
Amber—Fan has failed.
6
Fan 1/9 power LED
Off—Normal
Amber—Fan has failed.
7 Fan 2/10 power LED Off—Normal
Amber—Fan has failed.
8 Power supply 1 power LED Green—Normal
Off—No AC power
9 Power supply 2 power LED Green—Normal
Off—No AC power
10 Power supply 3 power LED Green—Normal
Off—No AC power
11 Power supply 4 power LED Green—Normal
Off—No AC power
12 Fan 5/13 power LED Off—Normal
Amber—Fan has failed.
13
Fan 6/14 power LED
Off—Normal
Amber—Fan has failed.
System board components
Item Description
1 Cache module connector
2 x24 riser connector
3
SATA hard drive connector 1

Component identification 10
Item Description
4 SATA hard drive connector 2
5 System battery
6 Processor socket 2
7 Processor 2 DIMM slots
8 Power connector
9 RPS connector
10 x32 riser connector
11 Processor 1 DIMM slots
12 Processor socket 1 (populated)
13 Mini-SAS hard drive connector port 2i
14 Mini-SAS hard drive connector port 1i
15 Internal USB connector
16 uSD card slot
17 Data LED connector
18 x16 FlexibleLOM slot
19 System maintenance switch
20 Trusted Platform Module
21 NMI header
NOTE:
This server supports PCIe Gen3 only in the FlexibleLOM slot. PCIe Gen2 is supported in
all other slots.
DIMM slot locations
DIMM slots are numbered sequentially (1 through 8) for each processor. The supported AMP modes use the
alpha assignments for population order, and the slot numbers designate the DIMM slot ID for spare
replacement.

Component identification 11
The arrow points to the front of the node.
System maintenance switch
Position Default Function
S1
Off
Off = iLO 4 security is enabled.
On = iLO 4 security is disabled.
S2 Off Off = System configuration can be
changed.
On = System configuration is locked.
S3 Off Reserved
S4 Off Reserved
S5 Off Off = Power-on password is enabled.
On = Power-on password is disabled.
S6 Off Off = No function
On = ROM reads system configuration
as invalid.
S7 — Reserved
S8 — Reserved
S9 — Reserved
S10 — Reserved
S11 — Reserved
S12 — Reserved
To access redundant ROM, set S1, S5, and S6 to on.
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all
system configuration settings from both CMOS and NVRAM.
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to
properly configure the server or data loss could occur.

Component identification 12
NMI header
The NMI header enables administrators to perform a memory dump before performing a hard reset. Crash
dump analysis is an essential part of eliminating reliability issues, such as hangs or crashes in operating
systems, device drivers, and applications. Many crashes can freeze a system, requiring you to perform a
hard reset. Resetting the system erases any information that supports root cause analysis.
When a Windows® operating system crashes, a blue-screen trap appears. When this trap appears,
Microsoft® recommends that system administrators perform an NMI event by temporarily shorting the NMI
header with a jumper. The NMI event enables a hung system to become responsive again.
For additional information, see the HP website
(http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00797875/c00797875.pdf).
Device numbers
•Front hot-plug hard drive bay numbers (box 1)

Component identification 13
•Rear SFF hard drive bay numbers (box 0)
Drive LED definitions
Item LED Status Definition
1 Locate Solid blue The drive is being identified by a host application.
Flashing blue
The drive carrier firmware is being updated or requires an update.
2 Activity ring Rotating green Drive activity
Off No drive activity
3 Do not remove Solid white Do not remove the drive. Removing the drive causes one or more of
the logical drives to fail.
Off Removing the drive does not cause a logical drive to fail.
4 Drive status Solid green The drive is a member of one or more logical drives.
Flashing green The drive is rebuilding or performing a RAID migration, stripe size
migration, capacity expansion, or logical drive extension, or is
erasing.
Flashing
amber/green The drive is a member of one or more logical drives and predicts the drive will fail.
Flashing amber The drive is not configured and predicts the drive will fail.
Solid amber The drive has failed.

Component identification 14
Item LED Status Definition
Off The drive is not configured by a RAID controller.

