HPE JL324A Assembly instructions

Product End-of-Life Disassembly Instructions
Product Category
: Networking
Marketing Name / Model
[List multiple models if applicable.]
ARUBA 2930M 24 SMRT RTE POE+ 1S SWCH
Name / Model #2
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium
coin or button style batteries
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Power Cord and Console RJ45 cable
2
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
MF877-00 Page 1
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01

Item Description Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torque Driver (Standard)
T10
Torque Bit
T10-70 mm
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew and remove - SCREW-MACHINE ASSEMBLY M5 X 0.8 10M ROHS at 2 locations
2. Unscrew and remove - ASSY, BULKHEAD BLANK FP
3. Unscrew and remove - ASSY, BLANK STACKING LAVA
4. Press handle and remove - PS BLANK FILLER
5. Press handle and remove PWR SUPPLY 680 W
6. Unscrew and remove - SCREW-THD-RLG M3 X 0.5 5MM-LG BLACK ROHS at 17 Locations and ASSY, CHASSIS
COVER LAVA2 AQM
7. Unplug Connector of FAN ASSEMBLY LAVA at 3 locations from PCA and remove the FAN ASSEMBLY LAVA
8. Unplug and remove - 1MM FFC CABLE,76MM LONG
9. Unscrew and remove - SCREW T10 M3X6 at 2 locations.
10. Remove PCA, LAVA LED BOARD
11. Remove PUSHBUTTON, SMT, MODE SWITCH
12. Unscrew and remove SCREW-TAPPING M3 X 0.5 8MM-LG ROHS at 11 Locations and PCA, LAVA2 24SR WITH
POE+ & MECH
13. Remove INSULATOR LAVA
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
MF877-00 Page 2
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01

MF877-00 Page 3
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01

MF877-00 Page 4
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01

MF877-00 Page 5
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01