HP 10500 series Installation instructions

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Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP 10500 Type D w/Comware v7 OS MPU (JH198A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm 2
Batteries All types including standard alkaline and lithium
coin or button style batteries 1
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries 0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm Includes background illuminated displays with gas discharge lamps 0
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height 0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. 0
Components and waste containing asbestos 0
Components, parts and materials containing
refractory ceramic fibers 0
Components, parts and materials containing
radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.

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Tool Description Tool Size (if
applicable)
Screw driver 2#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws on part 1,then remove part 1;
2. Unscrew the screws on guiding set 2,then remove guiding set 2;
3. Remove shielding finger 3 from panel 8;
4. Remove film 4 from panel 8;
5. Unscrew the screws on heatsink 6,then remove heatsink 6 from pcb 7;
6. Remove heatsink 5 from pcb 7;
7. Unscrew the screws on PCB 7,then remove PCB 7 from bottom panel 8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure1 Treatments to the product
3.3 Material of the facility built
Facility Components Material Weight(g) Weight
percentage Selective treatment for materials and components Details
1 Fe 48 1.67% Fe recycling
2 Zn 32 1.11% Zn recycling
3 Be-Cu 2.7 0.09% Cu recycling
4 PC 9.2 0.32% Pla
recycling
5 Al 10.5 0.37% Al recycling
6 Al 225 7.84% Al recycling

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7 Complex
PCB 1083 37.73% The surface lf PCB is greater than 10 square
centimeters
8 Fe 1460 50.86% Fe recycling
4. Revised record
Date Version Author Modify content
2015.01.06 V0 Liao Wenqing Initial version
2015.01.12 V1 Liao Wenqing Modify the figure