Operations 15
Operations
Power up the server
To power up the server, press the Power On/Standby button.
Power down the node
Before powering down the node for any upgrade or maintenance procedures, perform a backup of critical
server data and programs.
IMPORTANT: When the node is in standby mode, auxiliary power is still being provided to the
system.
To power down the node, use one of the following methods:
•Press and release the Power On/Standby button.
This method initiates a controlled shutdown of applications and the OS before the node enters standby
mode.
•Press and hold the Power On/Standby button for more than 4 seconds to force the node to enter
standby mode.
This method forces the node to enter standby mode without properly exiting applications and the OS.
If an application stops responding, you can use this method to force a shutdown.
•Use a virtual power button selection through iLO 4.
This method initiates a controlled remote shutdown of applications and the OS before the node enters
standby mode.
Before proceeding, verify the node is in standby mode by observing that the system power LED is amber.
Remove the server from the chassis
1. Power down the server ("Power down the node" on page 15).
2. Disconnect all peripheral cables from the node.

Operations 16
3. Remove the server from the chassis (on page 15).
4. Place the node on a flat, level work surface.
Remove the processor air baffle
To remove the component:
1. Power down the server ("Power down the node" on page 15).
2. Disconnect all peripheral cables from the node.
3. Remove the server from the chassis (on page 15).
4. Remove the front GPU module.
5. Remove the GPU bracket.
6. Remove the air baffle.
To replace the component, reverse the removal procedure.

Setup 17
Setup
Optional installation services
Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and
running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you integrate
both hardware and software support into a single package. A number of service level options are available
to meet your needs.
HP Care Pack Services offer upgraded service levels to expand your standard product warranty with
easy-to-buy, easy-to-use support packages that help you make the most of your server investments. Some of
the Care Pack services are:
•Hardware support
o6-Hour Call-to-Repair
o4-Hour 24x7 Same Day
o4-Hour Same Business Day
•Software support
oMicrosoft®
oLinux
oHP ProLiant Essentials (HP SIM and RDP)
oVMWare
•Integrated hardware and software support
oCritical Service
oProactive 24
oSupport Plus
oSupport Plus 24
•Startup and implementation services for both hardware and software
For more information on HP Care Pack Services, see the HP website
(http://www.hp.com/services/carepack).
Rack planning resources
The rack resource kit ships with all HP branded or Compaq branded 9000, 10000, and H9 series racks. For
more information on the content of each resource, see the rack resource kit documentation.
Optimum environment
When installing the server in a rack, select a location that meets the environmental standards described in
this section.

Setup 18
Space and airflow requirements
To allow for servicing and adequate airflow, observe the following space and airflow requirements when
deciding where to install a rack:
•Leave a minimum clearance of 63.5 cm (25 in) in front of the rack.
•Leave a minimum clearance of 76.2 cm (30 in) behind the rack.
•Leave a minimum clearance of 121.9 cm (48 in) from the back of the rack to the back of another rack
or row of racks.
HP nodes draw in cool air through the front door and expel warm air through the rear door. Therefore, the
front and rear rack doors must be adequately ventilated to allow ambient room air to enter the cabinet, and
the rear door must be adequately ventilated to allow the warm air to escape from the cabinet.
CAUTION: To prevent improper cooling and damage to the equipment, do not block the
ventilation openings.
When vertical space in the rack is not filled by a server or rack component, the gaps between the
components cause changes in airflow through the rack and across the servers. Cover all gaps with blanking
panels to maintain proper airflow.
CAUTION: Always use blanking panels to fill empty vertical spaces in the rack. This arrangement
ensures proper airflow. Using a rack without blanking panels results in improper cooling that can
lead to thermal damage.
The 9000 and 10000 Series Racks provide proper server cooling from flow-through perforations in the front
and rear doors that provide 64 percent open area for ventilation.
CAUTION: When using a Compaq branded 7000 series rack, install the high airflow rack door
insert (PN 327281-B21 for 42U rack, PN 157847-B21 for 22U rack) to provide proper
front-to-back airflow and cooling.
CAUTION: If a third-party rack is used, observe the following additional requirements to ensure
adequate airflow and to prevent damage to the equipment:
•Front and rear doors—If the 42U rack includes closing front and rear doors, you must allow
5,350 sq cm (830 sq in) of holes evenly distributed from top to bottom to permit adequate
airflow (equivalent to the required 64 percent open area for ventilation).
•Side—The clearance between the installed rack component and the side panels of the rack
must be a minimum of 7 cm (2.75 in).
Temperature requirements
To ensure continued safe and reliable equipment operation, install or position the system in a well-ventilated,
climate-controlled environment.
The maximum recommended ambient operating temperature (TMRA) for most server products is 35°C
(95°F). The temperature in the room where the rack is located must not exceed 35°C (95°F).
CAUTION: To reduce the risk of damage to the equipment when installing third-party options:
•Do not permit optional equipment to impede airflow around the server or to increase the
internal rack temperature beyond the maximum allowable limits.
•Do not exceed the manufacturer’s TMRA.

Setup 19
Power requirements
Installation of this equipment must comply with local and regional electrical regulations governing the
installation of information technology equipment by licensed electricians. This equipment is designed to
operate in installations covered by NFPA 70, 1999 Edition (National Electric Code) and NFPA-75, 1992
(code for Protection of Electronic Computer/Data Processing Equipment). For electrical power ratings on
options, refer to the product rating label or the user documentation supplied with that option.
WARNING: To reduce the risk of personal injury, fire, or damage to the equipment, do not
overload the AC supply branch circuit that provides power to the rack. Consult the electrical
authority having jurisdiction over wiring and installation requirements of your facility.
CAUTION: Protect the server from power fluctuations and temporary interruptions with a
regulating uninterruptible power supply. This device protects the hardware from damage caused
by power surges and voltage spikes and keeps the system in operation during a power failure.
When installing more than one server, you might need to use additional power distribution devices to safely
provide power to all devices. Observe the following guidelines:
•Balance the server power load between available AC supply branch circuits.
•Do not allow the overall system AC current load to exceed 80 percent of the branch circuit AC current
rating.
•Do not use common power outlet strips for this equipment.
•Provide a separate electrical circuit for the server.
For more information on the hot-plug power supply and calculators to determine server power consumption
in various system configurations, refer to the HP Enterprise Configurator website
(http://h30099.www3.hp.com/configurator/).
Electrical grounding requirements
The server must be grounded properly for proper operation and safety. In the United States, you must install
the equipment in accordance with NFPA 70, 1999 Edition (National Electric Code), Article 250, as well as
any local and regional building codes. In Canada, you must install the equipment in accordance with
Canadian Standards Association, CSA C22.1, Canadian Electrical Code. In all other countries, you must
install the equipment in accordance with any regional or national electrical wiring codes, such as the
International Electrotechnical Commission (IEC) Code 364, parts 1 through 7. Furthermore, you must be sure
that all power distribution devices used in the installation, such as branch wiring and receptacles, are listed
or certified grounding-type devices.
Because of the high ground-leakage currents associated with multiple servers connected to the same power
source, HP recommends the use of a PDU that is either permanently wired to the building’s branch circuit or
includes a nondetachable cord that is wired to an industrial-style plug. NEMA locking-style plugs or those
complying with IEC 60309 are considered suitable for this purpose. Using common power outlet strips for
the server is not recommended.
Rack warnings

Setup 20
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:
•The leveling jacks are extended to the floor.
•The full weight of the rack rests on the leveling jacks.
•The stabilizing feet are attached to the rack if it is a single-rack installation.
•The racks are coupled together in multiple-rack installations.
•Only one component is extended at a time. A rack may become unstable if more than one
component is extended for any reason.
WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack:
•At least two people are needed to safely unload the rack from the pallet. An empty 42U rack
can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and might
become unstable when being moved on its casters.
•Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle
the rack from both sides.
Contents of the server shipping carton
Unpack the server shipping carton and locate the materials and documentation necessary for installing the
server. All the rack mounting hardware necessary for installing the server into the rack is included with the
rack or the server.
The contents of the server shipping carton include:
•Server
•Power cord
•Printed setup documentation, Documentation CD, and software products
•Rack mounting hardware kit and documentation
In addition to these supplied items, you might need:
•T-10/T-15 Torx screwdriver
•Hardware options
•Operating system or application software
Installing the chassis
The chassis can be installed either in a rack or rack-free environment. For rack installations, install the rack
rails, and then install the chassis and other components.
For more information, see the HP ProLiant s6500 Chassis Setup and Installation Guide, Quick Deploy Rail
System Installation Instructions that ship with the rack hardware kit, and applicable installation instructions.
Installing options
Install any hardware options before initializing the node. For options installation information, see the
documentation that ships with the option. For node-specific information, see the node user guide on the HP
website (http://www.hp.com).